AT16C16

Features • Fast Read Access Time - 150 ns • Fast Byte Write - 200 µs or 1 ms • Self-Timed Byte Write Cycle – Internal Address and Data Latches – Internal Control Timer – Automatic Clear Before Write Direct Microprocessor Control – DATA POLLING Low Power – 30 mA Active Current – 100 µA CMOS Standby Current High Reliability – Endurance: 104 or 105 Cycles – Data Retention: 10 Years 5V ± 10% Supply CMOS & TTL Compatible Inputs and Outputs JEDEC Approved Byte Wide Pinout Commercial and Industrial Temperature Ranges • • • • • • • 16K (2K x 8) Parallel EEPROMs AT28C16 Description The AT28C16 is a low-power, high-performance Electrically Erasable and Programmable Read Only Memory with easy to use features. The AT28C16 is a 16K memory organized as 2,048 words by 8 bits. The device is manufactured with Atmel’s reliable (continued) nonvolatile CMOS technology. Pin Configurations Pin Name A0 - A10 CE OE WE I/O0 - I/O7 NC DC Function Addresses Chip Enable Output Enable Write Enable Data Inputs/Outputs No Connect Don’t Connect PLCC Top View A7 NC NC DC VCC WE NC A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 GND PDIP SOIC , Top View 1 2 3 4 5 6 7 8 9 10 11 12 24 23 22 21 20 19 18 17 16 15 14 13 VCC A8 A9 WE OE A10 CE I/O7 I/O6 I/O5 I/O4 I/O3 I/O1 I/O2 GND DC I/O3 I/O4 I/O5 14 15 16 17 18 19 20 A6 A5 A4 A3 A2 A1 A0 NC I/O0 5 6 7 8 9 10 11 12 13 4 3 2 1 32 31 30 29 28 27 26 25 24 23 22 21 A8 A9 NC NC OE A10 CE I/O7 I/O6 Note: PLCC package pins 1 and 17 are DON’T CONNECT. Rev. 0540B–10/98 1 The AT28C16 is accessed like a static RAM for the read or write cycles without the need of external components. During a byte write, the address and data are latched internally, freeing the microprocessor address and data bus for other operations. Following the initiation of a write cycle, the device will go to a busy state and automatically clear and write the latched data using an internal control timer. The end of a write cycle can be determined by DATA POLLING of I/O7. Once the end of a write cycle has been detected, a new access for a read or a write can begin. The CMOS technology offers fast access times of 150 ns at low power dissipation. When the chip is deselected the standby current is less than 100 µA. Atmel’s 28C16 has additional features to ensure high quality and manufacturability. The device utilizes error correction internally for extended endurance and for improved data retention characteristics. An extra 32 bytes of EEPROM are available for device identification or tracking. Block Diagram Absolute Maximum Ratings* Temperature Under Bias ................................ -55°C to +125°C Storage Temperature ..................................... -65°C to +150°C All Input Voltages (including NC Pins) with Respect to Ground ...................................-0.6V to +6.25V All Output Voltages with Respect to Ground .............................-0.6V to VCC + 0.6V Voltage on OE and A9 with Respect to Ground ...................................-0.6V to +13.5V *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability 2 AT28C16 AT28C16 Device Operation READ: The AT28C16 is accessed like a Static RAM. When CE and OE are low and WE is high, the data stored at the memory location determined by the address pins is asserted on the outputs. The outputs are put in a high impedance state whenever CE or OE is high. This dual line control gives designers increased flexibility in preventing bus contention. BYTE WRITE: Writing data into the AT28C16 is similar to writing into a Static RAM. A low pulse on the WE or CE input with OE h igh and CE or WE l ow (respectively) initiates a