ATA6622_10

Features • • • • • • Master and Slave Operation Possible Supply Voltage up to 40V Operating voltage VS = 5V to 27V Typically 10 µA Supply Current During Sleep Mode Typically 57 µA Supply Current in Silent Mode Linear Low-drop Voltage Regulator: – Normal, Fail-safe, and Silent Mode – ATA6622 VCC = 3.3V ±2% – ATA6624 VCC = 5.0V ±2% – ATA6626 VCC = 5.0V ±2%, TXD Time-out Timer Disabled – In Sleep Mode VCC is Switched Off VCC- Undervoltage Detection (4 ms Reset Time) and Watchdog Reset Logical Combined at Open Drain Output NRES Negative Trigger Input for Watchdog Boosting the Voltage Regulator Possible with an External NPN Transistor LIN Physical Layer According to LIN 2.0, 2.1 and SAEJ2602-2 Wake-up Capability via LIN-bus, Wake Pin, or Kl_15 Pin INH Output to Control an External Voltage Regulator or to Switch off the Master Pull Up Resistor TXD Time-out Timer; ATA6626: TXD Time-out Timer Is Disabled Bus Pin is Overtemperature and Short Circuit Protected versus GND and Battery Adjustable Watchdog Time via External Resistor Advanced EMC and ESD Performance Fulfills the OEM “Hardware Requirements for LIN in automotive Applications Rev.1.0” Interference and Damage Protection According ISO7637 Package: QFN 5 mm × 5 mm with 20 Pins • • • • • • • • • • • • • LIN Bus Transceiver with 3.3V (5V) Regulator and Watchdog ATA6622 ATA6624 ATA6626 ATA6622C ATA6624C ATA6626C 1. Description The ATA6622 is a fully integrated LIN transceiver, which complies with the LIN 2.0, 2.1 and SAEJ2602-2 specifications. It has a low-drop voltage regulator for 3.3V/50 mA output and a window watchdog. The ATA6624 has the same functionality as the ATA6622; however, it uses a 5V/50 mA regulator. The ATA6626 has the same functionality as ATA6624 without a TXD time-out timer. The voltage regulator is able to source 50 mA, but the output current can be boosted by using an external NPN transistor. This chip combination makes it possible to develop inexpensive, simple, yet powerful slave and master nodes for LIN-bus systems. ATA6622/ATA6624/ATA6626 are designed to handle the low-speed data communication in vehicles, e.g., in convenience electronics. Improved slope control at the LIN-driver ensures secure data communication up to 20 kBaud. Sleep Mode and Silent Mode guarantee very low current consumption. The ATA6626 is able to switch the LIN unlimited to dominant level via TXD for low data rates. 4986I–AUTO–07/10 Figure 1-1. Block Diagram 20 VS Normal and Fail-safe Mode PVCC 9 Receiver 10 INH + Normal Mode RXD 7 RF Filter 4 WAKE 16 KL_15 PVCC 11 TXD *) Control Unit 1 Normal/Silent/ Fail-safe Mode 3.3/5V /50 mA/±2% Undervoltage Reset 19 18 12 NRES VCC PVCC Edge Detection Wake-up Bus Timer LIN TXD Time-out Timer Slew Rate Control Short Circuit and Overtemperature Protection EN Debounce Time Mode Select GND 5 Internal Testing Unit PVCC 15 MODE 14 TM OUT Watchdog Adjustable Watchdog Oscillator 13 WD_OSC 3 NTRIG *) Not in ATA6626 2 ATA6622/ATA6624/ATA6626 4986I–AUTO–07/10 ATA6622/ATA6624/ATA6626 2. Pin Configuration Figure 2-1. Pinning QFN20 PVCC KL15 16 15 MODE TM WD_OSC NRES TXD 14 QFN 5 mm × 5 mm 0.65 mm pitch 20 lead 13 12 11 6 GND 7 LIN 8 GND 9 RXD 10 INH GND 17 VCC 19 VS 20 EN GND NTRIG WAKE GND 1 18 ATA6622/24/26 2 3 4 5 Table 2-1. Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Backside Pin Description Symbol EN GND NTRIG WAKE GND GND LIN GND RXD INH TXD NRES WD_OSC TM MODE KL_15 GND PVCC VCC VS Function Enables the device in Normal Mode System ground (optional) Low-level watchdog trigger input from microcontroller High-voltage input for local wake-up request; if not needed, connect directly to VS System ground (mandatory) System ground (optional) LIN-bus line input/output System ground (optional) Receive data output Battery related output for controlling an external voltage regulator Transmit data input; active low output (strong pull down) after a local wake-up request Output undervoltage and watchdog reset (open drain) External resistor for adjustable watchdog timing For factory testing only (tie to ground) Low, watchdog is on; high, watchdog is off Ignition detection (edge sensitive) System ground (optional) 3.3V/5V regulator sense input pin 3.3V/5V regulator output/driver pin Battery supply Heat slug is connected to all GND pins 3 4986I–AUTO–07/10 3. Functional Description 3.1 Physical Layer Compatibility Since the LIN physical layer is independent from higher LIN layers (e.g., the LIN protocol layer), all nodes with a LIN physical layer according to revision 2.x can be mixed with LIN physical layer nodes, which, according to older versions (i.e., LIN 1.0, LIN 1.1, LIN 1.2, LIN 1.3), are without any restrictions. 3.2 Supply Pin (VS) The LIN operating voltage is VS = 5V to 27V. An undervoltage detection is implemented to disable data transmission if VS falls below VSth < 4V in order to avoid false bus messages. After switching on VS, the IC starts in Fail-safe Mode, and the voltage regulator is switched on (i.e., 3.3V/5V/50 mA output capability). The supply current is typically 10 µA in Sleep Mode and 57 µA in Silent Mode. 3.3 Ground Pin (GND) The IC does not affect the LIN Bus in the event of GND disconnection. It is able to handle a ground shift up to 11.5% of VS. The mandatory system ground is pin 5. 3.4 Voltage Regulator Output Pin (VCC) The internal 3.3V/5V voltage regulator is capable of driving loads with up to 50 mA. It is able to supply the microcontroller and other ICs on the PCB and is protected against overloads by means of current limitation and overtemperature shut-down. Furthermore, the output voltage is monitored and will cause a reset signal at the NRES output pin if it drops below a defined threshold Vthun. To boost up the maximum load current, an external NPN transistor may be used, with its base connected to the VCC pin and its emitter connected to PVCC. 3.5 Voltage Regulator Sense Pin (PVCC) The PVCC is the sense input pin of the 3.3V/5V voltage regulator. For normal applications (i.e., when only using the internal output transistor), this pin is connected to the VCC pin. If an external boosting transistor is used, the PVCC pin must be connected to the output of this transistor, i.e., its emitter terminal. 