MMDP-67206HV-15-E

Features • • • • • • • • • • • • • • • First-in First-out Dual Port Memory 16384 bits x 9 Organization Fast Flag and Access Times: 15, 30 ns Wide Temperature Range: - 55°C to + 125°C Fully Expandable by Word Width or Depth Asynchronous Read/Write Operations Empty, Full and Half Flags in Single Device Mode Retransmit Capability Bi-directional Applications Battery Back-up Operation: 2V Data Retention TTL Compatible Single 5V ± 10% Power Supply No Single Event Latch-up below a LET Threshold of 80 MeV/mg/cm2 Tested up to a Total Dose of 30 krads (Si) according to MIL STD 883 Method 1019 Quality grades: QML Q and V with SMD 5962-93177 and ESCC with specification 9301/048 Rad. Tolerant High Speed 16 Kb x 9 Parallel FIFO M67206H Description The M67206H implements a first-in first-out algorithm, featuring asynchronous read/write operations. The FULL and EMPTY flags prevent data overflow and underflow. The Expansion logic allows unlimited expansion in word size and depth with no timing penalties. Twin address pointers automatically generate internal read and write addresses, and no external address information is required. Address pointers are automatically incremented with the write pin and read pin. The 9 bits wide data are used in data communications applications where a parity bit for error checking is necessary. The Retransmit pin resets the Read pointer to zero without affecting the write pointer. This is very useful for retransmitting data when an error is detected in the system. Using an array of eight transistors (8T) memory cell, the M67206H combines an extremely low standby supply current (typ = 0.1 µA) with a fast access time at 15 ns over the full temperature range. All versions offer battery backup data retention capability with a typical power consumption at less than 2 µW. The M67206H is processed according to the methods of the latest revision of the MIL PRF 38535 (Q and V) or ESCC 9000. Rev. 4143J–AERO–04/07 1 Block Diagram Pin Configuration DIL ceramic 28-pin 300 mils FP 28-pin 400 mils 2 M67206H 4143J–AERO–04/07 M67206H Pin Description Names I0-8 Q0-8 W R RS EF FF XO/HF XI FL/RT VCC GND Description Inputs Outputs Write Enable Read Enable Reset Empty Flag Full Flag Expansion Out/Half-Full Flag Expansion IN First Load/Retransmit Power Supply Ground Data In (I0 - I8) Reset (RS) Data inputs for 9-bit data Reset occurs whenever the Reset (RS) input is taken to a low state. Reset returns both internal read and write pointers to the first location. A reset is required after power-up before a write operation can be enabled. Both the Read Enable (R) and Write Enable (W) inputs must be in the high state during the period shown in Figure 1 (i.e. tRSS before the rising edge of RS) and should not change until tRSR after the rising edge of RS. The Half-Full Flag (HF) will be reset to high After Reset (RS) Figure 1. Reset Notes: 1. EF, FF and HF may change status during reset, but flags will be valid at tRSC. 2. W and R = VIH around the rising edge of RS. 3 4143J–AERO–04/07 Write Enable (W) A write cycle is initiated on the falling edge of this input if the Full Flag (FF) is not set. Data set-up and hold times must be maintained in the rise time of the leading edge of the Write Enable (W). Data is stored sequentially in the Ram array, regardless of any current read operation. Once half the memory is filled, and during the falling edge of the next write operation, the Half-Full Flag (HF) will be set to low and remain in this state until the difference between the write and read pointers is less than or equal to half of the total available memory in the device. The Half-Full Flag (HF) is then reset by the rising edge of the read operation. To prevent data overflow, the Full Flag (FF) will go low, inhibiting further write operations. On completion of a valid read operation, the Full Flag (FF) will go high after TRFF, allowing a valid write to begin. When the FIFO stack is full, the internal write pointer is blocked from W, so that external changes to W will have no effect on the full FIFO stack. Read Enable (R) A read cycle is initiated on the falling