AT17LV128-10JI

Features • EE Programmable 65,536 x 1-, 131,072 x 1-, 262,144 x 1-, 524,288 x 1-, 1,048,576 x 1-, 2,097,152 x 1-, and 4,194,304 x 1-bit Serial Memories Designed to Store Configuration Programs for Field Programmable Gate Arrays (FPGAs) Supports both 3.3V and 5.0V Operating Voltage Applications In-System Programmable (ISP) via Two-Wire Bus Simple Interface to SRAM FPGAs Compatible with Atmel AT6000, AT40K and AT94K Devices, Altera® FLEX®, APEX™ Devices, ORCA®, Xilinx® XC3000, XC4000, XC5200, Spartan®, Virtex® FPGAs Cascadable Read-back to Support Additional Configurations or Higher-density Arrays Very Low-power CMOS EEPROM Process Programmable Reset Polarity Available in 6 mm x 6 mm x 1 mm 8-lead LAP (Pin-compatible with 8-lead SOIC/VOIC Packages), 8-lead PDIP, 8-lead SOIC, 20-lead PLCC, 20-lead SOIC and 44-lead TQFP Packages Emulation of Atmel’s AT24CXXX Serial EEPROMs Low-power Standby Mode High-reliability – Endurance: 100,000 Write Cycles – Data Retention: 90 Years for Industrial Parts (at 85° C) and 190 Years for Commercial Parts (at 70° C) Green (Pb/Halide-free/RoHS Compliant) Package Options Available • • • • • • • • • • • FPGA Configuration EEPROM Memory AT17LV65 AT17LV128 AT17LV256 AT17LV512 AT17LV010 AT17LV002 AT17LV040 3.3V and 5V System Support • 1. Description The AT17LV series FPGA Configuration EEPROMs (Configurators) provide an easyto-use, cost-effective configuration memory for Field Programmable Gate Arrays. The AT17LV series device is packaged in the 8-lead LAP, 8-lead PDIP, 8-lead SOIC, 20lead PLCC, 20-lead SOIC and 44-lead TQFP, see Table 1-1. The AT17LV series Configurators uses a simple serial-access procedure to configure one or more FPGA devices. The user can select the polarity of the reset function by programming four EEPROM bytes. These devices also support a write-protection mechanism within its programming mode. The AT17LV series configurators can be programmed with industry-standard programmers, Atmel’s ATDH2200E Programming Kit or Atmel’s ATDH2225 ISP Cable. 2321I–CNFG–2/08 Table 1-1. AT17LV Series Packages AT17LV65/ AT17LV128/ AT17LV256 Yes Yes Yes Yes Yes(2) – AT17LV512/ AT17LV010 Yes Yes Use 8-lead LAP(1) Yes Yes(2) – Package 8-lead LAP 8-lead PDIP 8-lead SOIC 20-lead PLCC 20-lead SOIC 44-lead TQFP Notes: AT17LV002 Yes – Use 8-lead LAP(1) Yes Yes(2) Yes AT17LV040 (3) – (3) – – Yes 1. The 8-lead LAP package has the same footprint as the 8-lead SOIC. Since an 8-lead SOIC package is not available for the AT17LV512/010/002 devices, it is possible to use an 8-lead LAP package instead. 2. The pinout for the AT17LV65/128/256 devices is not pin-for-pin compatible with the AT17LV512/010/002 devices. 3. Refer to the AT17Fxxx datasheet, available on the Atmel web site. 2. Pin Configuration Figure 2-1. 8-lead LAP DATA CLK (1) (WP ) RESET/OE CE 1 2 3 4 8 7 6 5 VCC SER_EN CEO (A2) GND Figure 2-2. 8-lead SOIC DATA CLK (WP(1)) RESET/OE CE 1 2 3 4 8 7 6 5 VCC SER_EN CEO (A2) GND Figure 2-3. 8-lead PDIP DATA CLK (WP(1)) RESET/OE CE 1 2 3 4 8 7 6 5 VCC SER_EN CEO (A2) GND 2 AT17LV65/128/256/512/010/002/040 2321I–CNFG–2/08 AT17LV65/128/256/512/010/002/040 Figure 2-4. 20-lead PLCC NC DATA NC VCC NC 3 2 1 20 19 Notes: 1. This pin is only available on AT17LV65/128/256 devices. 2. This pin is only available on AT17LV512/010/002 devices. 3. The CEO feature is not available on the AT17LV65 device. Figure 2-5. 