EK68
Evaluation Kit
APPLICABLE PARTS (SOLD SEPARATELY)
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PA162DK
INTRODUCTION
Fast and easy breadboarding of circuits using the PA162DK is possible with the EK68 evaluation kit. The
EK68 includes the EVAL68 board. The use of EVAL68 allows for a large area of breadboarding space to work
with while allowing for the surface mount installation of PA162DK. The PA162DK amplifier may be mounted
directly to the EVAL68. The EK68 is designed for mounting of the PA162DK without the need to solder attach
the device terminals. The HS33 heat sink is designed to hold the part in place while providing thermal control
and electrical contact simultaneously. The obvious advantage is the ease of removal and replacement of the
PA162DK as required. External connection to the evaluation board can be made via the terminals at the edge
of the circuit board.
Figure 1: PCB Layout
6.00
TOP VIEW
INPUT GND
IN-A
IN-B
BNC_B
-VS
C7
C8
C2
C3
IN-C
BNC_C
-IN
+IN
+IN
-IN
-IN
+IN
+IN
-IN
OUT(B)
OUT(A)
BNC_A
4.05
OUTPUT GND
C1
C4
C6
C5
-VS
GND
+VS
GND
EVAL68 rev
COMP. SIDE
OUT(C)
OUT(D)
BNC_D
IN-D
+VS
GND
BOTTOM VIEW
www.apexanalog.com
© Apex Microtechnology Inc.
All rights reserved
Dec 2015
EK68U Rev D
EK68
Figure 2: Assembly Diagram for EK68
PARTS LIST
Reference
Part #
Description
EVAL68
Evaluation Board, PA162DK
1
C1, C4, C8, C6
PCE3927CT-ND
CAP, 47uF, 50V
4
C2, C3, C5, C7
1825B105K201NX
Cap, 200V, 1uF, Ceramic
4
HS33
Heat Sink
1
146510CJ
BNC Jacks
4
571-0100
Banana Jacks
4
571-0500
Banana Jacks
3
MS06
Mating Socket
4
QTY
Required #4 hardware and thermal grease not included.
2
EK68U Rev D
EK68
BEFORE YOU GET STARTED
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All Apex amplifiers should be handled using ESD precaution.
Review the Apex product datasheet and operating conditions.
Always provide the appropriate heat sinking. Power dissipation must be considered to ensure maximum
junction temperature (TJ) is not exceeded.
Always use adequate power supply bypass capacitors, Apex recommends at least 10µF per amp of output
current, as well as a 0.1 to 1µF high-quality ceramic capacitor between the power supplies and ground.
Do not change connections while the circuit is powered
In case -Vs is disconnected before +Vs, a diode between -Vs and ground is recommended to avoid damage.
Initially set all power supplies to the minimum operating levels allowed in the product datasheet.
Check for oscillations.
ASSEMBLY
The PA162DK and capacitors are surface mount components and should be assembled to the EVAL68
using surface mount processes. Solder paste may be dispensed or screen-printed on the DUT pads. If a solder
reflow furnace is not available, a heat plate capable of solder reflow temperatures may be used. The heat
slug on the back of the PA162DK provides maximum heat dissipation capabilities when in direct contact to
the heat sink. Thermal grease should be used when mounting the heat sink to the evaluation board. Mating
sockets strips are provided to facilitate adding additional components as required. Please use care when handling and assembling the PA162DK. Make certain that the package pin to pad alignment is correct and that
the pins are seated on each pad. The PA162DK heat slug and heat sink must be electrically connected to the
most negative power supply potential (-Vs).
Note: All grounds must be tied together on the EVAL68 board.
NEED TECHNICAL HELP? CONTACT APEX SUPPORT!
For all Apex Microtechnology product questions and inquiries, call toll free 800-546-2739 in North America. For
inquiries via email, please contact apex.support@apexanalog.com. International customers can also request
support by contacting their local Apex Microtechnology Sales Representative. To find the one nearest to you,
go to www.apexanalog.com
IMPORTANT NOTICE
Apex Microtechnology, Inc. has made every effort to insure the accuracy of the content contained in this document. However, the information is
subject to change without notice and is provided "AS IS" without warranty of any kind (expressed or implied). Apex Microtechnology reserves the right
to make changes without further notice to any specifications or products mentioned herein to improve reliability. This document is the property of
Apex Microtechnology and by furnishing this information, Apex Microtechnology grants no license, expressed or implied under any patents, mask
work rights, copyrights, trademarks, trade secrets or other intellectual property rights. Apex Microtechnology owns the copyrights associated with the
information contained herein and gives consent for copies to be made of the information only for use within your organization with respect to Apex
Microtechnology integrated circuits or other products of Apex Microtechnology. This consent does not extend to other copying such as copying for
general distribution, advertising or promotional purposes, or for creating any work for resale.
APEX MICROTECHNOLOGY PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN PRODUCTS USED FOR LIFE
SUPPORT, AUTOMOTIVE SAFETY, SECURITY DEVICES, OR OTHER CRITICAL APPLICATIONS. PRODUCTS IN SUCH APPLICATIONS ARE UNDERSTOOD TO BE
FULLY AT THE CUSTOMER OR THE CUSTOMER’S RISK.
Apex Microtechnology, Apex and Apex Precision Power are trademarks of Apex Microtechnology, Inc. All other corporate names noted herein may be
trademarks of their respective holders.
EK68U Rev D
3
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