ATF1504AS-10AI44

Features • High-density, High-performance, Electrically-erasable Complex Programmable Logic Device – 64 Macrocells – 5 Product Terms per Macrocell, Expandable up to 40 per Macrocell – 44, 68, 84, 100 Pins – 7.5 ns Maximum Pin-to-pin Delay – Registered Operation up to 125 MHz – Enhanced Routing Resources In-System Programmability (ISP) via JTAG Flexible Logic Macrocell – D/T/Latch Configurable Flip-flops – Global and Individual Register Control Signals – Global and Individual Output Enable – Programmable Output Slew Rate – Programmable Output Open Collector Option – Maximum Logic Utilization by Burying a Register with a COM Output Advanced Power Management Features – Automatic µA Standby for “L” Version – Pin-controlled 1 mA Standby Mode – Programmable Pin-keeper Circuits on Inputs and I/Os – Reduced-power Feature per Macrocell Available in Commercial and Industrial Temperature Ranges Available in 44-, 68-, and 84-lead PLCC; 44- and 100-lead TQFP; and 100-lead PQFP Advanced EE Technology – 100% Tested – Completely Reprogrammable – 10,000 Program/Erase Cycles – 20-year Data Retention – 2000V ESD Protection – 200 mA Latch-up Immunity JTAG Boundary-scan Testing to IEEE Std. 1149.1-1990 and 1149.1a-1993 Supported PCI-compliant 3.3V or 5.0V I/O Pins Security Fuse Feature Green (Pb/Halide-fee/RoHS Compliant) Package Options • • • Highperformance Complex Programmable Logic Device ATF1504AS ATF1504ASL • • • • • • • • Enhanced Features • • • • • • • • • • • Improved Connectivity (Additional Feedback Routing, Alternate Input Routing) Output Enable Product Terms Transparent – Latch Mode Combinatorial Output with Registered Feedback within Any Macrocell Three Global Clock Pins ITD (Input Transition Detection) Circuits on Global Clocks, Inputs and I/O Fast Registered Input from Product Term Programmable “Pin-keeper” Option VCC Power-up Reset Option Pull-up Option on JTAG Pins TMS and TDI Advanced Power Management Features – Edge-controlled Power-down “L” – Individual Macrocell Power Option – Disable ITD on Global Clocks, Inputs and I/O Rev. 0950O–PLD–7/05 1 44-lead TQFP Top View I/O I/O I/O VCC GCLK2/OE2/I GCLR/I I/OE1 GCLK1/I GND GCLK3/I/O I/O 44-lead PLCC Top View I/O I/O I/O VCC GCLK2/OE2/I GCLR/I OE1/I GCLK1/I GND GCLK3/I/O I/O 33 32 31 30 29 28 27 26 25 24 23 I/O I/O/TDO I/O I/O VCC I/O I/O I/O/TCK I/O GND I/O I/O VCCIO I/O/TDI I/O I/O I/O I/O GND I/O/PD1 I/O I/O I/O/TMS I/O I/O VCCIO I/O I/O I/O I/O I/O GND 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 44 43 42 41 40 39 38 37 36 35 34 I/O/TDI I/O I/O GND PD1/I/O I/O TMS/I/O I/O VCC I/O I/O 1 2 3 4 5 6 7 8 9 10 11 I/O I/O I/O I/O GND VCC I/O PD2/I/O I/O I/O I/O 68-lead PLCC Top View I/O I/O I/O GND I/O I/O VCCINT GCLK2/OE2/I GCLR/I OE1/I GCLK1/I GND GCLK3/I/O I/O VCCIO I/O I/O 9 8 7 6 5 4 3 2 1 68 67 66 65 64 63 62 61 I/O I/O I/O I/O VCCIO I/O I/O GND VCCINT I/O I/O/PD2 GND I/O I/O I/O I/O VCCIO 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 I/O VCCIO I/O/TD1 I/O I/O I/O GND I/O/PD1 I/O I/O/TMS I/O VCCIO I/O I/O I/O I/O GND 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 11 10 9 8 7 6 5 4 3 2 1 84 83 82 81 80 79 78 77 76 75 I/O I/O I/O I/O GND I/O I/O I/O VCCINT GCLK2/OE2/I I/GCLR I/OE1 GCLK1/I GND GCLK3/I/O I/O I/O VCCIO 1/O I/O I/O I/O I/O GND I/O/TDO I/O I/O I/O VCCIO I/O I/O I/O/TCK I/O GND I/O I/O I/O I/O I/O I/O I/O I/O GND VCC I/O PD2/I/O I/O I/O I/O 12 13 14 15 16 17 18 19 20 21 22 18 19 20 21 22 23 24 25 26 27 28 TDI/I/O I/O I/O GND PD1/I/O I/O I/O/TMS I/O VCC I/O I/O 7 8 9 10 11 12 13 14 15 16 17 6 5 4 3 2 1 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 I/O I/O/TDO I/O I/O VCC I/O I/O I/O/TCK I/O GND I/O 84-lead PLCC Top View 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 2 ATF1504AS(L) 0950O–PLD–7/05 I/O I/O I/O I/O I/O VCCIO I/O I/O I/O GND VCCINT I/O I/O I/O/PD2 GND I/O I/O I/O I/O I/O VCCIO 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 I/O I/O GND I/O/TDO I/O I/O I/O I/O VCCIO I/O I/O I/O I/O/TCK I/O I/O GND I/O I/O I/O I/O I/O ATF1504AS(L) 100-lead PQFP Top View I/O I/O I/O GND I/O I/O I/O VCCINT INPUT/OE2/GCLK2 INPUT/GCLR INPUT/OE1 INPUT/GCLK1 GND I/O/GCLK3 I/O I/O VCCIO I/O I/O I/O 100-lead TQFP Top View I/O I/O I/O I/O I/O GND I/O I/O I/O VCCINT INPUT/OE2/GCLK2 INPUT/GCLR INPUT/OE1 INPUT/GCLK1 GND I/O/GCLK3 I/O I/O VCCIO I/O I/O I/O NC NC I/O NC NC VCCIO I/O/TDI NC I/O NC I/O I/O I/O GND I/O/PD1 I/O I/O I/O/TMS I/O I/O VCCIO I/O I/O I/O NC I/O NC I/O 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 NC NC I/O I/O VCCIO I/O/TDI NC I/O NC I/O I/O I/O GND I/O/PD1 I/O I/O I/O/TMS I/O I/O VCCIO I/O I/O I/O NC I/O NC I/O GND NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 NC NC I/O I/O GND I/O/TDO NC I/O NC I/O I/O I/O VCCIO I/O I/O I/O I/O/TCK I/O I/O GND I/O I/O I/O NC I/O NC I/O VCCIO NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 I/O GND I/O/TDO NC I/O NC I/O I/O I/O VCCIO I/O I/O I/O I/O/TCK I/O I/O GND I/O I/O I/O NC I/O NC I/O VCCIO I/O I/O I/O I/O I/O VCCIO I/O I/O I/O GND VCCINT I/O I/O I/O/PD2 GND I/O I/O I/O I/O I/O GND NC NC I/O I/O I/O I/O I/O VCCIO I/O I/O I/O GND VCCINT I/O I/O I/O/PD2 GND I/O I/O I/O I/O I/O NC NC 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 3 0950O–PLD–7/05 Description The ATF1504AS is a high-performance, high-density complex programmable logic device (CPLD) that utilizes Atmel’s proven electrically-erasable memory technology. With 64 logic macrocells and up to 68 inputs, it easily integrates logic from several TTL, SSI, MSI, LSI and classic PLDs. The ATF1504AS’s enhanced routing switch matrices