AS3SSD8GB8PBG

AUSTIN SEMICONDUCTOR, INC. SOLID STA STATE DISK AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semiconductor, Inc. Solid State Disk On Chip (SSDoC) FEATURES • Capacities - 4 GB - 8 GB - 16 GB • PATA Compatibility - ATA-5 compatible - UDMA4 supported - PIO Mode 4 supported - MWDMA Mode 2 supported • Performance - Sustained Sequential Read Bandwidth:16 MB/s - Sustained Sequential Write Bandwidth: 5 MB/s • Form Factor - BGA Package • 31 mm (W) x 31 mm (L) x 4.2-7.8 mm (H) • Weighs approximately 11 grams (TYP) • Each NAND component, either a 4, 8 or 16Gb device, based on the use of single and stacked silicon solutions • ECC correction = 6 Bytes within a 512 Byte sector • Automatic sleep mode • Controller contained in base interposer • SLC (Single-Level Cell) NAND Flash • Reliability - Mean Time Between Failure (MTBF) >2,000,000 Hours (est.) - Program/Erase >1,000,000 Times (est.) - Temp Cycle 500/1000 cycles, JEDEC A104 Condition B -55ºC to +125ºC • Power Supply Voltage: 5.0V or 3.3 V ± 10% (TYP) • Power Consumption (Vcc = 5.0 V) - Idle: 10 mW (TYP) - Active: 255 mW (TYP) • Operating Temperature - Commercial: 0C to 70C - Industrial: -45C to 85C • Shock and Vibration - Shock: 1500G MIL-STD0810F - Vibration: 15 G RMS MIL-STD0810F • Compliances - Lead free - RoHS - Sn/Pb Ball Option OVERVIEW The solid state disk is based on a proprietary package stacking technology to create an extremely space conscious, robust Solid State Disk. The SSD is capable of operating in harsh, vibration prone product platforms such embedded computing applications, heavy transportation, ultra portables, handhelds, mobile computing, digital radio, high-speed networking & enterprise applications, as well as, military, aerospace and industrial applications. For more products and information please visit our web site at www.austinsemiconductor.com AS3SSD4GB8PBG, AS3SSD8GB8PBG, AS3SSD16GB5PBG Rev. 1.3 07/09 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 1 AUSTIN SEMICONDUCTOR, INC. SOLID STA STATE DISK AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semiconductor, Inc. KEY FEATURES • • • • • • • • • • • • • • NAND FLASH Controller (2) stacks, each containing (2 or 4) NAND components Each NAND component, either a 4,8 or 16Gb device, based on the use of single silicon and stacked silicon solutions Providing a total bit density of either 4,8 or 16GB Controller contained in base interposer Fast ATA host to buffer transfer rates supporting True IDE, PIO/4 mode support 512Byte Sector Buffers Flash Memory power-down logic ECC correction = 6 Bytes within a 512 Byte sector Automatic Sleep Mode Burst Transfer rate, 16.67MB per second Sustained Transfer rate: 6.7MB per second Sophisticated Wear Leveling ARCHITECTURE The PATA controller in the PATA Solid State Drive utilizes a 32-bit RISC architecture which provides for direct connection of one, two or four NAND flash memory devices (2 per channel). An on-chip error correction code (ECC) and cyclic redundancy check (CRC) unit generates the required code bytes facilitating error detection and correction of up to six bytes per 512 byte data sector. On the fly code byte generation for read and write operations minimizes ECC performance impacts. The controller’s flash memory interface allows the direct connection of up to 10 chips and support Samsung (NAND) type flash memory. ASI PATA Solid State Drives use single level cell (SLC) Samsung NAND Flash Memory devices. AS3SSD4GB8PBG, AS3SSD8GB8PBG, AS3SSD16GB5PBG