AT97SC3204

1. Features • Full Trusted Computing Group (TCG) Trusted Platform Module (TPM) Version 1.2 Compatibility • Compliant with TCG PC Client Specific TPM Interface Specification Version 1.2 • Single-chip Turnkey Solution • Hardware Asymmetric Crypto Engine • 2048-bit RSA® Sign in 200ms • AVR® RISC Microprocessor • Internal EEPROM Storage for RSA Keys • 33MHz LPC (Low Pin Count) Bus for Easy PC Interface • Secure Hardware and Firmware Design and Chip Layout • True Random Number Generator (RNG) – FIPS 140-2 Compliant • NV Storage space for 1280-bytes of user defined data • 3.3V Supply Voltage • 28-lead Thin TSSOP, Wide TSSOP or 40-lead QFN Packages • Offered in both Commercial (0 to 70°C) and Industrial (-40 to +85°C) Temperature Ranges Trusted Platform Module Atmel AT97SC3204 LPC Interface Summary * See the full data sheet for detailed design information 2. Description The Atmel® AT97SC3204 is a fully integrated security module designed to be integrated into personal computers and other embedded systems. It implements version 1.2 of the Trusted Computing Group (TCG) specification for Trusted Platform Modules (TPM). The TPM includes a cryptographic accelerator capable of computing a 2048-bit RSA signature in 200ms and a 1024-bit RSA signature in 40ms. Performance of the SHA-1 accelerator is 20µs per 64-byte block. The chip communicates with the PC through the LPC interface. The TPM supports SIRQ (for interrupts) and CLKRUN to permit clock stopping for power savings in mobile computers. 5294BS–TPM–9/10 Note: This is a summary document. A complete document is available under NDA. For more information, please contact your local Atmel sales office. Table 1-1. Pin Name VCC SB3V GND LRESET# LAD0 LAD1 LAD2 LAD3 LCLK LFRAME# CLKRUN# LPCPD# SERIQ GPIO6 TestI TestBI ATest NC NBO Pin Configurations Function 3.3V Supply Voltage Standby 3.3V Supply Voltage Ground PCI Reset Input Active Low LPC Command, Address, Data Line Input/Output LPC Command, Address, Data Line Input/Output LPC Command, Address, Data Line Input/Output LPC Command, Address, Data Line Input/Output 33MHz PCI Clock Input LPC FRAME Input PCI Clock Run Input/Output LPC Power Down Input Serialized Interrupt Request Input/Output General Purpose Input/Output Test Input (disabled) Test Input (disabled) Atmel Test Pin No Connect Not Bounded out 2 Atmel AT24C256C 5294BS–TPM–9/10 Atmel AT24C256C Figure 2-1. Pinout Diagrams 28-pin Thin TSSOP 4.4 mm x 9.7 mm Body 0.65 mm Pitch 28-pin TSSOP 6.1 mm x 9.7 mm Body 0.65 mm Pitch 40 ATest 39 ATest 40-pin QFN 6.0 mm x 6.0 mm Body 0.50 mm Pitch 38 LPCPD# 37 SERIRQ 36 NBO 35 NBO 34 NBO 33 NBO 32 NBO CLKRUN# 19 ATest ATest ATest GND SB3V GPIO6 NC TestI TestBI 1 2 3 4 5 6 7 8 9 28 LPCPD# 27 SERIRQ 26 LAD0 25 GND 24 VCC 23 LAD1 22 LFRAME# 21 LCLK 20 LAD2 19 VCC 18 GND 17 LAD3 16 LRESET# 15 CLKRUN# ATest GND SB3V GPIO6 NC TestI TestBI VCC GND 1 2 3 4 5 6 7 8 9 NBO 11 NBO 12 NBO 13 NBO 14 NBO 15 NBO 16 NBO 17 NBO 18 NBO 12 NBO 13 NBO 14 LRESET# 20 VCC 10 GND 11 NBO 10 31 NBO 30 LAD0 29 GND 28 VCC 27 LAD1 26 LFRAME# 25 LCLK 24 LAD2 23 VCC 22 GND 21 LAD3 3 5294BS–TPM–9/10 Figure 2-2. Atmel AT97SC3204 Block Diagram ROM Program EEPROM Program 33MHz LPC Interface AVR 8-bit RISC CPU SRAM GPIO6 GPIO RNG EEPROM Data CRYPTO Engine Timer Physical Security Circuitry The TPM includes a hardware random number generator, including a FIPS-approved Pseudo Random Number Generator that is used for key generation and TCG protocol functions. The RNG is also available to the system to generate random numbers that may be needed during normal operation. The chip uses a dynamic internal memory management scheme to store multiple RSA keys. Other than the standard TCG commands (TPM_FlushSpecific, TPM_Loadkey2), no system intervention is required to manage this internal key cache. The TPM is offered to OEM and ODM manufacturers as a turnkey solution, including the firmware integrated on the chip. In addition, Atmel provides the necessary device driver software for integration into certain operating systems, along with BIOS drivers. Atmel will also provide manufacturing support software for use by OEMs and ODMs during initialization and verification of the TPM during board assembly. Full documentation for TCG primitives can be found in the TCG TPM Main Specification, Parts 1 to 3, on the TCG Web site located at https://www.trustedcomputinggroup.org. TPM features specific to PC Client platforms are specified in