6N140A/883B

Hermetically Sealed, Low IF, Wide VCC, High Gain Optocouplers Data Sheet 6N140A,* HCPL-675X, 83024, HCPL-570X, HCPL-177K, 5962-89810, HCPL-573X, HCPL-673X, 5962-89785, 5962-98002 *See matrix for available extensions. Description Features These units are single, dual, and quad channel, hermetically sealed optocoup­lers. The products are capable of operation and storage over the full military temperature range and can be purchased as either standard product or with full MIL-PRF-38534 Class Level H or K testing or from the appro­priate DSCC Drawing. All devices are manufactured and tested on a MIL-PRF-38534 certified line and are included in the DSCC Quali­fied Manufacturers List QML38534 for Hybrid Microcircuits. • Dual marked with device part number and DSCC drawing number • Manufactured and tested on a MIL-PRF-38534 Certified Line • QML-38534, Class H and K • Five hermetically sealed package configurations • Performance guaranteed over full military temperature range: -55°C to +125°C • Low input current requirement: 0.5 mA • High current transfer ratio: 1500% typical @ IF  =  0.5 mA • Low output saturation voltage: 0.11 V typical • 1500 Vdc withstand test voltage • High radiation immunity • 6N138/9, HCPL-2730/31 function compatibility • Reliability data Each channel contains a GaAsP light emitting diode which is optically coupled to an integrated high gain photon detector. The high gain output stage features an open collector output providing both lower saturation voltage and higher signaling speed than possible with conventional photo-Darling­ton optocouplers. The shallow depth and small junctions offered by the IC process provides better radiation immunity than conven­tional photo transistor optocouplers. The supply voltage can be operated as low as 2.0 V without adversely affecting the parametric performance. These devices have a 300% minimum CTR at an input current of only 0.5 mA making them ideal for use in low input current applications such as MOS, CMOS, low power logic interfaces or line receivers. Compatibility with high voltage CMOS logic systems is assured by specifying ICCH and IOH at 18 Volts. Applications • • • • • • • • • • • • • • • Military and aerospace High reliability systems Telephone ring detection Microprocessor system interface Transportation, medical, and life critical systems Isolated input line receiver EIA RS-232-C line receiver Voltage level shifting Isolated input line receiver Isolated output line driver Logic ground isolation Harsh industrial environments Current loop receiver System test equipment isolation Process control input/output isolation The connection of a 0.1 µF bypass capacitor between VCC and GND is recommended. CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. Functional Diagram Upon special request, the follow­ing device selections can be made: CTR minimum of up to 600% at 0.5 mA, and lower output leakage current levels to 100 µA. Multiple Channel Devices Available 1 8 2 7 3 6 4 5 Package styles for these parts are 8 and 16 pin DIP through hole (case outlines P and E respec­tively), 16 pin DIP flat pack (case outline F), and leadless ceramic chip carrier (case outline 2). Devices may be purchased with a variety of lead bend and plating options. See Selection Guide table for details. Standard Military Drawing (SMD) parts are available for each package and lead style. Because