Rev. 1.3 07/09 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 2 AUSTIN SEMICONDUCTOR, INC. SOLID STA STATE DISK AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semiconductor, Inc. BLOCK DIAGRAM 16 Gb Gb Dual enable NAND 16 Gb Gb Dual enable NAND 16 Gb Gb Dual enable NAND 16 Gb Gb Dual enable NAND Controller 16 Gb Dual enable NAND IDE Interface 16 Gb Dual enable NAND 16 Gb Dual enable NAND 16 Gb Dual enable NAND REGULATORY COMPLIANCE Since the PATA SSD is a component (or a set of components depending on the configuration) on the motherboard, system certifications are the responsibility of the OEM or ODM. DEVICE COMPLIANCE Compliance PB Free RoHS Description Components and materials are lead free. Restriction of Hazardous Substance Directive AS3SSD4GB8PBG, AS3SSD8GB8PBG, AS3SSD16GB5PBG Rev. 1.3 07/09 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 3 AUSTIN SEMICONDUCTOR, INC. SOLID STA STATE DISK AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semiconductor, Inc. PRODUCT SPECIFICATIONS Capacity and User Addressable Sectors Unformatted 4GB* 8GB* 16GB* User Addressable Sector in LBA mode 7,880,544 15,761,088 31,522,176 Note: Formatting and other functions will use some of the space, thus the listed capacity will not be available entirely for data storage. Read and Write Perfomance Operation READ WRITE Access Type Sustained Sequential Read Bandwidth Sustained Sequential Write Bandwidth MB/second 16 MB/second 5 MB/second OPERATING CONDITIONS Maximum Ratings Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not guaranteed. Exposure to absolute maximum rating conditions for extended periods may affect reliability. Absolute Maximum Ratings by Device Parameter Vcc supply voltage Non-Operation Temperature Symbol Vcc_P Ti Max. -0.5 -40 Min. +5.5 +85 Unit V o C AS3SSD4GB8PBG, AS3SSD8GB8PBG, AS3SSD16GB5PBG Rev. 1.3 07/09 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 4 AUSTIN SEMICONDUCTOR, INC. SOLID STA STATE DISK AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semiconductor, Inc. OPERATING CONDITIONS (continued) Recommended Operating Conditions Operating Temperature and Voltages Parameter Industrial: 0 C to +70 C Commercial: -40 C to +85 C Vcc supply voltage Ground supply voltage o o o o Symbol T0 T0 Tcc_P Tcc_P GndPLN Max. 0 0 4.5 3.0 0 Typ 5 3.3 0 Min. 70 70 5.5 3.6 0 Unit o o C C V V V DC Characteristics (PATA controller configuration) Symbol Paramenter VIL Input LOW Voltage VIH VOL VOH Input HIGH Voltage Output LOW Voltage Output HIGH Voltage Operating Current, VCC_R=5.0V ICC Sleep Mode Operating, 20 MHz Operating, 40 MHz Operating Current, VCC_R=3.3V ICC Sleep Mode Operating, 20 MHz ILI ILO CI/O Operating, 40 MHz Input Leakage Current Output Leakage Current Input / Output Capacitance 0.2 30 50 .02 30 50 ±10 ±10 10 mA mA mA m m m μA μA pF 2.4 Min. -0.3 2.2 Max. +0.8 Vcc+0.3 0.45 Units V V V V IOL=4mA IOH=-1mA Conditions AS3SSD4GB8PBG, AS3SSD8GB8PBG, AS3SSD16GB5PBG Rev. 1.3 07/09 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 5 AUSTIN SEMICONDUCTOR, INC. SOLID STA STATE DISK AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semiconductor, Inc. ELECTRICAL CHARACTERISTICS Power Consumption Setting Active Idle Current Active Current Active Power Idle Power Value 1.85mA 51mA 255mW 9.25mW ENVIRONMENTAL CONDITIONS Temperature Specifications Mode Ambient Temperature Operate - Commercial Operate - Industrial Max. 0 -40 Min. +70 +85 Unit o o C C Altitude Since there are no moving parts, this device