3.6 Bus Pin (LIN) A low-side driver with internal current limitation and thermal shutdown and an internal pull-up resistor compliant with the LIN 2.x specification are implemented. The allowed voltage range is between –27V and +40V. Reverse currents from the LIN bus to VS are suppressed, even in the event of GND shifts or battery disconnection. LIN receiver thresholds are compatible with the LIN protocol specification. The fall time from recessive to dominant bus state and the rise time from dominant to recessive bus state are slope controlled. 4 ATA6622/ATA6624/ATA6626 4986I–AUTO–07/10 ATA6622/ATA6624/ATA6626 3.7 Input/Output Pin (TXD) In Normal Mode the TXD pin is the microcontroller interface used to control the state of the LIN output. TXD must be pulled to ground in order to have a low LIN-bus. If TXD is high or unconnected (internal pull-up resistor), the LIN output transistor is turned off, and the bus is in recessive state. During Fail-safe Mode, this pin is used as output. It is current-limited to < 8 mA. and is latched to low if the last wake-up event was from pin WAKE or KL_15. 3.8 TXD Dominant Time-out Function The TXD input has an internal pull-up resistor. An internal timer prevents the bus line from being driven permanently in dominant state. If TXD is forced to low for longer than tDOM > 6 ms, the LIN-bus driver is switched to recessive state. To reactivate the LIN bus driver, switch TXD to high (> 10 µs). The time-out function is disabled in the ATA6626. Switching to dominant level on the LIN bus occurs without any time limitations. 3.9 Output Pin (RXD) This output pin reports the state of the LIN-bus to the microcontroller. LIN high (recessive state) is reported by a high level at RXD; LIN low (dominant state) is reported by a low level at RXD. The output has an internal pull-up resistor with typically 5 kΩ to VCC. The AC characteristics can be defined with an external load capacitor of 20 pF. The output is short-circuit protected. RXD is switched off in Unpowered Mode (i.e., VS = 0V). 3.10 Enable Input Pin (EN) The Enable Input pin controls the operation mode of the device. If EN is high, the circuit is in Normal Mode, with transmission paths from TXD to LIN and from LIN to RXD both active. The VCC voltage regulator operates with 3.3V/5V/50 mA output capability. If EN is switched to low while TXD is still high, the device is forced to Silent Mode. No data transmission is then possible, and the current consumption is reduced to IVS typ. 57 µA. The VCC regulator has its full functionality. If EN is switched to low while TXD is low, the device is forced to Sleep Mode. No data transmission is possible, and the voltage regulator is switched off. 3.11 Wake Input Pin (WAKE) The Wake Input pin is a high-voltage input used to wake up the device from Sleep Mode or Silent Mode. It is usually connected to an external switch in the application to generate a local wake-up. A pull-up current source, typically 10 µA, is implemented. If a local wake-up is not needed in the application, connect the Wake pin directly to the VS pin. 3.12 Mode Input Pin (MODE) Connect the MODE pin directly or via an external resistor to GND for normal watchdog operation. To debug the software of the connected microcontroller, connect MODE pin to 3.3V/5V and the watchdog is switched off. 5 4986I–AUTO–07/10 3.13 TM Input Pin The TM pin is used for final production measurements at Atmel®. In normal application, it has to be always connected to GND. 3.14 KL_15 Pin The KL_15 pin is a high-voltage input used to wake up the device from Sleep or Silent Mode. It is an edge sensitive pin (low-to-high transition). It is usually connected to ignition to generate a local wake-up in the application when the ignition is switched on. Although KL_15 pin is at high voltage (VBatt), it is possible to switch the IC into Sleep or Silent Mode. Connect the KL_15 pin directly to GND if you do not need it. A debounce timer with a typical Tdb Kl_15 of 160 µs is implemented. The input voltage threshold can be adjusted by varying the external resistor due to the input current IKL_15. To protect this pin against voltage transients, a serial resistor of 47 kΩ and a ceramic capacitor of 100 nF are recommended. With this RC combination you can increase the wake-up time TwKL_15 and, therefore, the sensitivity against transients on the ignition Kl.15. You can also increase the wake-up time using external capacitors with higher values. 3.15 INH Output Pin The INH Output pin is used to switch an external voltage regulator on during Normal or Fail-safe Mode. The INH pin is switched off in Sleep or Silent Mode. It is possible to switch off the external 1 kΩ master resistor via the INH pin for master node applications. The INH pin is switched off during VCC undervoltage reset. 3.16 Reset Output Pin (NRES) The Reset Output pin, an open drain output, switches to low during VCC undervoltage or a watchdog failure. 3.17 WD_OSC Output Pin The WD_OSC Output pin provides a typical voltage of 1.2V, which supplies an external resistor with values between 34 kΩ and 120 kΩ to adjust the watchdog oscillator time. 3.18 NTRIG Input Pin The NTRIG Input pin is the trigger input for the window watchdog. A pull-up resistor is implemented. A negative edge triggers the watchdog. The trigger signal (low) must exceed a minimum time ttrigmin to generate a watchdog trigger. 