20-lead SOIC(1) NC DATA NC CLK NC RESET/OE NC CE NC GND 1 2 3 4 5 6 7 8 9 10 NC GND NC NC NC 9 10 11 12 13 CLK (WP1(2)) NC (WP(1)) RESET/OE (WP2(2)) NC CE 4 5 6 7 8 18 17 16 15 14 NC SER_EN NC NC (READY(2)) CEO (A2) 20 19 18 17 16 15 14 13 12 11 VCC NC NC SER_EN NC NC CEO (A2) NC NC NC Note: 1. This pinout only applies to AT17LV65/128/256 devices. 3 2321I–CNFG–2/08 Figure 2-6. 20-lead SOIC(1) DATA NC CLK NC NC NC NC RESET/OE NC CE 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VCC NC SER_EN NC NC NC NC CEO NC GND Notes: 1. This pinout only applies to AT17LV512/010/002 devices. 2. The CEO feature is not available on the AT17LV65 device. Figure 2-7. 44 TQFP NC CLK NC NC DATA NC VCC NC NC SER_EN NC 44 43 42 41 40 39 38 37 36 35 34 NC NC NC NC NC NC (WP1(1)) NC NC NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 33 32 31 30 29 28 27 26 25 24 23 NC NC NC NC NC NC NC NC NC NC READY Note: 1. This pin is only available on AT17LV002 devices. 4 AT17LV65/128/256/512/010/002/040 2321I–CNFG–2/08 NC RESET/OE NC CE NC NC GND NC NC CEO(A2) NC AT17LV65/128/256/512/010/002/040 Figure 2-8. Block Diagram SER_EN WP1(2) WP2(2) POWER ON RESET READY (2) (1) Notes: 1. This pin is only available on AT17LV65/128/256 devices. 2. This pin is only available on AT17LV512/010/002 devices. 3. The CEO feature is not available on the AT17LV65 device. 5 2321I–CNFG–2/08 3. Device Description The control signals for the configuration EEPROM (CE, RESET/OE and CCLK) interface directly with the FPGA device control signals. All FPGA devices can control the entire configuration process and retrieve data from the configuration EEPROM without requiring an external intelligent controller. The configuration EEPROM RESET/OE and CE pins control the tri-state buffer on the DATA output pin and enable the address counter. When RESET/OE is driven High, the configuration EEPROM resets its address counter and tri-states its DATA pin. The CE pin also controls the output of the AT17LV series configurator. If CE is held High after the RESET/OE reset pulse, the counter is disabled and the DATA output pin is tri-stated. When OE is subsequently driven Low, the counter and the DATA output pin are enabled. When RESET/OE is driven High again, the address counter is reset and the DATA output pin is tri-stated, regardless of the state of CE. When the configurator has driven out all of its data and CEO is driven Low, the device tri-states the DATA pin to avoid contention with other configurators. Upon power-up, the address counter is automatically reset. This is the default setting for the device. Since almost all FPGAs use RESET Low and OE High, this document will describe RESET/OE. 4. Pin Description AT17LV65/ AT17LV128/ AT17LV256 8 DIP/ LAP/ SOIC 1 2 – 3 8 DIP/ LAP 1 2 – 3 – 4 5 O 6 A2 READY SER_EN VCC I O I – 7 8 – 17 20 – 17 20 – 7 8 15 17 20 14 14 6 14 – – 18 20 – 7 8 15 17 20 8 10 8 10 4 5 AT17LV512/ AT17LV010 8 DIP/ LAP/ SOIC 1 2 – 3 – 4 5 6 AT17LV002 AT17LV040 Name DATA CLK WP1 RESET/OE WP2 CE GND CEO I/O I/O I I I I I 20 PLCC 2 4 – 6 20 SOIC 2 4 – 6 20 PLCC 2 4 5 6 7 8 10 20 SOIC 1 3 – 8 – 10 11 13 20 PLCC 2 4 5 6 7 8 10 14 20 SOIC 1 3 – 8 – 10 11 13 44 TQFP 40 43 – 13 – 15 18 21 44 TQFP 40 43 – 13 – 15 18 21 23 35 38 – – 18 20 23 35 38 Note: 1. The CEO feature is not available on the AT17LV65 device. 