132-PGM13072-30

P/N 95-132I25 JEDEC 132-Position QFP-to-PGA Adapter 0.025 [0.64] Pitch FEATURES • Convert surface-mount QFP packages to a 13x13 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact. • Consult factory for Panelized Form or for mounting of consigned chips. GENERAL SPECIFICATIONS • ADAPTOR BODY: FR-4 with 1-oz. Cu traces • PADS: Bare Cu protected with Entek® by Enthone or immersion white Sn to eliminate coplanarity concerns and solder bridges associated with hot air solder leveling • PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M • PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290 • OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ORDERING INFORMATION P/N 95132125 QFP-to-PGA 13x13 Adapter P/N 995132125-P QFP-to-PGA 13x13 Panilized Form P/N 132PGM13072-30 QFP-to-PGA 13x13 Wire Wrap • SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. • Will plug into standard PGA socket ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED ROW-TO-ROW AND PIN-TO-PIN ±0.003 [±0.08] CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 WWW.ARIESELEC.COM • INFO@ARIESELEC.COM PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED 18017 Rev. AA