increase usable gate count and the odds of successful pin-locked design modifications. The ATF1504AS has up to 68 bi-directional I/O pins and four dedicated input pins, depending on the type of device package selected. Each dedicated pin can also serve as a global control signal, register clock, register reset or output enable. Each of these control signals can be selected for use individually within each macrocell. Each of the 64 macrocells generates a buried feedback that goes to the global bus. Each input and I/O pin also feeds into the global bus. The switch matrix in each logic block then selects 40 individual signals from the global bus. Each macrocell also generates a foldback logic term that goes to a regional bus. Cascade logic between macrocells in the ATF1504AS allows fast, efficient generation of complex logic functions. The ATF1504AS contains four such logic chains, each capable of creating sum term logic with a fan-in of up to 40 product terms. The ATF1504AS macrocell, shown in Figure 1, is flexible enough to support highly-complex logic functions operating at high speed. The macrocell consists of five sections: product terms and product term select multiplexer, OR/XOR/CASCADE logic, a flip-flop, output select and enable, and logic array inputs. 4 ATF1504AS(L) 0950O–PLD–7/05 ATF1504AS(L) Block Diagram I/O (MC64)/GCLK3 Unused product terms are automatically disabled by the compiler to decrease power consumption. A security fuse, when programmed, protects the contents of the ATF1504AS. Two bytes (16 bits) of User Signature are accessible to the user for purposes such as storing project name, part number, revision or date. The User Signature is accessible regardless of the state of the security fuse. The ATF1504AS device is an in-system programmable (ISP) device. It uses the industry-standard 4-pin JTAG interface (IEEE Std. 1149.1), and is fully-compliant with JTAG’s Boundary-scan Description Language (BSDL). ISP allows the device to be programmed without removing it from the printed circuit board. In addition to simplifying the manufacturing flow, ISP also allows design modifications to be made in the field via software. 5 0950O–PLD–7/05 Product Terms and Select Mux Each ATF1504AS macrocell has five product terms. Each product term receives as its possible inputs all signals from both the global bus and regional bus. The product term select multiplexer (PTMUX) allocates the five product terms as needed to the macrocell logic gates and control signals. The PTMUX programming is determined by the design compiler, which selects the optimum macrocell configuration. OR/XOR/CASCADE Logic The ATF1504AS’s logic structure is designed to efficiently support all types of logic. Within a single macrocell, all the product terms can be routed to the OR gate, creating a 5-input AND/OR sum term. With the addition of the CASIN from neighboring macrocells, this can be expanded to as many as 40 product terms with a little small additional delay. The macrocell’s XOR gate allows efficient implementation of compare and arithmetic functions. One input to the XOR comes from the OR sum term. The other XOR input can be a product term or a fixed high- or low-level. For combinatorial outputs, the fixed level input allows polarity selection. For registered functions, the fixed levels allow DeMorgan minimization of product terms. The XOR gate is also used to emulate T- and JK-type flip-flops. Flip-flop The ATF1504AS’s flip-flop has very flexible data and control functions. The data input can come from either the XOR gate, from a separate product term or directly from the I/O pin. Selecting the separate product term allows creation of a buried registered feedback within a combinatorial output macrocell. (This feature is automatically implemented by the fitter software). In addition to D, T, JK and SR operation, the flip-flop can also be configured as a flow-through latch. In this mode, data passes through when the clock is high and is latched when the clock is low. The clock itself can be either one of the Global CLK Signals (GCK[0 : 2]) or an individual product term. The flip-flop changes state on the clock’s rising edge. When the GCK signal is used as the clock, one of the macrocell product terms can be selected as a clock enable. When the clock enable function is active and the enable signal (product term) is low, all clock edges are ignored. The flip-flop’s asynchronous reset signal (AR) can be either the Global Clear (GCLEAR), a product term, or always off. AR can also be a logic OR of GCLEAR with a product term. The asynchronous preset (AP) can be a product term or always off. Output Select and Enable The ATF1504AS macrocell output can be selected as registered or combinatorial. The buried feedback signal can be either combinatorial or registered signal regardless of whether the output is combinatorial or registered. The output enable multiplexer (MOE) controls the output enable signals. Any buffer can be permanently enabled for simple output operation. Buffers can also be permanently disabled to allow use of the pin as an input. In this configuration all the macrocell resources are still available, including the buried feedback, expander and CASCADE logic. The output enable for each macrocell can be selected as either of the two dedicated OE input pins as an I/O pin configured as an input, or as an individual product term. Global Bus/Switch Matrix The global bus contains all input and I/O pin signals as well as the buried feedback signal from all 64 macrocells. The switch matrix in each logic block receives as its possible inputs all signals from the global bus. Under software control, up to 40 of these signals can be selected as inputs to the logic block. 