is not susceptible to a lack of air molecules and will operate correctly to 85,000 feet above sea level. Shock and Vibration Characteristics Condition Operating Shock Operating Vibration Value 1500G MIL-STD-810F 15G RMS MIL-STD-810F AS3SSD4GB8PBG, AS3SSD8GB8PBG, AS3SSD16GB5PBG Rev. 1.3 07/09 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 6 AUSTIN SEMICONDUCTOR, INC. SOLID STA STATE DISK AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semiconductor, Inc. ENVIRONMENTAL CONDITIONS (continued) Acoustics This drive has no moving or noise-emitting parts; therefore, it produces negligible sound (0dB) in all modes of operation. Electrostatic Discharge (ESD) The PATA SSD can withstand an electrostatic discharge of +/- of 2 KV. ESD testing is done to demonstrate that the units can withstand discharge encountered in normal handling or operations of the equipment. Humidity Specifications Condition Operate non-condensing Value 5-95 Unit % Reliability Specifications Parameter Mean Time Between Failure (MTBF) Program / Erase Warranty Value >2,000,000 Hours (est.) >1,000,000 Time (est.) 2 Years AS3SSD4GB8PBG, AS3SSD8GB8PBG, AS3SSD16GB5PBG Rev. 1.3 07/09 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 7 AUSTIN SEMICONDUCTOR, INC. SOLID STA STATE DISK AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semiconductor, Inc. MECHANICAL INFORMATION PATA SSD (Top, Side and Bottom Views) o0.76 381 PLCS 1.27mm 0.61mm 7.41mm 1.27mm 29.21 SQ. 31.00 SQ. Stacks, each containing (2 or 4) NAND Components 4GB 8GB & 16GB 0.61mm 5.01mm (2)high + base 0.61mm 7.41mm AS3SSD4GB8PBG, AS3SSD8GB8PBG, AS3SSD16GB5PBG Rev. 1.3 07/09 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 8 AUSTIN SEMICONDUCTOR, INC. SOLID STA STATE DISK AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semiconductor, Inc. PIN ASSIGNMENTS AS3SSD4GB8PBG, AS3SSD8GB8PBG, AS3SSD16GB5PBG Rev. 1.3 07/09 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 9 AUSTIN SEMICONDUCTOR, INC. SOLID STA STATE DISK AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semiconductor, Inc. PIN ASSIGNMENTS (continued) N1 N2 N3 N4 N5 N6 N7 N8 N9 N10 N11 N12 N13 N14 N15 N16 N17 N18 N19 N20 N21 N22 N23 N24 Vcc_P Vcc_P Vcc_P IDE_D8 BLANK BLANK BLANK BLANK VccNAND_IN VccNAND_IN VccNAND_IN FC_WP_EN1 FC_WP_EN1 VccNAND_IN VccNAND_IN VccNAND_IN BLANK BLANK BLANK BLANK IDE_D3 FOUT FOUT FOUT P1 P2 P3 P4 P5 P6 P7 P8 P9 P10 P11 P12 P13 P14 P15 P16 P17 P18 P19 P20 P21 P22 P23 P24 IDE_D8 IDE_D8 IDE_D8 IDE_D2 BLANK BLANK BLANK BLANK VccNAND_IN VccNAND_IN GndPLN GndPLN GndPLN GndPLN VccNAND_IN VccNAND_IN BLANK BLANK BLANK BLANK FADJ FOUT FOUT FOUT R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 R15 R16 R17 R18 R19 R20 R21 R22 R23 R24 IDE_D2 IDE_D2 IDE_D2 IDE_D9 BLANK BLANK BLANK BLANK VccNAND_IN GndPLN GndPLN GndPLN GndPLN GndPLN GndPLN VccNAND_IN BLANK BLANK BLANK BLANK NC FADJ FADJ FADJ T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 T23 T24 IDE_D9 IDE_D9 IDE_D9 IDE_PIOIS16\ BLANK BLANK BLANK BLANK GndPLN GndPLN GndPLN GndPLN GndPLN GndPLN GndPLN GndPLN BLANK BLANK BLANK BLANK NC Vcc_R Vcc_R Vcc_R U1 U2 U3 U4 U5 U6 U7 U8 U9 U10 U11 U12 U13 U14 U15 U16 U17 U18 U19 U20 U21 U22 U23 U24 IDE_PIOIS16\ IDE_PIOIS16\ IDE_PIOIS16\ IDE_D10 BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK Vcc_R GndPLN GndPLN GndPLN V1 V2 V3 V4 V5 V6 V7 V8 V9 V10 V11 V12 V13 V14 V15 V16 V17 V18 V19 V20 V21 V22 V23 V24 IDE_D10 IDE_D10 IDE_D10 FC_WP_EN BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK CADJ Vcc_R