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3090R-681J

3090R-681J

  • 厂商:

    API

  • 封装:

    IND-2P_2.54X2.54MM_SM

  • 描述:

    680 nH 无屏蔽 电感器 390 mA 500 毫欧最大 2-SMD

  • 详情介绍
  • 数据手册
  • 价格&库存
3090R-681J 数据手册
F R NG TI ) RA A T (m EN UM RR IM CE CU X MA TAN S) S SI HM RE M (O DC U ) M XI Hz (M MA M MU NI ) MI F Hz (M SR Y NC UE M EQ FR MU NI ST MI TE Q E NC RA LE TO H) (µ CE AN CT DU R* IN Actual Size Physical Parameters Inches A 0.050 Max. B 0.100±0.010 C 0.100±0.010 D 0.050 Min. E 0.015 Min. (Typ.) F 0.020 Max. (Typ.) Millimeters 1.27 Max. 2.54±0.254 2.54±0.254 1.27 Min. 0.38 Min. (Typ.) 0.51 Max. (Typ.) Current Rating at 90°C Ambient 35°C Rise Operating Temperature Range –55°C to +125°C Maximum Power Dissipation at 90°C 0.105 W Core Material Powdered iron core for improved temperature stability. Mechanical Configuration Units are epoxy encapsulated. Contact area for reflow soldering are gold plated per MIL-G-45204 Type 1 Grade A. Internal connections are thermal compression bonded. E MB NU Micro i® Low Profile Chip Inductors -100M -150M -220M -330K -390K -470K -560K -680K -820K -101K -121K -151K -181K -221K -271K -331K -391K -471K -561K -681K -821K -102K -122K -152K -182K -222K -272K -332K -392K -472K -562K -682K -822K -103K 0.010 0.015 0.022 0.033 0.039 0.047 0.056 0.068 0.082 0.10 0.12 0.15 0.18 0.22 0.27 0.33 0.39 0.47 0.56 0.68 0.82 1.00 1.20 1.50 1.80 2.20 2.70 3.30 3.90 4.70 5.60 6.80 8.20 10.0 SERIES 3090 IRON CORE ± 20% 42 50.0 1000 ± 20% 42 50.0 1000 ± 20% 40 50.0 1000 ± 10% 40 50.0 900 ± 10% 40 50.0 900 ± 10% 38 50.0 900 ± 10% 35 50.0 800 ± 10% 30 50.0 700 ± 10% 25 50.0 650 ± 10% 32 25.0 510 ± 10% 32 25.0 410 ± 10% 32 25.0 370 ± 10% 32 25.0 330 ± 10% 34 25.0 300 ± 10% 34 25.0 250 ± 10% 34 25.0 220 ± 10% 34 25.0 200 ± 10% 34 25.0 180 ± 10% 34 25.0 160 ± 10% 30 25.0 140 ± 10% 28 25.0 120 ± 10% 24 25.0 100 ± 10% 24 7.9 95 ± 10% 24 7.9 90 ± 10% 24 7.9 85 ± 10% 25 7.9 80 ± 10% 25 7.9 70 ± 10% 25 7.9 65 ± 10% 25 7.9 60 ± 10% 24 7.9 55 ± 10% 22 7.9 53 ± 10% 22 7.9 50 ± 10% 22 7.9 45 ± 10% 20 7.9 40 0.095 0.115 0.140 0.185 0.100 0.110 0.135 0.16 0.19 0.08 0.10 0.12 0.14 0.16 0.20 0.25 0.30 0.36 0.45 0.50 0.60 0.70 1.10 1.20 1.25 1.30 1.50 1.90 2.30 3.00 3.50 4.00 4.50 5.00 s or ct du In 3090R 3090 SH DA SERIES 890 810 765 640 870 830 750 690 630 970 870 795 765 690 615 550 500 460 410 390 355 330 265 250 245 240 225 200 180 160 145 135 130 120 Optional Tolerances: J = 5% H = 3% G = 2% F = 1% *Complete part # must include series # PLUS the dash # Termination Finish Options Standard: Gold over Nickel. For Tin/Lead over Nickel: Add suffix “S” to part number and allow an additional .010 inch for maximum height. For RoHS, order 3090R - XXXKS. Notes 1) Designed specifically for reflow soldering and other high temperature processes with metalized edges to exhibit solder fillet. 2) Self Resonant Frequency (SRF) values 250 MHz and above are calculated and for reference only. Packaging Tape & reel (8mm): 7" reel, 2000 pieces max.; 13" reel, 8000 pieces max. MIL-PRF-83446 (Reference) for testing methods only. Made in the U.S.A. 270 Quaker Rd., East Aurora NY 14052 • Phone 716-652-3600 • Fax 716-652-4814 • E-mail: apisales@delevan.com • www.delevan.com 8/2021
3090R-681J
- 物料型号:例如4590R-225K - 器件简介:Micro i®低剖面芯片电感器,具有粉末铁芯,提高温度稳定性 - 引脚分配:文档未明确提供引脚分配信息 - 参数特性:包括最小自谐振频率、最小Q值测试频率、最大直流电阻、最大电流额定值、尺寸参数等 - 功能详解:设计用于回流焊接和其他高温工艺,具有金属化边缘以展示焊料填充 - 应用信息:适用于需要高温稳定性的应用 - 封装信息:环氧树脂封装,回流焊接接触区域为MIL-G-45204 Type 1 Grade A镀金,内部连接为热压缩键合 - 封装选项:标准为镍上金,可选锡/铅上镍,RoHS版本为3090R-XXXKS - 包装:胶带和卷轴(8mm),7英寸卷轴最多2000件,13英寸卷轴最多8000件
3090R-681J 价格&库存

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