PC8245MTPU300D

Features • 300 MHz - 333 MHz To Be Confirmed-PC603e Processor Core Implementing the • • • • • • • • PowerPC® Architecture 32-bit PCI Interface Operating at up to 66 MHz Memory Controller Offering SDRAM Support up to 133 MHz Operation, Support up to 2 GB General Purpose I/O and ROM Interface Support Two Channel DMA Controller that Supports Chaining Messaging Unit with I2O Messaging Support Capability Industry-standard I2C Interface Programmable Interrupt Controller with Multiple Timers and Counters 16550-compatible DUART Description The PC8245 combines a PC603e core microprocessor with a PCI bridge. The PCI support on the PC8245 will allow system designers to rapidly design systems using peripherals already designed for PCI and the other standard interfaces. The PC8245 also integrates a high-performance memory controller which supports various types of ROM and SDRAM. The PC8245 is the second of a family of products that provides system-level support for industry standard interfaces with a PC603e processor core. This document describes pertinent electrical and physical characteristics of the PC8245. For functional characteristics of the processor, refer to the Motorola’s documentation "MPC8245 Integrated Processor User’s Manual" (MPC8245UM/D). Integrated Processor Family PC8245 Product Specification Screening/Quality/Packaging This product is manufactured in full compliance with: • Upscreening based upon Atmel standards • Military temperature range (Tc = -55°C, Tc = +125°C) • Core power supply: 2.0 ± 100 mV • • I/O power supply: 3.3V ± 0.3V 352 Tape Ball Grid Array (TBGA) TP suffix TBGA352 Tape Ball Grid Array Rev. 2171D–HIREL–06/04 2171D–HIREL–06/04 General Description Block Diagram Figure 1. Block Diagram PC8245 Additional features: • Prog I/O with Watchpoint • JTAG/COP Interface • Power Management Processor Core Block Processor PLL (64-bit) Two-instruction fetch The PC8245 integrated processor is comprised of a peripheral logic block and a 32-bit superscalar PowerPC 603e core, as shown in Figure 1. Branch Processing Instruction Unit Unit (BPU) (64-bit) Two-instruction dispatch System Register Unit (SRU) Integer Unit (IU) Load/Store Unit (LSU) Floating Point Unit (FPU) 64-bit Data MMU 16-Kbyte Data Cache Instruction MMU 16-Kbyte Instruction Cache Peripheral Logic Bus Peripheral Logic Block Message Unit (with I2O) DMA Controller Address (32-bit) Central Control Unit Data (64-bit) Data Path ECC Controller Data Bus (32- or 64-bit) with 8-bit Parity or ECC Memory/ROM/PortX Address and Control Memory Controller I2C I2C Controller EPIC Interrupt Controller /Timers Performance Monitor DLL Peripheral Logic PLL Configuration Registers SDRAM_SYNC_IN SDRAM Clocks PCI_SYNC_IN 5 IRQs/ 16 Serial Interrupts DUART PCI Bus Interface Unit Watchpoint Facility Address Translator PCI Arbiter Fanout Buffers PCI Bus Clocks 32-bit Five Request/ PCI Interface Grant Pairs Oscillator Input 2 PC8245 2171D–HIREL–06/04 PC8245 The peripheral logic integrates a PCI bridge, dual universal asynchronous receiver/transmitter (DUART), memory controller, DMA controller, EPIC interrupt controller, a message unit (and I2O interface), and a I2C inteface controller. The processor core is a full-featured, high-performance processor with floating-point support, memory management, 16-Kbyte instruction cache, 16-Kbyte data cache, and power management features. The integration reduces the overall packaging requirements and the number of discrete devices required for an embedded system. The PC8245 contains an internal peripheral logic bus that interfaces the processor core to the peripheral logic. The core can operate at a variety of frequencies, allowing the designer to trade-off performance for power consumption. The processor core is clocked from a separate PLL, which is referenced to the peripheral logic PLL. This allows the microprocessor and the peripheral logic block to operate at different frequencies, while maintaining a synchronous bus interface. The interface uses a 64- or 32-bit data bus (depending on memory data bus width) and a 32-bit address bus along with control signals that enable the interface between the processor and peripheral logic to be optimized for performance. PCI accesses to the PC8245 memory space are passed to the processor bus for snooping when snoop mode is enabled. The processor core and peripheral logic are general-purpose in order to serve a variety of embedded applications. The PC8245 can be used as either a PCI host or PCI agent controller. General Parameters The following list provides a summary of the general parameters of the PC8245: Technology0.25 µm CMOS, five-layer metal Die size 49.2 mm2 Transistor count4.5 million Logic designFully static Packages Surface-mount 352 tape ball grid array (TBGA) Core power supply:2.0V ± 100 mV DC (nominal; see Table “Recommended Operating Conditions” on page 12 for details I/O power supply3.0 to 3.6V DC Features Major features of the PC8245 are as follows: • Processor core – – High-performance, superscalar processor core Integer unit (IU), floating-point unit (FPU) (software enabled or disabled), load/store unit (LSU), system register unit (SRU), and a branch processing unit (BPU) 16-Kbyte instruction cache 16-Kbyte data cache Lockable L1 caches — entire cache or on a per-way basis up to three of four ways Dynamic power management — supports 60x nap, doze, and sleep modes – – – – 3 2171D–HIREL–06/04 • Peripheral logic Peripheral Logic Bus – – – – – Supports various operating frequencies and bus divider ratios 32-bit address bus, 64-bit data bus Supports full memory coherency Decoupled address and data buses for pipelining of peripheral logic bus accesses Store gathering on peripheral logic bus-to-PCI writes Memory interface – – – – – – – – – – – – Supports up to 2 Gbytes of SDRAM memory High-bandwidth data bus (32- or 64-bit) to SDRAM Programmable timing supporting SDRAM Supports 1 to 8 banks of 16-, 64-, 128-, 256-, or 512-Mbit memory devices Write buffering for PCI and processor accesses Supports normal parity, read-modify-write (RMW), or ECC Data-path buffering between memory interface and processor Low-voltage TTL logic (LVTTL) interfaces 272 Mbytes of base and extended ROM/Flash/PortX space Base ROM space supports 8-bit data path or same size as the SDRAM data path (32- or 64-bit) Extended ROM space supports 8-, 16-, 32-bit gathering data path, 32- or 64bit (wide) data path PortX: 8-, 16-, 32-, or 64-bit general-purpose I/O port using ROM controller interface with programmable address strobe timing, data ready input signal (DRDY), and 4 chip selects 32-bit PCI interface – – – – – – – – – – – – – – Operates up to 66 MHz PCI 2.2-compliant PCI 5.0V tolerance Support for dual address cycle (DAC) for 64-bit PCI addressing (master only) Support for PCI locked accesses to memory Support for accesses to PCI memory, I/O, and configuration spaces Selectable big- or little-endian operation Store gathering of processor-to-PCI write and PCI-to-memory write accesses Memory prefetching of PCI read accesses Selectable hardware-enforced coherency PCI bus arbitration unit (five request/grant pairs) PCI agent mode capability Address translation with two inbound and outbound units (ATU) Some internal configuration registers accessible from PCI Two-channel integrated DMA controller (writes to ROM/PortX not supported) 4 PC8245 2171D–HIREL–06/04 PC8245 – – – – – – – – Supports direct mode or chaining mode (automatic linking of DMA