Vcc_R Vcc_R W1 W2 W3 W4 W5 W6 W7 W8 W9 W10 W11 W12 W13 W14 W15 W16 W17 W18 W19 W20 W21 W22 W23 W24 FC_WP_EN FC_WP_EN FC_WP_EN NC BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK COUT CADJ CADJ CADJ Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 Y10 Y11 Y12 Y13 Y14 Y15 Y16 Y17 Y18 Y19 Y20 Y21 Y22 Y23 Y24 Vcc_F Vcc_F Vcc_F Vcc_F BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK BLANK Vcc_F COUT COUT COUT AA1 AA2 AA3 AA4 AA5 AA6 AA7 AA8 AA9 AA10 AA11 AA12 AA13 AA14 AA15 AA16 AA17 AA18 AA19 AA20 AA21 AA22 AA23 AA24 Vcc_F Vcc_F Vcc_F NC VccPLN_IN NC FOUT FOUT NC XTALI XTALC XTALR Vcc_C NC NC Vcc_F NC NC VccPLN_IN FC_RESET NC Vcc_F Vcc_F Vcc_F AB1 AB2 AB3 AB4 AB5 AB6 AB7 AB8 AB9 AB10 AB11 AB12 AB13 AB14 AB15 AB16 AB17 AB18 AB19 AB20 AB21 AB22 AB23 AB24 GndPLN GndPLN NC VccPLN_IN VccPLN_IN VccPLN_IN FOUT FOUT XTALI XTALC XTALR Vcc_C GndPLN Vcc_C Vcc_F GndPLN Vcc_F VccPLN_IN VccPLN_IN VccPLN_IN FC_RESET NC GndPLN GndPLN AC1 AC2 AC3 AC4 AC5 AC6 AC7 AC8 AC9 AC10 AC11 AC12 AC13 AC14 AC15 AC16 AC17 AC18 AC19 AC20 AC21 AC22 AC23 AC24 GndPLN GndPLN NC VccPLN_IN VccPLN_IN VccPLN_IN FOUT FOUT XTALI XTALC XTALR Vcc_C GndPLN Vcc_C Vcc_F GndPLN Vcc_F VccPLN_IN VccPLN_IN VccPLN_IN FC_RESET NC GndPLN GndPLN AD1 AD2 AD3 AD4 AD5 AD6 AD7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 AD16 AD17 AD18 AD19 AD20 AD21 AD22 AD23 AD24 GndPLN GndPLN NC VccPLN_IN VccPLN_IN VccPLN_IN FOUT FOUT XTALI XTALC XTALR Vcc_C GndPLN Vcc_C Vcc_F GndPLN Vcc_F VccPLN_IN VccPLN_IN VccPLN_IN FC_RESET NC GndPLN GndPLN AS3SSD4GB8PBG, AS3SSD8GB8PBG, AS3SSD16GB5PBG Rev. 1.3 07/09 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 10 AUSTIN SEMICONDUCTOR, INC. SOLID STA STATE DISK AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semiconductor, Inc. SIGNAL DESCRIPTIONS g Symbol IDE_A0 IDE_A1 IDE_A2 IDE_D0 IDE_D1 IDE_D2 IDE_D3 IDE_D4 IDE_D5 IDE_D6 IDE_D7 IDE_D8 IDE_D9 IDE_D10 IDE_D11 IDE_D12 IDE_D13 IDE_D14 IDE_D15 IDE_INTRQ Type Output Output Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Input/Output Output Description Address bus Data bus. The signals D15..D0 represent the bidirectional data bus; active high signals a "one". IDE_IOWR\ Input IDE_IORD\ IDE_CS0\ IDE_CS1\ IDE_PIOIS16\ IDE_PDIG Input Input Input Output Input/Output IDE_DMARQ IDE_DMARQ\ Output Drive interrupt request. I/O Data Write Enable is the strobe signal asserted by the host to write device registers or the data port. DIOW shall be negated by the host prior to the initiation of an Ultra DMA burst. STOP shall be negated by the host before the data is transferred in an Ultra DMA burst. The assertion of STOP by the host during an Ultra DMA burst signals the termination of the Ultra DMA burst. I/O Data Read Enable is the strobe signal asserted by the host to read device registers or the data port. Drive chip select 0 is used by host to select Command Block registers. Drive chip select 1 is used by host to select Command Block registers. 16-bit I/O transfer. Passed diagnostics. DMA request. This signal, used for DMA data transfers between host and device, shall be asserted by the device when it is ready to transfer data to or from the host. For multi word DMA transfers, the direction of data transfer is Controller by IDE_IORD\ and IDE_IOWR\. When a DMS operation is enabled, CS0\ and CS1\ shall not be asserted and transfers shall be 16 bits wide. This signal shall be release when the device is not selected. Ready signal to IDE_IORDY Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. FC_WAIT