MM065608EV-30-E

Features • Operating Voltage: 5V • Access Time: 30, 45 ns • Very Low Power Consumption • • • • • • • • – Active: 600 mW (Max) – Standby: 1 µW (Typ) Wide Temperature Range: -55⋅C to +125⋅C 400 Mils Width Packages: FP32 and SB32 TTL Compatible Inputs and Outputs Asynchronous No Single Event Latch-up below a LET Threshold of 80 MeV/mg/cm2 Tested up to a Total Dose of 30 krads (Si) according to MIL STD 883 Method 1019 QML Q and V with SMD 5962-89598 ESCC with Specification 9301/047 Description The M65608E is a very low power CMOS static RAM organized as 131072 x 8 bits. Utilizing an array of six transistors (6T) memory cells, the M65608E combines an extremely low standby supply current (Typical value = 0.2 µA) with a fast access time at 30 ns over the full military temperature range. The high stability of the 6T cell provides excellent protection against soft errors due to noise. The M65608E is processed according to the methods of the latest revision of the MIL PRF 38535 or ESCC 9000. Rad. Tolerant 128Kx8, 5-Volt Very Low Power CMOS SRAM M65608E Block Diagram Pin Configuration 32-lead DIL side-brazed 32-lead Flatpack 400 MILS 400 MILS 2 M65608E 4151N–AERO–04/09 M65608E Pin Description Table 1. Pin Names Names A0 - A16 I/O0 - I/O7 CS1 CS2 WE OE VCC GND Description Address inputs Data Input/Output Chip select 1 Chip select 2 Write Enable Output Enable Power Ground Table 2. Truth Table CS1 H CS2 X W X OE X Inputs/ Outputs Z Mode Deselect/ Power-down Deselect/ power-down Read Write Output Disable X L L L Note: L H H H X H L H X L X H Z Data Out Data In Z L = low, H = high, X = H or L, Z = high impedance. 3 4151N–AERO–04/09 Electrical Characteristics Absolute Maximum Ratings Supply voltage to GND potential: ........................ -0.5V + 7.0V Voltage range on any input: ............ GND - 0.5V to VCC + 0.5 Voltage range on any ouput: ........... GND - 0.5V to VCC + 0.5 Storage temperature: ..................................... -65⋅C to +150⋅C Output Current from Output Pins: ................................ 20 mA Electrostatic Discharge Voltage: ............................... > 2000V (MIL STD 883D method 3015.3) *NOTE: Stresses beyond those listed under "Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure between recommended DC operating and absolute maximum rating conditions for extended periods may affect device reliability. Military Operating Range Operating Voltage 5V + 10% Operating Temperature -55⋅C to + 125⋅C Recommended DC Operating Conditions Parameter Description Minimum 4.5 0.0 GND - 0.5 2.2 Typical 5.0 0.0 0.0 – Maximum 5.5 0.0 0.8 VCC + 0.5 Unit V V V V VCC GND VIL VIH Capacitance Parameter Supply voltage Ground Input low voltage Input high voltage Description Minimum – – Typical – – Maximum 8 8 Unit pF pF Cin(1) Cout(1) Note: Input low voltage Output high voltage 1. Guaranteed but not tested. 4 M65608E 4151N–AERO–04/09 M65608E DC Parameters DC Test Conditions Table 3. DC Test Conditions TA = -55°C to + 125°C; Vss = 0V; VCC = 4.5V to 5.5V Symbol Description Minimum -1 -1 – 2.4 Typical – – – – Maximum 1 1 0.4 – Unit µA µA V V IIX (1) IOZ(1) VOL (2) VOH (3) 1. 2. 3. Input leakage current Output leakage current Output low voltage Output high voltage GND < Vin < VCC, GND < Vout < VCC Output Disabled. VCC min. IOL = 8 mA VCC min. IOH = -4 mA. Consumption Symbol Description 65608E-30 2 300 110 65608E-45 2 300 100 Unit mA µA mA Value max max max ICCSB (1) ICCSB1 (2) ICCOP (3) 1. 2. 3. Standby supply current Standby supply current Dynamic operating current CS1 > VIH or CS2 < VIL and CS1 < VIL. CS1 > VCC - 0.3V or, CS2 < GND + 0.3V and CS1 < 0.2V. F = 1/TAVAV, Iout = 0 mA, W = OE = VIH, Vin = GND or VCC, VCC max. 5 4151N–AERO–04/09 AC Parameters AC Test Conditions Input Pulse Levels: ....................................GND to 3.0V Input Rise/Fall Times: ...............................5 ns Input Timing Reference Levels: ................1.5V Output loading IOL/IOH (see Figure 1 and Figure 2)+30 pF AC Test Loads Waveforms Figure 1 Figure 2 Figure 3 Data Retention Mode Atmel CMOS RAM’s are designed with battery backup in mind. Data retention voltage and supply current are guaranteed over temperature. The following rules ensure data retention: 1. During data retention chip select CS1 must be held high within VCC to VCC -0.2V or, chip select CS2 must be held down within GND to GND +0.2V. 2. Output Enable (OE) should be held high to keep the RAM outputs high impedance, minimizing power dissipation. 