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ACFM-2013-BLK

ACFM-2013-BLK

  • 厂商:

    AVAGO(博通)

  • 封装:

    SMD15

  • 描述:

    IC QUADPLEXER B1+B3

  • 数据手册
  • 价格&库存
ACFM-2013-BLK 数据手册
ACFM-2013 Band 1/Band 3 Quadplexer Product Brief Description High power rating — +31 dBm maximum Tx power  The Avago Technologies' ACFM-2013 is a quadplexer that combines Band 1 and Band 3 duplexers into a single, miniature package. Applications The ACFM-2013 features a single antenna connection, which eliminates the need for antenna switching. High isolation between bands enables the use of carrier aggregation. Smartphones, tablets, and mobile/portable communications devices operating in Bands 1 and 3. The ACFM-2013 is designed with Avago Technologies' film bulk acoustic resonator (FBAR) technology. The ACFM-2013 also uses Avago Technologies' innovative microcap bonded-wafer, chip scale packaging technology. This process allows the filters to be assembled in a module with a footprint of only 3.6 mm × 2 mm with a maximum height of 0.80 mm. Functional Block Diagram Low Tx insertion loss of the ACFM-2013 reduces power amplifier current, which extends battery life. The ACFM-2013 enhances receiver sensitivity and dynamic range with low Rx insertion loss and high rejection of Tx signals at the Rx ports. "OU 1PSU 1JO #BOE %VQMFYFS #BOE %VQMFYFS The excellent power handling capability of Avago Technologies' FBAR bulk-mode resonators supports the high power levels used in mobile communications devices while adding virtually no distortion. Features      Single antenna Band 1 and Band 3 carrier aggregation High cross band isolation — Enables carrier aggregation Miniature size — 3.6 x 2 mm footprint — 0.80 mm maximum height Environmental — RoHS 6 compliant — Halogen free — TBBPA free #BOE5Y #BOE3Y #BOE5Y #BOE3Y 1PSU 1PSU 1PSU 1PSU 1JO 1JO 1JO 1JO Ordering Information Part Number Number of Devices Container ACFM-2013-BLK 100 Tape strip or gel-pack ACFM-2013-TR1 3000 178 mm (7-inch) reel Avago Technologies -1- Package Dimensions and Marking Specification 0.750 ±0.05 3.600 ±0.075 11 ANT 13 0.400 X 0.250 (14X) B3 TX B1 RX PIN 1 MARK 12 OXIDE LAYER OVER GROUND METAL (SEE NOTES) 14 1 VAGO MFIYWW DDXXXX 0.25 X 45° CHAMFER 1.500 2.000 ±0.075 10 2 15 9 3 0.750 (REF) 0.500 B3 RX 1.600 x 0.750 B1 TX 8 0.750 6 7 5 4 1.500 (REF) 3.000 TOP VIEW SIDE VIEW BOTTOM VIEW Package Marking Code: Notes: 1. Dimensions in millimeters 2. Tolerance, unless otherwise noted: X.XX ± 0.05 mm X.XXX ± 0.025 mm 3. Dimensions nominal unless otherwise noted 4. Angles 45° nominal 5. Contact areas are gold plated 6. Ground pads on bottom metal are solder mask defined by means of a thin (< 1μm) oxide layer AVAGO = Avago Technologies, Inc. M = ACFM-2013 F = Avago FBAR Technology I = Assembly Information Y = Year WW = Work Week DD = Date Code XXXX = Assembly Lot Pin Description Pin Connection 1 Band 1 Rx 4 Band 3 Rx 8 Band 1 Tx 11 Band 3 Tx 13 Ant 2, 3, 5, 6, 7, 9, 10, 12, 14, 15 GND For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. All other brand and product names may be trademarks of their respective companies. Data subject to change. Copyright © 2015 Avago Technologies. All Rights Reserved. AV02-4908EN – 2015-05-01
ACFM-2013-BLK 价格&库存

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