ATS-51450K-C2-R0

Ultra High Performance BGA Cooling Solutions w/ maxiGRIP™ Attachment ATS PART # ATS-51450K-C2-R0 Features & Benefits » maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards Comes preassembled with high performance thermal interface material Designed for low profile components from 1.5 to 2.99mm C D » » B A » » thermal Performance AIR VELOCITy *Image above is for illustration purposes only. THERMAL RESISTANCE FT/MIN 200 300 400 500 600 700 800 M/S 1.0 1.5 2.0 2.5 3.0 3.5 4.0 °C/W (UNDUCTED FLOW) 2.1 1.6 1.4 1.2 1.1 1 1 °C/W (DUCTED FLOW) 1.5 Product Details DIMENSION A 45 mm Notes: 1) 2) 3) 4) 5) DIMENSION B 45 mm DIMENSION C 14.5 mm DIMENSION D 69.6 mm INTERFACE MATERIAL SAINT-GOBAIN C675 FINISH BLACK- ANODIZED Dimension C = heat sink height from bottom of the base to the top of the fin field. Thermal performance data are provided for reference only. Actual performance may vary by application. ATS reserves the right to update or change its products without notice to improve the design or performance. Optional maxiGRIP™ Installation/Removal Tool Set P/N: MGT450 Contact ATS to learn about custom options available. For more information, to find a distributor or to place an order, visit www.qats.com or call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe). REV1_0908