High Performance BGA Cooling Solutions w/ superGRIP™ Attachment
ATS PART # ATS-X50425G-C1-R0
Features & Benefits
» » »
Designed for 42.5 x 42.5 mm BGA components requires minimal space around the component’s perimeter; ideal for densely populated PCBs Allows the heat sink to be detached and reattached without damaging the component or the PCB, an important feature in the event a PCB may need to be reworked Strong, uniform attachment force helps achieve maximum performance from phase-changing TIMs Eliminates the need to drill mounting holes in the PCB Assembly comes standard with a high performance maxiFLOW™ heat sink which maximizes convection (air) cooling Comes standard with clean break, reworkable, Chomerics T-766 phase change material
FT
» » »
W
»
L H
thermal Performance
AIR VELoCITy
*Image above is for illustration purposes only.
THERMAL RESISTANCE
FT/MIN
200 300 400 500 600 700 800
M/S
1.0 1.5 2.0 2.5 3.0 3.5 4.0
°C/W (UNDUCTED FLOW)
2.4 1.9 1.7 1.5 1.4 1.3 1.2
°C/W (DUCTED FLOW)
2
Product Details
LENGTH 42.5 mm
Notes:
1) 2) 3) 4) 5) 6) Length and width dimensions refer to the size of the component. Dimensions of the heat sink are subject to tolerances of up to .99 mm in order to accommodate the clip assembly Thermal performance data are provided for reference only. Actual performance may vary by application ATS reserves the right to update or change its products without notice to improve the design or performance Additional tooling fees may be required Typical lead time is a minimum of 4-6 weeks Contact ATS to learn about custom options available
WIDTH 42.5 mm
HEIGHT 12.5 mm
FIN TIP to FIN TIP 72.8 mm
INTERFACE MATERIAL
FINISH BLUE-ANODIZED
ChOMErICS T766
For more information, to find a distributor or to place an order, visit www.qats.com or call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).
REV0_042109
很抱歉,暂时无法提供与“ATS-X50425G-C1-R0”相匹配的价格&库存,您可以联系我们找货
免费人工找货