3. During power up and power-down transitions CS1 and OE must be kept between VCC + 0.3V and 70% of VCC, or with CS2 between GND and GND -0.3V. 4. The RAM can begin operation > TR ns after VCC reaches the minimum operation voltages (4.5V). Timing 6 M65608E 4151N–AERO–04/09 M65608E Data Retention Characteristics Parameter Description Minimum 2.0 Typical TA = 25 ⋅C – Maximum – Unit V VCCDR VCC for data retention Chip deselect to data retention time Operation recovery time Data retention current at 2.0V Data retention current at 3.0V TCDR 0.0 – – ns TR TAVAV(1) – – ns ICCDR1 – 0.1 150 µA ICCDR2 Notes: (2) – 0.2 200 µA 1. TAVAV = Read Cycle Time 2. CS1 = VCC or CS2 = CS1 = GND, Vin = GND/VCC, this parameter is only tested at VCC = 2V. 3. Parameters guaranteed but not tested Write Cycle Symbol Parameter 65608-30 30 0 22 18 22 22 8 22 0 0 0 65608-45 45 0 35 20 35 35 15 35 0 0 0 Unit ns ns ns ns ns ns ns ns ns ns ns Value min min min min min min max min min min min TAVAW TAVWL TAVWH TDVWH TE1LWH TE2HWH TWLQZ TWLWH TWHAX TWHDX TWHQX Note: Write cycle time Address set-up time Address valid to end of write Data set-up time CS1 low to write end CS2 high to write end Write low to high Z(1) Write pulse width Address hold from to end of write Data hold time Write high to low Z(1) 1. Parameters guaranteed, not tested, with output loading 5 pF. 7 4151N–AERO–04/09 Read Cycle Symbol Parameter 65608-30 30 30 5 30 3 15 30 3 15 12 0 8 65608-45 45 45 5 45 3 20 45 3 20 15 0 15 Unit ns ns ns ns ns ns ns ns ns ns ns ns Value min max min max min max max min max max min max TAVAV TAVQV TAVQX TE1LQV TE1LQX TE1HQZ TE2HQV TE2HQX TE2LQZ TGLQV TGLQX TGHQZ Note: Read cycle time Address access time Address valid to low Z(1) Chip-select1 access time CS1 low to low Z(1) CS1 high to high Z(1) Chip-select2 access time CS2 high to low Z(1) CS2 low to high Z(1) Output Enable access time OE low to low Z(1) OE high to high Z(1) 1. Parameters Guaranteed, not tested, with output loading 5 pF. 8 M65608E 4151N–AERO–04/09 M65608E Write Cycle 1 WE Controlled, OE High During Write Write Cycle 2 WE Controlled, OE Low 9 4151N–AERO–04/09 Write Cycle 3 CS1 or CS2, Controlled Note: The internal write time of the memory is defined by the overlap of CS1 Low and CS2 HIGH and W LOW. Both signals must be actived to initiate a write and either signal can terminate a write by going in actived. The data input setup and hold timing should be referenced to the actived edge of the signal that terminates the write. Data out is high impedance if OE = VIH. 10 M65608E 4151N–AERO–04/09 M65608E Read Cycle 1 Read Cycle 2 Read Cycle 3 11 4151N–AERO–04/09 Ordering Information Part Number Temperature Range (1) Speed 30 ns 30 ns 30 ns 30 ns 45 ns 45 ns 30 ns 30 ns 45 ns 45 ns 30 ns 30 ns 45 ns 45 ns 30 ns 30 ns Package SB32.4 FP32.4 SB32.4 FP32.4 SB32.4 FP32.4 SB32.4 FP32.4 SB32.4 FP32.4 SB32.4 FP32.4 SB32.4 FP32.4 Die Die Flow Engineering Samples Engineering Samples QML Q QML Q QML Q QML Q QML V QML V QML V QML V ESCC ESCC ESCC ESCC Engineering Samples QML V MMC9-65608EV-30-E MMDJ-65608EV-30-E 5962-8959847QZC 5962-8959847QTC 5962-8959818QZC 5962-8959818QTC 5962-8959847VZC 5962-8959847VTC 5962-8959818VZC 5962-8959818VTC 930104703 930104704 930104701 930104702 MM065608EV-30-E 5962-8959847V6A Note: 25⋅C 25⋅C -55⋅ to +125⋅C -55⋅ to +125⋅C -55⋅ to +125⋅C -55⋅ to +125⋅C -55⋅ to +125⋅C -55⋅ to +125⋅C -55⋅ to +125⋅C -55⋅ to +125⋅C -55⋅ to +125⋅C -55⋅ to +125⋅C -55⋅ to +125⋅C -55⋅ to +125⋅C1 25⋅C -55⋅ to +125⋅C 1. Contact Atmel for availability. 12 M65608E 4151N–AERO–04/09 M65608E Package Drawings 32-lead Flat Pack 400 Mils 13 4151N–AERO–04/09 Package Drawings 32-lead Side Braze 400 Mils 14 M65608E 4151N–AERO–04/09 M65608E Document Revision History Changes from Rev. L to Rev. M Changes from Rev. M to Rev. N 1. Change in “Consumption” on page 5. ICCOP. 1. Update of footnotes under “Data Retention Characteristics” table 2. Update of Absolute Maximum Ratings section 15 4151N–AERO–04/09 A tmel Corporation 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 487-2600 Atmel Operations Memory 2325 Orchard Parkway San Jose, CA 95131, USA Tel: 1(408) 441-0311 Fax: 1(408) 436-4314 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany Tel: (49) 71-31-67-0 Fax: (49) 71-31-67-2340 1150 East Cheyenne Mtn. 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