edge of the Read Enable (R) provided that the Empty Flag (EF) is not set. The data is accessed on a first-in/first-out basis, not including any current write operations. After Read Enable (R) goes high, the Data Outputs (Q0 - Q8) will return to a high impedance state until the next Read operation. When all the data in the FIFO stack has been read, the Empty Flag (EF) will go low, allowing the “final” read cycle, but inhibiting further read operations while the data outputs remain in a high impedance state. Once a valid write operation has been completed, the Empty Flag (EF) will go high after tWEF and a valid read may then be initiated. When the FIFO stack is empty, the internal read pointer is blocked from R, so that external changes to R will have no effect on the empty FIFO stack. This pin is a dual-purpose input. In the Depth Expansion Mode, this pin is connected to ground to indicate that it is the first loaded (see Operating Modes). In the Single Device Mode, this pin acts as the retransmit input. The Single Device Mode is initiated by connecting the Expansion In (XI) to ground. The M67206H can be set to retransmit data when the Retransmit Enable Control (RT) input is pulsed low. A retransmit operation will set the internal read point to the first location and will not affect the write pointer. Read Enable (R) and Write Enable (W) must be in the high state during retransmit. The retransmit feature is intended for use when a number of writes are equal to or less than the depth of the FIFO has occurred since the last RS cycle. The retransmit feature is not compatible with the Depth Expansion Mode and will affect the Half-Full Flag (HF), in accordance with the relative locations of the read and write pointers. First Load/Retransmit (FL/RT) Expansion In (XI) The XI input is a dual-purpose pin. Expansion In (XI) is connected to GND to indicate an operation in the single device mode. Expansion In (XI) is connected to Expansion Out (XO) of the previous device in the Depth Expansion or Daisy Chain modes. The Full Flag (FF) will go low, inhibiting further write operations when the write pointer is one location less than the read pointer, indicating that the device is full. If the read pointer is not moved after Reset (RS), the Full Flag (FF) will go low after 16384 writes. The Empty Flag (EF) will go low, inhibiting further read operations when the read pointer is equal to the write pointer, indicating that the device is empty. Full Flag (FF) Empty Flag (EF) 4 M67206H 4143J–AERO–04/07 M67206H Expansion Out/Half-Full Flag (XO/HF) The XO/HF pin is a dual-purpose output. In the single device mode, when Expansion In (XI) is connected to ground, this output acts as an indication of a half-full memory. After half the memory is filled and on the falling edge of the next write operation, the Half-Full Flag (HF) will be set to low and will remain set until the difference between the write and read pointers is less than or equal to half of the total memory of the device. The Half-Full Flag (HF) is then reset by the rising edge of the read operation. In the Depth Expansion Mode, Expansion In (XI) is connected to Expansion Out (XO) of the previous device. This output acts as a signal to the next device in the Daisy Chain by providing a pulse to the next device when the previous device reaches the last memory location. Data Output (Q0 - Q8) DATA output for 9-bit wide data. This data is in a high impedance condition whenever Read (R) is in a high state. 5 4143J–AERO–04/07 Functional Description Single Device Mode A single M67206H may be used when the application requirements are for 16384 words or less. The M67206H is in a Single Device Configuration when the Expansion In (XI) control input is grounded (see Figure 2). In this mode the Half-Full Flag (HF), which is an active low output, is shared with Expansion Out (XO). Figure 2. Block Diagram of Single 16384 bits × 9 HF (HALF-FULL FLAG) WRITE (W) HF 9 DATAIN (I) (Q) (EF) (RT) 9 DATAOUT (R) READ FULL FLAG (FF) RESET (RS) EMPTY FLAG RETRANSMIT EXPANSION IN (XI) M67206H Width Expansion Mode Word width may be increased simply by connecting the corresponding input control signals of multiple devices. Status flags (EF, FF and HF) can be detected from any device. Figure 3 demonstrates an 18-bit word width by using two M67206H. Any word width can be attained by adding additional M67206H. Figure 3. Block Diagram of 16384 bits x 18 FIFO Memory Used in Width Expansion Mode H Note: Flag detection is accomplished by monitoring the FF, EF and the HF signals on either (any) device used in the width expansion configuration. Do not connect any output control signals together. 