AOWF4N60

AOWF4N60 600V,4A N-Channel MOSFET General Description Product Summary The AOWF4N60 is fabricated using an advanced high voltage MOSFET process that is designed to deliver high levels of performance and robustness in popular AC-DC applications.By providing low RDS(on), Ciss and Crss along with guaranteed avalanche capability this parts can be adopted quickly into new and existing offline power supply designs. VDS ID (at VGS=10V) 700V@150℃ 4A RDS(ON) (at VGS=10V) < 2.3Ω 100% UIS Tested 100% Rg Tested TO-262F Top View D Bottom View S G D S D G G S AOWF4N60 Absolute Maximum Ratings TA=25°C unless otherwise noted Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage Continuous Drain Current VGS TC=25°C TC=100°C ID AOWF4N60 600 Units V ±30 V 4* 2.6* A Pulsed Drain Current C IDM Avalanche Current C IAR 2.8 A Repetitive avalanche energy C EAR 118 mJ 235 5 25 mJ V/ns W 0.2 -55 to 150 W/ oC °C 300 °C AOWF4N60 65 5 Units °C/W °C/W Single pulsed avalanche energy G EAS Peak diode recovery dv/dt dv/dt TC=25°C PD Power Dissipation B Derate above 25oC TJ, TSTG Junction and Storage Temperature Range Maximum lead temperature for soldering TL purpose, 1/8" from case for 5 seconds Thermal Characteristics Symbol Parameter Maximum Junction-to-Ambient A,D RθJA Maximum Junction-to-Case RθJC * Drain current limited by maximum junction temperature. Rev0: Nov 2011 www.aosmd.com 14 Page 1 of 5 AOWF4N60 Electrical Characteristics (TJ=25°C unless otherwise noted) Symbol Parameter Conditions Min ID=250µA, VGS=0V, TJ=25°C 600 Typ Max Units STATIC PARAMETERS BVDSS Drain-Source Breakdown Voltage BVDSS /∆TJ Breakdown Voltage Temperature Coefficient IDSS Zero Gate Voltage Drain Current ID=250µA, VGS=0V, TJ=150°C 700 V ID=250µA, VGS=0V 0.67 V/ oC VDS=600V, VGS=0V 1 VDS=480V, TJ=125°C 10 IGSS Gate-Body leakage current VDS=0V, VGS=±30V VGS(th) Gate Threshold Voltage VDS=5V, ID=250µA RDS(ON) Static Drain-Source On-Resistance VGS=10V, ID=2A gFS Forward Transconductance VDS=40V, ID=2A VSD Diode Forward Voltage IS=1A,VGS=0V ±100 3.4 µA 4.1 4.5 nΑ V 1.8 2.3 Ω 1 V 6 S 0.76 IS Maximum Body-Diode Continuous Current 4 A ISM Maximum Body-Diode Pulsed Current 14 A DYNAMIC PARAMETERS Input Capacitance Ciss Coss Output Capacitance Crss Reverse Transfer Capacitance Rg Gate resistance VGS=0V, VDS=25V, f=1MHz VGS=0V, VDS=0V, f=1MHz SWITCHING PARAMETERS Qg Total Gate Charge Qgs Gate Source Charge Qgd Gate Drain Charge VGS=10V, VDS=480V, ID=4A 420 528 640 pF 35 53 70 pF 2.5 4.8 7 pF 1.2 2.5 3.8 Ω 9.5 12 14.5 nC 2.8 3.6 4.5 nC 2.2 4.4 6.6 nC tD(on) Turn-On DelayTime tr Turn-On Rise Time tD(off) Turn-Off DelayTime tf trr Turn-Off Fall Time IF=4A,dI/dt=100A/µs,VDS=100V 150 190 230 Qrr Body Diode Reverse Recovery Charge IF=4A,dI/dt=100A/µs,VDS=100V 1.9 2.4 3 Body Diode Reverse Recovery Time VGS=10V, VDS=300V, ID=4A, RG=25Ω 17 ns 26 ns 34 ns 21 ns ns µC A. The value of R θJA is measured with the device in a still air environment with T A =25°C. B. The power dissipation PD is based on TJ(MAX)=150°C, using junction-to-case thermal resistance, and is more useful in setting the upper dissipation limit for cases where additional heatsinking is used. C. Repetitive rating, pulse width limited by junction temperature TJ(MAX)=150°C, Ratings are based on low frequency and duty cycles to keep initial TJ =25°C. D. The R θJA is the sum of the thermal impedance from junction to case R θJC and case to ambient. E. The static characteristics in Figures 1 to 6 are obtained using