ACMD-7403-BLK

ACMD-7403 Miniature UMTS Band II / PCS Duplexer Data Sheet Description Features The Avago Technologies’ ACMD-7403 is a miniature duplexer designed for use in UMTS Band II and PCS (Blocks A–F) handsets. • Miniature Size The ACMD-7403 enhances the sensitivity and dynamic range of handset receivers by providing more than 54 dB attenuation of the transmitted signal at the receiver input and more than 44 dB rejection of transmit-generated noise in the receive band. Maximum Insertion Loss in the Tx channel is only 2.7 dB, which minimizes current drain from the power amplifier. Insertion Loss in the Rx channel is a maximum of 3.2 dB, thus improving receiver sensitivity. The ACMD-7403 is designed with Avago Technologies’ Film Bulk Acoustic Resonator (FBAR) technology, which makes possible ultra-small, high-Q filters at a fraction of their usual size. The excellent power handling capability of the FBAR bulk-mode resonators supports the high output power levels needed in PCS handsets while adding virtually no distortion. The ACMD-7403 also utilizes Avago Technologies’ innovative Microcap bonded-wafer, chip scale packaging technology. This process allows the filters to be assembled in a molded chip-on-board module that is less than 1.2 mm high with a footprint of only 3.0 mm x 3.0 mm. Functional Block Diagram • 3.0 x 3.0 mm Max footprint • 1.2 mm Max height • High Power Rating • 33 dBm Abs Max Tx Power • Lead-Free Construction Specifications • Rx Band Performance, 1930.5-1989.5 MHz, – 30 to +85°C • Rx Noise Blocking: 44 dB min • Insertion Loss: 3.2 dB max • Tx Band Performance, 1850.5-1909.5 MHz, – 30 to +85°C • Tx Interferer Blocking: 52 dB min • Insertion Loss: 2.7 dB max Applications Handsets or data terminals operating in the PCS (A–F) frequency band. ACMD-7403 Electrical Specifications [2,3], Z0=50 Ω, TC [1] as indicated, – 30°C Symbol Parameter Units Min Typ +25°C Max Min +85°C Typ Max 1.9 1.3 3.1 3.0 Min Typ Max Antenna Port to Receive Port S23 Insertion Loss in Receive Band 1930.5 – 1931.5 MHz 1931.5 – 1989.5 MHz dB ∆S23 Ripple (p-p) in Receive Band dB S22 Return Loss of Receive Port in Receive Band dB 9.5 9.5 15 9.5 S23 Attenuation in Transmit Band (1850.5 – 1909.5 MHz) dB 52 52 59 52 S23 Attenuation 0 – 1600 MHz dB 20 29 S23 Attenuation in Receive 2nd Harmonic Band (3861 – 3979 MHz) dB 14 18 3.2 3.0 3.0 3.2 1.7 Transmit Port to Antenna Port S31 Insertion Loss in Transmit Band 1850.5 – 1908.5 MHz 1908.5 – 1909.5 MHz dB ∆S31 Ripple (p-p) in Transmit Band dB S11 Return Loss of Transmit Port in Transmit Band dB 9.5 9.5 20 9.5 S31 Attenuation in Receive Band (1930.5 – 1989.5 MHz) dB 40 40 49 40 S31 Attenuation 0 – 1600 MHz dB 22 32 S31 Attenuation in GPS Rx Band (1574.42 – 1576.42 MHz) dB 23 27 S31 Attenuation in Transmit 2nd Harmonic Band (3701 – 3819 MHz) dB 5 9 2.5 2.5 1.0 1.4 2.1 2.3 2.5 2.7 1.3 Antenna Port S33 Return Loss of Antenna Port in Receive Band (1930.5 – 1989.5 MHz) dB 9 9 16 9 S33 Return Loss of Antenna Port in Transmit Band (1850.5 – 1909.5 MHz) dB 9 9 17 9 Isolation Transmit Port to Receive Port S21 Tx-Rx Isolation in Receive Band (1930.5 – 1989.5 MHz) dB 44 44 51 44 S21 Tx-Rx Isolation in Transmit Band (1850.5 – 1909.5 MHz) dB 54 54 61 54 Notes: TC is the case temperature and is defined as the temperature of the underside of the Duplexer where it makes contact with the circuit board. Min/Max specifications are guaranteed at the indicated temperature with the input power to the Tx ports equal to or less than +29 dBm over all Tx frequencies unless otherwise noted. Typical data is the average value of the parameter over the indicated band at the specified temperature. Typical values may vary over time.  ACMD-7403 Absolute Maximum Ratings [1] Characterization Parameter Unit Value Storage temperature °C –65 to +125 Maximum RF Input Power to Tx Port dBm +33 Maximum Recommended Operating Conditions [2] Parameter Unit Value Operating temperature, Tc [3] , Tx Power ≤ 29 dBm °C –40 to +100 Operating temperature, Tc [3] , Tx Power ≤ 30 dBm °C –40 to +85 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. The device will function over the recommended range without degradation in reliability or permanent change in performance, but is not guaranteed to meet electrical specifications. 