6 AT17LV65/128/256/512/010/002/040 2321I–CNFG–2/08 AT17LV65/128/256/512/010/002/040 4.1 DATA Three-state DATA output for configuration. Open-collector bi-directional pin for programming. 4.2 CLK Clock input. Used to increment the internal address and bit counter for reading and programming. 4.3 WP1 WRITE PROTECT (1). Used to protect portions of memory during programming. Disabled by default due to internal pull-down resistor. This input pin is not used during FPGA loading operations. This pin is only available on AT17LV512/010/002 devices. 4.4 RESET/OE Output Enable (active High) and RESET (active Low) when SER_EN is High. A Low level on RESET/OE resets both the address and bit counters. A High level (with CE Low) enables the data output driver. The logic polarity of this input is programmable as either RESET/OE or RESET/OE. For most applications, RESET should be programmed active Low. This document describes the pin as RESET/OE. 4.5 WP Write protect (WP) input (when CE is Low) during programming only (SER_EN Low). When WP is Low, the entire memory can be written. When WP is enabled (High), the lowest block of the memory cannot be written. This pin is only available on AT17LV65/128/256 devices. 4.6 WP2 WRITE PROTECT (2). Used to protect portions of memory during programming. Disabled by default due to internal pull-down resistor. This input pin is not used during FPGA loading operations. This pin is only available on AT17LV512/010 devices. 4.7 CE Chip Enable input (active Low). A Low level (with OE High) allows CLK to increment the address counter and enables the data output driver. A High level on CE disables both the address and bit counters and forces the device into a low-power standby mode. Note that this pin will n ot enable/disable the device in the Two-Wire Serial Programming mode (SER_EN Low). 4.8 GND Ground pin. A 0.2 µF decoupling capacitor between VCC and GND is recommended. 4.9 CEO Chip Enable Output (active Low). This output goes Low when the address counter has reached its maximum value. In a daisy chain of AT17LV series devices, the CEO pin of one device must be connected to the CE input of the next device in the chain. It will stay Low as long as CE is Low and OE is High. It will then follow CE until OE goes Low; thereafter, CEO will stay High until the entire EEPROM is read again. This CEO feature is not available on the AT17LV65 device. 7 2321I–CNFG–2/08 4.10 A2 Device selection input, A2. This is used to enable (or select) the device during programming (i.e., when SER_EN is Low). A2 has an internal pull-down resistor. 4.11 READY Open collector reset state indicator. Driven Low during power-up reset, released when power-up is complete. It is recommended to use a 4.7 kΩ pull-up resistor when this pin is used. 4.12 SER_EN Serial enable must be held High during FPGA loading operations. Bringing SER_EN L ow enables the Two-Wire Serial Programming Mode. For non-ISP applications, SER_EN should be tied to VCC. 4.13 VCC 3.3V (±10%) and 5.0V (±5% Commercial, ±10% Industrial) power supply pin. 5. FPGA Master Serial Mode Summary The I/O and logic functions of any SRAM-based FPGA are established by a configuration program. The program is loaded either automatically upon power-up, or on command, depending on the state of the FPGA mode pins. In Master mode, the FPGA automatically loads the configuration program from an external memory. The AT17LV Serial Configuration EEPROM has been designed for compatibility with the Master Serial mode. This document discusses the Atmel AT40K, AT40KAL and AT94KAL applications as well as Xilinx applications. 