3.19 Wake-up Events from Sleep or Silent Mode • LIN-bus • WAKE pin • EN pin • KL_15 6 ATA6622/ATA6624/ATA6626 4986I–AUTO–07/10 ATA6622/ATA6624/ATA6626 4. Modes of Operation Figure 4-1. Modes of Operation Unpowered Mode VBatt = 0V b a b b c+d+e a: VS > 5V b: VS < 4V c: Bus wake-up event d: Wake up from WAKE or KL_15 pin e: NRES switches to low Fail-safe Mode b e EN = 1 Go to silent command VCC: 3.3V/5V/50 mA with undervoltage monitoring Communication: OFF Watchdog: ON EN = 1 c+d EN = 0 TXD = 1 Normal Mode VCC: 3.3V/5V/50 mA with undervoltage monitoring EN = 0 Communication: ON Watchdog: ON TXD = 0 Local wake-up event Silent Mode VCC: 3.3V/5V/50 mA with undervoltage monitoring Communication: OFF Watchdog: OFF EN = 1 Go to sleep command Sleep Mode VCC: switched off Communication: OFF Watchdog: OFF Table 4-1. Mode of Operation Fail-safe Normal Silent Sleep Table of Modes Transceiver Off On Off Off VCC 3.3V/5V 3.3V/5V 3.3V/5V 0V Watchdog WD_OSC INH On On Off Off 1.23V 1.23V 0V 0V On On Off Off RXD LIN High, Recessive except after wake-up LIN depending High 0V TXD depending Recessive Recessive 7 4986I–AUTO–07/10 4.1 Normal Mode This is the normal transmitting and receiving mode of the LIN Interface in accordance with the LIN specification LIN 2.x. The voltage regulator is active and can source up to 50 mA. The undervoltage detection is activated. The watchdog needs a trigger signal from NTRIG to avoid resets at NRES. If NRES is switched to low, the IC changes its state to Fail-safe Mode. 4.2 Silent Mode A falling edge at EN when TXD is high switches the IC into Silent Mode. The TXD Signal has to be logic high during the Mode Select window (see Figure 4-2 on page 8). The transmission path is disabled in Silent Mode. The overall supply current from V Batt i s a combination of the IVSsi = 57 µA plus the VCC regulator output current IVCC. The 3.3V/5V regulator with 2% tolerance can source up to 50 mA. The internal slave termination between the LIN pin and the VS pin is disabled in Silent Mode, only a weak pull-up current (typically 10 µA) between the LIN pin and the VS pin is present. Silent Mode can be activated independently from the actual level on the LIN, WAKE, or KL_15 pins. If an undervoltage condition occurs, NRES is switched to low, and the IC changes its state to Fail-safe Mode. A voltage less than the LIN Pre_Wake detection VLINL at the LIN pin activates the internal LIN receiver and switches on the internal slave termination between the LIN pin and the VS pin. Figure 4-2. Switch to Silent Mode Normal Mode EN Silent Mode TXD Mode select window td = 3.2 µs NRES VCC Delay time silent mode td_silent = maximum 20 µs LIN LIN switches directly to recessive mode 8 ATA6622/ATA6624/ATA6626 4986I–AUTO–07/10 ATA6622/ATA6624/ATA6626 A falling edge at the LIN pin followed by a dominant bus level maintained for a certain time period (tbus) and the following rising edge at the LIN pin (see Figure 4-3 on page 9) results in a remote wake-up request. The device switches from Silent Mode to Fail-safe Mode. The remote wake-up request is indicated by a low level at the RXD pin to interrupt the microcontroller (see Figure 4-3 on page 9). EN high can be used to switch directly to Normal Mode. Figure 4-3. LIN Wake Up from Silent Mode Bus wake-up filtering time tbus Fail-safe mode Normal mode LIN bus Node in silent mode RXD High Low High TXD Watchdog Watchdog off Start watchdog lead time td VCC voltage regulator Silent mode 3.3V/5V/50 mA Fail safe mode 3.3V/5V/50 mA Normal mode EN High EN NRES Undervoltage detection active 4.3 Sleep Mode A falling edge at EN when TXD is low switches the IC into Sleep Mode. The TXD Signal has to be logic low during the Mode Select window (Figure 4-4 on page 10). In order to avoid any influence to the LIN-pin during switching into sleep mode it is possible to switch the EN up to 3.2 µs earlier to LOW than the TXD. Therefore, the best and easiest way are two falling edges at TXD and EN at the same time.The transmission path is disabled in Sleep Mode. The supply current IVSsleep from VBatt is typically 10 µA. 9 4986I–AUTO–07/10 The VCC regulator is switched off. NRES and RXD are low. The internal slave termination between the LIN pin and VS pin is disabled, only a weak pull-up current (typically 10 µA) between the LIN pin and the VS pin is present. Sleep Mode can be activated independently from the current level on the LIN, WAKE, or KL_15 pin. A voltage less than the LIN Pre_Wake detection VLINL at the LIN pin activates the internal LIN receiver and switches on the internal slave termination between the LIN pin and the VS pin. A falling edge at the LIN pin followed by a dominant bus level maintained for a certain time period (tbus) and a following rising edge at pin LIN results in a remote wake-up request. The device switches from Sleep Mode to Fail-safe Mode. The VCC regulator is activated, and the remote wake-up request is indicated by a low level at the RXD pin to interrupt the microcontroller (see Figure 4-5 on page 11). EN high can be used to switch directly from Sleep/Silent to Fail-safe Mode. If EN is still high after VCC ramp up and undervoltage reset time, the IC switches to the Normal Mode. Figure 4-4. Switch to Sleep Mode Normal Mode Sleep Mode EN Mode select window TXD td = 3.2 µs NRES VCC Delay time sleep mode td_sleep = maximum 20 µs LIN LIN switches directly to recessive mode 4.4 Fail-safe Mode The device automatically switches to Fail-safe Mode at system power-up. The voltage regulator is switched on (VCC = 3.3V/5V/2%/50 mA) (see Figure 5-1 on page 14). The NRES output switches to low for tres = 4 ms and gives a reset to the microcontroller. LIN communication is switched off. The IC stays in this mode until EN is switched to high. The IC then changes to Normal Mode. A power down of VBatt (VS < 4V) during Silent or Sleep Mode switches the IC into Fail-safe Mode after power up. A low at NRES switches into Fail-safe Mode directly. During Fail-safe Mode the TXD pin is an output and signals the last wake-up source. 