6 ATF1504AS(L) 0950O–PLD–7/05 ATF1504AS(L) Foldback Bus Each macrocell also generates a foldback product term. This signal goes to the regional bus and is available to four macrocells. The foldback is an inverse polarity of one of the macrocell’s product terms. The sixteen foldback terms in each region allow generation of high fan-in sum terms (up to sixteen product terms) with a nominal additional delay. Figure 1. ATF1504AS Macrocell 7 0950O–PLD–7/05 Programmable Pinkeeper Option for Inputs and I/Os The ATF1504AS offers the option of programming all input and I/O pins so that pinkeeper circuits can be utilized. When any pin is driven high or low and then subsequently left floating, it will stay at that previous high- or low-level. This circuitry prevents unused input and I/O lines from floating to intermediate voltage levels, which causes unnecessary power consumption and system noise. The keeper circuits eliminate the need for external pull-up resistors and eliminate their DC power consumption. Input Diagram Speed/Power Management The ATF1504AS has several built-in speed and power management features. The ATF1504AS contains circuitry that automatically puts the device into a low-power standby mode when no logic transitions are occurring. This not only reduces power consumption during inactive periods, but also provides proportional power savings for most applications running at system speeds below 5 MHz. This feature may be selected as a device option. I/O Diagram To further reduce power, each ATF1504AS macrocell has a Reduced Power bit feature. This feature allows individual macrocells to be configured for maximum power savings. This feature may be selected as a design option. All ATF1504AS also have an optional power-down mode. In this mode, current drops to below 10 mA. When the power-down option is selected, either PD1 or PD2 pins (or both) can be used to power-down the part. The power-down option is selected in the design source file. When enabled, the device goes into power-down when either PD1 or PD2 is high. In the power-down mode, all internal logic signals are latched and held, as are any enabled outputs. 8 ATF1504AS(L) 0950O–PLD–7/05 ATF1504AS(L) All pin transitions are ignored until the PD pin is brought low. When the power-down feature is enabled, the PD1 or PD2 pin cannot be used as a logic input or output. However, the pin’s macrocell may still be used to generate buried foldback and cascade logic signals. All power-down AC characteristic parameters are computed from external input or I/O pins, with Reduced Power Bit turned on. For macrocells in reduced-power mode (reduced-power bit turned on), the reduced-power adder, tRPA, must be added to the AC parameters, which include the data paths tLAD, tLAC, tIC, tACL, tACH and tSEXP. The ATF1504AS macrocell also has an option whereby the power can be reduced on a per macrocell basis. By enabling this power-down option, macrocells that are not used in an application can be turned-down, thereby reducing the overall power consumption of the device. Each output also has individual slew rate control. This may be used to reduce system noise by slowing down outputs that do not need to operate at maximum speed. Outputs default to slow switching, and may be specified as fast switching in the design file. Design Software Support Power-up Reset ATF1504AS designs are supported by several industry-standard third-party tools. Automated fitters allow logic synthesis using a variety of high level description languages and formats. The ATF1504AS is designed with a power-up reset, a feature critical for state machine initialization. At a point delayed slightly from VCC crossing VRST, all registers will be initialized, and the state of each output will depend on the polarity of its buffer. However, due to the asynchronous nature of reset and uncertainty of how VCC actually rises in the system, the following conditions are required: 1. The VCC rise must be monotonic, 2. After reset occurs, all input and feedback setup times must be met before driving the clock pin high, and, 3. The clock must remain stable during TD. The ATF1504AS has two options for the hysteresis about the reset level, VRST, Small and Large. During the fitting process users may configure the device with the Power-up Reset hysteresis set to Large or Small. Atmel POF2JED users may select the Large option by including the flag “-power_reset” on the command line after “filename.POF”. To allow the registers to be properly reinitialized with the Large hysteresis option selected, the following condition is added: 4. If VCC falls below 2.0V, it must shut off completely before the device is turned on again. When the Large hysteresis option is active, ICC is reduced by several hundred microamps as well. Security Fuse Usage A single fuse is provided to prevent unauthorized copying of the ATF1504AS fuse patterns. Once programmed, fuse verify is inhibited. However, the 16-bit User Signature remains accessible. 