6 M67206H 4143J–AERO–04/07 M67206H Table 1. Reset and Retransmit Single Device Configuration/Width Expansion Mode Inputs Mode Reset Retransmit Read/Write Note: RS 0 1 1 Internal Status XI 0 0 0 Outputs EF 0 X X RT X 0 1 Read Pointer Location Zero Location Zero Increment(1) Write Pointer Location Zero Unchanged Increment(1) FF 1 X X HF 1 X X 1. Pointer will increment if flag is high. Table 2. Reset and First Load Truth Table Depth Expansion/Compound Expansion Mode Inputs Mode Reset First Device Reset All Other Devices Read/Write Note: RS 0 Internal Status XI (1) Outputs EF 0 FL 0 Read Pointer Location Zero Location Zero X Write Pointer Location Zero Location Zero X FF 1 0 1 (1) 0 1 1 X (1) X X 1. XI is connected to XO of previous device. See Figure 4. Depth Expansion (Daisy Chain) Mode The M67206H can be easily adapted for applications which require more than 16384 words. Figure 4 demonstrates Depth Expansion using three M67206Hs. Any depth can be achieved by adding an additional M67206H. The M67206H operates in the Depth Expansion configuration if the following conditions are met: 1. The first device must be designated by connecting the First Load (FL) control input to ground. 2. All other devices must have FL in the high state. 3. The Expansion Out (XO) pin of each device must be connected to the Expansion In (XI) pin of the next device. See Figure 4 4. External logic is needed to generate a composite Full Flag (FF) and Empty Flag (EF). This requires that all EF’s and all FFs be ORed (i.e. all must be set to generate the correct composite FF or EF). See Figure 4. 5. The Retransmit (RT) function and Half-Full Flag (HF) are not available in the Depth Expansion Mode. Compound Expansion Module It is quite simple to apply the two expansion techniques described above together to create large FIFO arrays (see Figure 5). 7 4143J–AERO–04/07 Bi-directional Mode Applications which require data buffering between two systems (each system being capable of Read and Write operations) can be created by coupling M67206H as shown in Figure 6. Care must be taken to ensure that the appropriate flag is monitored by each system (i.e. FF is monitored on the device on which W is in use; EF is monitored on the device on which R is in use). Both Depth Expansion and Width Expansion may be used in this mode. Two types of flow-through modes are permitted: a read flow-through and a write flowthrough mode. In the read flow-through mode (Figure 17) the FIFO stack allows a single word to be read after one word has been written to an empty FIFO stack. The data is enabled on the bus at (tWEF + tA) ns after the leading edge of W which is known as the first write edge and remains on the bus until the R line is raised from low to high, after which the bus will go into a three-state mode after tRHZ ns. The EF line will show a pulse indicating temporary reset and then will be set. In the interval in which R is low, more words may be written to the FIFO stack (the subsequent writes after the first write edge will reset the Empty Flag); however, the same word (written on the first write edge) presented to the output bus as the read pointer will not be incremented if R is low. On toggling R, the remaining words written to the FIFO will appear on the output bus in accordance with the read cycle timings. In the write flow-through mode (Figure 18), the FIFO stack allows a single word of data to be written immediately after a single word of data has been read from a full FIFO stack. The R line causes the FF to be reset, but the W line, being low, causes it to be set again in