10 ATA6622/ATA6624/ATA6626 4986I–AUTO–07/10 ATA6622/ATA6624/ATA6626 4.5 Unpowered Mode If you connect battery voltage to the application circuit, the voltage at the VS pin increases according to the block capacitor (see Figure 5-1 on page 14). After VS is higher than the VS undervoltage threshold VSth, the IC mode changes from Unpowered Mode to Fail-safe Mode. The VCC output voltage reaches its nominal value after tVCC. This time, tVCC, depends on the VCC capacitor and the load. The NRES is low for the reset time delay treset . During this time, treset, no mode change is possible. Figure 4-5. LIN Wake Up from Sleep Mode Bus wake-up filtering time tbus Fail-safe Mode Normal Mode LIN bus RXD Low or floating Low TXD VCC voltage regulator On state Off state Regulator wake-up time EN High EN Reset time NRES Floating Microcontroller start-up time delay Watchdog Watchdog off Start watchdog lead time td 11 4986I–AUTO–07/10 5. Wake-up Scenarios from Silent or Sleep Mode 5.1 Remote Wake-up via Dominant Bus State A voltage less than the LIN Pre_Wake detection VLINL at the LIN pin activates the internal LIN receiver. A falling edge at the LIN pin followed by a dominant bus level VBUSdom maintained for a certain time period (tBUS) and a rising edge at pin LIN result in a remote wake-up request. The device switches from Silent or Sleep Mode to Fail-safe Mode. The VCC voltage regulator is/remains activated, the INH pin is switched to high, and the remote wake-up request is indicated by a low level at the RXD pin to generate an interrupt for the microcontroller. A low level at the LIN pin in the Normal Mode starts the bus wake-up filtering time, and if the IC is switched to Silent or Sleep Mode, it will receive a wake-up after a positive edge at the LIN pin. 5.2 Local Wake-up via Pin WAKE A falling edge at the WAKE pin followed by a low level maintained for a certain time period (tWAKE) results in a local wake-up request. The device switches to Fail-safe Mode. The local wake-up request is indicated by a low level at the RXD pin to generate an interrupt in the microcontroller and a strong pull down at TXD. When the Wake pin is low, it is possible to switch to Silent or Sleep Mode via pin EN. In this case, the wake-up signal has to be switched to high > 10 µs before the negative edge at WAKE starts a new local wake-up request. 5.3 Local Wake-up via Pin KL_15 A positive edge at pin KL_15 followed by a high voltage level for a certain time period (> tKL_15) results in a local wake-up request. The device switches into the Fail-safe Mode. The extra long wake-up time ensures that no transients at KL_15 create a wake up. The local wake-up request is indicated by a low level at the RXD pin to generate an interrupt for the microcontroller and a strong pull down at TXD. During high-level voltage at pin KL_15, it is possible to switch to Silent or Sleep Mode via pin EN. In this case, the wake-up signal has to be switched to low > 250 µs before the positive edge at KL_15 starts a new local wake-up request. With external RC combination, the time is even longer. 5.4 Wake-up Source Recognition The device can distinguish between a local wake-up request (Wake or KL_15 pins) and a remote wake-up request (dominant LIN bus state). The wake-up source can be read on the TXD pin in Fail-safe Mode. A high level indicates a remote wake-up request (weak pull up at the TXD pin); a low level indicates a local wake-up request (strong pull down at the TXD pin). The wake-up request flag (signalled on the RXD pin), as well as the wake-up source flag (signalled on the TXD pin), is immediately reset if the microcontroller sets the EN pin to high (see Figure 4-2 on page 8 and Figure 4-3 on page 9) and the IC is in Normal Mode. The last wake-up source flag is stored and signalled in Fail-safe Mode at the TXD pin. 12 ATA6622/ATA6624/ATA6626 4986I–AUTO–07/10 ATA6622/ATA6624/ATA6626 5.5 Fail-safe Features • During a short-circuit at LIN to VBattery, the output limits the output current to IBUS_lim. Due to the power dissipation, the chip temperature exceeds TLINoff, and the LIN output is switched off. The chip cools down and after a hysteresis of Thys, switches the output on again. RXD stays on high because LIN is high. During LIN overtemperature switch-off, the VCC regulator works independently. • During a short-circuit from LIN to GND the IC can be switched into Sleep or Silent Mode. If the short-circuit disappears, the IC starts with a remote wake-up. • The reverse current is very low < 2 µA at the LIN pin during loss of VBatt. This is optimal behavior for bus systems where some slave nodes are supplied from battery or ignition. • During a short circuit at VCC, the output limits the output current to IVCClim. Because of undervoltage, NRES switches to low and sends a reset to the microcontroller. The IC switches into Fail-safe Mode. If the chip temperature exceeds the value TVCCoff, the VCC output switches off. The chip cools down and after a hysteresis of Thys, switches the output on again. Because of the Fail-safe Mode, the VCC voltage will switch on again although EN is switched off from the microcontroller. The microcontroller can start with its normal operation. • EN pin provides a pull-down resistor to force the transceiver into recessive mode if EN is disconnected. • RXD pin is set floating if VBatt is disconnected. • TXD pin provides a pull-up resistor to force the transceiver into recessive mode if TXD is disconnected. • If TXD is short-circuited to GND, it is possible to switch to Sleep Mode via ENABLE after tdom > 20 ms (only for ATA6622/ATA6624). • If the WD_OSC pin has a short-circuit to GND and the NTRIG Signal has a period time > 27 ms, the watchdog runs with an internal oscillator and guarantees a reset after the second NTRIG signal at the latest. • If the resistor at WO_OSC pin is disconnected, the watchdog runs with an internal oscillator and guarantees a reseet after the second NTRIG signal at the latest. 5.6 Voltage Regulator The voltage regulator needs an external capacitor for compensation and for smoothing the disturbances from the microcontroller. It is recommended to use an electrolythic capacitor with C > 1.8 µF and a ceramic capacitor with C = 100 nF. The values of these capacitors can be varied by the customer, depending on the application. The main power dissipation of the IC is created from the VCC output current IVCC , which is needed for the application. In Figure 5-2 on page 14 the safe operating area of the ATA6622/ATA6624/ATA6626 is shown. 