transfers) Supports scatter gathering — read or write discontinuous memory 64-byte transfer queue per channel Interrupt on completed segment, chain, and error Local-to-local memory PCI-to-PCI memory Local-to-PCI memory PCI memory-to-local memory Message unit – – – Two doorbell registers Two inbound and two outbound messaging registers I2O message interface Two-wire interface controller with full master/slave support that accepts broadcast messages Embedded programmable interrupt controller (EPIC) – – Five hardware interrupts (IRQs) or 16 serial interrupts Four programmable timers with cascade Two (dual) universal asynchronous receiver/transmitters (UARTs) Integrated PCI bus and SDRAM clock generation Programmable PCI bus and memory interface output drivers • • System level performance monitor facility Debug features – Memory attribute and PCI attribute signals – Debug address signals – MIV signal: marks valid address and data bus cycles on the memory bus – Programmable input and output signals with watchpoint capability – Error injection/capture on data path – IEEE 1149.1 (JTAG)/test interface 5 2171D–HIREL–06/04 Pinout Listing Table 1. PC8245 Pinout Listing Signal Name PCI Interface Signals C/BE[3:0] DEVSEL FRAME IRDY LOCK Table 1 provides the pinout listing for the PC8245, 352 TBGA package. Pin Number Type Power Supply Output Driver Type Notes P25 K23 F23 A25 H26 J24 K25 J26 V25 U25 U26 U24 U23 T25 T26 R25 R26 N26 N25 N23 M26 M25 L25 L26 F24 E26 E25 E23 D26 D25 C26 A26 B26 A24 B24 D19 B23 B22 D22 C22 G25 W25 W24 W23 V26 W26 Y25 AA26 AA25 AB26 Y26 G26 F26 H25 K26 AC26 P26 I/O I/O3 I/O I/O Input OVDD OVDD OVDD OVDD OVDD DRV_PCI DRV_PCI DRV_PCI DRV_PCI – (6)(15) (8)(15) (8)(15) (8)(15) (8) AD[31:0] I/O3 OVDD DRV_PCI (6)(15) PAR GNT[3:0] GNT4/DA5 REQ[3:0] REQ4/DA4 PERR SERR STOP TRDY INTA IDSEL Memory Interface Signals I/O Output Output Input I/O I/O I/O I/O I/O Output Input OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD DRV_PCI DRV_PCI DRV_PCI – – DRV_PCI DRV_PCI DRV_PCI DRV_PCI DRV_PCI – (15) (6)(15) (7)(14)(15) (6)(12) (12)(14) (8)(15)(18) (8)(15)(16) (8)(15) (8)(15) (15)(16) MDL[0:31] AD17 AE17 AE15 AF15 AC14 AE13 AF13 AF12 AF11 AF10 AF9 AD8 AF8 AF7 AF6 AE5 B1 A1 A3 A4 A5 A6 A7 D7 A8 B8 A10 D10 A12 B11 B12 A14 AC17 AF16 AE16 AE14 AF14 AC13 AE12 AE11 AE10 AE9 AE8 AC7 AE7 AE6 AF5 AC5 E4 A2 B3 D4 B4 B5 D6 C6 B7 C9 A9 B10 A11 A13 B13 A15 AB1 AB2 K3 K2 AC1 AC2 K1 J1 Y4 AA3 AA4 AC4 M2 L2 M1 L1 H1 N4 N2 I/O GVDD DRV_STD_MEM (5)(6) MDH[0:31] I/O GVDD DRV_STD_MEM (6) DQM[0:7] CS[0:7] FOE RCS0 RCS1 Output Output I/O Output Output GVDD GVDD GVDD GVDD GVDD DRV_MEM_CTRL DRV_MEM_CTRL DRV_MEM_CTRL DRV_MEM_CTRL DRV_MEM_CTRL (6) (6) (3)(4) (3)(4) 6 PC8245 2171D–HIREL–06/04 PC8245 Table 1. PC8245 Pinout Listing (Continued) Signal Name RCS2/TRIG_IN RCS3/TRIG_OUT SDMA[1:0] SDMA[11:2] DRDY SDMA12/SRESET SDMA13/TBEN SDMA14/CHKSTOP_IN SDBA1 SDBA0 PAR[0:7] SDRAS SDCAS CKE WE AS EPIC Control Signals IRQ0/S_INT IRQ1/S_CLK IRQ2/S_RST IRQ_3/S_FRAME IRQ_4/ L_INT C19 B21 AC22 AE24 A23 Input I/O I/O I/O I/O OVDD OVDD OVDD OVDD OVDD – DRV_PCI DRV_PCI DRV_PCI DRV_PCI Pin Number AF20 AC18 W1 W2 N1 R1 R2 T1 T2 U4 U2 U1 V1 V3 B20 B16 B14 D14 P1 P2 AF3 AE3 G4 E2 AE4 AF4 D2 C2 AD1 AD2 H2 AA1 Y1 Type I/O Output I/O Output Input I/O I/O I/O Output Output I/O Output Output Output Output Output Power Supply OVDD GVDD GVDD GVDD OVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD GVDD Output Driver Type – DRV_MEM_CTRL DRV_MEM_CTRL DRV_MEM_CTRL – DRV_MEM_CTRL DRV_MEM_CTRL DRV_MEM_CTRL DRV_MEM_CTRL DRV_MEM_CTRL DRV_STD_MEM DRV_MEM_CTRL DRV_MEM_CTRL DRV_MEM_CTRL DRV_MEM_CTRL DRV_MEM_CTRL (3)(4) (6) (3) (3) (3)(4) Notes (10)(14) (14) (3)(4)(6) (6) (9)(14) (10)(14) (10)(14) (10)(14) Two-wire Interface Control Signals SDA SCL DUART Control Signals SOUT1/PCI_CLK0 SIN1/PCI_CLK1 SOUT2/RTS1/PCI_CLK2 SIN2/CTS1/PCI_CLK3 Clock Out Signals PCI_CLK0/SOUT1 PCI_CLK1/SIN1 PCI_CLK2/RTS1/SOUT2 PCI_CLK3/CTS1/SIN2 AC25 AB25 AE26 AF25 Output I/O Output I/O GVDD GVDD GVDD GVDD DRV_PCI_CLK DRV_PCI_CLK DRV_PCI_CLK DRV_PCI_CLK (13)(14) (13)(14) (13)(14) (13)(14) AE20 AF21 I/O I/O OVDD OVDD DRV_STD_MEM DRV_STD_MEM (10)(16) (10)(16) AC25 AB25 AE26 AF25 Output I/O Output I/O GVDD GVDD GVDD GVDD DRV_PCI_CLK DRV_PCI_CLK DRV_PCI_CLK DRV_PCI_CLK (13)(14) (13)(14) (13)(14) (13)(14) 7 2171D–HIREL–06/04 Table 1. PC8245 Pinout Listing (Continued) Signal Name PCI_CLK4/DA3 PCI_SYNC_OUT PCI_SYNC_IN SDRAM_CLK [0:3] SDRAM_SYNC_OUT SDRAM_SYNC_IN CKO/DA1 OSC_IN Miscellaneous Signals HRST_CTRL HRST_CPU MCP NMI SMI SRESET/SDMA12 TBEN/SDMA13 QACK/DA0 CHKSTOP_IN/SDMA14 TRIG_IN/RCS2 TRIG_OUT/RCS3 MAA[0:2] MIV PMAA[0:1] PMAA[2] Test/Configuration Signals PLL_CFG[0:4]/DA[10:6] TEST0 DRDY RTC TCK TDI TDO TMS TRST A22 B19 A21 B18 B17 AD22 B20 Y2 AF22 AF23 AC21 AE22 AE23 I/O Input Input Input Input Input Output Input Input OVDD OVDD OVDD GVDD OVDD OVDD OVDD OVDD OVDD DRV_STD_MEM – – – – – – – – (6)(14)(20) Pin Number AF26 AD25 AB23 D1 G1 G2 E1 C1 H3 B15 AD21 Type Output Output Input Output Output Input Output Input Power Supply GVDD GVDD GVDD GVDD GVDD GVDD OVDD OVDD Output Driver Type DRV_PCI_CLK DRV_PCI_CLK – DRV_MEM_CTRL or DRV_MEM_CLK DRV_MEM_CTRL or DRV_MEM_CLK – DRV_STD_MEM – Notes (13)(14) (6)(21) (21) (14) (19) A20 A19 A17 D16 A18 B16 B14 F2 D14 AF20 AC18 AF2 AF1 AE1 A16 AD18 AF18 AE19 Input Input Output Input Input I/O I/O Output I/O I/O Output Output Output Output Output OVDD OVDD OVDD OVDD OVDD GVDD GVDD OVDD GVDD OVDD GVDD GVDD OVDD OVDD OVDD – – DRV_STD_MEM – – DRV_MEM_CTRL DRV_MEM_CTRL DRV_STD_MEM DRV_MEM_CTRL – DRV_MEM_CTRL DRV_STD_MEM – DRV_STD_MEM DRV_STD_MEM (10) (10)(14) (10)(14) (3)(4)(14) (10)(14) (10)(14) (14) (3)(4)(6) (24) (3)(4)(6)(15) (4)(6)(15) (3)(4)(17) (1)(9) (9)(10)(14) (11) (9)(12) (9)(12) (24) (9)(12) (9)(12) 8 PC8245 2171D–HIREL–06/04 PC8245 Table 1. PC8245 Pinout Listing (Continued) Signal Name Power and Ground Signals AA2 AA23 AC12 AC15 AC24 AC3 AC6 AC9 AD11 AD14 AD16 AD19 AD23 AD4 AE18 AE2 AE21 AE25 B2 B25 B6 B9 C11 C13 C16 C23 C4 C8 D12 D15 D18 D21 D24 D3 F25 F4 H24 J25 J4 L24 L3 M23 M4 N24 P3 R23 R4 T24 T3 V2 V23 W3 AC20 AC23 D20 D23 G23 P23 Y23 AB3 AB4 AC10 AC11 AC8 AD10 AD13 AD15 AD3 AD5 AD7 C10 C12 C3 C5 C7 D13 D5 D9 E3 G3 H4 K4 L4 N3 P4 R3 U3 V4 Y3 AB24 AD20 AD24 C14 C20 C24 E24 G24 J23 K24 M24 P24 T23 Y24 AA24 AC16 AC19 AD12 AD6 AD9 C15 C18 C21 D11 D8 F3 H23 J3 L23 M3 R24 T4 V24 W4 D17 Pin Number Type Power Supply Output Driver Type Notes GND Ground – – LVDD Reference voltage 3.3V, 5.0V Power for Memory Drivers 3.3V PCI/Stnd 3.3V Power for Core 1.8/2.0V – Power for PLL (CPU Core Logic) 1.8/2.0V Power for PLL (Peripheral Logic) 1.8/2.0V LVDD – GVDD GVDD – OVDD OVDD – VDD No Connect VDD – – – (22) (23) AVDD C17 AVDD – (22) AVDD2 Debug/Manufacturing Pins DA0/QACK DA1/CKO DA2 DA3/PCI_CLK4 DA4/REQ4 DA5/GNT4 DA[10:6]/PLL_CFG[0:4] DA[11] DA[12:13] AF24 AVDD2 – (22) F2 B15 C25 AF26 Y26 W26 A22 B19 A21 B18 B17 AD26 AF17 AF19 Output Output Output Output I/O Output I/O Output Output OVDD OVDD OVDD GVDD OVDD OVDD OVDD OVDD OVDD DRV_STD_MEM DRV_STD_MEM DRV_PCI DRV_PCI_CLK – DRV_PCI DRV_STD_MEM DRV_PCI DRV_STD_MEM DRV_MEM_CTRL (3)(4)(14) (14) (2) (14) (12)(14) (7)(14)(15) (6)(14)(20) (2) (2)(6) (2)(6) DA[14:15] F1 J2 Output GVDD Notes: 1. Place a pull-up resistor of 120Ω or less on the TEST0 pin. 2. Treat these pins as no connects (NC) unless using debug address functionality. 9 2171D–HIREL–06/04 3. This pin has an internal pull-up resistor which is enabled only when the PC8245 is in the reset state. The value of the internal pull-up resistor is not guaranteed, but is sufficient to ensure that a logic 1 is read into configuration bits during reset. 