AT88SA10HS

A tmel AT88SA10HS Atmel CryptoAuthentication Host Security Chip DATASHEET Features • • • • • • • • • • • Secure key storage to complement the Atmel® AT88SA100S and the Atmel AT88SA102S devices Superior SHA-256 hash algorithm Guaranteed Unique 48-bit serial number High speed single wire interface, optionally shared with client Supply voltage: 2.7 – 5.25V 1.8V – 5.5V communications voltage =3.7 V; must be 0xFFFF otherwise Which fuses to burn, may be encrypted Table 6-14. Output Parameters Name Success Size 1 Notes Upon successful execution, a value of zero will be returned by AT88SA10HS This command takes a constant time to execute regardless of the number of fuses being burned. Atmel AT88SA10HS [DATASHEET] 8595G−CRYPTO−9/11 18 6.7 PauseShort Forces the chip into a busy mode for a period of tPAUSE. During execution of this command the chip will ignore all activity on the IO signal. This command is used to prevent bus conflicts in a system that also includes one or more AT88SA100S or AT88SA102S client chips sharing the same signal wire. Table 6-15. Input Parameters Name Opcode Param1 Param2 Data PAUSESHORT Ignored Ignored Ignored Size 1 1 2 0 Notes 0x00 Must be 0x00 Must be 0x0000 Table 6-16. Output Parameters Name Success Size 1 Notes After a delay of tPAUSE, the AT88SA10HS will return a value of zero in response to a transmit flag Atmel AT88SA10HS [DATASHEET] 8595G−CRYPTO−9/11 19 7. Pinout Table 7-1. Pin Definitions Pin # 1 Name Signal Description IO channel to the system, open drain output. It is expected that an external pull-up resistor will be provided to pull this signal up to VCC for proper communications. When the chip is not in use this pin can be pulled to either VCC or GND Power supply, 2.7 – 5.25V. This pin should be bypassed with a high quality 0.1µF capacitor close to this pin with a short trace to GND. See applications notes on the Atmel website for more details Connect to system ground Not connected SOIC/TSSOP 5 8 2 VCC 4 1,2,3,6,7 3 -- GND NC Atmel AT88SA10HS [DATASHEET] 8595G−CRYPTO−9/11 20 8. Package Drawing 3TS1 – Shrink SOT 3 GND C L E1 E SDA 1 e1 2 VCC Top View End View b A2 SEATING PLANE A e D A1 Side View L1 Notes: 1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.25mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side. 2. The package top may be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15mm from the lead tip. COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE This drawing is for general information only. Refer to JEDEC Drawing TO-236, Variation AB for additional information. A A1 A2 D E E1 L1 e1 b 0.89 0.01 0.88 2.80 2.10 1.20 2.90 1.30 0.54 REF 1.90 BSC 0.30 - 1.12 0.10 1.02 3.04 2.64 1.40 1,2 1,2 0.50 3 12/11/09 TITLE R Package Drawing Contact: packagedrawings@atmel.com GPC DRAWING NO. REV. 3TS1, 3-lead, 1.30mm Body, Plastic Thin Shrink Small Outline Package (Shrink SOT) TBG 3TS1 B Atmel AT88SA10HS [DATASHEET] 8595G−CRYPTO−9/11 21 8X –TSSOP C 1 Pin 1 indicator this corner E1 E L1 N L Top View b A A1 End View e D A2 SYMBOL A COMMON DIMENSIONS (Unit of Measure = mm) MIN 0.05 0.80 2.90 NOM 1.00 3.00 MAX 1.20 0.15 1.05 3.10 6.40 BSC 4.30 0.19 4.40 – 0.65 BSC 0.45 0.60 1.00 REF 0.09 0.20 0.75 4.50 0.30 3, 5 4 2, 5 NOTE Side View Notes: 1. This drawing is for general information onl Refer to y. JEDEC Drawing MO-153, VariationAA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15mm (0.006in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25mm (0.010in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07mm. 5. Dimension D and E1 to be determined at Datum Plane H. A1 A2 D E E1 b e L L1 C 6/22/11 TITLE GPC DRAWING NO. 8X REV. D Package Drawing Contact: 8X, 8-lead 4.4mm Body, Plastic Thin packagedrawings@atmel.com Shrink Small Outline Package (TSSOP) TNR Atmel AT88SA10HS [DATASHEET] 8595G−CRYPTO−9/11 22 8S1 – JEDEC SOIC C 1 E E1 N L Ø TOP VIEW END VIEW e b A A1 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN A 1.35 A1 b C D E1 E e L 0.40 0° 0.10 0.31 0.17 4.80 3.81 5.79 NOM – – – – – – – 1.27 BSC – – 1.27 8° MAX 1.75 0.25 0.51 0.25 5.05 3.99 6.20 NOTE D SIDE VIEW Notes: This drawing is for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. 6/22/11 TITLE Package Drawing Contact: 8S1, 8-lead (0.150” Wide Body), Plastic Gull packagedrawings@atmel.com Wing Small Outline (JEDEC SOIC) GPC SWB DRAWING NO. 8S1 REV. G Atmel AT88SA10HS [DATASHEET] 8595G−CRYPTO−9/11 23 9. Ordering Codes Atmel AT88SA10HS Ordering Information Atmel Ordering Code AT88SA10HS-TSU-T AT88SA10HS-TH-T AT88SA10HS-SH-T Package Type SOT, Tape and Reel TSSOP, Tape and Reel SOIC, Tape and Reel Voltage Range 2.7 V–5.25 V 2.7 V–5.25 V 2.7 V–5.25 V Temperature Range Green compliant (exceeds RoHS)/Industrial (−40°C to 85°C) Green compliant (exceeds RoHS)/Industrial (−40°C to 85°C) Green compliant (exceeds RoHS)/Industrial (−40°C to 85°C) 10. Revision History Doc. Rev. 8595G 8595F 8595E 8595D 8595C 8595B 8595A Date 09/2011 08/2010 06/2010 05/2010 04/2010 02/2010 04/2009 Comments Correct references and section numbers Section 5.1.3, Sleep Flag, change “ within 0.5V of VCC” to “within 0.3V of VCC” Update IO Timeout description Update to Table 3: AC Parameters Expansion of IO Timeout specification Added 8ld TSSOP Updated parameter tables and added 8ld SOIC Initial document release Atmel AT88SA10HS [DATASHEET] 8595G−CRYPTO−9/11 24 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: (+1)(408) 441-0311 Fax: (+1)(408) 487-2600 www.atmel.com Atmel Asia Limited Unit 01-5 & 16, 19F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel: (+49) 89-31970-0 Fax: (+49) 89-3194621 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 JAPAN Tel: (+81)(3) 3523-3551 Fax: (+81)(3) 3523-7581 © 2011 Atmel Corporation. All rights reserved. / Rev.: 8595G−CRYPTO−9/11 Atmel®, logo and combinations thereof, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. 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