13 4986I–AUTO–07/10 Figure 5-1. VCC Voltage Regulator: Ramp-up and Undervoltage Detection VS 12V 5.5V/3.8V t VCC 5V/3.3V Vthun TVCC NRES 5V/3.3V TReset Tres_f t t Figure 5-2. Power Dissipation: Safe Operating Area versus VCC Output Current and Supply Voltage VS at Different Ambient Temperatures Due to Rthja = 35 K/W 60 Tamb = 105°C Tamb = 125°C 50 IVCC (mA) 40 30 20 10 0 3 5 7 9 11 13 15 17 19 VS (V) For programming purposes of the microcontroller it is potentially necessary to supply the VCC output via an external power supply while the VS Pin of the system basis chip is disconnected. This behavior is no problem for the system basis chip. 14 ATA6622/ATA6624/ATA6626 4986I–AUTO–07/10 ATA6622/ATA6624/ATA6626 6. Watchdog The watchdog anticipates a trigger signal from the microcontroller at the NTRIG (negative edge) input within a time window of T w d . The trigger signal must exceed a minimum time ttrigmin > 200 ns. If a triggering signal is not received, a reset signal will be generated at output NRES. The timing basis of the watchdog is provided by the internal oscillator. Its time period, Tosc, is adjustable via the external resistor Rwd_osc (34 kΩ to 120 kΩ). During Silent or Sleep Mode the watchdog is switched off to reduce current consumption. The minimum time for the first watchdog pulse is required after the undervoltage reset at NRES disappears. It is defined as lead time td. After wake up from Sleep or Silent Mode, the lead time td starts with the negative edge of the RXD output. 6.1 Typical Timing Sequence with RWD_OSC = 51 kΩ The trigger signal T wd i s adjustable between 20 ms and 64 ms using the external resistor RWD_OSC. For example, with an external resistor of RWD_OSC = 51 kΩ ±1%, the typical parameters of the watchdog are as follows: tosc = 0.405 × RWD_OSC – 0.0004 × (RWD_OSC)2 (RWD_OSC in kΩ; tosc in µs) tOSC = 19.6 µs due to 51 kΩ td = 7895 × 19.6 µs = 155 ms t1 = 1053 × 19.6 µs = 20.6 ms t2 = 1105 × 19.6 µs = 21.6 ms tnres = constant = 4 ms After ramping up the battery voltage, the 3.3V/5V regulator is switched on. The reset output NRES stays low for the time treset (typically 4 ms), then it switches to high, and the watchdog waits for the trigger sequence from the microcontroller. The lead time, td, follows the reset and is td = 155 ms. In this time, the first watchdog pulse from the microcontroller is required. If the trigger pulse NTRIG occurs during this time, the time t1 starts immediately. If no trigger signal occurs during the time td, a watchdog reset with tNRES = 4 ms will reset the microcontroller after td = 155 ms. The times t1 and t2 have a fixed relationship between each other. A triggering signal from the microcontroller is anticipated within the time frame of t2 = 21.6 ms. To avoid false triggering from glitches, the trigger pulse must be longer than tTRIG,min > 200 ns. This slope serves to restart the watchdog sequence. If the triggering signal fails in this open window t2, the NRES output will be drawn to ground. A triggering signal during the closed window t1 immediately switches NRES to low. 15 4986I–AUTO–07/10 Figure 6-1. VCC 3.3V/5V Timing Sequence with RWD_OSC = 51 kΩ Undervoltage Reset NRES treset = 4 ms Watchdog Reset tnres = 4 ms td = 155 ms t1 = 20.6 ms twd t2 = 21 ms t1 t2 NTRIG ttrig > 200 ns 6.2 Worst Case Calculation with RWD_OSC = 51 kΩ The internal oscillator has a tolerance of 20%. This means that t1 and t2 can also vary by 20%. The worst case calculation for the watchdog period twd is calculated as follows. The ideal watchdog time twd is between the maximum t1 and the minimum t1 plus the minimum t2. t1,min = 0.8 × t1 = 16.5 ms, t1,max = 1.2 × t1 = 24.8 ms t2,min = 0.8 × t2 = 17.3 ms, t2,max = 1.2 × t2 = 26 ms twdmax = t1min + t2min = 16.5 ms + 17.3 ms = 33.8 ms twdmin = t1max = 24.8 ms twd = 29.3 ms ±4.5 ms (±15%) A microcontroller with an oscillator tolerance of ±15% is sufficient to supply the trigger inputs correctly. Table 6-1. RWD_OSC kΩ 34 51 91 120 Typical Watchdog Timings Oscillator Period tosc/µs 13.3 19.61 33.54 42.84 Lead Time td/ms 105 154.8 264.80 338.22 Closed Window t1/ms 14.0 20.64 35.32 45.11 Open Window t2/ms 14.7 21.67 37.06 47.34 Trigger Period from Microcontroller Reset Time twd/ms tnres/ms 19.9 29.32 50.14 64.05 4 4 4 4 16 ATA6622/ATA6624/ATA6626 4986I–AUTO–07/10 ATA6622/ATA6624/ATA6626 7. Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Parameters Supply voltage VS Pulse time ≤ 500 ms; Ta = 25°C Output current IVCC ≤ 50 mA Pulse time ≤ 2 min; Ta = 25°C Output current IVCC ≤ 50 mA WAKE (with 33 kΩ serial resistor) KL_15 (with 50 kΩ/100 nF) DC voltage Transient voltage due to ISO7637 (coupling 1 nF) INH - DC voltage LIN - DC voltage Logic pins (RxD, TxD, EN, NRES, NTRIG, WD_OSC, MODE, TM) Output current NRES PVCC DC voltage VCC DC voltage ESD according to IBEE LIN EMC Test Spec. 1.0 following IEC 61000-4-2 - Pin VS, LIN to GND - Pin WAKE (33 kΩ serial resistor) to GND ESD HBM following STM5.1 with 1.5 kΩ 100 pF - Pin VS, LIN, WAKE to GND HBM ESD ANSI/ESD-STM5.1 JESD22-A114 AEC-Q100 (002) CDM ESD STM 5.3.1 Machine Model ESD AEC-Q100-RevF(003) Junction temperature Storage temperature Tj Ts INRES –0.3 –0.3 Symbol VS VS VS –1 –150 Min. –0.3 Typ. Max. +40 +40 27 Unit V V V +40 +100 V V –0.3 –27 –0.3 VS + 0.3 +40 +5.5 +2 +5.5 +6.5 V V V mA V V ±6 ±5 ±6 KV KV KV ±3 KV ±750 ±200 –40 –55 +150 +150 V V °C °C 8. Thermal Characteristics Parameters Thermal resistance junction to heat slug Thermal resistance junction to ambient, where heat slug is soldered to PCB Thermal shutdown of VCC regulator Thermal shutdown of LIN output Thermal shutdown hysteresis Symbol Rthjc Rthja 150 150 35 165 165 10 170 170 Min. Typ. Max. 10 Unit K/W K/W °C °C °C 17 4986I–AUTO–07/10 9. Electrical Characteristics 5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins No. 1 1.1 Parameters VS Pin Nominal DC voltage range Sleep Mode VLIN > VS – 0.5V VS < 14V (Tj = 25°C) Sleep Mode VLIN > VS – 0.5V VS < 14V (Tj = 125°C) Bus recessive VS < 14V (Tj = 25°C) Without load at VCC Bus recessive VS < 14V (Tj = 125°C) Without load at VCC VS VS IVSsleep 5 27 V A Test Conditions Pin Symbol Min. Typ. Max. Unit Type* VS 3 10 14 µA A 1.2 Supply current in Sleep Mode VS IVSsleep 5 11 16 µA A VS IVSsi 47 57 67 µA A 1.3 Supply current in Silent Mode