AS8E128K32_05

EEPROM E EPROM Austin Semiconductor, Inc. 128K x 32 EEPROM EEPROM Memory Array AVAILABLE AS MILITARY SPECIFICATIONS • • • • • • • • • AS8E128K32 PIN ASSIGNMENT (Top View) 66 Lead PGA (Pins 8, 21, 28, 39 are no connects on the PN package) SMD 5962-94585 MIL-STD-883 Access times of 120, 140, 150, 200, 250, and 300 ns Built in decoupling caps for low noise operation Organized as 128K x32; User configurable as 256K x16 or 512K x8 Operation with single 5 volt supply Low power CMOS TTL Compatible Inputs and Outputs Operating Temperature Ranges: Military: -55oC to +125oC Industrial: -40oC to +85oC FEATURES 66 Lead PGA (Pins 8, 21, 28, 39 are grounds on the P package) OPTIONS • MARKINGS -120 -140 -150 -200 -250 -300 Q P PN No. 703 No. 904 No. 904 68 Lead CQFP 3 4 • Timing 120 ns 140 ns 150 ns 200 ns 250 ns 300 ns Package Ceramic Quad Flat pack Pin Grid Array- 8 Series Pin Grid Array- 8 Series GENERAL DESCRIPTION The Austin Semiconductor, Inc. AS8E128K32 is a 4 Megabit EEPROM Module organized as 128K x 32 bit. User configurable to 256K x16 or 512Kx 8. The module achieves high speed access, low power consumption and high reliability by employing advanced CMOS memory technology. The military grade product is manufactured in compliance to the SMD and MIL-STD 883, making the AS8E128K32 ideally suited for military or space applications. The module is offered in a 1.075 inch square ceramic pin grid array substrate. This package design provides the optimum space saving solution for boards that accept through hole packaging. The module is also offered as a 68 lead 0.990 inch square ceramic quad flat pack. It has a max. height of 0.200 inch. This package design is targeted for those applications which require low profile SMT Packaging. For more products and information please visit our web site at www.austinsemiconductor.com AS8E128K32 Rev. 7.6 06/05 Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. 1 EEPROM E EPROM Austin Semiconductor, Inc. DEVICE IDENTIFICATION An extra 128 bytes of EEPROM memory is available on each die for user identification. By raising A9 to 12V + 0.5V and using address locations 1FF80H to 1FFFFH the bytes may be written to or read from in the same manner as the regular memory array. AS8E128K32 of the last byte written will result in the complement of the written data to be presented on I/O7. Once the write cycle has been completed, true data is valid on all outputs, and the next write cycle may begin. DATA Polling may begin at anytime during the write cycle. TOGGLE BIT DEVICE OPERATION The 128K x 32 EEPROM memory solution is an electrically erasable and programmable memory module that is accessed like a Static RAM for the read or write cycle without the need for external components. The device contains a 128-byte-page register to allow writing of up to 128 bytes of data simultaneously. During a write cycle, the address and 1 to 128 bytes of data are internally latched, freeing the address and data bus for other operations. Following the initiation of a write cycle, the device will automatically write the latched data using an internal control timer. The end of a write cycle can be detected by DATA polling of I/O7. Once the end of a write cycle has been detected a new access for a read or write can begin. In addition to DATA Polling the module provides another method for determining the end of a write cycle. During the write operation, successive attempts to read data from the device will result in I/O6 of the accessed die toggling between one and zero. Once the write has completed, I/O6 will stop toggling and valid data will be read. Reading the toggle bit may begin at any time during the write cycle. DATA PROTECTION If precautions are not taken, inadvertent writes may occur during transitions of the host power supply. The E2 module has incorporated both hardware and software features that will protect the memory against inadvertent writes. READ The memory module is accessed like a Static RAM. When CE\ and OE\ are low and WE\ is High, the data stored at the memory location determined by the address pins is asserted on the outputs. The module can be read as a 32 bit, 16 bit or 8 bit device. The outputs are put in the high impedance state when either CE\ or OE\ is high. This dual-line control gives designers flexibility in preventing bus contention in their system. HARDWARE PROTECTION Hardware features protect against inadvertent writes to the module in the following ways: (a) Vcc sense - if Vcc is below 3.8 V (typical) the write function is inhibited; (b) Vcc power-on delay once Vcc has reached 3.8 V the device will automatically time out 5 ms (typical) before allowing a write; (c) write inhibit - holding any one of OE\ low, CE\ high or WE\ high inhibits write cycles; (d) noise filter pulses of less than 15 ns (typical) on the WE\ or CE\ inputs will not initiate a write cycle. BYTE WRITE A low pulse on the WE\ or CE\ input with CE\ or WE\ low (respectively) and OE\ high initiates a write cycle. The address is latched on the falling edge of CE\ or WE\, whichever occurs last. The data is latched by the first rising edge of CE\ or WE\. Once a BWDW (byte, word or double word) write has been started it will automatically time itself to completion. SOFTWARE DATA PROTECTION A software controlled data protection feature has been implemented on the memory module. When enabled, the software data protection (SDP), will prevent inadvertent writes. The SDP feature may be enabled or disabled by the user and is shipped with SDP disabled, SDP is enabled by the host system issuing a series of three write commands; three specific bytes of data are written to three specific addresses (refer to Software Data Protection Algorithm). After writing the three byte command sequence and after tWC the entire module will be protected from inadvertent write operations. It should be noted, that once protected the host may still perform a byte of page write to the module. This is done by preceding the data to be written by the same three byte command sequence used to enable SDP. Once set, SDP will remain active unless the disable command sequence is issued. Power transitions do not disable SDP and SDP will protect the 128K x 32 EEPROM during power-up and Power-down conditions. All command sequences must conform to the page write timing specifications. The data in the enable and disable command sequences is not written to the device and the memory addresses used in the sequence may be written with data in either a byte or page write operation. After setting SDP, any attempt to write to the device without the three byte command sequence will start the internal write timers. No data will be written to the device; however, for the duration of tWC, read operations will effectively be polling operations. Austin Semiconductor, Inc. reserves the right to change products or specifications without notice. PAGE WRITE The page write operation of the 128K x 32 EEPROM allows 1 to 128 BWDWs of data to be written into the device during a single internal programming period. Each new BWDW must be written within 150-µ sec (tBLC) of the previous BWDW. If the tBLC limit is exceeded the memory module will cease accepting data and commence the internal programming operation. For each WE high to low transition during the page write operation, A7-A16 must be the same. The A0-A6 inputs are used to specify which bytes within the page are to be written. The bytes may be loaded in any order and may be altered within the same load period. Only bytes which are specified for writing will be written; unnecessary cycling of other bytes within the page does not occur. DATA POLLING This memory module features DATA Polling to indicate the end of a write cycle. During a byte or page write cycle an attempted read AS8E128K32 Rev. 7.6 06/05 2 EEPROM E EPROM Austin Semiconductor, Inc. ABSOLUTE MAXIMUM RATINGS* Voltage on Vcc Supply Relative to Vss Vcc ..............................................................................-.5V to +7.0V Storage Temperature ....................... ....................-65°C to +150°C Voltage on any Pin Relative to Vss.....................-.5V to Vcc+1 V Max Junction Temperature**.............................................+150°C Thermal Resistance junction to case (θJC): Package Type Q...............................................11.3° C/W Package Type P & PN.......................................2.8° C/W AS8E128K32 *Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. **Junction temperature depends upon package type, cycle time, loading, ambient temperature and airflow, and humidity (plastics). ELECTRICAL CHARACTERISTICS AND RECOMMENDED DC OPERATING CONDITIONS (-55oC