9 0950O–PLD–7/05 Programming ATF1504AS devices are in-system programmable (ISP) devices utilizing the 4-pin JTAG protocol. This capability eliminates package handling normally required for programming and facilitates rapid design iterations and field changes. Atmel provides ISP hardware and software to allow programming of the ATF1504AS via the PC. ISP is performed by using either a download cable or a comparable board tester or a simple microprocessor interface. To facilitate ISP programming by the Automated Test Equipment (ATE) vendors. Serial Vector Format (SVF) files can be created by Atmel provided software utilities. ATF1504AS devices can also be programmed using standard third-party programmers. With third-party programmer, the JTAG ISP port can be disabled thereby allowing four additional I/O pins to be used for logic. Contact your local Atmel representatives or Atmel PLD applications for details. ISP Programming Protection The ATF1504AS has a special feature that locks the device and prevents the inputs and I/O from driving if the programming process is interrupted for any reason. The inputs and I/O default to high-Z state during such a condition. In addition the pin-keeper option preserves the former state during device programming, if this circuit were previously programmed on the device. This prevents disturbing the operation of other circuits in the system while the ATF1504AS is being programmed via ISP. All ATF1504AS devices are initially shipped in the erased state thereby making them ready to use for ISP. Note: For more information refer to the “Designing for In-System Programmability with Atmel CPLDs” application note. 10 ATF1504AS(L) 0950O–PLD–7/05 ATF1504AS(L) DC and AC Operating Conditions Commercial Operating Temperature (Ambient) VCCINT or VCCIO (5V) Power Supply VCCIO (3.3V) Power Supply 0°C - 70°C 5V ± 5% 3.0V - 3.6V Industrial -40°C - 85°C 5V ± 10% 3.0V - 3.6V DC Characteristics Symbol IIL IIH IOZ Parameter Input or I/O Low Leakage Current Input or I/O High Leakage Current Tri-state Output Off-state Current VO = VCC or GND Std Mode ICC1 Power Supply Current, Standby VCC = Max VIN = 0, VCC Com. Ind. Com. Ind. -40 105 130 10 10 1 Com Ind Com. Ind. 4.75 4.5 3.0 -0.3 2.0 VIN = VIH or VIL VCCIO = MIN, IOL = 12 mA VIN = VIH or VIL VCC = MIN, IOL = 0.1 mA VIN = VIH or VIL VCCIO = MIN, IOH = -4.0 mA Com. Ind. Com. Ind. 2.4 .2 .2 V V V 85 105 5.25 5.5 3.6 0.8 VCCIO + 0.3 0.45 V V V V V V 10 Condition VIN = VCC Min Typ -2 2 Max -10 10 40 µA mA mA µA µA mA ma Units µA “L” Mode “PD” Mode Std Power ICC2 ICC3(2) VCCIO VCCIO VIL VIH Power Supply Current, Power-down Mode Current in Reduced-power Mode Supply Voltage Supply Voltage Input Low Voltage Input High Voltage Output Low Voltage (TTL) VCC = Max VIN = 0, VCC VCC = Max VIN = 0, VCC 5.0V Device Output 3.3V Device Output VOL Output Low Voltage (CMOS) VOH Notes: Output High Voltage (TTL) 1. Not more than one output at a time should be shorted. Duration of short circuit test should not exceed 30 sec. 2. When macrocell reduced-power feature is enabled. Pin Capacitance Typ CIN CI/O Note: 8 8 Max 10 10 Units pF pF Conditions VIN = 0V; f = 1.0 MHz VOUT = 0V; f = 1.0 MHz Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested. The OGI pin (high-voltage pin during programming) has a maximum capacitance of 12 pF. 11 0950O–PLD–7/05 Absolute Maximum Ratings* Temperature Under Bias.................................. -40°C to +85°C Storage Temperature ..................................... -65°C to +150°C Voltage on Any Pin with Respect to Ground .........................................-2.0V to +7.0V(1) Voltage on Input Pins with Respect to Ground During Programming.....................................-2.0V to +14.0V(1) Note: Programming Voltage with Respect to Ground .......................................-2.0V to +14.0V(1) 1. *NOTICE: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Minimum voltage is -0.6V DC, which may undershoot to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is VCC + 0.75V DC, which may overshoot to 7.0V for pulses of less than 20 ns. AC Characteristics -7 Symbol tPD1 tPD2 tSU tH tFSU tFH tCOP tCH tCL tASU tAH tACOP tACH tACL tCNT fCNT tACNT fACNT Parameter Input or Feedback to Non-registered Output I/O Input or Feedback to Non-registered Feedback Global Clock Setup Time Global Clock Hold Time Global Clock Setup Time of Fast Input Global Clock Hold Time of Fast Input Global Clock to Output Delay Global Clock High Time Global Clock Low Time Array Clock Setup Time Array Clock Hold Time Array Clock Output Delay Array Clock High Time Array Clock Low Time Minimum Clock Global Period Maximum Internal Global Clock Frequency Minimum Array Clock Period Maximum Internal Array Clock Frequency 125 125 8 100 3 3 8 100 10 76.9 3 3 3 2 7.5 4 4 10 76.9 13 66 6 0 3 0.5 4.5 4 4 3 3 10 6 6 13 66 17 50 Min Max 7.5 7 7 0 3 0.5 5 5 5 4 4 15 8 8 17 50 22 Min -10 Max 10 9 Min 3 3 11 0 3 1.0 8 6 6 4 5 20 10 10 22 -15 Max 15 12 16 0 3 1.5 10 7 7 5 6 25 Min -20 Max 20 16 20 0 5 2 13 Min -25 Max 25 25 Units ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns MHz ns MHz 12 ATF1504AS(L) 0950O–PLD–7/05 ATF1504AS(L) AC Characteristics (Continued) -7 Symbol fMAX tIN tIO tFIN tSEXP tPEXP tLAD tLAC tIOE tOD1 Parameter Maximum Clock Frequency Input Pad and Buffer Delay I/O Input Pad and Buffer Delay Fast Input Delay Foldback Term Delay Cascade Logic Delay Logic Array Delay Logic Control Delay Internal Output Enable Delay Output Buffer and Pad Delay (Slow slew rate = OFF; VCCIO = 5V; CL = 35 pF) Output Buffer and Pad Delay (Slow slew rate = OFF; VCCIO = 3.3V; CL = 35 pF) Output Buffer and Pad Delay (Slow slew rate = ON; VCCIO = 5V or 3.3V; CL = 35 pF) See ordering information for valid part numbers. Min 166.7 0.5 0.5 1 4 0.8 3 3 2 2 Max Min 125 0.5 0.5 1 5 0.8 5 5 2 1.5 -10 Max Min 100 2 2 2 8 1 6 6 3 4 -15 Max Min 83.3 2 2 2 10 1 7 7 3 5 -20 Max Min 60 2 2 2 12 1.2 8 8 4 6 -25 Max Units MHz ns ns ns ns ns ns ns ns ns tOD2 2.5 