4. This pin is a reset configuration pin. 5. DL[0] is a reset configuration pin and has an internal pull-up resistor which is enabled only when the PC8245 is in the reset state. The value of the internal pull-up resistor is not guaranteed, but is sufficient to ensure that a logic 1 is read into configuration bits during reset. 6. Multi-pin signals such as AD[31:0] or MDL[0:31] have their physical package pin numbers listed in order, corresponding to the signal names. Example: AD0 is on pin C22, AD1 is on pin D22, ..., AD31 is on pin V25. 7. GNT4 is a reset configuration pin and has an internal pull-up resistor which is enabled only when the PC8245 is in the reset state. 8. Recommend a weak pull-up resistor (2 kΩ – 10 kΩ) be placed on this PCI control pin to LVDD. 9. VIH and VIL for these signals are the same as the PCI VIH and VIL entries in Table 4 on page 23. 10. Recommend a weak pull-up resistor (2 kΩ – 10 kΩ) be placed on this pin to OVDD. 11. Recommend a weak pull-up resistor (2 kΩ – 10 kΩ) be placed on this pin to GVDD. 12. This pin has an internal pull-up resistor which is enabled at all times. The value of the internal pull-up resistor is not guaranteed, but is sufficient to prevent unused inputs from floating. 13. External PCI clocking source or fan-out buffer may be required for system if using the PC8245 DUART functionality since PCI_CLK[0:3] are not available in DUART mode. Only PCI_CLK4 is available in DUART mode. 14. This pin is a multiplexed signal and appears more than once in this table. 15. This pin is affected by programmable PCI_HOLD_DEL parameter. 16. This pin is an open drain signal. 17. This pin can be programmed to be driven (default) or can be programmed (in PMCR2) to be open drain. 18. This pin is a sustained three-state pin as defined by the PCI Local Bus Specification. 19. OSC_IN utilizes the 3.3V PCI interface driver which is 5V tolerant, see Table “Recommended Operating Conditions” on page 12 for details. 20. PLL_CFG[0:4] signals are sampled a few clocks after the negation of HRST_CPU and HRST_CTRL. 21. SDRAM_CLK[0:3] and SDRAM_SYNC_OUT signals use DRV_MEM_CTRL for chip Rev 1.1 (A). These signals use DRV_MEM_CLK for chip Rev 1.2 (B). 22. The 266 and 300 MHz part offerings can be ran at a source voltage of 1.8 ± 100 mV or 2.0 ± 100 mV. Note that source voltage should be 2.0 ± 100 mV for 333- and 350-MHz parts. 23. This pin was formally LAVDD on the PC8240. It is a no connect on the PC8245. This should not pose a problem when replacing an PC8240 with an PC8245. 24. The driver capability of this pin is hardwired to 40Ω and cannot be changed. 10 PC8245 2171D–HIREL–06/04 PC8245 Electrical and Thermal Characteristics DC Electrical Characteristics This section provides the AC and DC electrical specifications and thermal characteristics for the PC8245. This section covers ratings, conditions, and other characteristics. The tables in this section describe the PC8245 DC electrical characteristics. Following table provides the absolute maximum ratings. Absolute Maximum Ratings Symbol VDD GVDD OVDD AVDD/AVDD2 LVDD VIN TSTG Notes: Characteristic(1) Supply Voltage – CPU Core and Peripheral Logic Supply Voltage – Memory Bus Drivers Supply Voltage – PCI and Standard I/O Buffers Supply Voltage – PLLs Supply Voltage – PCI Reference Input Voltage (2) Absolute Maximum Ratings Value -0.3 to 2.1 -0.3 to 3.6 -0.3 to 3.6 -0.3 to 2.1 -0.3 to 5.4 -0.3 to 3.6 -65 to 150 Unit V V V V V V °C Storage Temperature Range 1. Functional and tested operating conditions are given in Table. Absolute maximum ratings are stress ratings only and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause permanent damage to the device. 2. PCI inputs with LVDD = 5V ± 5% V DC may be correspondingly stressed at voltages exceeding LVDD + 0.5V DC. 11 2171D–HIREL–06/04 Recommended Operating Conditions Characteristic(1)(6) Supply Voltage Following table provides the recommended operating conditions for the PC8245. Recommended Operating Conditions Symbol VDD OVDD GVDD AVDD AVDD2 LVDD Recommended Value 2.0 ± 100 mV 3.3 ± 0.3 3.3 ± 5 % 2.0 ± 100 mV 2.0 ± 100 mV 5.0 ± 5 % PCI Reference 3.3 ± 0.3 PCI Inputs VIN Tc Notes: Input Voltage All Other Inputs Tcase 0 to 3.6 -55 to 125 V °C 0 to 3.6 or 5.75 V V Unit V V V V V V Notes (5) (5) (7) (5) (5) (2)(8)(9) (3)(8)(9) (2)(3) (4) I/O Buffer supply for PCI and Standard Supply Voltages for Memory Bus Drivers CPU PLL Supply Voltage PLL Supply Voltage – Peripheral Logic 1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions is not guaranteed. 2. PCI pins are designed to withstand LVDD + 0.5V DC when LVDD is connected to a 5.0V DC power supply. 3. PCI pins are designed to withstand LVDD + 0.5V DC when LVDD is connected to a 3.3V DC power supply. 4. Caution: Input voltage (VIN) must not be greater than the supply voltage (VDD/AVDD/AVDD2) by more than 2.5V at all times including during power-on reset. Input voltage (VIN) must not be greater than GVDD/OVDD by more than 0.6V at all times including during power-on reset. 5. Caution: OVDD must not exceed VDD/AVDD/AVDD2 by more than 1.8V at any time including during power-on reset. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 6. Caution: VDD/AVDD/AVDD2 must not exceed OVDD by more than 0.6V at any time including during power-on reset. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 7. Caution: GVDD must not exceed VDD/AVDD/AVDD2 by more than 1.8V at any time including during power-on reset. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 8. Caution: LVDD must not exceed VDD/AVDD/AVDD2 by more than 5.4V at any time including during power-on reset. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 9. Caution: LVDD must not exceed OVDD by more than 3.0V at any time including during power-on reset. This limit may be exceeded for a maximum of 20 ms during power-on reset and power-down sequences. 12 PC8245 2171D–HIREL–06/04 PC8245 Figure 2 shows supply voltage sequencing and separation cautions. Figure 2. Supply Voltage Sequencing and Separation Cautions DC Power Supply Voltage 5V 10 9 LVdd at 5V See Note (1) 3.3V 2.0V 7 10 9 6.8 GVdd_OVdd/(LVdd at 3.3V ----) Vdd/AVdd/AVdd2 Vdd Stable 100 µs PLL Relock Time (3) 0 Voltage Regulator Delay (2) HRST_CPU & HRST_CTRL asserted 255 external memory Clock cycles (3) Time Power Supply Ramp Up (2) Reset Configuration Pins 9 external memory clock cycles setup time (4) HRST_CPU, HRST_CTRL Maximum rise time must be less than one external memory clock cycle (5) VM = 1.4V Notes: 1. Numbers associated with waveform separations correspond to caution numbers listed in Table “Recommended Operating Conditions” on page 12. 2. Refer to section for additional information. 3. Refer to Table 7 on page 25 for additional information on PLL Relock and reset signal assertion timing requirements. 4. Refer to Table 9 on page 31 for additional information on reset configuration pin setup timing requirements. 5. HRST_CPU/HRST_CTRL must transition from a logic 0 to a logic 1 in less than one SDRAM_SYNC_IN clock cycle for the device to be in the non-reset state. 