VS IVSsi 56 66 76 µA A 1.4 Bus recessive Supply current in Normal VS < 14V Mode Without load at VCC Bus dominant Supply current in Normal VS < 14V Mode VCC load current 50 mA Supply current in Fail-safe Mode VS undervoltage threshold VS undervoltage threshold hysteresis RXD Output Pin Low-level output sink current Normal Mode VLIN = 0V VRXD = 0.4V Bus recessive VS < 14V Without load at VCC VS IVSrec 0.3 0.8 mA A 1.5 VS IVSdom 50 53 mA A 1.6 VS IVSfail VSth VSth_hys 250 550 µA A 1.7 1.8 2 2.1 2.2 2.3 3 3.1 3.2 3.3 3.4 VS VS 4.0 4.5 0.2 5 V V A A RXD RXD RXD TXD TXD IRXD VRXDL RRXD VTXDL VTXDH RTXD ITXD 1.3 2.5 8 0.4 mA V kΩ V V kΩ µA A A A A A A A Low-level output voltage IRXD = 1 mA Internal resistor to VCC TXD Input/Output Pin Low-level voltage input High-level voltage input Pull-up resistor High-level leakage current VTXD = 0V VTXD = VCC 3 –0.3 2 125 –3 5 7 +0.8 VCC + 0.3V TXD TXD 250 400 +3 *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter 18 ATA6622/ATA6624/ATA6626 4986I–AUTO–07/10 ATA6622/ATA6624/ATA6626 9. Electrical Characteristics (Continued) 5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins No. Parameters Test Conditions Pin Symbol Min. Typ. Max. Unit Type* Fail-safe Mode Low-level output sink VLIN = VS current at local wake-up VWAKE = 0V request VTXD = 0.4V EN Input Pin Low-level voltage input High-level voltage input Pull-down resistor Low-level input current Low-level voltage input High-level voltage input Pull-up resistor High-level leakage current Mode Input Pin Low-level voltage input High-level voltage input Leakage current INH Output Pin High-level voltage Switch-on resistance between VS and INH Leakage current Sleep Mode VINH = 0V/27V, VS = 27V IINH = –15 mA INH INH INH VINHH RINH IINHL –3 VS – 0.75 30 VS 50 +3 V Ω µA A A A VMODE = VCC or VMODE = 0V MODE MODE MODE VMODEL VMODEH IMODE –0.3 2 –3 +0.8 VCC + 0.3V +3 V V µA A A A VNTRIG = 0V VNTRIG = VCC VEN = VCC VEN = 0V EN EN EN EN NTRIG NTRIG NTRIG NTRIG VENL VENH REN IEN VNTRIGL VNTRIGH RNTRIG INTRIG –0.3 2 50 –3 –0.3 2 125 –3 250 125 +0.8 VCC + 0.3V 200 +3 +0.8 VCC + 0.3V 400 +3 V V kΩ µA V V kΩ µA A A A A A A A A 3.5 TXD ITXDwake 2 2.5 8 mA A 4 4.1 4.2 4.3 4.4 5 5.1 5.2 5.3 5.4 6 6.1 6.2 6.3 7 7.1 7.2 7.3 NTRIG Watchdog Input Pin 8 LIN Bus Driver: Bus Load Conditions: Load 1 (Small): 1 nF, 1 kΩ; Load 2 (Large): 10 nF, 500Ω; Internal Pull-up RRXD = 5 kΩ; CRXD = 20 pF Load 3 (Medium): 6.8 nF, 660Ω, Characterized on Samples 10.6 and 10.7 Specifies the Timing Parameters for Proper Operation at 20 kBit/s and 10.8 and 10.9 at 10.4 kBit/s Driver recessive output voltage Driver dominant voltage Driver dominant voltage Driver dominant voltage Driver dominant voltage Load1/Load2 VVS = 7V Rload = 500 Ω VVS = 18V Rload = 500 Ω VVS = 7.0V Rload = 1000 Ω VVS = 18V Rload = 1000 Ω LIN LIN LIN LIN LIN VBUSrec V_LoSUP V_HiSUP V_LoSUP_1k V_HiSUP_1k 0.6 0.8 0.9 × VS VS 1.2 2 V V V V V A A A A A 8.1 8.2 8.3 8.4 8.5 *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter 19 4986I–AUTO–07/10 9. Electrical Characteristics (Continued) 5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins No. 8.6 8.7 8.8 Parameters Pull-up resistor to VS Test Conditions The serial diode is mandatory Pin LIN LIN LIN Input leakage current Driver off VBUS = 0V VBatt = 12V Driver off 8V < VBatt < 18V 8V < VBUS < 18V VBUS ≥ VBatt Symbol RLIN VSerDiode IBUS_LIM Min. 20 0.4 40 120 Typ. 30 Max. 60 1.0 200 Unit kΩ V mA Type* A D A Voltage drop at the serial In pull-up path with Rslave diodes ISerDiode = 10 mA LIN current limitation VBUS = VBatt_max Input leakage current at the receiver including pull-up resistor as specified Leakage current LIN recessive 8.9 LIN IBUS_PAS_dom –1 –0.35 mA A 8.10 LIN IBUS_PAS_rec 10 20 µA A 8.11 Leakage current when control unit disconnected from ground. GNDDevice = VS VBatt = 12V Loss of local ground 0V < VBUS < 18V must not affect communication in the residual network. Leakage current at a disconnected battery. Node has to sustain the VBatt disconnected current that can flow VSUP_Device = GND under this condition. Bus 0V < VBUS < 18V must remain operational under this condition. Capacitance on pin LIN to GND LIN Bus Receiver Center of receiver threshold VBUS_CNT = (Vth_dom + Vth_rec)/2 LIN IBUS_NO_gnd –10 +0.5 +10 µA A 8.12 LIN IBUS_NO_bat 0.1 2 µA A 8.13 9 9.1 9.2 9.3 9.4 9.5 9.6 10 10.1 LIN CLIN 20 pF D LIN LIN LIN LIN LIN LIN VBUS_CNT VBUSdom VBUSrec VBUShys VLINH VLINL 0.475 × VS 0.6 × VS 0.028 × VS VS – 2V –27 0.5 × VS 0.525 × VS 0.4 × VS 0.175 × VS VS + 0.3V VS – 3.3V V V V A A A A A A Receiver dominant state VEN = 5V Receiver recessive state VEN = 5V Receiver input hysteresis Pre_Wake detection LIN High-level input voltage Pre_Wake detection LIN Activates the LIN receiver Low-level input voltage Internal Timers Dominant time for wake-up via LIN bus VLIN = 0V Vhys = Vth_rec – Vth_dom 0.1 × VS V V V LIN tbus 30 90 150 µs A *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter 20 ATA6622/ATA6624/ATA6626 4986I–AUTO–07/10 ATA6622/ATA6624/ATA6626 9. Electrical Characteristics (Continued) 5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins No. Parameters Time delay for mode change from Fail-safe into Normal Mode via EN pin Test Conditions Pin Symbol Min. Typ. Max. Unit Type* 10.2 VEN = 5V EN tnorm 5 15 20 µs A 10.3 Time delay for mode change from Normal V = 0V Mode to Sleep Mode via EN EN pin TXD dominant time-out = 0V V time (ATA6626 disabled) TXD Time delay for mode change from Silent V = 5V Mode into Normal Mode EN via EN THRec(max) = 0.744 × VS THDom(max) = 0.581 × VS VS = 7.0V to 18V tBit = 50 µs D1 = tbus_rec(min)/(2 × tBit) THRec(min) = 0.422 × VS THDom(min) = 0.284 × VS VS = 7.6V to 18V tBit = 50 µs D2 = tbus_rec(max)/(2 × tBit) THRec(max) = 0.778 × VS THDom(max) = 0.616 × VS VS = 7.0V to 18V tBit = 96 µs D3 = tbus_rec(min)/(2 × tBit) THRec(min) = 0.389 × VS THDom(min) = 0.251 × VS VS = 7.6V to 18V tBit = 96 µs D4 = tbus_rec(max)/(2 × tBit) VS = 7.0V to 18V EN tsleep 2 7 12 µs A 10.4 TXD tdom 6 13 20 ms A 10.5 EN ts_n 5 15 40 µs A 10.6 Duty cycle 1 LIN D1 0.396 A 10.7 Duty cycle 2 LIN D2 0.581 