2.0 5 6 7 ns tOD3 Note: 5 5.5 8 10 10 ns Timing Model 13 0950O–PLD–7/05 AC Characteristics (Continued) -7 Symbol tZX1 Parameter Output Buffer Enable Delay (Slow slew rate = OFF; VCCIO = 5.0V; CL = 35 pF) Output Buffer Enable Delay (Slow slew rate = OFF; VCCIO = 3.3V; CL = 35 pF) Output Buffer Enable Delay (Slow slew rate = ON; VCCIO = 5.0V/3.3V; CL = 35 pF) Output Buffer Disable Delay (CL = 5 pF) Register Setup Time Register Hold Time Register Setup Time of Fast Input Register Hold Time of Fast Input Register Delay Combinatorial Delay Array Clock Delay Register Enable Time Global Control Delay Register Preset Time Register Clear Time Switch Matrix Delay Reduced-power Adder (2) -10 Max 4.0 Min Max 5.0 Min -15 Max 7 Min -20 Max 9 Min -25 Max 10 Units ns Min tZX2 4.5 5.5 7 9 10 ns tZX3 9 9 10 11 12 ns tXZ tSU tH tFSU tFH tRD tCOMB tIC tEN tGLOB tPRE tCLR tUIM tRPA Notes: 4 3 2 3 0.5 1 1 3 3 1 2 2 1 10 3 3 3 0.5 5 4 4 2 2 2 2 5 5 1 3 3 1 11 6 5 5 2 2 1 1 6 6 1 4 4 2 13 7 6 6 3 2.5 2 2 7 7 1 5 5 2 14 8 ns ns ns ns ns 2 2 8 8 1 6 6 2 15 ns ns ns ns ns ns ns ns ns 1. See ordering information for valid part numbers. 2. The tRPA parameter must be added to the tLAD, tLAC,tTIC, tACL, and tSEXP parameters for macrocells running in the reducedpower mode. Input Test Waveforms and Measurement Levels tR, tF = 1.5 ns typical 14 ATF1504AS(L) 0950O–PLD–7/05 ATF1504AS(L) Output AC Test Loads Note: *Numbers in parenthesis refer to 3.0V operating conditions (preliminary). Power-down Mode The ATF1504AS includes an optional pin-controlled power-down feature. When this mode is enabled, the PD pin acts as the power-down pin. When the PD pin is high, the device supply current is reduced to less than 10 mA. During power-down, all output data and internal logic states are latched internally and held. Therefore, all registered and combinatorial output data remain valid. Any outputs that were in a high-Z state at the onset will remain at high-Z. During power-down, all input signals except the power-down pin are blocked. Input and I/O hold latches remain active to ensure that pins do not float to indeterminate levels, further reducing system power. The power-down mode feature is enabled in the logic design file or as a fitted or translated s/w option. Designs using the power-down pin may not use the PD pin as a logic array input. However, all other PD pin macrocell resources may still be used, including the buried feedback and foldback product term array inputs. Power Down AC Characteristics(1)(2) -7 Symbol tIVDH tGVDH tCVDH tDHIX tDHGX tDHCX tDLIV tDLGV tDLCV tDLOV Notes: Parameter Valid I, I/O before PD High Valid OE (2) -10 Max Min 10 10 10 12 12 12 1 1 1 1 15 15 15 1 1 1 1 Max Min 15 15 15 -15 Max Min 20 20 20 25 25 25 1 1 1 1 -20 Max Min 25 25 25 30 30 30 1 1 1 1 -25 Max Units ns ns ns 35 35 35 1 1 1 1 ns ns ns µs µs µs µs Min 7 7 7 before PD High (2) Valid Clock before PD High I, I/O Don’t Care after PD High OE(2) Don’t Care after PD High Clock (2) Don’t Care after PD High PD Low to Valid I, I/O PD Low to Valid OE (Pin or Term) PD Low to Valid Clock (Pin or Term) PD Low to Valid Output 1. For slow slew outputs, add tSSO. 2. Pin or product term. 3. Includes tRPA due to reduced power bit enabled. 15 0950O–PLD–7/05 JTAG-BST/ISP Overview The JTAG boundary-scan testing is controlled by the Test Access Port (TAP) controller in the ATF1504AS. The boundary-scan technique involves the inclusion of a shift-register stage (contained in a boundary-scan cell) adjacent to each component so that signals at component boundaries can be controlled and observed using scan testing principles. Each input pin and I/O pin has its own boundary-scan cell (BSC) in order to support boundary scan testing. The ATF1504AS does not currently include a Test Reset (TRST) input pin because the TAP controller is automatically reset at power-up. The five JTAG modes supported include: SAMPLE/PRELOAD, EXTEST, BYPASS, IDCODE and HIGHZ. The ATF1504AS’s ISP can be fully described using JTAG’s BSDL as described in IEEE Standard 1149.1b. This allows ATF1504AS programming to be described and implemented using any one of the third-party development tools supporting this standard. The ATF1504AS has the option of using four JTAG-standard I/O pins for boundary-scan testing (BST) and in-system programming (ISP) purposes. The ATF1504AS is programmable through the four JTAG pins using the IEEE standard JTAG programming protocol established by IEEE Standard 1149.1 using 5V TTL-level programming signals from the ISP interface for in-system programming. The JTAG feature is a programmable option. If JTAG (BST or ISP) is not needed, then the four JTAG control pins are available as I/O pins. JTAG Boundary-scan Cell (BSC) Testing The ATF1504AS contains up to 68 I/O pins and four input pins, depending on the device type and package type selected. Each input pin and I/O pin has its own boundary-scan cell (BSC) in order to support boundary-scan testing as described in detail by IEEE Standard 1149.1. A typical BSC consists of three capture registers or scan registers and up to two update registers. There are two types of BSCs, one for input or I/O pin, and one for the macrocells. The BSCs in the device are chained together through the capture registers. Input to the capture register chain is fed in from the TDI pin while the output is directed to the TDO pin. Capture registers are used to capture active device data signals, to shift data in and out of the device and to load data into the update registers. Control signals are generated internally by the JTAG TAP controller. The BSC configuration for the input and I/O pins and macrocells are shown below. BSC Configuration for Input and I/O Pins (Except JTAG TAP Pins) Note: The ATF1504AS has pull-up option on TMS and TDI pins. This feature is selected as a design option. 