13 2171D–HIREL–06/04 Figure 3 shows the undershoot and overshoot voltage of the memory interface of the PC8245. Figure 3. Overshoot/Undershoot Voltage 4V GVdd_OVvdd + 5% VIH GVdd_OVdd VIL GND/GNDRING GND/GNDRING - 0.3V GND/GNDRING Q - 1.0V Not to exceed 10% of tSDRAM_CLK Thermal Characteristics Table 2 provides the package thermal characteristics for the PC8245. For further information, see Section “Thermal Management Information” on page 15. Table 2. Thermal Characterization Data Symbol RθJA RθJMA RθJMA RθJMA RθJB RθJC ΨJT Notes: Characteristic Junction-to-ambient natural convection (Single-layer board—1s) (1)(2) Value 16.1 12.0 11.6 9.0 4.8 1.8 (6) Unit °C/W °C/W °C/W °C/W °C/W °C/W °C/W Junction-to-ambient natural convection (Four-layer board—2s2p)(1)(3) Junction-to-ambient (at 200 ft/min) (Single-layer board—1s) (1)(3) (1)(3) Junction-to-ambient (at 200 ft/min)(Four layer board—2s2p) Junction-to-Board (4) Junction-to-Case(5) Junction-to-package top (natural convection) 1.0 1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance. 2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal. 3. Per JEDEC JESD51-6 with the board horizontal. 4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. 5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate used for case temperature. 6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as PsiJT. 14 PC8245 2171D–HIREL–06/04 PC8245 Thermal Management Information This section provides thermal management information for the tape ball grid array (TBGA) package for air-cooled applications. Depending on the application environment and the operating frequency, heat sinks may be required to maintain junction temperature within specifications. Proper thermal control design is primarily dependent upon the system-level design: the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat sinks may be attached to the package by several methods: adhesive, spring clip to holes in the printed-circuit board or package, or mounting clip and screw assembly; see Figure 4. Figure 4. Package Exploded Cross-Sectional View with Several Heat Sink Options Heat Sink Heat Sink Clip Adhesive or Thermal Interface Material Die TBGA Package Printed-Circuit Board Option Figure 5 depicts the die junction-to-ambient thermal resistance for four typical cases: • • • A heat sink is not attached to the TBGA package and there exists a high board-level thermal loading from adjacent components. A heat sink is not attached to the TBGA package and there exists a low board-level thermal loading from adjacent components. A heat sink (for example, ChipCoolers #HTS255-P) is attached to the TBGA package and there exists high board-level thermal loading from adjacent components. A heat sink (for example, ChipCoolers #HTS255-P) is attached to the TBGA package and there exists low board-level thermal loading from adjacent components. • 15 2171D–HIREL–06/04 Figure 5. Die Junction-to-Ambient Resistance 18 Die Junction-to-Ambient Thermal Resistance (°C/W) No heat sink and high thermal board-level loading of adjacent components No heat sink and low thermal board-level loading of adjacent components Attached heat sink and high thermal board-level loading of adjacent components Attached heat sink and low thermal board-level loading of adjacent components 16 14 12 10 8 6 4 2 0 0.5 1 1.5 2 2.5 Airflow Velocity (m/s) 16 PC8245 2171D–HIREL–06/04 PC8245 The board designer can choose between several types of heat sinks to place on the PC8245. There are several commercially available heat sinks for the PC8245 provided by the following vendors: Aavid Thermalloy 80 Commercial St. Concord, NH 03301 Internet: www.aavidthermalloy.com Alpha Novatech 473 Sapena Ct. #15 Santa Clara, CA 95054 Internet: www.alphanovatech.com The Bergquist Company 603-224-9988 408-749-7601 800-347-4572 18930 West 78th St. Chanhassen, MN 55317 Internet: www.bergquistcompany.com International Electronic Research Corporation (IERC) 413 North Moss St. Burbank, CA 91502 Internet: www.ctscorp.com Tyco Electronics Chip Coolers™ P.O. Box 3668 Harrisburg, PA 17105-3668 Internet: www.chipcoolers.com Wakefield Engineering 33 Bridge St. Pelham, NH 03076 Internet: www.wakefield.com 818-842-7277 800-522-6752 603-635-5102 Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Other heat sinks offered by Aavid Thermalloy, Alpha Novatech, The Bergquist Company, IERC, Chip Coolers, and Wakefield Engineering offer different heat sink-to-ambient thermal resistances, and may or may not need airflow. 17 2171D–HIREL–06/04 Internal Package Conduction Resistance For the TBGA, cavity down, packaging technology, shown in Figure 6 , the intrinsic conduction thermal resistance paths are as follows: • • the die junction-to-case thermal resistance, the die junction-to-ball thermal resistance. Figure 6 depicts the primary heat transfer path for a package with an attached heat sink mounted to a printed-circuit board. Figure 6. TBGA Package with Heat Sink Mounted to a Printed-Circuit Board External Re sistance Radiation Convection Heat Sink Thermal Interface Material Internal Resistance Mold Cap Die Junction Die/Substrate/C5 Solder Balls Printed-Circuit Board External Resistance Radiation Convection (Note the internal versus external package resistance) For this die-up, wire-bond TBGA package, heat generated on the active side of the chip is conducted mainly through the mold cap, the heat sink attach material (or thermal interface material), and finally through the heat sink where it is removed by forced-air convection. Adhesives and Thermal Interface Materials A thermal interface material is recommended between the top of the mold cap and the bottom of the heat sink to minimize the thermal contact resistance. For those applications where the heat sink is attached by spring clip mechanism, Figure 7 shows the thermal performance of three thin-sheet thermal-interface materials (silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure. As shown, the performance of these thermal interface materials improves with increasing contact pressure. The use of thermal grease significantly reduces the interface thermal resistance. That is, the bare joint results in a thermal resistance approximately seven times greater than the thermal grease joint. Heat sinks are attached to the package by means of a spring clip to holes in the printedcircuit board (see Figure 7). Therefore, the synthetic grease offers the best thermal performance, considering the low interface pressure. Of course, the selection of any thermal interface material depends on many factors: thermal performance requirements, manufacturability, service temperature, dielectric properties, cost, etc. 18 PC8245 2171D–HIREL–06/04 PC8245 Figure 7. Thermal Performance of Select Thermal Interface Material 2 Silicone Sheet (0.006 inch) Bare Joint Floroether Oil Sheet (0.007 inch) Graphite/Oil Sheet (0.005 inch) Synthetic Grease Specific Thermal Resistance (K-in.2/W) 1.5 1 0.5 0 0 10 20 30 40 50 60 70 80 Contact Pressure (PSI) 19 2171D–HIREL–06/04 The board designer can choose between several types of thermal interface. Heat sink adhesive materials should be selected based upon high conductivity, yet adequate mechanical strength to meet equipment shock/vibration requirements. There are several commercially-available thermal interfaces and adhesive materials provided by the following vendors: Chomerics, Inc. 77 Dragon Ct. Woburn, MA 01888-4014 Internet: www.chomerics.com Dow-Corning Corporation Dow-Corning Electronic Materials 2200 W. Salzburg Rd. Midland, MI 48686-0997 Internet: www.dow.com Shin-Etsu MicroSi, Inc. 10028 S. 51st St. Phoenix, AZ 85044 Internet: www.microsi.com Thermagon Inc. 4707 Detroit Ave. Cleveland, OH 44102 Internet: www.thermagon.com 781-935-4850 800-248-2481 888-642-7674 