6. Control of Configuration Most connections between the FPGA device and the AT17LV Serial EEPROM are simple and self-explanatory. • The DATA output of the AT17LV series configurator drives DIN of the FPGA devices. • The master FPGA CCLK output drives the CLK input of the AT17LV series configurator. • The CEO output of any AT17LV series configurator drives the CE input of the next configurator in a cascaded chain of EEPROMs. • SER_EN must be connected to VCC (except during ISP). • The READY(1) pin is available as an open-collector indicator of the device’s reset status; it is driven Low while the device is in its power-on reset cycle and released (tri-stated) when the cycle is complete. Note: 1. This pin is not available for the AT17LV65/128/256 devices. 8 AT17LV65/128/256/512/010/002/040 2321I–CNFG–2/08 AT17LV65/128/256/512/010/002/040 7. Cascading Serial Configuration EEPROMs For multiple FPGAs configured as a daisy-chain, or for FPGAs requiring larger configuration memories, cascaded configurators provide additional memory. After the last bit from the first configurator is read, the clock signal to the configurator asserts its CEO output Low and disables its DATA line driver. The second configurator recognizes the Low level on its CE input and enables its DATA output. After configuration is complete, the address counters of all cascaded configurators are reset if the RESET/OE on each configurator is driven to its active (Low) level. If the address counters are not to be reset upon completion, then the RESET/OE input can be tied to its inactive (High) level. The AT17LV65 devices do not have the CEO feature to perform cascaded configurations. 8. AT17LV Series Reset Polarity The AT17LV series configurator allows the user to program the reset polarity as either RESET/OE o r RESET /OE. This feature is supported by industry-standard programmer algorithms. 9. Programming Mode The programming mode is entered by bringing SER_EN Low. In this mode the chip can be programmed by the Two-Wire serial bus. The programming is done at V CC s upply only. Programming super voltages are generated inside the chip. 10. Standby Mode The AT17LV series configurators enter a low-power standby mode whenever CE is asserted High. In this mode, the AT17LV65/128/256 configurator consumes less than 50 µA of current at 3.3V (100 µA for the AT17LV512/010 and 200 µA for the AT17LV002/040). The output remains in a high-impedance state regardless of the state of the OE input. 9 2321I–CNFG–2/08 11. Absolute Maximum Ratings* Operating Temperature................................... -40° C to +85 ° C Storage Temperature .................................... -65 ° C to +150° C Voltage on Any Pin with Respect to Ground ..............................-0.1V to VCC +0.5V Supply Voltage (VCC) .........................................-0.5V to +7.0V Maximum Soldering Temp. (10 sec. @ 1/16 in.)............ 260° C ESD (RZAP = 1.5K, CZAP = 100 pF)................................. 2000V *NOTICE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those listed under operating conditions is not implied. Exposure to Absolute Maximum Rating conditions for extended periods of time may affect device reliability. 