16 ATF1504AS(L) 0950O–PLD–7/05 ATF1504AS(L) BSC Configuration for Macrocell Pin BSC TDO Pin 0 1 DQ Capture DR TDI Clock Shift TDO OEJ 0 0 1 1 DQ DQ OUTJ 0 0 1 1 DQ DQ Pin Capture DR TDI Shift Update DR Mode Clock Macrocell BSC 17 0950O–PLD–7/05 PCI Compliance The ATF1504AS also supports the growing need in the industry to support the new Peripheral Component Interconnect (PCI) interface standard in PCI-based designs and specifications. The PCI interface calls for high current drivers, which are much larger than the traditional TTL drivers. In general, PLDs and FPGAs parallel outputs to support the high current load required by the PCI interface. The ATF1504AS allows this without contributing to system noise while delivering low output-to-output skew. Having a programmable high drive option is also possible without increasing output delay or pin capacitance. The PCI electrical characteristics appear on the next page. PCI Voltage-to-current Curves for +5V Signaling in Pull-up Mode Pull Up VCC Voltage Test Point 2.4 1.4 DC drive point AC drive point -2 -44 Current (mA) -178 PCI Voltage-to-current Curves for +5V Signaling in Pull-down Mode Pull Down VCC Voltage AC drive point 2.2 DC drive point 0.55 Test Point 3,6 95 Current (mA) 380 18 ATF1504AS(L) 0950O–PLD–7/05 ATF1504AS(L) PCI DC Characteristics Symbol VCC VIH VIL IIH IIL VOH VOL CIN CCLK CIDSEL LPIN Note: Parameter Supply Voltage Input High Voltage Input Low Voltage Input High Leakage Current Input Low Leakage Current Output High Voltage Output Low Voltage Input Pin Capacitance CLK Pin Capacitance IDSEL Pin Capacitance Pin Inductance Leakage current is with pin-keeper off. VIN = 2.7V VIN = 0.5V IOUT = -2 mA IOUT = 3 mA, 6 mA 2.4 0.55 10 12 8 20 Conditions Min 4.75 2.0 -0.5 Max 5.25 VCC + 0.5 0.8 70 -70 Units V V V µA µA V V pF pF pF nH PCI AC Characteristics Symbol Parameter Switching Current High (Test High) Conditions 0 < VOUT ≤ 1.4 IOH(AC) 1.4 < VOUT < 2.4 3.1 < VOUT < VCC VOUT = 3.1V VOUT > 2.2V IOL(AC) Switching Current Low (Test Point) Low Clamp Current Output Rise Slew Rate Output Fall Slew Rate 2.2 > VOUT > 0 0.1 > VOUT > 0 VOUT = 0.71 ICL SLEWR SLEWF Notes: -5 < VIN ≤ -1 0.4V to 2.4V load 2.4V to 0.4V load -25+(VIN + 1)/0.015 0.5 0.5 3 3 95 VOUT/0.023 Equation B 206 Min -44 -44+(VOUT - 1.4)/0.024 Equation A -142 Max Units mA mA mA µA mA mA mA mA mA V/ns V/ns 1. Equation A: IOH = 11.9 (VOUT - 5.25) * (VOUT + 2.45) for VCC > VOUT > 3.1V. 2. Equation B: IOL = 78.5 * VOUT * (4.4 - VOUT) for 0V < VOUT < 0.71V. 19 0950O–PLD–7/05 ATF1504AS Dedicated Pinouts Dedicated Pin INPUT/OE2/GCLK2 INPUT/GCLR INPUT/OE1 INPUT/GCLK1 I/O /GCLK3 I/O/PD (1,2) I/O/TDI (JTAG) I/O/TMS (JTAG) I/O/TCK (JTAG) I/O/TDO (JTAG) GND VCCINT VCCIO 44-lead TQFP 40 39 38 37 35 5, 19 1 7 26 32 4, 16, 24, 36 9, 17, 29, 41 – 44-lead J-lead 2 1 44 43 41 11, 25 7 13 32 38 10, 22, 30, 42 3, 15, 23, 35 – 68-lead J-lead 2 1 68 67 65 17, 37 12 19 50 57 6, 16, 26, 34, 38, 48, 58, 66 3, 35 11, 21, 31, 43, 53, 63 84-lead J-lead 2 1 84 83 81 20, 46 14 23 62 71 7, 19, 32, 42, 47, 59, 72, 82 3, 43 13, 26, 38, 53, 66, 78 100-lead PQFP 92 91 90 89 87 14, 44 6 17 64 75 13, 28, 40, 45, 61, 76, 88, 97 41, 93 5, 20, 36, 53, 68, 84 1, 2, 7, 9, 24, 26, 29, 30, 51, 52, 55, 57, 72, 74, 79, 80 68 64 100-lead TQFP 90 89 88 87 85 12, 42 4 15 62 73 11, 26, 38, 43, 59, 74, 86, 95 39, 91 3, 18, 34, 51, 66, 82 1, 2, 5, 7, 22, 24, 27, 28, 49, 50, 53, 55, 70, 72, 77, 78 68 64 N/C – – – – # of Signal Pins # User I/O Pins 36 32 36 32 52 48 68 64 OE (1, 2) GCLR GCLK (1, 2, 3) PD (1, 2) TDI, TMS, TCK, TDO GND VCCINT VCCIO Global OE Pins Global Clear Pin Global Clock Pins Power down pins JTAG pins used for boundary-scan testing or in-system programming Ground Pins VCC pins for the device (+5V - Internal) VCC pins for output drivers (for I/O pins) (+5V or 3.3V - I/Os) 20 ATF1504AS(L) 0950O–PLD–7/05 ATF1504AS(L) ATF1504AS I/O Pinouts 4444688410010044446884100100- lead MC 1 2 3 4 5 6 7 8/ TDI 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32/ TMS PLC A A A/ PD1 A A A A A A A A A A A A A B B B B B B B B B B B B B B B B PLCC 12 – 11 9 8 – – 7 – – 6 – – 5 – 4 21 – 20 19 18 – – 17 16 – – – – 14 – 13 lead TQFP 6 – 5 3 2 – – 1 – – 44 – – 43 – 42 15 – 14 13 12 – – 11 10 – – – – 8 – 7 lead PLCC 18 – 17 15 14 13 – 12 10 – 9 8 7 5 – 4 33 – 32 30 29 28 – 27 25 – 24 23 22 20 – 19 lead PLCC 22 21 20 18 17 16 15 14 12 11 10 9 8 6 5 4 41 40 39 37 36 35 34 33 31 30 29 28 27 25 24 23 lead PQFP 16 15 14 12 11 10 8 6 4 3 100 99 98 96 95 94 39 38 37 35 34 33 32 31 27 25 23 22 21 19 18 17 lead TQFP 14 13 12 10 9 8 6 4 100 99 98 97 96 94 93 92 37 36 35 33 32 31 30 29 25 23 21 20 19 17 16 15 MC 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48/ TCK 49 50 51 52 53 54 55 56/ TDO 57 58 59 60 61 62 63 64 PLC C C C/ PD2 C C C C C C C C C C C C C D D D D D D D D D D D D D D D D/ GCLK3 lead PLCC 24 – 25 26 27 – – 28 29 – – – – 31 – 32 33 – 34 36 37 – – 38 39 – – – – 40 – 41 lead TQFP 18 – 19 20 21 – – 22 23 – – – – 25 – 26 27 – 28 30 31 – – 32 33 – – – – 34 – 35 lead PLCC 36 – 37 39 40 41 – 42 44 – 45 46 47 49 – 50 51 – 52 54 55 56 – 57 59 – 60 61 62 64 – 65 lead PLCC 44 45 46 48 49 50 51 52 54 55 56 57 58 60 61 62 63 64 65 67 68 69 70 71 73 74 75 76 77 79 80 81 lead PQFP 42 43 44 46 47 48 49 50 54 56 58 59 60 62 63 64 65 66 67 69 70 71 73 75 77 78 81 82 