the “TCG PC Client Specific TPM Interface Specification, Version 1.2”, also available on the TCG web site. Implementation guidance for 32-bit PC platforms is outlined in the “TCG PC Client Specific Implementation Specification for Conventional BIOS for TCG Version 1.2”, also available on the TCG web site. 4 Atmel AT24C256C 5294BS–TPM–9/10 Atmel AT24C256C 3. Ordering Information Table 1-2. Atmel AT24C256C Ordering Information Package 28A2 (28-pin Thin TSSOP) 28A3 (28-pin TSSOP) 40ML1 (40-pin QFN) (2) Lead-free, RoHS Lead-free, RoHS Lead-free, RoHS Operating Range Commercial (0°C to 70°C) Industrial (-40°C to 85°C) Commercial (0°C to 70°C) Industrial (-40°C to 85°C) Commercial (0°C to 70°C) Industrial (-40°C to 85°C) (1) Atmel Ordering Code AT97SC3204 AT97SC3204(1) AT97SC3204(1) Notes: 1. Please see the Atmel AT97SC3204 datasheet addendum for the complete catalog number ordering code 5 5294BS–TPM–9/10 4. Package Drawing 28A2 – Thin TSSOP b L L1 E E1 e A D A2 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE 1. 2. 3. 4. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs shall not exceed .15mm (.006 in) per side. Dimension "E1" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed .25mm (.010 in) per side. Dimension 'b' does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the 'b' dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. Dimension 'D' and 'E1' to be determined at Datum Plane H. D E E1 A A2 b e L L1 9.60 4.30 0.80 0.19 9.70 6.40 BSC 4.40 1.00 0.65 BSC 9.80 4.50 1.20 1.05 0.30 1,4 2,4 3 0.45 0.60 1.00 REF 0.75 This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation AE for additional information. TITLE 28A2, 28-lead, 4.4x9.7 mm Body, 0.65 pitch, Thin Shrink Small Outline Package (TSSOP) GPC TFL 6/17/08 DRAWING NO. 28A2 REV. B Package Drawing Contact: packagedrawings@atmel.com 6 Atmel AT24C256C 5294BS–TPM–9/10 Atmel AT24C256C 28A3 – TSSOP b L L1 E E1 e Top View End View COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL D MIN 9.60 NOM 9.70 8.10 BSC 6.00 – MAX 9.80 NOTE 2, 5 A D A2 E E1 A A2 6.10 – 6.20 1.20 1.05 0.30 3, 5 0.80 0.19 1.00 – Side View b e L L1 4 0.65 BSC 0.45 0.60 1.00 REF 0.75 Note: 1. 2. 3. 4. 5. This drawing is for general information only. Please refer to JEDEC Drawing MO-153, Variation DB for additional information. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006 in) per side. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010 in) per side. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07 mm. Dimension D and E1 to be determined at Datum Plane H. 1/8/02 2325 Orchard Parkway San Jose, CA 95131 TITLE 28A3, 28-lead, 6.1 x 9.7 mm Body, 0.65 pitch, Thin Shrink Small Outline Package (TSSOP) DRAWING NO. 28A3 REV. A R 7 5294BS–TPM–9/10 40ML1 – QFN D N A2 A3 1 2 3 E Pin 1 Indicator A A1 Top View L 0 Side View D2 SYMBOL D E COMMON DIMENSIONS (Unit of Measure = mm) MIN NOM 6.00 BSC 6.00 BSC 3.95 3.95 0.0 4.10 4.10 0.85 0.01 0.65 0.20 REF 0.30 0.40 0.50 BSC 0.18 0.23 0.30 2 0.50 4.25 4.25 0.90 0.05 0.70 MAX NOTE E2 3 2 1 N b D2 E2 A A1 A2 e PIN1 ID A3 L e b Bottom View Note: 1. 2. This drawing is for general information only. Refer to JEDEC Drawing MO-220, Variation WJJD-2, for proper dimensions, tolerances, datums, etc. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. 9/27/07 2325 Orchard Parkway San Jose, CA 95131 R TITLE 40ML1, , 40-lead 6.0 x 6.0 mm Body, 0.50 mm Pitch, Molded Quad Flat No Lead Package (QFN) Punched DRAWING NO. 40ML1 REV. C 8 Atmel AT24C256C 5294BS–TPM–9/10 Atmel AT24C256C 5. Revision History Doc. Rev. 5294BS 5294AS Date 10/2010 01/2008 Comments Added Industrial Grade support detail Initial document release 9 5294BS–TPM–9/10 Product Contact Product Line pcsecurity@atmel.com Sales Contact www.atmel.com/contacts Literature Requests www.atmel.com/literature Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: (+1)(408) 441-0311 Fax: (+1)(408) 487-2600 www.atmel.com Atmel Asia Limited Unit 01-5 & 16, 19F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel: (+49) 89-31970-0 Fax: (+49) 89-3194621 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 JAPAN Tel: (+81)(3) 3523-3551 Fax: (+81)(3) 3523-7581 © 2010 Atmel Corporation. All rights reserved. / Rev.: 5294BS−TPM−10/10 Atmel®, logo and combinations thereof, CryptoAuthentication™ and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended, authorized, or warranted for use as components in applications intended to support or sustain life.