32-655000-10

Series 655000 TSOP-to-DIP 0.600 [15.24] Adapter FEATURES • Designed to allow user to cut 32-position adapter down to any size desired. • Pins are mechanically fastened and soldered to board using Aries’ patented process, creating a reliable electrical connection and rugged contact. GENERAL SPECIFICATIONS • ADAPTER BODY: FR-4 with 1-oz. Cu traces • PADS: bare Cu protected with Entek® by Enthone or immersion white Sn to eliminate coplanarity concerns and solder bridges associated with hot air solder leveling • PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M • PIN PLATING: 200µ [5.08µ] Sn/Pb 93/7 per ASTM B579-73 over 100µ [2.54µ] CUSTOMIZATION: In addition to the standard products shown Ni per SAE AMS-QQ-N-290 on this page, Aries specializes in custom design and production. • OPERATING TEMPERATURE: 221°F [105°C] Special materials, platings, sizes, and configurations can be MOUNTING CONSIDERATIONS • SUGGESTED PCB HOLE SIZE: 0.028 ±0.003 [0.71 ±0.08] dia. • Will plug into standard IC sockets ALL DIMENSIONS: INCHES [MILLIMETERS] ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ORDERING INFORMATION 32-655000-10 32-655000-10-P for Panelized Version Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 WWW.ARIESELEC.COM • INFO@ARIESELEC.COM PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED 18041 Rev. AA