12. Operating Conditions 3.3V Symbol Description Commercial VCC Industrial Supply voltage relative to GND -0° C to +70° C Supply voltage relative to GND -40° C to +85° C Min 3.0 3.0 Max 3.6 3.6 Min 4.75 4.5 5V Max 5.25 5.5 Units V V 10 AT17LV65/128/256/512/010/002/040 2321I–CNFG–2/08 AT17LV65/128/256/512/010/002/040 13. DC Characteristics VCC = 3.3V ± 10% AT17LV65/ AT17LV128/ AT17LV256 Symbol VIH VIL VOH VOL VOH VOL ICCA IL ICCS Description High-level Input Voltage Low-level Input Voltage High-level Output Voltage (IOH = -2.5 mA) Low-level Output Voltage (IOL = +3 mA) High-level Output Voltage (IOH = -2 mA) Low-level Output Voltage (IOL = +3 mA) Supply Current, Active Mode Input or Output Leakage Current (VIN = VCC or GND) Commercial Supply Current, Standby Mode Industrial 100 100 150 µA -10 2.4 Industrial 0.4 5 10 50 -10 0.4 5 10 100 -10 0.4 5 10 150 V mA µA µA Commercial 0.4 2.4 0.4 2.4 0.4 V V Min 2.0 0 2.4 Max VCC 0.8 AT17LV512/ AT17LV010 Min 2.0 0 2.4 Max VCC 0.8 AT17LV002/ AT17LV040 Min 2.0 0 2.4 Max VCC 0.8 Units V V V 14. DC Characteristics VCC = 5V ± 5% Commercial; VCC = 5V ± 10% Industrial AT17LV65/ AT17LV128/ AT17LV256 Symbol VIH VIL VOH VOL VOH VOL ICCA IL ICCS Description High-level Input Voltage Low-level Input Voltage High-level Output Voltage (IOH = -2.5 mA) Low-level Output Voltage (IOL = +3 mA) High-level Output Voltage (IOH = -2 mA) Low-level Output Voltage (IOL = +3 mA) Supply Current, Active Mode Input or Output Leakage Current (VIN = VCC or GND) Commercial Supply Current, Standby Mode Industrial 150 200 350 µA -10 3.6 Industrial 0.37 10 10 75 -10 0.37 10 10 200 -10 0.37 10 10 350 V mA µA µA Commercial 0.32 3.76 0.32 3.76 0.32 V V Min 2.0 0 3.7 Max VCC 0.8 AT17LV512/ AT17LV010 Min 2.0 0 3.86 Max VCC 0.8 AT17LV002/ AT17LV040 Min 2.0 0 3.86 Max VCC 0.8 Units V V V 11 2321I–CNFG–2/08 15. AC Waveforms CE TSCE RESET/OE TLC CLK TOE TCE DATA TOH TCAC TOH TDF THC THOE TSCE THCE 16. AC Waveforms when Cascading RESET/OE CE CLK TCDF DATA LAST BIT FIRST BIT TOCK CEO TOCE TOOE TOCE 12 AT17LV65/128/256/512/010/002/040 2321I–CNFG–2/08 AT17LV65/128/256/512/010/002/040 17. AC Characteristics VCC = 3.3V ± 10% AT17LV65/128/256 Commercial Symbol TOE(1) TCE(1) TCAC(1) TOH TDF TLC THC TSCE THCE THOE FMAX (2) AT17LV512/010/002/040 Commercial Min Max 50 55 55 0 55 50 25 25 30 0 25 10 15 25 25 35 0 25 10 0 50 Industrial Min Max 55 60 60 Units ns ns ns ns ns ns ns ns ns ns MHz Industrial Min Max 55 60 80 0 Description OE to Data Delay CE to Data Delay CLK to Data Delay Data Hold from CE, OE, or CLK CE or OE to Data Float Delay CLK Low Time CLK High Time CE Setup Time to CLK (to guarantee proper counting) CE Hold Time from CLK (to guarantee proper counting) OE High Time (guarantees counter is reset) Maximum Clock Frequency Min Max 50 60 75 0 55 25 25 35 0 25 10 25 25 60 0 25 Notes: 1. AC test lead = 50 pF. 2. Float delays are measured with 5 pF AC loads. Transition is measured ± 200 mV from steady-state active levels. 18. AC Characteristics when Cascading VCC = 3.3V ± 10% AT17LV65/128/256 Commercial Symbol TCDF (2) (1) (1) AT17LV512/010/002/040 Commercial Min Max 50 50 35 35 12.5 Industrial Min Max 50 55 40 35 10 Units ns ns ns ns MHz Industrial Min Max 60 60 60 45 8 Description CLK to Data Float Delay CLK to CEO Delay CE to CEO Delay RESET/OE to CEO Delay Maximum Clock Frequency Min Max 60 55 55 40 8 TOCK TOCE TOOE(1) FMAX Notes: 1. AC test lead = 50 pF. 2. Float delays are measured with 5 pF AC loads. Transition is measured ± 200 mV from steady-state active levels. 