APM0882-P29

plerowTM APM0882-P29 High OIP3 Medium Power Amplifier Module Features · S21 = 32.3 dB @ 869 MHz = 31.7 dB @ 894 MHz · NF of 6.6 dB over Frequency · Unconditionally Stable · Single 5V Supply · High OIP3 @ Low Current Description The plerowTM APM-Series is an internally matched amplifier mini-module for such application band in SMD package with the output P1dB of 29 dBm. It is compactly designed for low current consumption and high OIP3. Integrating all the components for biasing and matching within the module enhances production yield and throughput as well. It passes through the stringent DC, RF, and reliability tests. Not sample test but 100% quality control test is made before packing. Specifications (in Production) Typ. @ T = 25°C, Vs = 5 V, Freq. = 882 MHz, Zo.sys = 50 ohm Parameter Frequency Range Gain Gain Flatness Noise Figure Output IP3 S11 / S22 (1) (2) Unit MHz dB dB dB dBm dB dBm Specifications Min 869 31 32 ± 0.3 6.6 44 28 47 -15 / -9 29 370 5 50 C.W 23 ~ 25 (before fail) Surface Mount Type, 10Wx10Lx3.8H 400 ± 0.5 7.0 Typ Max 894 1-stage Single Type More Information Website: www.asb.co.kr E-mail: sales@asb.co.kr Tel: (82) 42-528-7223 Fax: (82) 42-528-7222 ASB Inc., 4th Fl. Venture Town Bldg., 367-17 Goijeong-Dong, Seo-Gu, Daejon 302-716, Korea Output P1dB Switching Time Supply Current Supply Voltage Impedance Max. RF Input Power Package Type & Size (3) µsec mA V Ω dBm mm Operating temperature is -40°C to +85°C. 1) OIP3 is measured with two tones at an output power of 12 dBm / tone separated by 1 MHz. 2) S11/S22 (max) is the worst value within the frequency band. 3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS. Outline Drawing (Unit: mm) plerow APM0882-P29 Pin Number 2 5 6 (Bottom View) Function RF In RF Out Vs Ground ASB Inc. (Top View) Solder Stencil Area Others (Side View) Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side. Ø0.3 plated thru holes to ground plane 2 x Ø2.0 plated thru holes to screw on heat sinker (Recommended Footprint) 1/5 www.asb.co.kr February 2009 plerowTM APM0882-P29 High OIP3 Medium Power Amplifier Module S-parameters Typical Performance (Measured) Tx 869~894 +5 V Stability Factor (K) Noise Figure OIP3 P1dB 2/5 www.asb.co.kr February 2009 plerowTM APM0882-P29 High OIP3 Medium Power Amplifier Module Output Channel Power (@ ACLR=-45dBc, +/-5MHz Offset) OIP3 vs Output Power (@ 1MHz offset, 1-tone power) ACLR vs Channel Power ** Test Source : Agilent E4433B (3GPP W-CDMA Test Model-1 64DPCH) 3/5 www.asb.co.kr February 2009 plerowTM APM0882-P29 High OIP3 Medium Power Amplifier Module Application Circuit VS + - Tantal or MLC (Multi Layer Ceramic) Capacitor C1 IN C2 APM OUT 1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced from the DC supply. The capacitance value may be determined by customer’s DC supply status. The capacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for the best electrical performance. DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are included inside the APM module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency. 2) Recommended Soldering Reflow Process Evaluation Board Layout Vs 260°C Ramp-up (3˚C/sec) 200°C 20~40 sec Ramp-down (6°C/sec) IN OUT 150°C 60~180 sec Size 40x40mm (for APM Series – 10x10mm) 4/5 www.asb.co.kr February 2009 plerowTM APM0882-P29 High OIP3 Medium Power Amplifier Module Channel Power vs. ACLR Test Configuration APM0882 – P29 Evaluation Board attached with Heat Sink Evaluation Board * In order to prevent damage of D.U.T (APM-Series) from heating, you must to use a properly sized heat sink for testing a module. 5/5 www.asb.co.kr February 2009