Output AS3SSD4GB8PBG, AS3SSD8GB8PBG, AS3SSD16GB5PBG Rev. 1.3 07/09 11 AUSTIN SEMICONDUCTOR, INC. SOLID STA STATE DISK AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semiconductor, Inc. IDE_PRESET FC_WP_EN FC_WP_EN1 Input Input Reset Write protect signal # Reset processor. RESET# low resets the processor to the initial state and halts all activity. RESET# must be low for at least one cycle. On a transition from low to high, a Reset exception occurs and the processor starts execution at the Reset entry determined by the INT4 state. The transition may occur asynchronously to the clock. We recommend connecting this pin to a voltage monitoring circuit with open-drain output (e.g. Torex XC61A) supplying a reset signal for supply voltages less than 2.6 or 2.7V, connected to a R/C combination of 100 kΩ and 100 nF giving an additional reset delay in the order of 10 ms. Operation LED signal Master/Slave select and connect to IDE_CSEL for Cable select option R/C Clock Oscillator Resistor Output. The resistor connected between this pin and XTALI determines the operating clock frequency. Use a 470Ω resistor to obtain a frequency of about 20 MHz R/C Clock Oscillator Capacitor Output. Connect a 22pF capacitor between this pin and XTALI. R/C Clock Oscillator Input. This input connects to the other side of the resisors and the capacitor connected to XTALR1, XTALR2 and XTALC. Connect a 22pF capacitor from this pin to ground. Not connected Power Supply Voltage, Core Power Supply Voltage, Regulator Power Supply Voltage, Flash Memory Power Supply Voltage, controller 3.3V Flash Memory Power Supply Adjustment. Connect a 270pF capacitor from this pin to FOUT. 3.3V Flash Memory Power Supply. This output provides a regulated 3.3V supply if the power supply voltage is above 3.3V. This supply voltage must also be connected to the VCC_F pins. 2.5V Core Power Supply Adjustment. Connect a 220kΩ resistor from this pin to GND, a 220kΩ resistor from this pin to COUT, and a 270pF capacitor from this pin to COUT. 2.5V Core Power Supply. This output provides a regulated 2.5V supply if the power supply voltage is above 3.3V. This supply voltage must be connected to the VCC_C pins. 3.3V Flash Memory Power Supply Supply to the controller Supply ground Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. FC_RESET Input FC_LED\ FC_MODE FC_IDEEN XTALR Output Output Output XTALC XTALI Output Input NC Vcc_C Vcc_R Vcc_F Vcc_P FADJ FOUT Supply Supply Supply Supply Input Output CADJ Input COUT Output VccNAND_IN VccPLN_IN GndPLN Supply Supply Supply AS3SSD4GB8PBG, AS3SSD8GB8PBG, AS3SSD16GB5PBG Rev. 1.3 07/09 12 AUSTIN SEMICONDUCTOR, INC. SOLID STA STATE DISK AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semiconductor, Inc. TYPICAL APPLICATION DESIGN AS3SSD4GB8PBG, AS3SSD8GB8PBG, AS3SSD16GB5PBG Rev. 1.3 07/09 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 13 AUSTIN SEMICONDUCTOR, INC. SOLID STA STATE DISK AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semiconductor, Inc. COMMAND SETS The PATA SSD device supports all the mandatory ATA commands as defined in the ATA/ATAPI-5 specification. ATA General Feature Command Set The PATA SSD device supports the ATA General Feature command set. Common Name EXECUTE DEVICE DIAGNOSTIC IDENTIFY DEVICE IDENTIFY DEVICE DMA INITIALI E DRIVE PARAMETERS NOP READ BUFFER READ DMA READ LONG READ MULTIPLE READ NATIVE MAX ADDRESS READ SECTOR(S) READ VERIFY SECTOR(S) RECALIBRATE SEEK SET FEATURES SET MULTIPLE MODE SMART TRANSLATE