13 2321I–CNFG–2/08 19. AC Characteristics VCC = 5V ± 5% Commercial; VCC = 5V ± 10% Industrial AT17LV65/128/256 Commercial Symbol TOE(1) TCE(1) TCAC(1) TOH TDF TLC THC TSCE THCE THOE FMAX (2) AT17LV512/010/002/040 Commercial Min Max 30 45 50 0 50 50 20 20 20 0 20 12.5 15 20 20 25 0 20 15 0 50 Industrial Min Max 35 45 50 Units ns ns ns ns ns ns ns ns ns ns MHz Industrial Min Max 35 45 55 0 Description OE to Data Delay CE to Data Delay CLK to Data Delay Data Hold from CE, OE, or CLK CE or OE to Data Float Delay CLK Low Time CLK High Time CE Setup Time to CLK (to guarantee proper counting) CE Hold Time from CLK (to guarantee proper counting) OE High Time (guarantees counter is reset) Maximum Clock Frequency Min Max 30 45 50 0 50 20 20 35 0 20 12.5 20 20 40 0 20 Notes: 1. AC test lead = 50 pF. 2. Float delays are measured with 5 pF AC loads. Transition is measured ± 200 mV from steady-state active levels. 20. AC Characteristics when Cascading VCC = 5V ± 5% Commercial; VCC = 5V ± 10% Industrial AT17LV65/128/256 Commercial Symbol TCDF (2) (1) (1) AT17LV512/010/002/040 Commercial Min Max 50 35 35 30 12.5 Industrial Min Max 50 40 35 30 12.5 Units ns ns ns ns MHz Industrial Min Max 50 40 35 35 10 Description CLK to Data Float Delay CLK to CEO Delay CE to CEO Delay RESET/OE to CEO Delay Maximum Clock Frequency Min Max 50 35 35 30 10 TOCK TOCE TOOE(1) FMAX Notes: 1. AC test lead = 50 pF. 2. Float delays are measured with 5 pF AC loads. Transition is measured ± 200 mV from steady-state active levels. 14 AT17LV65/128/256/512/010/002/040 2321I–CNFG–2/08 AT17LV65/128/256/512/010/002/040 21. Thermal Resistance Coefficients(1) Package Type AT17LV65/ AT17LV128/ AT17LV256 θJC [° C/W] 45 115.71 37 107 45 150 35 90 AT17LV512/ AT17LV010 45 135.71 37 107 – – 35 90 AT17LV002 45 159.60 – – – – 35 90 AT17LV040 – – – – – – – – – – 8CN 4 Leadless Array Package (LAP) θJA [° C/W](2) θJC [° C/W] θJA [° C/W](2) θJC [° C/W] θJA [° C/W](2) θJC [° C/W] θJA [° C/W](2) θJC [° C/W] θJA [° C/W](2) θJC [° C/W] θJA [° C/W](2) 8P3 Plastic Dual Inline Package (PDIP) 8S1 Plastic Gull Wing Small Outline (SOIC) 20J Plastic Leaded Chip Carrier (PLCC) 20S2 Plastic Gull Wing Small Outline (SOIC) – – – – 17 62 17 62 44A Thin Plastic Quad Flat Package (TQFP) Notes: 1. For more information refer to the “Thermal Characteristics of Atmel’s Packages”, available on the Atmel web site. 2. Airflow = 0 ft/min. 15 2321I–CNFG–2/08 Figure 21-1. Ordering Code AT17LV65A-10PC Voltage 3.0V to 5.5V Size (Bits) 65 128 256 512 010 002 040 = 65K = 128K = 256K = 512K = 1M = 2M = 4M Special Pinouts A = Altera Package C P N J S Temperature = 8CN4 C = Commercial = 8P3 = 8S1 = 20J = 20S2 I = Industrial U = Fully Green Blank = Xilinx /Atmel/ Other TQ = 44A BJ = 44J Package Type 8CN4 8P3 8S1 20J 20S2 44A 8-lead, 6 mm x 6 mm x 1 mm, Leadless Array Package (LAP) – Pin-compatible with 8-lead SOIC/VOID Packages 8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 20-lead, Plastic J-leaded Chip Carrier (PLCC) 20-lead, 0.300" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 44-lead, Thin (1.0 mm) Plastic Quad Flat Package Carrier (TQFP) 16 AT17LV65/128/256/512/010/002/040 