byte write. The address location is latched on the last falling edge of WE (or CE); the new data is latched on the first rising edge. Internally, the device performs a selfclear before write. Once a byte write has been started, it will automatically time itself to completion. Once a programming operation has been initiated and for the duration of tWC, a read operation will effectively be a polling operation. FAST BYTE WRITE: The AT28C16E offers a byte write time of 200 µ s maximum. This feature allows the entire device to be rewritten in 0.4 seconds. DATA POLLING: The AT28C16 provides DATA POLLING to signal the completion of a write cycle. During a write cycle, an attempted read of the data being written results in the complement of that data for I/O7 (the other outputs are indeterminate). When the write cycle is finished, true data appears on all outputs. WRITE PROTECTION: Inadvertent writes to the device are protected against in the following ways: (a) V C C sense—if VCC is below 3.8V (typical) the write function is inhibited; (b) VCC power on delay—once VCC has reached 3.8V the device will automatically time out 5 ms (typical) before allowing a byte write; and (c) write inhibit—holding any one of OE low, CE high or WE high inhibits byte write cycles. CHIP CLEAR: The contents of the entire memory of the AT28C16 may be set to the high state by the CHIP CLEAR operation. By setting CE low and OE to 12 volts, the chip is cleared when a 10 msec low pulse is applied to WE. D E V I C E I DE NT I F I C A T I O N : A n e x t r a 3 2 b y t e s o f EEPROM memory are available to the user for device identification. By raising A9 to 12 ± 0 .5V and using address locations 7E0H to 7FFH the additional bytes may be written to or read from in the same manner as the regular memory array. 3 DC and AC Operating Range AT28C16-15 Operating Temperature (Case) VCC Power Supply Com. Ind. 0°C - 70°C -40°C - 85°C 5V ± 10% Operating Modes Mode Read Write (2) CE VIL VIL VIH X X X VIL OE VIL VIH X (1) WE VIH VIL X VIH X X VIL I/O DOUT DIN High Z Standby/Write Inhibit Write Inhibit Write Inhibit Output Disable Chip Erase Notes: 1. X can be VIL or VIH. 2. Refer to AC Programming Waveforms. 3. VH = 12.0V ± 0.5V X VIL VIH VH (3) High Z High Z DC Characteristics Symbol ILI ILO ISB1 ISB2 Parameter Input Load Current Output Leakage Current VCC Standby Current CMOS VCC Standby Current TTL Condition VIN = 0V to VCC + 1V VI/O = 0V to VCC CE = VCC - 0.3V to VCC + 1.0V Com. CE = 2.0V to VCC + 1.0V f = 5 MHz; IOUT = 0 mA CE = VIL Ind. Com. Ind. Min Max 10 10 100 2 3 30 45 0.8 2.0 IOL = 2.1 mA IOH = -400 µA 2.4 .4 Units µA µA µA mA mA mA mA V V V V ICC VIL VIH VOL VOH VCC Active Current AC Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage 4 AT28C16 AT28C16 AC Read Characteristics AT28C16-15 Symbol tACC tCE (1) (2) Parameter Address to Output Delay CE to Output Delay OE to Output Delay CE or OE High to Output Float Output Hold from OE, CE or Address, whichever occurred first Min Max 150 150 Units ns ns ns ns ns tOE 10 0 0 70 50 tDF(3)(4) tOH AC Read Waveforms(1)(2)(3)(4) Notes: 1. CE may be delayed up to tACC - tCE after the address transition without impact on tACC. 2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE or by tACC - tOE after an address change without impact on tACC. 3. tDF is specified from OE or CE whichever occurs first (CL = 5 pF). 4. This parameter is characterized and is not 100% tested. Input Test Waveforms and Measurement Level Output Test Load tR, tF < 20 ns Pin Capacitance f = 1 MHz, T = 25°C(1) Symbol CIN COUT Note: Typ 4 8 Max 6 12 Units pF pF Conditions VIN = 0V VOUT = 0V 1. This parameter is characterized and is not 100% tested. 