888-246-9050 Heat Sink Usage An estimation of the chip junction temperature, TJ, can be obtained from the equation: TJ = TA + (RθJA x PD) where TA = ambient temperature for the package (°C) RθJA = junction-to-ambient thermal resistance (°C/W) PD = power dissipation in the package (W) The junction-to-ambient thermal resistance is an industry-standard value that provides a quick and easy estimation of thermal performance. Unfortunately, two values are in common usage: the value determined on a single layer board and the value obtained on a board with two planes. For packages such as the TBGA, these values can be different by a factor of two. Which value is closer to the application depends on the power dissipated by other components on the board. The value obtained on a single layer board is appropriate for the tightly packed printed-circuit board. The value obtained on the board with the internal planes is usually appropriate if the board has low power dissipation and the components are well separated. When a heat sink is used, the thermal resistance is expressed as the sum of a junctionto-case thermal resistance and a case-to-ambient thermal resistance: RθJA = RθJC + RθCA where RθJA = junction-to-ambient thermal resistance (°C/W) RθJC = junction-to-case thermal resistance (°C/W) RθCA = case-to-ambient thermal resistance (°C/W) 20 PC8245 2171D–HIREL–06/04 PC8245 RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat sink, the air flow around the device, the interface material, the mounting arrangement on the printed-circuit board, or the thermal dissipation on the printed-circuit board surrounding the device. To determine the junction temperature of the device in the application when heat sinks are not used, the thermal characterization parameter (θJT) can be used to determine the junction temperature with a measurement of the temperature at the top center of the package case using the following equation: TJ = TT + (θJT x PD) where: TT = thermocouple temperature atop the package (°C) θJT = thermal characterization parameter (°C/W) PD = power dissipation in package (W) The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects of the thermocouple wire. When a heat sink is used, the junction temperature is determined from a thermocouple inserted at the interface between the case of the package and the interface material. A clearance slot or hole is normally required in the heat sink. Minimizing the size of the clearance is important to minimize the change in thermal performance caused by removing part of the thermal interface to the heat sink. Because of the experimental difficulties with this technique, many engineers measure the heat sink temperature and then back calculate the case temperature using a separate measurement of the thermal resistance of the interface. From this case temperature, the junction temperature is determined from the junction-tocase thermal resistance. In many cases, it is appropriate to simulate the system environment using a computational fluid dynamics thermal simulation tool. In such a tool, the simplest thermal model of a package which has demonstrated reasonable accuracy (about 20%) is a two-resistor model consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case covers the situation where a heat sink will be used or where a substantial amount of heat is dissipated from the top of the package. The junction-to-board thermal resistance describes the thermal performance when most of the heat is conducted to the printed-circuit board. References Semiconductor Equipment and Materials International 805 East Middlefield Rd. Mountain View, CA 94043 (415) 964-5111 MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or 303-397-7956. JEDEC specifications are available on the WEB at http://www.jedec.org. 21 2171D–HIREL–06/04 Power Characteristics Table 3. Power Consumption Table 3 provides power consumption data for the PC8245. PCI Bus Clock/Memory Bus Clock CPU Clock Frequency (MHz) Mode Typical Max – FP Max – INT Doze Nap Sleep 66/66/266 1.7 (1.5) 2.2 (1.9) 1.8 (1.6) 1.1 (1.0) 0.4 (0.4) 0.2 (0.2) 66/133/266 2.0 (1.8) 2.4 (2.1) 2.1 (1.8) 1.4 (1.3) 0.7 (0.7) 0.4 (0.4) 66/66/300 1.8 (1.7) 2.3 (2.)) 2.0 (1.8) 1.2 (1.1) 0.4 (0.4) 0.2 (0.4) 66/100/300 2.0 (1.8) 2.5 (2.2) 2.1 (1.8) 1.4 (1.3) 0.6 (0.6) 0.3 (0.3) 33/83/333 2.0 2.6 2.2 1.4 66/133/333 2.3 2.8 2.4 1.6 0.7 0.4 Unit W W W W W W Notes (1)(5) (1)(2) (1)(3) (1)(4)(6) 0.5 0.3 (1)(4)(6) (1)(4)(6) I/O Power Supplies(10) Mode Typ – OVDD Typ – GVDD Notes: Minimum 134 (121) 324 (292) Maximum 334 (301) 800 (720) Unit mW mW Notes (7)(8) (7)(9) 1. The values include VDD, AVDD, and AVDD2 but do not include I/O supply power, see Section “Power Supply Sizing” on page 49, for information on OVDD and GVDD supply power. Values shown in parenthesis ( ) indicate power consumption at VDD/AVDD/AVDD2 = 1.8V 2. Maximum – FP power is measured at VDD = 2.1V with dynamic power management enabled while running an entirely cacheresident, looping, floating-point multiplication instruction. 3. Maximum – INT power is measured at VDD = 2.1V with dynamic power management enabled while running entirely cacheresident, looping, integer instructions. 4. Power saving mode maximums are measured at VDD = 2.1V while the device is in doze, nap, or sleep mode. 5. Typical power is measured at VDD = AVDD = 2.0V, OVDD = 3.3V where a nominal FP value, a nominal INT value, and a value where there is a continuous flush of cache lines with alternating ones and zeros on 64-bit boundaries to local memory are averaged. 6. Power saving mode data measured with only two PCI_CLKs and two SDRAM_CLKs enabled 7. The typical minimum I/O power values were results of the PC8245 performing cache resident integer operations at the slowest frequency combination of 33:66:200 (PCI:Mem:CPU) MHz 8. The typical maximum OVDD value resulted from the PC8245 operating at the fastest frequency combination of 66:100:350 (PCI:Mem:CPU) MHz and performing continuous flushes of cache lines with alternating ones and zeros to PCI memory. 9. The typical maximum GVDD value resulted from the PC8245 operating at the fastest frequency combination of 66:100:350 (PCI:Mem:CPU) MHz and performing continuous flushes of cache lines with alternating ones and zeros on 64-bit boundaries to local memory. 10. Power consumption of PLL supply pins (AVDD and AVDD2) < 15 mW. Guaranteed by design and is not tested. 22 PC8245 2171D–HIREL–06/04 PC8245 DC Electrical Characteristics Static Characteristics Table 4 provides the DC electrical characteristics for the PC8245 at recommended operating conditions (see Table “Recommended Operating Conditions” on page 12). Table 4. DC Electrical Specifications Value Characteristics Input High Voltage Input Low Voltage Input High Voltage Input Low Voltage PCI_SYNC_IN Input High Voltage PCI_SYNC_IN Input Low Voltage Input Leakage Current using DRV_PCI driver (4) (1) Conditions(3) PCI only PCI only All other pins (GVDD = 3.3V) All inputs except PC_SYNC_IN Symbol VIH VIL VIH VIL CVIH CVIL Min 0.65 x OVDD – 2.0 GND 2.4 GND – – 2.4 – – Max LVDD 0.3 x OVDD 3.3 0.8 – 0.4 ±70 ±10 – 0.4 7.0 Unit V V V V V V µA µA V V pF for pins 0.5V ≤ VIN ≤ 2.7V at LVDD = 4.75 LVDD = 3.6V GVDD ≤ 3.465 IOH = Driver Dependent(2) (GVDD = 3.3V) IOL = Driver Dependent(2) (GVDD = 3.3V) VIN = 0V, f = 1 MHz IL IL VOH VOL CIN Input Leakage Current(4) All others Output High Voltage Output Low Voltage Capacitance(2) Notes: 1. See Table 1 on page 6 for pins with internal pull-up resistors. 