the same electrical die (emitters and detectors) are used for each channel of each device listed in this data sheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the figures are similar for all parts except as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities justify the use of a common data base for die related reliability and certain limited radiation test results. Truth Table (Positive Logic) Input Output On (H) L Off (L) H Selection Guide-Package Styles and Lead Configuration Options Package 16 pin DIP 8 pin DIP 8 pin DIP 16 pin Flat Pack 20 Pad LCCC Lead Style Channels Common Channel Wiring Avago Part # & Options Commercial MIL-PRF-38534 Class H MIL-PRF-38534 Class K Standard Lead Finish Solder Dipped* Butt Cut/Gold Plate Gull Wing/Soldered* Crew Cut/Gold Plate Class H SMD Part # Prescript for all below Either Gold or Solder Gold Plate Solder Dipped* Butt Cut/Gold Plate Butt Cut/Soldered* Gull Wing/Soldered* Crew Cut/Gold Plate Crew Cut/Soldered* Class K SMD Part # Prescript for all below Either Gold or Solder Gold Plate Solder Dipped* Butt Cut/Gold Plate Butt Cut/Soldered* Gull Wing/Soldered* Crew Cut/Gold Plate Crew Cut/Soldered* Through Hole 4 VCC, GND Through Hole 1 None Through Hole 2 VCC, GND Unformed Leads 4 VCC, GND Surface Mount 2 None 6N140A[1] 6N140A/883B HCPL-177K Gold Plate Option #200 Option #100 Option #300 Option #600 HCPL-5700 HCPL-5701 HCPL-570K Gold Plate Option #200 Option #100 Option #300 Option #600 HCPL-5730 HCPL-5731 HCPL-573K Gold Plate Option #200 Option #100 Option #300 Option #600 HCPL-6750 HCPL-6751 HCPL-675K Gold Plate HCPL-6730 HCPL-6731 HCPL-673K Solder Pads* None 8302401EX 8302401EC 8302401EA 8302401YC 8302401YA 8302401XA 8302401ZC 8302401ZA 59628981001PX 8981001PC 8981001PA 8981001YC 8981001YA 8981001XA Available Available 59628978501PX 8978501PC 8978501PA 8978501YC 8978501YA 8978501ZA Available Available None 8302401FX 8302401FC 596289785022X 59629800201KEX 9800201KEC 9800201KEA 9800201KYC 9800201KYA 9800201KXA 9800201KZC 9800201KZA 59628981002KPX 8981002KPC 8981002KPA 8981002KYC 8981002KYA 8981002KXA Available Available 59628978503KPX 8978503KPC 8978503KPA 8978503KYC 8978503KYA 8978503KZA Available Available 59629800201KFX 9800201KFC *Solder contains lead. Note: 1. JEDEC registered part. 2 89785022A 59628978504K2X 8978504K2A Functional Diagrams 16 pin DIP 8 pin DIP 8 pin DIP 16 pin Flat Pack 20 Pad LCCC Through Hole Through Hole Through Hole Unformed Leads Surface Mount 4 Channels 1 Channel 2 Channels 4 Channels 2 Channels 15 16 1 1 8 8 1 VCC2 16 1 VO2 19 2 15 3 14 13 4 2 7 2 7 2 15 15 20 3 6 3 6 3 14 14 2 4 5 4 5 GND2 VCC1 13 12 10 3 13 4 GND1 VO1 7 5 12 5 12 6 11 6 11 7 10 7 10 8 9 8 9 8 Note: All DIP and flat pack devices have common VCC and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with separate VCC and ground connections. Outline Drawings 16 Pin DIP Through Hole, 4 Channels 0.89 (0.035) 1.65 (0.065) 20.06 (0.790) 20.83 (0.820) 8.13 (0.320) MAX. 4.45 (0.175) MAX. 0.51 (0.020) MIN. 3.81 (0.150) MIN. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MAX. 0.20 (0.008) 0.33 (0.013) 7.36 (0.290) 7.87 (0.310) Note: Dimensions in Millimeters (Inches) Leaded Device Marking Avago LOGO Avago P/N DSCC SMD* DSCC SMD* PIN ONE/ ESD IDENT A QYYWWZ XXXXXX XXXXXXX XXX XXX 50434 s *QUALIFIED PARTS ONLY 3 Leadless Device Marking COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) COUNTRY OF MFR. Avago CAGE CODE* Avago LOGO Avago P/N PIN ONE/ ESD IDENT COUNTRY OF MFR. A QYYWWZ XXXXXX XXXX XXXXXX XXX 50434 s *QUALIFIED PARTS ONLY COMPLIANCE INDICATOR,* DATE CODE, SUFFIX (IF NEEDED) DSCC SMD* DSCC SMD* Avago CAGE CODE* Outline Drawings (continued) 16 Pin Flat Pack, 4 Channels 7.24 (0.285) 6.99 (0.275) 2.29 (0.090) MAX. 1.27 (0.050) REF. 11.13 (0.438) 10.72 (0.422) 0.46 (0.018) 0.36 (0.014) 8.13 (0.320) MAX. 2.85 (0.112) MAX. 0.88 (0.0345) MIN. 0.89 (0.035) 0.69 (0.027) 5.23 (0.206) MAX. 0.31 (0.012) 0.23 (0.009) 9.02 (0.355) 8.76 (0.345) Note: Dimensions in Millimeters (Inches) 20 Terminal LCCC Surface Mount, 2 Channels   8 Pin DIP Through Hole, 1 and 2 Channel 8.70 (0.342) 9.10 (0.358) 1.78 (0.070) 2.03 (0.080) 1.02 (0.040) (3 PLCS) 1.14 (0.045) 1.40 (0.055) 8.70 (0.342) 9.10 (0.358) 4.95 (0.195) 5.21 (0.205) TERMINAL 1 IDENTIFIER 2.16 (0.085) METALIZED CASTILLATIONS (20 PLCS) 1.78 (0.070) 2.03 (0.080) 0.64 (0.025) (20 PLCS) 8.13 (0.320) MAX. 7.16 (0.282) 7.57 (0.298) 4.32 (0.170) MAX. 0.51 (0.020) MIN. 3.81 (0.150) MIN. 0.51 (0.020) 1.52 (0.060) 2.03 (0.080) Note: Dimensions in Millimeters (Inches). Solder Thickness 0.127 (0.005) Max. 4 9.40 (0.370) 9.91 (0.390) 0.76 (0.030) 1.27 (0.050) 4.95 (0.195) 5.21 (0.205) 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MAX. Note: Dimensions in Millimeters (Inches). 0.20 (0.008) 0.33 (0.013) 7.36 (0.290) 7.87 (0.310) Hermetic Optocoupler Options Option Description 100 Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). 4.32 (0.170) MAX. 0.51 (0.020) MIN. 1.14 (0.045) 1.40 (0.055) 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 4.32 (0.170) MAX. 0.51 (0.020) MIN. 1.14 (0.045) 1.40 (0.055) 0.20 (0.008) 0.33 (0.013) 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 7.36 (0.290) 7.87 (0.310) Note: Dimensions in Millimeters (Inches). 200 Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel product in 8 and 16 pin DIP. DSCC Drawing part numbers contain provisions for lead finish. All leadless chip carrier devices are delivered with solder dipped terminals as a standard feature. 300 Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). This option has solder dipped leads. 4.57 (0.180) MAX. 0.51 (0.020) MIN. 1.40 (0.055) 1.65 (0.065) 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 4.57 (0.180) MAX. 0.51 (0.020) MIN. 1.40 (0.055) 1.65 (0.065) 4.57 (0.180) MAX. 0.20 (0.008) 0.33 (0.013) 5° MAX. 9.65 (0.380) 9.91 (0.390) 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) Note: Dimensions in Millimeters (Inches). 600 Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). Contact factory for the availability of this option on DSCC part types. 3.81 (0.150) MIN. MAX. 0.51 (0.020) MIN. 0.20 (0.008) 0.33 (0.013) 2.29 (0.090) 2.79 (0.110) 1.14 (0.045) 1.25 (0.049) Note: Dimensions in Millimeters (Inches). Solder contains lead. 5 3.81 (0.150) MAX. 7.36 (0.290) 7.87 (0.310) 0.51 (0.020) MIN. 2.29 (0.090) 2.79 (0.110) 1.02 (0.040) TYP. Absolute Maximum Ratings Parameter Symbol Min. Max. Units Storage Temperature TS -65 +150 °C Operating Temperature TA -55 +125 °C Case Temperature TC +170 °C Junction Temperature TJ +175 °C 260 for 10 sec °C 40 mA Lead Solder Temperature Notes Output Current (each channel) IO Output Voltage (each channel) VO -0.5 20 V 1 Supply Voltage VCC -0.5 20 V 1 Output Power Dissipation (each channel) 50 mW 2 Peak Input Current (each channel,