83 85 86 87 lead TQFP 40 41 42 44 45 46 47 48 52 54 56 57 58 60 61 62 63 64 65 67 68 69 71 73 75 76 79 80 81 83 84 85 21 0950O–PLD–7/05 SUPPLY CURRENT VS. SUPPLY VOLTAGE (TA = 25°C, F = 0) 125 100 STANDARD ICC (mA) 75 50 25 0 4.50 REDUCED POWER MODE SUPPLY CURRENT VS. SUPPLY VOLTAGE PIN-CONTROLLED POWER-DOWN MODE (TA = 25°C, F = 0) 1100 1000 ICC (µA) STANDARD POWER 900 800 REDUCED POWER MODE 700 4.50 4.75 5.00 VCC (V) 5.25 5.50 4.75 5.00 VCC (V) 5.25 5.50 SUPPLY CURRENT VS. SUPPLY VOLTAGE LOW-POWER ("L") VERSION (TA = 25°C, F = 0) 30 SUPPLY CURRENT VS. FREQUENCY LOW-POWER ("L") VERSION LOW POWER (TA = 25°C) 125.0 100.0 ICC (mA) STANDARD POWER 75.0 50.0 REDUCED POWER MODE 25.0 0.0 0.00 20 ICC (µA) 10 0 4.50 5.00 10.00 15.00 20.00 25.00 4.75 5.00 VCC (V) 5.25 5.50 FREQUENCY (MHz) SUPPLY CURRENT VS. FREQUENCY STANDARD POWER (TA = 25°C) 200.0 OUTPUT SOURCE CURRENT VS. OUTPUT VOLTAGE (VCC = 5V, TA = 25°C) 0.0 -10.0 -20.0 -30.0 IOH (mA) 150.0 STANDARD POWER ICC (mA) 100.0 REDUCED POWER MODE 50.0 -40.0 -50.0 -60.0 -70.0 -80.0 -90.0 0.0 0.00 20.00 40.00 60.00 80.00 100.00 -100.0 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 4.50 5.00 FREQUENCY (MHz) OUTPUT VOLTAGE (V) OUTPUT SOURCE CURRENT VS. SUPPLY VOLTAGE (VOH = 2.4V, TA = 25°C) 0.0 INPUT CLAMP CURRENT VS. INPUT VOLTAGE (VCC = 5 V, TA = 25°C) 0 -10 -10.0 INPUT CURRENT (mA) -20 -30 -40 -50 -20.0 IOH (mA) -30.0 -40.0 -50.0 -60 -60.0 4.50 -1.00 -0.80 -0.60 -0.40 -0.20 0.00 4.75 5.00 SUPPLY VOLTAGE (V) 5.25 5.50 INPUT VOLTAGE (V) 22 ATF1504AS(L) 0950O–PLD–7/05 ATF1504AS(L) OUTPUT SINK CURRENT VS. SUPPLY VOLTAGE (VOL = 0.5V, TA = 25°C) 43 42 41 40 IOL (mA) NORMALIZED TPD VS. TEMPERATURE (VCC = 5 .0V) 1.2 39 38 37 36 35 34 4.50 NORMALIZED TPD 4.75 5.00 SUPPLY VOLTAGE (V) 5.25 5.50 1.1 1.0 0.9 0.8 -40.0 0.0 TEMPERATURE (C) 25.0 75.0 NORMALIZED TPD VS. SUPPLY VOLTAGE (TA = 25°C) 1.20 NORMALIZED TPD 1.10 NORMALIZED TCO VS. SUPPLY VOLTAGE (TA = 25°C) 1.2 1.00 0.90 NORMALIZED TPD 1.1 1.0 0.80 4.5 4.8 5.0 SUPPLY VOLTAGE (V) 5.3 5.5 0.9 0.8 4.5 4.8 5.0 5.3 5.5 INPUT CURRENT VS. INPUT VOLTAGE (VCC = 5V, TA = 25°C) 40 30 INPUT CURRENT ( A) 20 SUPPLY VOLTAGE (V) NORMALIZED TSU VS. SUPPLY VOLTAGE (TA = 25°C) 1.2 10 0 -10 -20 -30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 NORMALIZED TSU 1.1 1.0 INPUT VOLTAGE (V) 0.9 0.8 4.5 4.8 5.0 SUPPLY VOLTAGE (V) 5.3 5.5 OUTPUT SINK CURRENT VS. OUTPUT VOLTAGE (VCC = 5V, TA = 25°C) 140.0 120.0 100.0 IOL (mA) 80.0 60.0 40.0 20.0 0.0 0.00 0.50 1.00 1.50 2.00 2.50 3.00 3.50 4.00 4.50 5.00 OUTPUT VOLTAGE (V) 23 0950O–PLD–7/05 NORMALIZED TCO VS.TEMPERATURE (VCC = 5.0V) 1.2 NORMALIZED TCO 1.1 1.0 0.9 0.8 -40.0 0.0 TEMPERATURE (C) 25.0 75.0 NORMALIZED TSU VS. TEMPERATURE (VCC = 5.0V) 1.2 NORMALIZED TSU 1.1 1.0 0.9 0.8 -40.0 0.0 25.0 75.0 TEMPERATURE (C) 24 ATF1504AS(L) 0950O–PLD–7/05 ATF1504AS(L) Ordering Information ATF1504AS Standard Package Options tPD (ns) tCO1 (ns) fMAX (MHz) Ordering Code ATF1504AS-7 AC44 ATF1504AS-7 JC44 ATF1504AS-7 JC68 ATF1504AS-7 JC84 ATF1504AS-7 QC100 ATF1504AS-7 AC100 ATF1504AS-10 AC44 ATF1504AS-10 JC44 10 5 125 ATF1504AS-10 JC68 ATF1504AS-10 JC84 ATF1504AS-10 QC100 ATF1504AS-10 AC100 ATF1504AS-10 AI44 ATF1504AS-10 JI44 ATF1504AS-10 JI68 ATF1504AS-10 JI84 ATF1504AS-10 QI100 ATF1504AS-10 AI100 ATF1504AS-15 AC44 ATF1504AS-15 JC44 ATF1504AS-15 JC68 15 8 100 ATF1504AS-15 JC84 ATF1504AS-15 QC100 ATF1500AS-15 AC100 ATF1504AS-15 AI44 ATF1504AS-15 JI44 ATF1504AS-15 JI68 ATF1504AS-15 JI84 ATF1504AS-15 QI100 ATF1504AS-15 AI100 Package 44A 44J 68J 84J 100Q1 100A 44A 44J 68J 84J 100Q1 100A 44A 44J 68J 84J 100Q1 100A 44A 44J 68J 84J 100Q1 100A 44A 44J 68J 84J 100Q1 100A Commercial (0°C to 70°C) Commercial (0°C to 70°C) Operation Range 7.5 4.5 166.7 Commercial (0°C to 70°C) 10 5 125 Industrial (-40°C to +85°C) 15 8 100 Industrial (-40°C to +85°C) Notes: 1. The last time buy date is Sept. 30, 2005 for shaded parts. 2. For the QC100 package, customers may migrate to the ATF1508AS-10QU100 or AU100. Using “C” Product for Industrial To use commercial product for Industrial temperature ranges, down-grade one speed grade from the “I” to the “C” device (7 ns “C” = 10 ns “I”) and de-rate power by 30%. 25 0950O–PLD–7/05 ATF1504AS Green Package Options (Pb/Halide-free/RoHS Compliant) tPD (ns) 7.5 tCO1 (ns) 4.5 fMAX (MHz) 166.7 Ordering Code ATF1504AS-7 AX44 ATF1504AS-7 JX44 ATF1504AS-10 AU44 10 5 125 ATF1504AS-10 JU44 ATF1504AS-10AU100 ATF1504AS-10 JU84 Package 44A 44J 44A 44J 100A 84J Industrial (-40°C to +85°C) Operation Range Commercial (0°C to 70°C) Package Type 44A 44J 68J 84J 100Q1 100A 44-lead, Thin Plastic Gull Wing Quad Flatpack (TQFP) 44-lead, Plastic J-leaded Chip Carrier (PLCC) 68-lead, Plastic J-leaded Chip Carrier (PLCC) 84-lead, Plastic J-leaded Chip Carrier (PLCC) 100-lead, 14 x 20 mm Body, Plastic Quad Flat Package (PQFP) 100-lead, 14 x 14 mm Body, Thin Profile Plastic Quad Flat Package (TQFP) 26 ATF1504AS(L) 0950O–PLD–7/05 ATF1504AS(L) ATF1504ASL Standard Package Options tPD (ns) tCO1 (ns) fMAX (MHz) Ordering Code ATF1504ASL-20 AC44 ATF1504ASL-20 JC44 ATF1504ASL-20 JC68 ATF1504ASL-20 JC84 ATF1504ASL-20 QC100 ATF1504ASL-20 AC100 ATF1504ASL-25 AI44 ATF1504ASL-25 JI84 ATF1504ASL-25 JI68 ATF1504ASL-25 JI84 ATF1504ASL-25 QI100 ATF1504ASL-25 AI100 Package 44A 44J 68J 84J 100Q1 100A 44A 44J 68J 84J 100Q1 100A Operation Range 20 12 83.3 Commercial (0°C to 70°C) 25 15 70 Industrial (-40°C to +85°C) Note: 1. The last time buy date is Sept. 30, 2005 for shaded parts. Using “C” Product for Industrial To use commercial product for Industrial temperature ranges, down-grade one speed grade from