ATS-59002-C2-R0

Custom High Perfor mance Cooling Solutions w/ maxiGRIP™ Attachment ATS PART # ATS-59002-C2-R0 D Features & Benefits » » » Designed for flip-chip processors such as Freescale MPCs maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB Comes preassembled with high performance, phase changing, thermal interface material C B A Ther mal Perfor mance AIR VELOCITY *Image above is for illustration purposes only. THERMAL RESISTANCE FT/MIN 200 300 400 500 600 700 800 M/S 1.0 1.5 2.0 2.5 3.0 3.5 4.0 °C/W (UNDUCTED FLOW) 6.5 5 4.1 3.6 3.2 3 2.7 °C/W (DUCTED FLOW) 3.8 Product Details DIMENSION A 25 mm NOTES: 1) 2) 3) 4) 5) DIMENSION B 32 mm DIMENSION C 13 mm DIMENSION D 46.5 mm INTERFACE MATERIAL SAINT-GOBAIN C1100F FINISH BLACK-ANODIZED Dimension C = heat sink height from bottom of the base to the top of the fin field. ATS-59002-C1-R0 is a subsitute item available utilizing an equivalent phase change material (Chomerics T766). Thermal performance data are provided for reference only. Actual performance may vary by application. ATS reserves the right to update or change its products without notice to improve the design or performance. Contact ATS to learn about custom options available. For more infor mation, to find a distributor or to place an order, visit www.qats.com or call: 781.769.2800 (Nor th America); +31 (0) 3569 84715 (Europe). REV2_111108