A 10.8 Duty cycle 3 LIN D3 0.417 A 10.9 Duty cycle 4 LIN D4 0.590 A 10.10 11 Slope time falling and rising edge at LIN LIN tSLOPE_fall tSLOPE_rise 3.5 22.5 µs A Receiver Electrical AC Parameters of the LIN Physical Layer LIN Receiver, RXD Load Conditions: CRXD = 20 pF Propagation delay of receiver (Figure 9-1 on page 24) VS = 7.0V to 18V trx_pd = max(trx_pdr , trx_pdf) RXD trx_pd 6 µs A 11.1 11.2 12 12.1 Symmetry of receiver VS = 7.0V to 18V propagation delay rising t =t –t edge minus falling edge rx_sym rx_pdr rx_pdf NRES Open Drain Output Pin Low-level output voltage VS ≥ 5.5V INRES = 1 mA RXD trx_sym –2 +2 µs A NRES VNRESL 0.14 V A *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter 21 4986I–AUTO–07/10 9. Electrical Characteristics (Continued) 5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins No. 12.2 12.3 12.4 13 13.1 13.2 13.3 13.4 13.5 13.6 14 14.1 14.2 14.3 14.4 15 15.1 15.2 15.3 15.4 15.5 16 16.1 16.2 16.3 16.4 16.5 Parameters Low-level output low Undervoltage reset time Test Conditions 10 kΩ to 5V VCC = 0V VS ≥ 5.5V CNRES = 20 pF Pin NRES NRES NRES Symbol VNRESLL treset tres_f 2 1.5 4 Min. Typ. Max. 0.14 6 10 Unit V ms µs Type* A A A Reset debounce time for VS ≥ 5.5V CNRES = 20 pF falling edge Watchdog Oscillator Voltage at WD_OSC in Normal Mode Possible values of resistor Oscillator period Oscillator period Oscillator period Oscillator period Watchdog lead time after Reset Watchdog closed window Watchdog open window Watchdog reset time NRES KL_15 Pin High-level input voltage RV = 47 kΩ Low-level input voltage RV = 47 kΩ KL_15 pull-down current Internal debounce time KL_15 wake-up time WAKE Pin High-level input voltage Low-level input voltage WAKE pull-up current High-level leakage current Time of low pulse for wake-up via WAKE pin Initializes a wake-up signal VS < 27V VWAKE = 0V VS = 27V VWAKE = 27V VWAKE = 0V VS < 27V VKL_15 = 27V Without external capacitor RV = 47 kΩ, C = 100 nF Positive edge initializes a wake-up ROSC = 34 kΩ ROSC = 51 kΩ ROSC = 91 kΩ ROSC = 120 kΩ IWD_OSC = –200 µA VVS ≥ 4V WD_ OSC WD_ OSC VWD_OSC ROSC tOSC tOSC tOSC tOSC 1.13 34 10.65 15.68 26.83 34.2 1.23 1.33 120 V kΩ µs µs µs µs A A A A A A 13.3 19.6 33.5 42.8 15.97 23.52 40.24 51.4 Watchdog Timing Relative to tOSC td t1 t2 NRES tnres 3.2 7895 1053 1105 4 4.8 cycles cycles cycles ms A A A A KL_15 KL_15 KL_15 KL_15 KL_15 VKL_15H VKL_15L IKL_15 TdbKL_15 TwKL_15 4 –1 50 80 0.4 160 2 VS + 0.3V +2 65 250 4.5 VS + 0.3V VS – 3.3V –10 +5 70 150 V V µA µs ms A A A A C WAKE WAKE WAKE WAKE WAKE VWAKEH VWAKEL IWAKE IWAKEL IWAKEL VS – 1V –1 –30 –5 30 V V µA µA µs A A A A A *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter 22 ATA6622/ATA6624/ATA6626 4986I–AUTO–07/10 ATA6622/ATA6624/ATA6626 9. Electrical Characteristics (Continued) 5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins No. 17 17.1 17.2 17.3 17.4 17.5 17.6 17.7 17.8 17.9 17.10 17.11 17.12 18 18.1 18.2 18.3 18.4 18.5 18.6 18.7 18.8 18.9 Parameters Test Conditions 4V < VS < 18V (0 mA to 50 mA) 3V < VS < 4V VS > 3V IVCC = –15 mA VS > 3V IVCC = –50 mA 4V < VS < 18V 5 mA < IVCC < 50 mA 10 Hz to 100 kHz CVCC = 10 µF VS = 14V, IVCC = –15 mA 0.2Ω < ESR < 5Ω at 100 kHz Referred to VCC VS > 4V Referred to VCC VS > 4V Pin Symbol Min. Typ. Max. Unit Type* VCC Voltage Regulator ATA6622, PVCC = VCC Output voltage VCC Output voltage VCC at low VS Regulator drop voltage Regulator drop voltage Line regulation Load regulation Power supply ripple rejection VCC VCC VS, VCC VS, VCC VCC VCC VCC VCC VCC VCC VCC VCC IVCClim Cload VthunN Vhysthun TVCC VCCnor VCClow VD1 VD2 VCCline VCCload 50 –240 1.8 2.8 150 100 250 –160 10 3.2 –85 500 0.1 0.1 3.234 VS – VD 3.366 3.366 200 700 0.2 0.5 V V mV mV % % dB mA µF V mV µs A A A A A A D A D A A A Output current limitation VS > 4V Load capacity VCC undervoltage threshold Hysteresis of undervoltage threshold Ramp-up time VS > 4V to CVCC = 2.2 µF VCC = 3.3V Iload = –5 mA at VCC 5.5V < VS < 18V (0 mA to 50 mA) 4V < VS < 5.5V VS > 4V IVCC = –20 mA VS > 4V IVCC = –50 mA VS > 3.3V IVCC = –15 mA 5.5V < VS < 18V 5 mA < IVCC < 50 mA 10 Hz to 100 kHz CVCC = 10 µF VS = 14V, IVCC = –15 mA 0.2Ω < ESR < 5Ω at 100 kHz VCC Voltage Regulator ATA6624/ATA6626, PVCC = VCC Output voltage VCC Output voltage VCC at low VS Regulator drop voltage Regulator drop voltage Regulator drop voltage Line regulation Load regulation Power supply ripple rejection VCC VCC VS, VCC VS, VCC VS, VCC VCC VCC VCC VCC VCC IVCClim VthunN VCCnor VCClow VD1 VD2 VD3 VCCline VCCload 50 –240 1.8 –130 10 –85 0.1 0.1 400 4.9 VS – VD 5.1 5.1 250 600 200 0.2 0.5 V V mV mV mV % % dB mA µF A A A A A A A D A D Output current limitation VS > 5.5V 18.10 Load capacity *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter 23 4986I–AUTO–07/10 9. Electrical Characteristics (Continued) 5V < VS < 27V, -40°C < Tj < 150°C, unless otherwise specified. All values refer to GND pins No. 18.11 18.12 18.13 Parameters VCC undervoltage threshold Hysteresis of undervoltage threshold Test Conditions Referred to VCC VS > 5.5V Referred to VCC VS > 5.5V Pin VCC VCC VCC Symbol VthunN Vhysthun tVCC Min. 4.2 250 130 300 Typ. Max. 4.8 Unit V mV µs Type* A A A Ramp-up time VS > 5.5V CVCC = 2.2 µF to VCC = 5V Iload = –5 mA at VCC *) Type means: A = 100% tested, B = 100% correlation tested, C = Characterized on samples, D = Design parameter Figure 9-1. Definition of Bus Timing Characteristics tBit tBit tBit TXD (Input to transmitting node) tBus_dom(max) tBus_rec(min) THRec(max) VS (Transceiver supply of transmitting node) THDom(max) LIN Bus Signal THRec(min) THDom(min) Thresholds of receiving node1 Thresholds of receiving node2 tBus_dom(min) tBus_rec(max) RXD (Output of receiving node1) trx_pdf(1) trx_pdr(1) RXD (Output of receiving node2) trx_pdr(2) trx_pdf(2) 24 ATA6622/ATA6624/ATA6626 4986I–AUTO–07/10 ATA6622/ATA6624/ATA6626 Figure 9-2. Typical Application Circuit Ignition VBattery KL30 22 µF + 100 nF 47 kΩ Master node pull-up 100 nF KL_15 PVCC KL15 VCC VS + 10 kΩ 1 kΩ Debug 10 kΩ 100 nF 10 µF 20 19 18 17 16 15 EN VCC 10 kΩ NTRIG 33 kΩ WAKE GND EN Wake switch 1 2 3 4 5 6 7 8 9 10 MODE TM WD_OSC NRES TXD ATA6622/24/26 MLP 5 mm 5 mm 0.65 mm pitch 20 lead 14 13 12 11 Microcontroller 51 kΩ NTRIG RXD TXD GND RESET RXD 220 pF INH LIN sub bus LIN 25 4986I–AUTO–07/10 Figure 9-3. Application Circuit with External NPN-Transistor Ignition VBattery KL30 22 µF + 100 nF *) MJD31C + KL15 47 kΩ Master node pull-up 100 nF 2.2 µF 3.3Ω VCC VS + KL_15 PVCC 10 kΩ 1 kΩ Debug 10 kΩ 100 nF 10 µF 20 19 18 17 16 15 EN VCC 10 kΩ NTRIG 33 kΩ WAKE GND EN Wake switch 1 2 3 4 5 6 7 8 9 10 MODE TM WD_OSC NRES TXD ATA6622/24/26 MLP 5 mm 5 mm 0.65 mm pitch 20 lead 14 13 12 11 Microcontroller 51 kΩ NTRIG RXD TXD GND RESET RXD 220 pF INH *) Note that the output voltage PVCC is no longer short-ciruit protected when boosting the output current by an external NPN-transistor. 