the “I” to the “C” device (7 ns “C” = 10 ns “I”) and de-rate power by 30%. ATF1504ASL Green Package Options (Pb/Halide-free/RoHS Compliant) tPD (ns) 25 tCO1 (ns) 15 fMAX (MHz) 70 Ordering Code ATF1504ASL-25 AU44 ATF1504ASL-25 JU44 ATF1504ASL-25 AU100 Package 44A 44J 100A Operation Range Industrial (-40°C to +85°C) Package Type 44A 44J 68J 84J 100Q1 100A 44-lead, Thin Plastic Gull Wing Quad Flatpack (TQFP) 44-lead, Plastic J-leaded Chip Carrier (PLCC) 68-lead, Plastic J-leaded Chip Carrier (PLCC) 84-lead, Plastic J-leaded Chip Carrier (PLCC) 100-lead, 14 x 20 mm Body, Plastic Quad Flat Package (PQFP) 100-lead, 14 x 14 mm Body, Thin Profile Plastic Quad Flat Package (TQFP) 27 0950O–PLD–7/05 Packaging Information 44A – TQFP PIN 1 B PIN 1 IDENTIFIER e E1 E D1 D C 0˚~7˚ A1 L COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL A A1 A2 D D1 E MIN – 0.05 0.95 11.75 9.90 11.75 9.90 0.30 0.09 0.45 NOM – – 1.00 12.00 10.00 12.00 10.00 – – – 0.80 TYP MAX 1.20 0.15 1.05 12.25 10.10 12.25 10.10 0.45 0.20 0.75 Note 2 Note 2 NOTE A2 A Notes: 1. This package conforms to JEDEC reference MS-026, Variation ACB. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.10 mm maximum. E1 B C L e 10/5/2001 2325 Orchard Parkway San Jose, CA 95131 TITLE 44A, 44-lead, 10 x 10 mm Body Size, 1.0 mm Body Thickness, 0.8 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) DRAWING NO. 44A REV. B R 28 ATF1504AS(L) 0950O–PLD–7/05 ATF1504AS(L) 44J – PLCC 1.14(0.045) X 45˚ PIN NO. 1 IDENTIFIER 1.14(0.045) X 45˚ 0.318(0.0125) 0.191(0.0075) E1 B E B1 D2/E2 e D1 D A A2 A1 0.51(0.020)MAX 45˚ MAX (3X) COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL A A1 A2 D D1 E Notes: 1. This package conforms to JEDEC reference MS-018, Variation AC. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line. 3. Lead coplanarity is 0.004" (0.102 mm) maximum. E1 D2/E2 B B1 e MIN 4.191 2.286 0.508 17.399 16.510 17.399 16.510 14.986 0.660 0.330 NOM – – – – – – – – – – 1.270 TYP MAX 4.572 3.048 – 17.653 16.662 17.653 16.662 16.002 0.813 0.533 Note 2 Note 2 NOTE 10/04/01 2325 Orchard Parkway San Jose, CA 95131 TITLE 44J, 44-lead, Plastic J-leaded Chip Carrier (PLCC) DRAWING NO. 44J REV. B R 29 0950O–PLD–7/05 68J – PLCC 1.14(0.045) X 45˚ PIN NO. 1 IDENTIFIER 1.14(0.045) X 45˚ 0.318(0.0125) 0.191(0.0075) E1 B E B1 D2/E2 e D1 D A A2 A1 0.51(0.020)MAX 45˚ MAX (3X) COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL A A1 A2 D D1 E Notes: 1. This package conforms to JEDEC reference MS-018, Variation AE. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line. 3. Lead coplanarity is 0.004" (0.102 mm) maximum. E1 D2/E2 B B1 e MIN 4.191 2.286 0.508 25.019 24.130 25.019 24.130 22.606 0.660 0.330 NOM – – – – – – – – – – 1.270 TYP MAX 4.572 3.048 – 25.273 24.333 25.273 24.333 23.622 0.813 0.533 Note 2 Note 2 NOTE 10/04/01 2325 Orchard Parkway San Jose, CA 95131 TITLE 68J, 68-lead, Plastic J-leaded Chip Carrier (PLCC) DRAWING NO. 68J REV. B R 30 ATF1504AS(L) 0950O–PLD–7/05 ATF1504AS(L) 84J – PLCC 1.14(0.045) X 45˚ PIN NO. 1 IDENTIFIER 1.14(0.045) X 45˚ 0.318(0.0125) 0.191(0.0075) E1 B E B1 D2/E2 e D1 D A A2 A1 0.51(0.020)MAX 45˚ MAX (3X) COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL A A1 A2 D D1 E Notes: 1. This package conforms to JEDEC reference MS-018, Variation AF. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is .010"(0.254 mm) per side. Dimension D1 and E1 include mold mismatch and are measured at the extreme material condition at the upper or lower parting line. 3. Lead coplanarity is 0.004" (0.102 mm) maximum. E1 D2/E2 B B1 e MIN 4.191 2.286 0.508 30.099 29.210 30.099 29.210 27.686 0.660 0.330 NOM – – – – – – – – – – 1.270 TYP MAX 4.572 3.048 – 30.353 29.413 30.353 29.413 28.702 0.813 0.533 Note 2 Note 2 NOTE 10/04/01 2325 Orchard Parkway San Jose, CA 95131 TITLE 84J, 84-lead, Plastic J-leaded Chip Carrier (PLCC) DRAWING NO. 84J REV. B R 31 0950O–PLD–7/05 100Q1 – PQFP PIN 1 ID E PIN 1 e D1 B D E1 A C 0º~7º L A1 A A1 D E E1 B C D1 L e COMMON DIMENSIONS (Unit of Measure = mm) JEDEC STANDARD MS-022, GC-1 SYMBOL MIN – 0.25 NOM 3.04 0.33 23.20 BSC 17.20 BSC 14.00 BSC 0.22 0.11 – – 20 BSC 0.73 – 0.65 BSC 1.03 0.40 0.23 MAX 3.4 0.5 NOTE 07/6/2005 DRAWING NO. TITLE 2325 Orchard Parkway 100Q1, 100-lead, 14 x 20 mm Body, 3.2 mm Footprint, 0.65 mm Pitch, 100Q1 San Jose, CA 95131 Plastic Quad Flat Package (PQFP) REV. C R 32 ATF1504AS(L) 0950O–PLD–7/05 ATF1504AS(L) 100A – TQFP PIN 1 B PIN 1 IDENTIFIER e E1 E D1 D C 0˚~7˚ A1 L COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL A A1 A2 D D1 E MIN – 0.05 0.95 15.75 13.90 15.75 13.90 0.17 0.09 0.45 NOM – – 1.00 16.00 14.00 16.00 14.00 – – – 0.50 TYP MAX 1.20 0.15 1.05 16.25 14.10 16.25 14.10 0.27 0.20 0.75 Note 2 Note 2 NOTE A2 A Notes: 1. This package conforms to JEDEC reference MS-026, Variation AED. 2. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25 mm per side. Dimensions D1 and E1 are maximum plastic body size dimensions including mold mismatch. 3. Lead coplanarity is 0.08 mm maximum. E1 B C L e 10/5/2001 2325 Orchard Parkway San Jose, CA 95131 TITLE 100A, 100-lead, 14 x 14 mm Body Size, 1.0 mm Body Thickness, 0.5 mm Lead Pitch, Thin Profile Plastic Quad Flat Package (TQFP) DRAWING NO. 100A REV. C R 33 0950O–PLD–7/05 Revision History Revision 0950O Comments Green package options added. 34 ATF1504AS(L) 0950O–PLD–7/05 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Operations Memory 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel: (49) 71-31-67-0 Fax: (49) 71-31-67-2340 1150 East Cheyenne Mtn. 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