anticipation of a new data word. The new word is loaded into the FIFO stack on the leading edge of W. The W line must be toggled when FF is not set in order to write new data into the FIFO stack and to increment the write pointer. Figure 4. Block Diagram of 49152 bits × 9 FIFO Memory (Depth Expansion) Data Flow – Through Modes M 67206H M 67206H M 67206H 8 M67206H 4143J–AERO–04/07 M67206H Figure 5. Compound FIFO Expansion Q0 - Q8 Q0 - Q8 R W RS Q9 - Q17 Q9 - Q17 Q (N-8) - QN M67206H M67206H I0 - I 8 I0 - I 8 I9 - I17 I9 - I 17 I(N-8) - IN I(N-8) - IN Notes: 1. For depth expansion block see section on Depth Expansion and Figure 4. 2. For Flag detection see section on Width Expansion and Figure 3. Figure 6. Bi-directional FIFO Mode M 67206H M 67206H 9 4143J–AERO–04/07 Electrical Characteristics Absolute Maximum Ratings *NOTICE: Supply voltage (VCC - GND): .............................- 0.5V to 7.0V Input or Output voltage applied: (GND - 0.3V) to (Vcc + 0.3V) Storage temperature:................................. - 65 °C to + 150 °C Stresses beyond those listed under "Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. DC Parameters DC Test Conditions TA = -55°C to + 125°C; Vss = 0V; Vcc = 4.5V to 5.5V Parameter ICCOP (1) (2) Description Operating supply current Standby supply current Power down current M67206H-30 110 M67206H-15 120 Unit mA Value Max ICCSB 5 5 mA Max ICCPD (3) 400 400 µA Max 1. 2. 3. Icc measurements are made with outputs open. R = W = RS = FL/RT = VIH. All input = Vcc. Parameter ILI (1) ILO (2) VIL (3) VIH(3) VOL (4) VOH(4) C IN (5) C OUT(5) Description Input leakage current Output leakage current Input low voltage Input high voltage Output low voltage Output high voltage Input capacitance Output capacitance M67206H ±1 ±1 0.8 2.2 0.4 2.4 8 8 Unit µA µA V V V V pF pF Value Max Max Max Min Max Min Max Max 1. 2. 3. 4. 5. 0.4 ≤ Vin ≤ Vcc. R = VIH, 0.4 ≤ VOUT ≤ VCC. VIH max = Vcc + 0.3 V. VIL min = -0.3V or -1V pulse width 50 ns. For XI input, VIH = 2.8V Vcc min, IOL = 8 mA, IOH = -2 mA. Guaranteed but not tested. 10 M67206H 4143J–AERO–04/07 M67206H AC Test Conditions Input pulse levels: Gnd to 3.0V Input rise/Fall times: 5 ns Input timing reference levels: 1.5V Figure 7. Output Load Output reference levels: 1.5V Output load: See Figure 7 Table 3. AC Test Conditions M67206H- 15 Symbol (1) Read Cycle TRLRL TRLQV TRHRL TRLRH TRLQX TWHQX TRHQX TRHQZ tRC tA tRR tRPW tRLZ tWLZ tDV tRHZ M67206H- 30 Min Max Unit Symbol (2) Parameter (3) (4) Min Max Read cycle time Access time Read recovery time Read pulse width (5) Read low to data low Z (6) Write low to data low Z (6) (7) Data valid from read high Read high to data high Z(6) 25 – 10 15 0 3 5 – – 15 – – – – – 15 40 – 10 30 0 5 5 – – 30 – – – – – 20 ns ns ns ns ns ns ns ns Write Cycle TWLWL TWLWH TWHWL TDVWH TWHDX tWC tWPW tWR tDS tDH Write cycle time Write pulse width(5) Write recovery time Data set-up time Data hold time 25 15 10 9 0 – – – – – 40 30 10 18 0 – – – – – ns ns ns ns ns Reset Cycle TRSLWL TRSLRSH tRSC tRS Reset cycle time Reset pulse width (5) 25 15 – – 40 30 – – ns ns 11 4143J–AERO–04/07 Table 3. AC Test Conditions (Continued) M67206H- 15 Symbol (1) M67206H- 30 Min 30 10 Unit Symbol tRSS tRSR (2) Parameter (3) (4) Min 20 10 Max – – Max – – ns ns TWHRSH TRSHWL Reset set-up time Reset recovery time Retransmit Cycle TRTLWL TRTLRTH TWHRTH TRTHWL tRTC tRT tRTS tRTR Retransmit cycle time Retransmit pulse width(5) Retransmit set-up time(6) Retransmit recovery time 25 15 15 10 – – – – 40 30 30 10 – – – – ns ns ns ns Flags TRSLEFL TRSLFFH TRLEFL TRHFFH TEFHRH TWHEFH TWLFFL TWLHFL TRHHFH TFFHWH tEFL tHFH, tFFH tREF tRFF tRPE tWEF tWFF tWHF tRHF tWPF Reset to EF low Reset to HF/FF high Read low to EF low Read high to FF high Read width after EF high Write high to EF high Write low to FF low Write low to HF low Read high to HF high Write width after FF high – – – – 15 – – – – 15 25 25 25 25 – 15 20 30 30 – – – – – 30 – – – – 30 30 30 30 30 – 30 30 30 30 – ns ns ns ns ns ns ns ns ns ns Expansion TWLXOL TWHXOH TXILXIH TXIHXIL TXILRL tXOL tXOH tXI tXIR tXIS Read/Write to XO low Read/Write to XO high XI pulse width XI recovery time XI set-up time – – 15 10 10 15 15 – – – – – 30 10 10 30 30 – – – ns ns ns ns ns 1. 