2. See Table 5 on page 24 for the typical drive capability of a specific signal pin based on the type of output driver associated with that pin as listed in Table 1 on page 6. 3. These specifications are for the default driver strengths indicated in Table 5 on page 24. 4. Leakage current is measured on input and output pins in the high-impedance state. The leakage current is measured for nominal OVDD/LVDD and VDD or both OVDD/LVDD and VDD must vary in the same direction. 23 2171D–HIREL–06/04 Output Driver Characteristic Table 5 on page 24 provides information on the characteristics of the output drivers referenced in Table 1 on page 6. The values are preliminary estimates from an IBIS model and are not tested. Table 5. Drive Capability of PC8245 Output Pins(5) Driver Type DRV_STD_MEM 40 (default) 20 DRV_PCI 40 (default) DRV_MEM_CTRL DRV_PCI_CLK DRV_MEM_CLK Notes: 1. 6 (default) 20 GVDD = 3.3V 6.1 89.0 36.6 6.3 42.3 18.0 mA mA mA OVDD = 3.3V 18.6 12.0 9.2 12.4 mA mA Programmable Output Impedance (Ω) 20 Supply Voltage (V) IOH 36.6 IOL 18.0 Unit mA Notes (2)(4)(6) (2)(4)(6) (1)(3) (1)(3) (2)(4) (2)(4) 2. 3. 4. 5. 6. (2)(4) 40 18.6 9.2 mA For DRV_PCI, IOH read from the IBIS listing in the pull-up mode, I(Min) column, at the 0.33V label by interpolating between the 0.3V and 0.4V table entries’ current values which corresponds to the PCI VOH = 2.97 = 0.9 × OVDD (OVDD = 3.3V) where table entry voltage = OVDD – PCI VOH. For all others with GVDD or OVDD = 3.3V, IOH read from the IBIS listing in the pull-up mode, I(Min) column, at the 0.9V table entry which corresponds to the VOH = 2.4V where table entry voltage = GVDD/OVDD – VOH. For DRV_PCI, IOL read from the IBIS listing in the pull-down mode, I(Min) column, at 0.33V = PCI VOL = 0 × OVDD (OVDD = 3.3V) by interpolating between the 0.3V and 0.4V table entries. For all others with GVDD or OVDD = 3.3V, IOL read from the IBIS listing in the pull-down mode, I(Min) column, at the 0.4V table entry. See driver bit details for output driver control register (0x72) in the "MPC8245 Integrated Processor User’s Manual". See Chip Errata No. 19 in the PC8245/PC8241 RISC Microprocessor Chip Errata’s Motorola. AC Electrical Characteristics This section provides the AC electrical characteristics for the PC8245. After fabrication, functional parts are sorted by maximum processor core frequency as shown in Table 6 and tested for conformance to the AC specifications for that frequency. The processor core frequency is determined by the bus (PCI_SYNC_IN) clock frequency and the settings of the PLL_CFG[0:4] signals. Parts are sold by maximum processor core frequency. See “Ordering Information” on page 56. Table 7 provides the operating frequency information for the PC8245 at recommended operating conditions (see Table “Recommended Operating Conditions” on page 12) with LVDD = 3.3V ± 0.3V. 24 PC8245 2171D–HIREL–06/04 PC8245 Table 6. Operating Frequency 266 MHz Characteristic (2) 300 MHz 333 MHz 350 MHz Unit MHz MHz VDD/AVDD/AVDD2 = 2.0 ± 100 mV 100 – 266 50 – 133 100 – 300 50 – 100(3) VDD/AVDD/AVDD2 = 2.0 ± 100 mV 100 – 333 50 – 133 100 – 350 50 – 100(3) Processor Frequency (CPU) Memory Bus Frequency PCI Input Frequency 25 – 66 MHz Notes: 1. Caution: The PCI_SYNC_IN frequency and PLL_CFG[0:4] settings must be chosen such that the resulting peripheral logic/memory bus frequency and CPU (core) frequencies do not exceed their respective maximum or minimum operating frequencies. Refer to the PLL_CFG[0:4] signal description in Section “PLL Configuration” on page 45 for valid PLL_CFG[0:4] settings and PCI_SYNC_IN frequencies. 2. See Table 16 on page 45 and Table 17 on page 47 for more details on VCO limitations for memory and CPU VCO frequencies of various PLL configurations. 3. There are no available PLL_CFG[0:4] settings which support 133 MHz memory interface operation at 300 MHz CPU and at 350 MHz operation, since the multipliers do not allow a 300:133 and 350:133 ratio relation. However, running these parts are slower speeds may produce ratios that will run above 100 MHz. See Table 16 on page 45 for the PLL settings. Clock AC Specifications Table 7 provides the Clock AC timing specifications at recommended operating conditions, as defined in Section “Input AC Timing Specifications” on page 31. These specifications are for the default driver strengths indicated in Table 5 on page 24. At recommended operating conditions (see Table “Recommended Operating Conditions” on page 12) with LVDD = 3.3V ± 0.3V Table 7. Clock AC Timing Specifications Num 1a 2, 3 4 5a 5b 7 8a 8b 10 15 Characteristics and Conditions Frequency of Operation (PCI_SYNC_IN) PCI_SYNC_IN Rise and Fall Times PCI_SYNC_IN Duty Cycle Measured at 1.4V PCI_SYNC_IN Pulse Width High Measured at 1.4V PCI_SYNC_IN Pulse Width Low Measured at 1.4V PCI_SYNC_IN Jitter PCI_CLK[0:4] Skew (Pin-to-Pin) SDRAM_CLK[0:3] Skew (Pin-to-Pin) Internal PLL Relock Time DLL Lock Range with DLL_EXTEND = 0 Disabled (Default) Min 25 – 40 6 6 – – – – Max 66 2.0 60 9 9 150 250 190 100 Unit MHz ns % ns ns ps ps ps µs ns (3) (2)(4)(5) (2) (2) (1) Notes (N x TCLK – Tdp(max)) ≤ Tloop ≤ (N x TCLK – Tdp(min)) ((N – 0.5) x TCLK – Tdp(max)) ≤ Tloop ≤ ((N – 0.5) TCLK – Tdp(min)) 25 – 40 – 66 5 60 100 (6) 16 17 19 20 21 Notes: DLL Lock Range with DLL_EXTEND = 1 Enabled Frequency of Operation (OSC_IN) OSC_IN Rise and Fall Times OSC_IN Duty Cycle Measured at 1.4V OSC_IN Frequency Stability ns MHz ns % ppm (6) (7) 1. Rise and fall times for the PCI_SYNC_IN input are measured from 0.4 to 2.4V. 25 2171D–HIREL–06/04 2. Specification value at maximum frequency of operation. 3. Pin-to-pin skew includes quantifying the additional amount of clock skew (or jitter) from the DLL besides any intentional skew added to the clocking signals from the variable length DLL synchronization feedback loop, that is, the amount of variance between the internal sys_logic_clk and the SDRAM_SYNC_IN signal after the DLL is locked. While pin-to-pin skew between SDRAM_CLKs can be measured, the relationship between the internal sys_logic_clk and the external SDRAM_SYNC_IN cannot be measured and is guaranteed by design. 4. Relock time is guaranteed by design and characterization. Relock time is not tested. 5. Relock timing is guaranteed by design. PLL-relock time is the maximum amount of time required for PLL lock after a stable VDD and PCI_SYNC_IN are reached during the reset sequence. This specification also applies when the PLL has been disabled and subsequently re-enabled during sleep mode. Also note that HRST_CPU/HRST_CTRL must be held asserted for a minimum of 255 bus clocks after the PLL-relock time during the reset sequence. 6. DLL_EXTEND is bit 7 of the PMC2 register . N is a non-zero integer (1 or 2). TCLK is the period of one SDRAM_SYNC_OUT clock cycle in ns. Tloop is the propagation delay of the DLL synchronization feedback loop (PC board runner) from SDRAM_SYNC_OUT to SDRAM_SYNC_IN in ns; 6.25 inches of loop length (unloaded PC board runner) corresponds to approximately 1 ns of delay. Tfix0 is a fixed delay inherent in the design when the DLL is at tap point 0 and the DLL is contributing no delay; Tfix0 equals approximately 3 ns. See Figure 9 through Figure 12 for DLL locking ranges. 