2321I–CNFG–2/08 AT17LV65/128/256/512/010/002/040 22. Ordering Information 22.1 Standard Package Options Memory Size Ordering Code AT17LV65-10PC AT17LV65-10NC 64-Kbit(1) AT17LV65-10JC AT17LV65-10PI AT17LV65-10NI AT17LV65-10JI AT17LV128-10PC AT17LV128-10NC AT17LV128-10JC 128-Kbit(1) AT17LV128-10SC AT17LV128-10PI AT17LV128-10NI AT17LV128-10JI AT17LV128-10SI AT17LV256-10PC AT17LV256-10NC AT17LV256-10JC 256-Kbit(1) AT17LV256-10SC AT17LV256-10PI AT17LV256-10NI AT17LV256-10JI AT17LV256-10SI AT17LV512-10PC 512-Kbit(1) AT17LV512-10JC AT17LV512-10PI AT17LV512-10JI AT17LV010-10PC 1-Mbit(1) AT17LV010-10JC AT17LV010-10PI AT17LV010-10JI AT17LV002-10JC 2-Mbit(1) AT17LV002-10JI Notes: 20J Package(2)(3) 8P3 8S1 20J 8P3 8S1 20J 8P3 8S1 20J 20S2 8P3 8S1 20J 20S2 8P3 8S1 20J 20S2 8P3 8S1 20J 20S2 8P3 20J 8P3 20J 8P3 20J 8P3 20J 20J Commercial (0° C to 70° C) Industrial (-40° C to 85° C) Commercial (0° C to 70° C) Industrial (-40° C to 85° C) Commercial (0° C to 70° C) Industrial (-40° C to 85° C) Industrial (-40° C to 85° C) Commercial (0° C to 70° C) Industrial (-40° C to 85° C) Commercial (0° C to 70° C) Industrial (-40° C to 85° C) Commercial (0° C to 70° C) Operation Range 1. For operating 5V operating voltage, please refer to the corresponding AC and DC Characteristics. 2. For the -10SC and -10SI packages, customers may migrate to the AT17LVXXX-10SU. 3. For the -10TQC and -10TQI packages, customers may migrate to the AT17LVXXX-10TQU. 17 2321I–CNFG–2/08 22.2 Green Package Options (Pb/Halide-free/RoHS Compliant) Memory Size Ordering Code AT17LV256-10CU AT17LV256-10JU 256-Kbit(1) AT17LV256-10NU AT17LV256-10PU AT17LV256-10SU 512-Kbit(1) AT17LV512-10CU AT17LV512-10JU AT17LV010-10CU 1-Mbit(1) AT17LV010-10JU AT17LV010-10PU AT17LV002-10CU 2-Mbit(1) AT17LV002-10JU AT17LV002-10SU AT17LV002-10TQU 4-Mbit(1) AT17LV040-10TQU Package 8CN4 20J 8S1 8P3 20S2 8CN4 20J 8CN4 20J 8P3 8CN4 20J 20S2 44A 44A Industrial (-40° C to 85° C) Operation Range Note: 1. For operating 5V operating voltage, please refer to the corresponding AC and DC Characteristics. 18 AT17LV65/128/256/512/010/002/040 2321I–CNFG–2/08 AT17LV65/128/256/512/010/002/040 23. Packaging Information 23.1 8CN4 – LAP Marked Pin1 Indentifier E D A A1 Top View L1 8 1 Side View Pin1 Corner 0.10 mm TYP e 7 2 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL A 6 3 MIN 0.94 0.30 0.45 5.89 5.89 NOM 1.04 0.34 0.50 5.99 5.99 1.27 BSC 1.10 REF MAX 1.14 0.38 0.55 6.09 6.09 NOTE A1 b 5 4 b D E e e1 L L1 1 e1 L Bottom View Note: 1. Metal Pad Dimensions. 2. All exposed metal area shall have the following finished platings. Ni: 0.0005 to 0.015 mm Au: 0.0005 to 0.001 mm 0.95 1.25 1.00 1.30 1.05 1.35 1 1 2/15/08 Package Drawing Contact: packagedrawings@atmel.com TITLE 8CN4, 8-lead (6 x 6 x 1.04 mm Body), Lead Pitch 1.27mm, Leadless Array Package (LAP) GPC DMH DRAWING NO. 8CN4 REV. D 19 2321I–CNFG–2/08 23.2 8P3 – PDIP E E1 1 N Top View c eA End View D e D1 A2 A SYMBOL COMMON DIMENSIONS (Unit of Measure = inches) MIN NOM MAX NOTE A A2 b b2 b3 c D 0.115 0.014 0.045 0.030 0.008 0.355 0.005 0.300 0.240 0.310 0.250 0.100 BSC 0.300 BSC 0.115 0.130 0.130 0.018 0.060 0.039 0.010 0.365 0.210 0.195 0.022 0.070 0.045 0.014 0.400 2 5 6 6 3 3 b2 b3 4 PLCS L D1 E E1 e eA L b 0.325 0.280 4 3 Side View 4 0.150 2 Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information. 2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3. 