2. 3. 4. 5. 6. 7. STD symbol. ALT symbol. Timings referenced as in AC test conditions. All parameters tested only. Pulse widths less than minimum value are not allowed. Values guaranteed by design, not currently tested. Only applies to read data flow-through mode. 12 M67206H 4143J–AERO–04/07 M67206H Figure 8. Asynchronous Write and Read Operation Figure 9. Full Flag from Last Write to First Read Figure 10. Empty Flag from Last Read to First Write 13 4143J–AERO–04/07 Figure 11. Retransmit Figure 12. Empty Flag Timing Figure 13. Full Flag Timing 14 M67206H 4143J–AERO–04/07 M67206H Figure 14. Half Full Flag Timing Figure 15. Expansion Out Figure 16. Expansion In 15 4143J–AERO–04/07 Figure 17. Read Data Flow – Through Mode Figure 18. Write Data Flow – Through Mode 16 M67206H 4143J–AERO–04/07 M67206H Ordering Information Part Number MMCP-67206HV-15-E(1) SMCP-67206HV-15SCC SMCP-67206HV-30SCC 5962-9317708QTC 5962-9317707QTC 5962-9317708VTC 5962D9317708VTC 5962D9317707VTC 5962-9317707VTC MMDP-67206HV-15-E SMDP-67206HV-15SCC SMDP-67206HV-30SCC 5962-9317708QNC 5962-9317707QNC 5962-9317708VNC 5962-9317707VNC 5962D9317708VNC 5962D9317707VNC MM0 -67206HV-15SV(1) MM067206HV-15-E(1) Note: 1. Contact Atmel for availability. Temperature Range 25°C -55 to +125°C -55 to +125°C -55 to +125°C -55 to +125°C -55 to +125°C -55 to +125°C -55 to +125°C -55 to +125°C 25°C -55 to +125°C -55 to +125°C -55 to +125°C -55 to +125°C -55 to +125°C -55 to +125°C -55 to +125°C -55 to +125°C -55 to +125°C 25°C Speed 15 ns 15 ns 30 ns 15 ns 30 ns 15 ns 15 ns 30 ns 30 ns 15 ns 15 ns 30 ns 15 ns 30 ns 15 ns 30 ns 15 ns 30 ns 15 ns 15 ns Package SB28.3 SB28.3 SB28.3 SB28.3 SB28.3 SB28.3 SB28.3 SB28.3 SB28.3 FP28.4 FP28.4 FP28.4 FP28.4 FP28.4 FP28.4 FP28.4 FP28.4 FP28.4 Die Die Quality Flow Engineering Samples ESCC ESCC QML Q QML Q QML V QML V RHA QML V RHA QML V Engineering Samples ESCC ESCC QML Q QML Q QML V QML V QML V RHA QML V RHA QML V Engineering Samples 17 4143J–AERO–04/07 Package Drawings 28-lead Side Braze (300 Mils) 18 M67206H 4143J–AERO–04/07 28-lead Flat Pack (400 Mils) 19 M67206H 4143J–AERO–04/07 Atmel Headquarters Corporate Headquarters 2325 Orchard Parkway San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 487-2600 Atmel Operations Memory 2325 Orchard Parkway San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 436-4314 RF/Automotive Theresienstrasse 2 Postfach 3535 74025 Heilbronn, Germany TEL (49) 71-31-67-0 FAX (49) 71-31-67-2340 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TEL 1(719) 576-3300 FAX 1(719) 540-1759 Europe Atmel Sarl Route des Arsenaux 41 Case Postale 80 CH-1705 Fribourg Switzerland TEL (41) 26-426-5555 FAX (41) 26-426-5500 Microcontrollers 2325 Orchard Parkway San Jose, CA 95131 TEL 1(408) 441-0311 FAX 1(408) 436-4314 La Chantrerie BP 70602 44306 Nantes Cedex 3, France TEL (33) 2-40-18-18-18 FAX (33) 2-40-18-19-60 Asia Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimhatsui East Kowloon Hong Kong TEL (852) 2721-9778 FAX (852) 2722-1369 Biometrics/Imaging/Hi-Rel MPU/ High Speed Converters/RF Datacom Avenue de Rochepleine BP 123 38521 Saint-Egreve Cedex, France TEL (33) 4-76-58-30-00 FAX (33) 4-76-58-34-80 ASIC/ASSP/Smart Cards Zone Industrielle 13106 Rousset Cedex, France TEL (33) 4-42-53-60-00 FAX (33) 4-42-53-60-01 1150 East Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TEL 1(719) 576-3300 FAX 1(719) 540-1759 Scottish Enterprise Technology Park Maxwell Building East Kilbride G75 0QR, Scotland TEL (44) 1355-803-000 FAX (44) 1355-242-743 Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan TEL (81) 3-3523-3551 FAX (81) 3-3523-7581 e-mail literature@atmel.com Web Site http://www.atmel.com Disclaimer: A tmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical components in life support devices or systems. © 2007 Atmel Corporation . A ll rights reserved. A tmel ®, logo and combinations thereof, and Everywhere You Are® a re the trademarks or registered trademarks, of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others. 4143J–AERO–04/07 /xM