SG1316

Semiconductor SG1316 Chip LED Lamp Features • • • • 1.6mm(L)×0.8mm small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip LED Applications • • • • LCD backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp Outline Dimensions unit : mm KLG-0002-000 1 SG1316 Absolute maximum ratings Characteristic Power Dissipation Forward Current * Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature 2 1 Symbol PD IF IFP VR Topr Tstg Ratings 70 25 50 4 -25∼80 -30∼100 Unit mW mA mA V ℃ ℃ 240℃ for 5 seconds * Soldering Temperature Tsol *1.Duty ratio = 1/16, Pulse width = 0.1ms *2.Recommended soldering Temperature Profile 2-1) Preheating 100℃ to 150℃ within 2 minutes Soldering 240℃ within 5 seconds Gradual cooling (Avoid quenching) Electrical Characteristics Characteristic Forward Voltage Luminous Intensity Peak Wavelength Spectrum Bandwidth Reverse Current Half angle Symbol VF IV Test Condition IF= 20mA IF= 20mA IF= 20mA IF= 20mA VR=4V Min - Typ 2.1 3 557 30 ±65 ±70 Max 2.8 10 - Unit V mcd nm nm uA deg λP Δλ IR θ1/2 X Y IF= 20mA KLG-0002-000 2 Characteristic Diagrams Fig. 1 IF - VF Fig. 2 IV - IF SG1316 Forward Voltage VF [V] Luminous Intensity Iv [mcd] Forward Current IF [mA] Forward Current IF [mA] Fig. 3 IF – Ta Fig.4 Spectrum Distribution Current IF [mA] Forward Ambient Temperature Ta [℃] Relative Intensity [%] Wavelength λ [nm] Fig. 5-1 Radiation Diagram(X) Fig. 5-2 Radiation Diagram(Y) Relative Luminous Intensity Iv [%] Relative Luminous Intensity Iv [%] KLG-0002-000 3