3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch. 4. E and eA measured with the leads constrained to be perpendicular to datum. 5. Pointed or rounded lead tips are preferred to ease insertion. 6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm). 01/09/02 2325 Orchard Parkway San Jose, CA 95131 TITLE 8P3, 8-lead, 0.300" Wide Body, Plastic Dual In-line Package (PDIP) DRAWING NO. 8P3 REV. B R 20 AT17LV65/128/256/512/010/002/040 2321I–CNFG–2/08 AT17LV65/128/256/512/010/002/040 23.3 8S1 – SOIC C 1 E E1 N L Ø TOP VIEW END VIEW e b A A1 SYMBOL A1 COMMON DIMENSIONS (Unit of Measure = mm) MIN NOM – MAX NOTE 0.10 0.25 D SIDE VIEW Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. 3/17/05 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TITLE 8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) DRAWING NO. 8S1 REV. C R 21 2321I–CNFG–2/08 23.4 20J – PLCC 1.14(0.045) X 45˚ PIN NO. 1 IDENTIFIER 1.14(0.045) X 45˚ 0.318(0.0125) 0.191(0.0075) e E1 B E B1 D2/E2 D1 D A A2 A1 0.51(0.020)MAX 45˚ MAX (3X) COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL A A1 A2 D D1 E Notes: 1. This package conforms to JEDEC reference MS-018, Variation AA. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line. 3. Lead coplanarity is 0.004" (0.102 mm) maximum. E1 D2/E2 B B1 e MIN 4.191 2.286 0.508 9.779 8.890 9.779 8.890 7.366 0.660 0.330 NOM – – – – – – – – – – 1.270 TYP MAX 4.572 3.048 – 10.033 9.042 10.033 9.042 8.382 0.813 0.533 Note 2 Note 2 NOTE 10/04/01 2325 Orchard Parkway San Jose, CA 95131 TITLE 20J, 20-lead, Plastic J-leaded Chip Carrier (PLCC) DRAWING NO. 20J REV. B R 22 AT17LV65/128/256/512/010/002/040 2321I–CNFG–2/08 AT17LV65/128/256/512/010/002/040 23.5 20S2 – SOIC 23 2321I–CNFG–2/08 23.6 44A – TQFP PIN 1 B PIN 1 IDENTIFIER e E1 E D1 D C 0˚~7˚ A1 L COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL A A1 A2 D D1 E MIN – 0.05 0.95 11.75 9.90 11.75 9.90 0.30 0.09 0.45 NOM – – 1.00 12.00 10.00 12.00 10.00 – – – 0.80 TYP MAX 1.20 0.15 1.05 12.25 10.10 12.25 10.10 0.45 0.20 0.75 Note 2 Note 2 NOTE A2 A Notes: 1. This package conforms to JEDEC reference MS-026, Variation ACB. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.10 mm maximum. E1 B C L e 10/5/2001 2325 Orchard Parkway San Jose, CA 95131 TITLE 44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness, 0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) DRAWING NO. 44A REV. B R 24 AT17LV65/128/256/512/010/002/040 2321I–CNFG–2/08 AT17LV65/128/256/512/010/002/040 24. Revision History Revision Level – Release Date H – March 2006 I – February 2008 History Added last-time buy for AT17LVXXX-10CC and AT17LVXXX-10CI. Removed -10SC, 10SI, -10TQC, -10TQI, -10BJC and -10BJI devices from ordering information. 25 2321I–CNFG–2/08 Headquarters Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 International Atmel Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimshatsui East Kowloon Hong Kong Tel: (852) 2721-9778 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-enYvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Product Contact Web Site www.atmel.com Technical Support configurator@atmel.com Sales Contact www.atmel.com/contacts Literature Requests www.atmel.com/literature Disclaimer: T he information in this document is provided in connection with Atmel products. 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