7. Rise and fall times for the OSC_IN input is guaranteed by design and characterization. OSC_IN input rise and fall times are not tested. Figure 8. PCI_SYNC-IN Input Clock Timing Diagram 1 5a 5b 2 3 CVIH PCI_SYNC_IN VM VM VM CVIL VM = Midpoint Voltage (1.4V) Table 8. Tdp(max) and Tdp(min) Mode Normal tap delay: Bit 2 (DLL_MAX_DELAY) at offset 0 x 76 is cleared Maximum tap delay: Bit 2 (DLL_MAX_DELAY) at offset 0 x 76 is set Tdp (min) 7.58 8.28 Tdp (max) 12.97 17.57 Unit ns ns Figure 9 through Figure 12 show the DLL locking range loop delay vs. frequency of operation.These graphs define the areas of DLL locking for various modes. The grey areas represent where the DLL will lock. Note also that the DLL_MAX_DELAY bit can lengthen the amount of time through the delay line. This is accomplished by increasing the time between each of the 128 tap points in the delay line. Although this increased time makes it easier to guarantee that the reference clock will be within the DLL lock range, it also means there may be slightly more jitter in the output clock of the DLL, should the phase comparator shift the clock between adjacent tap points. 26 PC8245 2171D–HIREL–06/04 PC8245 Figure 9. DLL Locking Range Loop Delay vs. Frequency of Operation for DLL_Extend = 1 and Normal Tap Delay 30 27.5 N=1 25 22.5 Tclk SDRAM_OUT Period (ns) 20 17.5 15 12.5 10 N=2 7.5 0 1 2 3 4 Tloop Propagation Delay Time (ns) 27 2171D–HIREL–06/04 Figure 10. DLL Locking Range Loop Delay vs. Frequency of Operation for DLL_Extend = 1 and Tap Max Delay 30 27.5 N=1 25 22.5 Tclk SDRAM_OUT Period (ns) 20 17.5 15 12.5 10 N=2 7.5 0 1 2 3 4 Tloop Propagation Delay Time (ns) 28 PC8245 2171D–HIREL–06/04 PC8245 Figure 11. DLL Locking Range Loop Delay vs. Frequency of Operation for DLL_Extend = 0 and Normal Tap Delay 25 22.5 Tclk SDRAM_OUT Period (ns) 20 17.5 15 N=1 12.5 10 N=2 7.5 0 1 2 Tloop Propagation Delay Time (ns) 3 4 29 2171D–HIREL–06/04 Figure 12. DLL Locking Range Loop Delay vs. Frequency of Operation for DLL_Extend = 0 and Normal Tap Delay 25 22.5 Tclk SDRAM_OUT Period (ns) 20 N=1 17.5 15 12.5 10 N=2 7.5 0 1 2 Tloop Propagation Delay Time (ns) 3 4 30 PC8245 2171D–HIREL–06/04 PC8245 Input AC Timing Specifications Table 9 provides the input AC timing specifications at recommended operating conditions (see Table “Recommended Operating Conditions” on page 12) with LVDD = 3.3V ± 0.3V. See Figure 13 and Figure 14. Table 9. Input AC Timing Specifications Num 10a 10b 10b0 10b1 10b2 10b3 10c 10d 10e 11 11a 11a0 11a1 11a2 11a3 11b 11c Notes: Characteristic PCI Input Signals Valid to PCI_SYNC_IN (Input Setup) Memory Input Signals Valid to SDRAM_SYNC_IN (Input Setup) Tap 0, Register Offset , Bits 5:4 = 0b10 Tap 1, Register Offset , Bits 5:4 = 0b11 Tap 2, Register Offset , Bits 5:4 = 0b00 (Default) Tap 3, Register Offset , Bits 5:4 = 0b01 Epic, Misc. Debug Input Signals Valid to SDRAM_SYNC_IN (Input Setup) 2.6 1.9 1.2 0.5 3.0 3.0 9 x TCLK 0.65 – – ns – – – – – 1.0 ns ns ns ns (2)(3) (2)(3) (2)(3)(4)(5) (7) (2)(3)(6) Min 3.0 Max – Unit ns Notes (1)(3) Two-wire interface Input Signals Valid to SDRAM_SYNC_IN (Input Setup) Mode Select Inputs Valid to HRST_CPU/HRST_CTRL (Input Setup) Tos – SDRAM_SYNC_IN to sys_logic_clk offset time SDRAM_SYNC_IN to Memory Signal Inputs Invalid (Input Hold) Tap 0, Register Offset , Bits 5:4 = 0b10 Tap 1, Register Offset , Bits 5:4 = 0b11 Tap 2, Register Offset , Bits 5:4 = 0b00 (Default) Tap 3, Register Offset , Bits 5:4 = 0b01 HRST_CPU/HRST_CTRL to Mode Select Inputs Invalid (Input Hold) PCI_SYNC_IN to Inputs Invalid (Input Hold) 0 0.7 1.4 2.1 0 1.0 – – ns – – – – ns ns (2)(3)(5) (1)(2)(3) (2)(3)(6) 1. All PCI signals are measured from OVDD/2 of the rising edge of PCI_SYNC_IN to 0.4 x OVDD of the signal in question for 3.3V PCI signaling levels. See Figure 14. 2. All memory and related interface input signal specifications are measured from the TTL level (0.8 or 2.0V) of the signal in question to the VM = 1.4V of the rising edge of the memory bus clock, SDRAM_SYNC_IN. SDRAM_SYNC_IN is the same as PCI_SYNC_IN in 1:1 mode, but is twice the frequency in 2:1 mode (processor/memory bus clock rising edges occur on every rising and falling edge of PCI_SYNC_IN). See Figure 13. 3. Input timings are measured at the pin. 4. TCLK is the time of one SDRAM_SYNC_IN clock cycle. 5. All mode select input signals specifications are measured from the TTL level (0.8 or 2.0V) of the signal in question to the VM = 1.4V of the rising edge of the HRST_CPU/HRST_CTRL signal. See Figure 15. 6. The memory interface input setup and hold times are programmable to four possible combinations by programming bits 5:4 of register offset to select the desired input setup and hold times. 7. Tos represents a timing adjustment for SDRAM_SYNC_IN with respect to sys_logic_clk. Due to the internal delay present on the SDRAM_SYNC_IN signal with respect to the sys_logic_clk inputs to the DLL, the resulting SDRAM clocks become offset by the delay amount. The feedback trace length of SDRAM_SYNC_OUT to SDRAM_SYNC_IN must be shortened by this amount relative to the SDRAM clock output trace lengths to maintain phase-alignment of the memory clocks with respect to sys_logic_clk. Note that the DLL locking range graphs of Figure 9 through Figure 12 compensate for Tos and there is no additional requirement to shorten Tloop by the duration of Tos. Refer to Motorola Application Note AN2164, MPC8245/MPC8241 Memory Clock Design Guidelines, for more details on accommodating for the problem of Tos and trace measurements in general. 31 2171D–HIREL–06/04 Figure 13. Input – Output Timing Diagram Referenced to SDRAM_SYNC_IN PCI_SYNC_IN VM sys_logic_clk Tos VM VM VM SDRAM_SYNC_IN (After DLL Locks if no compensation for Tos is made) Shown in 2:1 Mode 10b-d VM 11a 12b-d 13b 14b 2.0 V Memory Inputs/Outputs 0.8 V Input Timing 2.0 V 0.8 V Output Timing Notes: VM = midpoint voltage (1.4V). 11a = input hold time of SDRAM_SYNC_IN to memory. 12b-d = SDRAM_SYNC_IN to output valid timing. 13b = output hold time for non-PCI signals. 14b = SDRAM-SYNC_IN to output high-impedance timing for non-PCI signals. Tos = offset timing required to align sys_logic_clk with SDRAM_SYNC_IN. The SDRAM_SYNC_IN signal is adjusted by the DLL to accommodate for internal delay. This causes SDRAM_SYNC_IN to be seen before sys_logic_clk once the DLL locks, if no other accommodation is made for the delay. 10b-d = input signals valid timing. Figure 14. Input – Output Timing Diagram Referenced to PCI_SYNC_IN PCI_SYNC_IN OVdd/2 OVdd/2 OVdd/2 10a 12a 11c 13a 14a 0.615*OVdd 0.4*OVdd 0.285*OVdd PCI INPUTS/OUTPUTS Input Timing Output Timing 32 PC8245 2171D–HIREL–06/04 PC8245 Figure 15. Input Timing Diagram for Mode Select Signals HRST_CPU/HRST_CTRL VM 10e 11b 2.0V MODE PINS 0.8V VM = Midpoint Voltage (1.4V) Output AC Timing Specification Table 10 provides the processor bus AC timing specifications for the PC8245 at recommended operating conditions (see Table “Recommended Operating Conditions” on page 12) with LVDD = 3.3V ± 0.3V. See Figure 13 on page 32. All output timings assume a purely resistive 50Ω load (see Figure 16 on page 34). Output timings are measured at the pin; time-of-flight delays must be added for trace lengths, vias, and connectors in the system. These specifications are for the default driver strengths indicated in Table 5 on page 24. Table 10. Output AC Timing Specifications Num 12a 12a0 12a1 12a2 12a3 12b 12c 12d 12e 13a 13a0 13a1 13a2 13a3 13b 14a 14b Notes: Characteristics PCI_SYNC_IN to Output Valid, see Figure 17 on page 35 Tap 0, PCI_HOLD_DEL = 00, [MCP,CKE] = 11, 66 MHz PCI (Default) Tap 1, PCI_HOLD_DEL = 01, [MCP,CKE] = 10 Tap 2, PCI_HOLD_DEL = 10, [MCP,CKE] = 01, 33 MHz PCI Tap 3, PCI_HOLD_DEL = 11, [MCP,CKE] = 00 SDRAM_SYNC_IN to Output Valid (Memory Control and Data Signals) SDRAM_SYNC_IN to Output Valid (For All Others) SDRAM_SYNC_IN to Output Valid (For Two-wire interface) SDRAM_SYNC_IN to Output Valid (ROM/Flash/PortX) Output Hold (PCI), see Figure 17 Tap 0, PCI_HOLD_DEL = 00, [MCP,CKE] = 11, 66 MHz PCI (Default) Tap 1, PCI_HOLD_DEL = 01, [MCP,CKE] = 10 Tap 2, PCI_HOLD_DEL = 10, [MCP,CKE] = 01, 33 MHz PCI Tap 3, PCI_HOLD_DEL = 11, [MCP,CKE] = 00 Output Hold (All Others) PCI_SYNC_IN to Output High Impedance (For PCI) SDRAM_SYNC_IN to Output High Impedance (For All Others) 2.0 2.5 3.0 3.5 1.0 – – – – ns – – – 14.0 4.0 ns ns ns (2) (1)(3) (2) (1)(3)(4) Min Max Unit Notes – – – – – – – – 6.0 6.5 ns 7.0 7.5 4.5 7.0 5.0 6.0 ns ns ns ns (2) (2) (2) (2) (1)(3) 1. All PCI signals are measured from GVDD_OVDD/2 of the rising edge of PCI_SYNC_IN to 0.285 × OVDD or 0.615 × OVDD of the signal in question for 3.3V PCI signaling levels. See Figure 14 on page 32. 