5 AC Write Characteristics Symbol tAS, tOES tAH tWP tDS tDH, tOEH tCS, tCH tWC Parameter Address, OE Set-up Time Address Hold Time Write Pulse Width (WE or CE) Data Set-up Time Data, OE Hold Time CE to WE and WE to CE Set-up and Hold Time AT28C16 Write Cycle Time AT28C16E 100 200 Min 10 50 100 50 10 0 0.5 1.0 1000 Typ Max Units ns ns ns ns ns ns ms µs AC Write Waveforms WE Controlled CE Controlled 6 AT28C16 AT28C16 Data Polling Characteristics(1) Symbol tDH tOEH tOE tWR Notes: Parameter Data Hold Time OE Hold Time OE to Output Delay (2) Min 10 10 Typ Max Units ns ns ns Write Recovery Time 1. These parameters are characterized and not 100% tested. 2. See AC Characteristics. 0 ns Data Polling Waveforms Chip Erase Waveforms tS = tH = 1 µsec (min.) tW = 10 msec (min.) VH = 12.0V ± 0.5V 7 8 AT28C16 AT28C16 Ordering Information(1) tACC (ns) 150 ICC (mA) Active 30 Standby 0.1 Ordering Code AT28C16(E)-15JC AT28C16(E)-15PC AT28C16(E)-15SC AT28C16(E)-15JI AT28C16(E)-15PI AT28C16(E)-15SI Package 32J 24P6 24S 32J 24P6 24S Operation Range Commercial (0°C to 70°C) Industrial (-40°C to 85°C) 45 0.1 Notes: 1. See Valid Part Numbers table below. 2. The 28C16 200 ns and 250 ns speed selections have been removed from valid selections table and are replaced by the faster 150 ns TAA offering. 3. The 28C16 ceramic package offerings have been removed. New designs should utilize the 28C256 ceramic offerings. Valid Part Numbers The following table lists standard Atmel products that can be ordered. Device Numbers AT28C16 AT28C16E AT28C16 Speed 15 15 Package and Temperature Combinations JC, JI, PC, PI, SC, SI JC, JI, PC, PI, SC, SI W Die Products Reference Section: Parallel EEPROM Die Products Package Type 32J 24P6 24S W 32 Lead, Plastic J-Leaded Chip Carrier (PLCC) 24 Lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 24 Lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC) Die Options Blank E Standard Device: Endurance = 10K Write Cycles; Write Time = 1 ms High Endurance Option: Endurance = 100K Write Cycles; Write Time = 200 µs 9 Packaging Information 32J, 32-Lead, Plastic J-Leaded Chip Carrier (PLCC) Dimensions in Inches and (Millimeters) JEDEC STANDARD MS-018 AA 24P6, 24-Lead, 0.600” Wide, Plastic Dual Inline Package (PDIP) Dimensions in Inches and (Millimeters) JEDEC STANDARD MS-011 AA .045(1.14) X 45° PIN NO. 1 IDENTIFY .025(.635) X 30° - 45° .012(.305) .008(.203) .530(13.5) .490(12.4) .021(.533) .013(.330) .030(.762) .015(3.81) .095(2.41) .060(1.52) .140(3.56) .120(3.05) 1.27(32.3) 1.24(31.5) PIN 1 .032(.813) .026(.660) .553(14.0) .547(13.9) .595(15.1) .585(14.9) .566(14.4) .530(13.5) .050(1.27) TYP 1.100(27.94) REF .220(5.59) MAX SEATING PLANE .161(4.09) .125(3.18) .110(2.79) .090(2.29) .065(1.65) .041(1.04) .630(16.0) .590(15.0) 0 REF 15 .690(17.5) .610(15.5) .090(2.29) MAX .005(.127) MIN .300(7.62) REF .430(10.9) .390(9.90) AT CONTACT POINTS .065(1.65) .015(.381) .022(.559) .014(.356) .022(.559) X 45° MAX (3X) .453(11.5) .447(11.4) .495(12.6) .485(12.3) .012(.305) .008(.203) 24S, 24-Lead, 0.300” Wide, Plastic Gull Wing Small Outline (SOIC) Dimensions in Inches and (Millimeters) .020(.508) .013(.330) .299(7.60) .420(10.7) .291(7.39) .393(9.98) PIN 1 ID .050(1.27) BSC .616(15.6) .598(15.2) .105(2.67) .092(2.34) .012(.305) .003(.076) .013(.330) .009(.229) 0 REF 8 .050(1.27) .015(.381) 10 AT28C16 AT28C16 11 Atmel Headquarters Corporate Headquarters 2325 Orchard Parkway San Jose, CA 95131 TEL (408) 441-0311 FAX (408) 487-2600 Atmel Operations Atmel Colorado Springs 1150 E. 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