26 ATA6622/ATA6624/ATA6626 4986I–AUTO–07/10 LIN sub bus LIN ATA6622/ATA6624/ATA6626 Figure 9-4. LIN Slave Application with Minimum External Devices VBAT + C2 22 µF/50V VCC 100 nF 10 µF 100 nF 20 19 18 17 16 15 14 EN GND VCC VCC NTRIG WAKE GND VS C1 GND VCC C5 + C3 KL_15 PVCC 1 2 3 4 5 6 7 8 9 10 MODE TM WD_OSC NRES TXD ATA6622/24/26 13 12 11 Microcontroller EN NTRIG GND GND RXD LIN INH RXD TXD RESET GND R9 10 kΩ C4 220 pF VCC Note: No watchdog, INH output not used, no local wake-up LIN Sub Bus 27 4986I–AUTO–07/10 10. Ordering Information Extended Type Number ATA6622-PGPW ATA6624-PGPW ATA6622-PGQW ATA6624-PGQW ATA6626-PGQW ATA6622C-PGPW ATA6624C-PGPW ATA6622C-PGQW ATA6624C-PGQW ATA6626C-PGQW Package QFN20 QFN20 QFN20 QFN20 QFN20 QFN20 QFN20 QFN20 QFN20 QFN20 Remarks 3.3V LIN system-basis-chip, Pb-free, 1.5k, taped and reeled 5V LIN system-basis-chip, Pb-free, 1.5k, taped and reeled 3.3V LIN system-basis-chip, Pb-free, 6k, taped and reeled 5V LIN system-basis-chip, Pb-free, 6k, taped and reeled 5V LIN system-basis-chip, Pb-free, 6k, taped and reeled 3.3V LIN system-basis-chip, Pb-free, 1.5k, taped and reeled 5V LIN system-basis-chip, Pb-free, 1.5k, taped and reeled 3.3V LIN system-basis-chip, Pb-free, 6k, taped and reeled 5V LIN system-basis-chip, Pb-free, 6k, taped and reeled 5V LIN system-basis-chip, Pb-free, 6k, taped and reeled 11. Package Information Package: VQFN_5 x 5_20L Exposed pad 3.1 x 3.1 Dimensions in mm Not indicated tolerances ±0.05 0 0.05-0.05 Bottom 3.1±0.15 16 15 20 1 Top 20 Pin 1 identification 1 5 0.2 5 0.9±0.1 11 10 6 5 0.65 nom. 2.6 Drawing-No.: 6.543-5129.01-4 Issue: 2; 09.02.07 0.28±0.07 0.6±0.1 technical drawings according to DIN specifications 28 ATA6622/ATA6624/ATA6626 4986I–AUTO–07/10 ATA6622/ATA6624/ATA6626 12. Revision History Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this document. Revision No. 4986I-AUTO-07/10 History • Section 6 “Watchdog” on pages 15 to 16 changed • • • • • • • • • • • New Part numbers ATA6622C, ATA6624C and ATA6626C added Features on page 1 changed Pin Description table: rows Pin 4 and Pin 15 changed Text under headings 3.3, 3.9, 3.11, 5.5 and 6 changed Figures 4-5, 6-1 and 9-3 changed Abs.Max.Rat.Table -> Values in row “ESD HBM following....” changed El.Char.Table -> rows changed: 7.1, 12.1, 12.2, 17.5, 17.6, 17.7, 17.8, 18.6, 18.7, 18.8, 18.9 El.Char.Table -> row 8.13 added Figures 9-2 and 9-3 figure title changed Figure 9-4 on page 27 added Ord.Info.Table -> new part numbers added 4986H-AUTO-05/10 4986G-AUTO-08/09 • complete datasheet: “LIN 2.0 specicfication” changed in “LIN 2.1 specicfication” • Figures changed: 1-1, 4-2, 4-3, 4-4, 4-5, 5-1, 9-2, 9-3 • Sections changed: 3.1, 3.6, 3.8, 3.9, 3.10, 3.14, 4.1, 4.2, 4,3, 5.1, 5.2, 5.3, 5.5, 5.6 • Features and Description changed • Table 4-1 changed • Abs. Max. Ratings table changed • Thermal Characteristics table inserted • El. Characteristics table changed • Section 3.15 “INH Output Pin” on page 6 changed • Section 5.5 “Fail-safe Features” on page 13 changed • Section 6.1 “Typical Timing Sequence with RWD_OSC = 51 kΩ” on page 15 changed • Section 8 “Electrical Characteristics” numbers 1.6 to 1.8 on page 18 changed • Figure 2-1 on page 3 renamed • Figure 6-1 “Timing Sequence with RWD_OSC = 51 kΩ” on page 16 changed • Figure 8-3 “Application Circuit with External NPN” on page 26 added 4986F-AUTO-05/08 4986E-AUTO-02/08 29 4986I–AUTO–07/10 Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this document. Revision No. 4986D-AUTO-10/07 History • Section 9 “Ordering Information” on page 26 changed • • • • • • • • • • • • • • • • Features changed Sections 4.2, 4.3, 4.4 and 4.5 changed Figures 4-2, 4-3, 4-4, 5-1, 5-2, 5-3, 5-6, 6-1 and 6-2 changed Section 7 “Absolute Maximum Ratings” changed” Section 8 “Electrical Characteristics”: numbers 17.9 and 18.9 changed 4986C-AUTO-09/07 4986B-AUTO-06/07 Put datasheet into a new template Part number ATA6626 added Features changed Description text changed Figure 1-1 “Block Diagram” changed Figure 2-1 “Pinning SO8 changed” Figure 4-3 “LIN Wake Up from Silent Mode” changed Figure 4-5 “LIN Wake Up from Sleep Mode” changed Sections 3.2, 3.4, 3.7, 3.8, 3.9, 3.10, 3.11, 3.12, 3.13 and 3.14 changed Sections 4.2, 4.3, 4.4, 4.5, 5.1, 5.2, 5.3, 5.5, 5.6, 6.1 and 6.2 changed Section 8 “Electrical Characteristics”: numbers 1.3, 3.5, 8.4, 12.1, 15.5, 17.9, 18 and 18.9 changed • Figure 8-2 “Application Circuit” changed • Section 9 “Ordering Information” changed • Section 10 “Package Information” changed 30 ATA6622/ATA6624/ATA6626 4986I–AUTO–07/10 Headquarters Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 International Atmel Asia Unit 1-5 & 16, 19/F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon Hong Kong Tel: (852) 2245-6100 Fax: (852) 2722-1369 Atmel Europe Le Krebs 8, Rue Jean-Pierre Timbaud BP 309 78054 Saint-Quentin-en-Yvelines Cedex France Tel: (33) 1-30-60-70-00 Fax: (33) 1-30-60-71-11 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan Tel: (81) 3-3523-3551 Fax: (81) 3-3523-7581 Product Contact Web Site www.atmel.com Technical Support auto_control@atmel.com Sales Contact www.atmel.com/contacts Literature Requests www.atmel.com/literature Disclaimer: T he information in this document is provided in connection with Atmel products. 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