2. All memory and related interface output signal specifications are specified from the VM = 1.4V of the rising edge of the memory bus clock, SDRAM_SYNC_IN to the TTL level (0.8 or 2.0V) of the signal in question. SDRAM_SYNC_IN is the same as PCI_SYNC_IN in 1:1 mode, but is twice the frequency in 2:1 mode (processor/memory bus clock rising edges occur on every rising and falling edge of PCI_SYNC_IN). See Figure 13 on page 32. 33 2171D–HIREL–06/04 3. PCI bused signals are composed of the following signals: LOCK, IRDY, C/BE[3:0], PAR, TRDY, FRAME, STOP, DEVSEL, PERR, SERR, AD[31:0], REQ[4:0], GNT[4:0], IDSEL, INTA. 4. In order to meet minimum output hold specifications relative to PCI_SYNC_IN for both 33 and 66 MHz PCI systems, the PC8245 has a programmable output hold delay for PCI signals (the PCI_SYNC_IN to output valid timing is also affected). The initial value of the output hold delay is determined by the values on the MCP and CKE reset configuration signals; the values on these two signals are inverted then stored as the initial settings of PCI_HOLD_DEL = PMCR2[5:4] (power management configuration register 2 ), respectively. Since MCP and CKE have internal pull-up resistors, the default value of PCI_HOLD_DEL after reset is 0b00. Further output hold delay values are available by programming the PCI_HOLD_DEL value of the PMCR2 configuration register. See Figure 17 on page 35. Figure 16. AC Test Load for the PC8245 Output measurements are made at the device pin OUTPUT Z0 = 50Ω RL = 50Ω OVDD/2 for PCI OVDD/2 for Memory 34 PC8245 2171D–HIREL–06/04 PC8245 Figure 17. PCI_HOLD_DEL Affect on Output Valid and Hold Time PCI_SYNC_IN 12a, 8 ns for 33 MHz PCI PCI_HOLD_DEL = 10 0Vdd/2 0Vdd/2 13a, 2.1 ns for 33 MHz PCI PCI_HOLD_DEL = 10 PCI INPUTS/OUTPUTS 33 MHz PCI 12a0, 5.5 ns for 66 MHz PCI PCI_HOLD_DEL = 00 13a0, 1 ns for 66 MHz PCI PCI_HOLD_DEL = 00 PCI INPUTS/OUTPUTS 66 MHz PCI As PCI_HOLD_DEL values decrease PCI INPUTS and OUTPUTS As PCI_HOLD_DEL values increase OUTPUT VALID Note: Diagram not to scale OUTPUT HOLD 35 2171D–HIREL–06/04 I2C AC Timing Specifications Table 11 provides the I2C interface input AC timing specifications for the PC8245 at recommended operating conditions (see Table “Recommended Operating Conditions” on page 12) with LVDD = 3.3V ± 0.3V. Table 11. I2C interface Input AC Timing Specifications Number 1 Characteristics Start condition hold time Clock low period (time before the PC8245 will drive SCL low as a transmitting slave after detecting SCL low as driven by an external master.) SCL/SDA rise time (from 0.5V to 2.4V) Data hold time SCL/SDA fall time (from 2.4V to 0.5V) Clock high period (Time needed to either receive a data bit or generate a START or STOP.) Data setup time Start condition setup time (for repeated start condition only) Stop condition setup time Min 4.0 8.0 + (16 x 2FDR[4:2]) x (5 4({FDR[5],FDR[1]} == b’10) 3({FDR[5],FDR[1]} == b’11) 2({FDR[5],FDR[1]} == b’00) 1({FDR[5],FDR[1]} == b’01)) – 0 – 5.0 3.0 4.0 4.0 Max – Unit CLKs Notes (1)(2) 2 – CLKs (1)(2)(4)(5) 3 4 5 6 7 8 9 Notes: 1 – 1 – – – – ms ns ms CLKs ns CLKs CLKs (1)(2)(5) (2) (3) (1)(2) (1)(2) 1. Units for these specifications are in SDRAM_CLK units. 2. The actual values depend on the setting of the digital filter frequency sampling rate (DFFSR) bits in the frequency divider register I2CFDR. Therefore, the noted timings in the above table are all relative to qualified signals. The qualified SCL and SDA are delayed signals from what is seen in real time on the I2C interface bus. The qualified SCL, SDA signals are delayed by the SDRAM_CLK clock times DFFSR times 2 plus 1 SDRAM_CLK clock. The resulting delay value is added to the value in the table (where this note is referenced). See Figure 19 on page 39. 3. Timing is relative to the Sampling Clock (not SCL). 4. FDR[x] refers to the Frequency Divider Register I2CFDR bit x. 5. Input clock low and high periods in combination with the FDR value in the Frequency Divider Register (I2CFDR) determine the maximum I2C interface input frequency. See Table 12. 36 PC8245 2171D–HIREL–06/04 PC8245 Table 12 provides the I2C Interface Frequency Divider Register (I2CFDR) information for the PC8245. Table 12. PC8245 Maximum I2C Interface Input Frequency Max I2C Interface Input Frequency(1) FDR Hex(2) 20, 21 22, 23, 24, 25 0, 1 2, 3, 26, 27, 28, 29 4, 5 6, 7, 2A, 2B, 2C, 2D 8, 9 A, B, 2E, 2F, 30, 31 C, D E, F, 32, 33, 34, 35 10, 11 12, 13, 36, 37, 38, 39 14, 15 16, 17, 3A, 3B, 3C, 3D 18, 19 1A, 1B, 3E, 3F 1C, 1D 1E, 1F Notes: Divider (Dec)(2)(3) 160, 192 224, 256, 320, 384 288, 320 384, 448, 480, 512, 640, 768 576, 640 768, 896, 960, 1024, 1280, 1536 1152, 1280 1536, 1792, 1920, 2048, 2560, 3072 2304, 2560 3072, 3584, 3840, 4096, 5120, 6144 4608, 5120 6144, 7168, 7680, 8192, 10240, 12288 9216, 10240 12288, 14336, 15360, 16384, 20480, 24576 18432, 20480 24576, 28672, 30720, 32768 36864, 40960 49152, 61440 SDRAM_CLK at 33 MHz 1.13 MHz 733 540 428 302 234 160 122 83 62 42 31 21 16 10 8 5 4 SDRAM_CLK at 50 MHz 1.72 MHz 1.11 MHz 819 649 458 354 243 185 125 95 64 48 32 24 16 12 8 6 SDRAM_CLK at 100 MHz 3.44 MHz 2.22 MHz 1.63 MHz 1.29 MHz 917 709 487 371 251 190 128 96 64 48 32 24 16 12 SDRAM_CLK at 133 MHz 4.58 MHz 2.95 MHz16 2.18 MHz 1.72 MHz 1.22 MHz 943 648 494 335 253 170 128 85 64 43 32 21 16 1. Values are in kHz unless otherwise specified. 2. FDR Hex and Divider (Dec) values are listed in corresponding order. 3. Multiple Divider (Dec) values will generate the same input frequency, but each Divider (Dec) value will generate a unique output frequency as shown in Table 13. 37 2171D–HIREL–06/04 Table 13 provides the I2C interface output AC timing specifications for the PC8245 at recommended operating conditions (see Table “Recommended Operating Conditions” on page 12) with LVDD = 3.3V ± 0.3V. Table 13. I2C Interface Output AC Timing Specifications Number 1 2 3 Characteristics Start condition hold time Clock low period SCL/SDA rise time (from 0.5V to 2.4V) Min (FDR[5] == 0) x (DFDR/16)/2N + (FDR[5] == 1) x (DFDR/16)/2M DFDR/2 – 8.0 + (16 x 2FDR[4:2]) x (5 4({FDR[5],FDR[1]} == b’10) 3({FDR[5],FDR[1]} == b’11) 2({FDR[5],FDR[1]} == b’00) 1({FDR[5],FDR[1]} == b’01)) Max – – – Unit CLKs CLKs ms Notes (1)(2)(3) (1)(2)(3) (4) 4 Data hold time – CLKs (1)(2)(3) 5 6 7 8 9 Notes: SCL/SDA fall time (from 2.4V to 0.5V) Clock high time Data setup time (PC8245 as a master only) Start condition setup time (for repeated start condition only) Stop condition setup time DFDR/2 (DFDR/2) – (Output data hold time) DFDR + (Output start condition hold time) 4.0