SECTOR WRITE BUFFER WRITE DMA WRITE LONG WRITE MULTIPLE WRITE MULTIPLE without ERASE WRITE SECTOR(S) WRITE SECTOR(S)without ERASE WRITE VERIFY Code 90h ECh EEh 91h 00h E4h C8h, C9h 22h, 23h C4h F8h 20h, 21h 40h, 41h 1Xh 7Xh EFh C6h B0h 87h E8h CAh, CBh 32h, 31h C5h CDh 30h, 31h 38h 3Ch AS3SSD4GB8PBG, AS3SSD8GB8PBG, AS3SSD16GB5PBG Rev. 1.3 07/09 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 14 AUSTIN SEMICONDUCTOR, INC. SOLID STA STATE DISK AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semiconductor, Inc. REFERENCE This document also references standards and specifications defined by a variety of organizations. Please use the following information to identify the location of an organization's standards information. Date or Revision Number February 2000 ATA 5 JEDEC Standard JESD22 C101C: Field Induced Charged Device Model Test Method for Electrostatic Discharge Withstand Thresholds of Microelectronic Components Hyperston F2 16x, 32 Bit Flash Memory Controller Specification JEDEC Standard: Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM) Title Location http://www.t13.org/Documents/ UploadedDocuments/project/d1321r3 ATAATAPI 5.pdf December 2004 http://www.jedec.org/download/search/ default2.cfm March 2006 http://www.hyperstone.com/fmc_f2_en,15593.html http://www.jedec.org/download/search/ default2.cfm January 2007 GLOSSARY This document incorporates many industry and device specific words. Use the following list to define a variety of terms and acronyms. y y Term ATA CFA CPRM CRC DMA ECC ESD HDD HPA IDE LBA MTBF MWDMA ODM OEM PATA PCMCIA PIO SATA SSD UMDA Definition Advanced Technology Attachment CompactFlash Association Content Protection for Recordable Media Cyclic Redundancy Check Direct Memory Access Error Correction Code Electrostatic Discharge Hard Disk Drive Host Protected Area Integrated Device Electronics Logical Block Addressing Mean Time Between Failure Multi-word DMA Original Design Manufacturer Original Equipment Manufacturer Parallel ATA Personal Computer Memory Card International Assocoation Programmable Input / Output Serial ATA Solid state drive Ultra DMA, also know Ultra ATA AS3SSD4GB8PBG, AS3SSD8GB8PBG, AS3SSD16GB5PBG Rev. 1.3 07/09 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 15 AUSTIN SEMICONDUCTOR, INC. SOLID STA STATE DISK AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semiconductor, Inc. ORDER CHART Part Number AS3SSD4GB8PBGR/IT AS3SSD8GB8PBGR/IT AS3SSD16GB5PBGR/IT AS3SSD4GB8PBGR/CT AS3SSD8GB8PBGR/CT AS3SSD16GB5PBGR/CT Available Processes CT = Commercial Temperature Range IT = Industrial Temperature Range R = RoHS Compliant / Lead Free Blank = Sn / Pb Finish Option o o 0 C to +70 C 40°C to +85°C Storage Density 4GB 8GB 16GB 4GB 8GB 16GB Sustained Transfer Rate 7.7MB/sec 7.7MB/sec 5.0MB/sec 7.7MB/sec 7.7MB/sec 5.0MB/sec AS3SSD4GB8PBG, AS3SSD8GB8PBG, AS3SSD16GB5PBG Rev. 1.3 07/09 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 16 AUSTIN SEMICONDUCTOR, INC. SOLID STA STATE DISK AS3SSD4GB8PBG AS3SSD8GB8PBG AS3SSD16GB5PBG PRELIMINARY Austin Semiconductor, Inc. DOCUMENT TITLE 4GB, 8GB, 16GB Solid State Disk on Chip REVISION HISTORY Rev # 1.0 1.1 1.2 1.3 History Initial Release Updated Mechanical Information Updated Order Chart Updated 4GB & 8GB Drawing Release Date December 2008 January 2009 March 2009 July 2009 Status Preliminary Preliminary Preliminary Preliminary AS3SSD4GB8PBG, AS3SSD8GB8PBG, AS3SSD16GB5PBG Rev. 1.3 07/09 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 17