3. TC is defined as case temperature, the temperature of the underside of the duplexer where it makes contact with the circuit board. Figure 1. ACP Probe Test Circuit.  A test circuit similar to the one shown in Figure 1 was used to measure typical device performance. This circuit is designed to interface with Air Coplanar (ACP), GroundSignal-Ground (GSG) RF probes of the type commonly used to test semiconductor wafers.The PCB test circuit uses multiple vias to create a well-grounded pad to which the device under test (DUT) is solder-attached. Short lengths of 50-ohm microstripline connect the DUT to ACP probe patterns on the board. A test circuit with ACMD-7403 mounted in place is shown in Figure 2. S-parameters are then measured using a network analyzer and calibrated ACP probe set. Phase data for s-parameters measured with ACP probe circuits are adjusted to place the reference plane at the edge of the duplexer. Figure 2. Test Circuit with Duplexer. ACMD-7403 Typical Performance at Tc = 25°C 0.0 Insertion Loss (dB) Insertion Loss (dB) 0.0 -1.0 -2.0 -3.0 1850 1860 1870 1880 1890 1900 -1.0 -2.0 -3.0 1930 1910 1940 1950 Figure 3. Tx–Ant Insertion Loss 1990 0 -10 Insertion Loss (dB) -5 Return Loss (dB) 1980 Figure 4. Ant–Rx Insertion Loss 0 -10 -15 -20 -20 -30 -40 -50 1800 1850 1900 1950 2000 2050 -60 1750 2100 1800 1850 Frequency (MHz) 1900 1950 2000 2050 2100 2050 2100 Frequency (MHz) Figure 6. Tx Rejection in Rx Band and Rx Rejection in Tx Band Figure 5. Tx and Rx Port Return Loss 0 -35 -40 -5 -45 Return Loss (dB) Insertion Loss (dB) 1970 Frequency (MHz) Frequency (MHz) -25 1750 1960 -50 -55 -60 -65 -70 -10 -15 -20 -75 -80 1750 1800 1850 1900 1950 Frequency (MHz) Figure 7. Tx–Rx Isolation  2000 2050 2100 -25 1750 1800 1850 1900 1950 Frequency (MHz) Figure 8. Antenna Port Return Loss 2000 ACMD-7403 Typical Performance at Tc = 25°C 0 0 Ins ertion Los s (dB ) Insertion Loss (dB) -10 -20 -30 -40 -5 -10 -15 -50 -60 0.0 -20 1.0 2.0 3.0 4.0 5.0 6.0 3700 3720 3740 Frequency (GHz) -10 -10 Insertion Loss (dB) Insertion Loss (dB) 0 -20 -30 -40 -40 -60 0.0 -60 0.0 1.0 Frequency (GHz) Figure 11. Tx–Ant Low Frequency Rejection  -30 -50 0.8 3820 -20 -50 0.6 3800 Figure 10. Tx–Ant Rejection at Tx Second Harmonic 0 0.4 3780 Frequency (MHz) Figure 9. Tx–Ant and Ant–Rx Wideband Insertion Loss 0.2 3760 1.2 1.4 1.6 0.2 0.4 0.6 0.8 1.0 Frequency (GHz) Figure 12. Ant–Rx Low Frequency Rejection 1.2 1.4 1.6 1 0.8 1 0.8 1.5 0.6 1.5 0.6 2 2 0.4 0.4 3 3 4 4 5 5 10 10 20 20 50 0.2 0.4 0.6 0.8 1 1.5 2 3 4 5 10 50 20 50 0.2 0.4 0.6 0.8 1 1.5 2 3 4 5 10 20 50 -50 -50 -20 -20 -10 -10 -5 -5 -4 -4 -3 -3 -0.4 -0.4 -2 -0.6 -2 -0.6 -1.5 -0.8 -1.5 -0.8 -1 Figure 14. Rx Port Impedance in Rx Band Figure 13. Tx Port Impedance in Tx Band 1 0.8 -1 1 0.8 1.5 0.6 1.5 0.6 2 2 0.4 0.4 3 3 4 4 5 5 10 10 20 20 50 0.2 0.4 0.6 0.8 1 1.5 2 3 4 5 10 50 20 50 0.2 0.4 0.6 0.8 1 1.5 2 3 4 5 10 20 50 -50 -50 -20 -20 -10 -10 -5 -5 -4 -4 -3 -0.4 -3 -0.4 -2 -0.6 -1.5 -0.8 -1 Figure 15. Ant Port Impedance in Tx Band  -2 -0.6 -1.5 -0.8 -1 Figure 16. Ant Port Impedance in Rx Band 2.80 3.0 MAX 1.2 MAX ANT 1.40 0.33 + TX SIGNAL VIA (2 PLS) 0.05 2.80 3.0 MAX 0.61 PRODUCT MARKING 2.45 0.25 0.35 RX PACKAGE ORIENTATION 0.35 2.45 0.43 TOP VIEW SIDE VIEW BOTTOM VIEW Notes: 0.25 1. Dimensions in millimeters Tolerance: X.X ± 0.1 mm X.XX ± 0.05 mm Angles 45°, unless otherwise noted 2. Dimensions nominal unless otherwise noted 3. I/O Pads (3 ea) Size: 0.35 X 0.35 mm Spacing to ground metal: 0.30 mm 4. Signal Vias (2 ea), Ø 0.25; covered with 0.40 Ø solder mask. Shown for reference only. PCB metal under signal via does not need to be voided. 5. Contact areas are gold plated 0.30 0.075 0.25 0.30 0.05 0.075 DETAIL OF IO PAD AREA Figure 17. Package Outline Drawing PACKAGE ORIENTATION RX TX ANT Figure 18. Product Marking  H = ACMD -7403 FB = Avago ID Y = Year WW = Work Week DC = Date Code NNNN = Lot Number 0.05 Ø 0.30 VIA ARRAY HORIZ PITC H = 0.40 VERT PITC H = 0.40 0.25 0.30 Ant 0.25 0.30 0.35 2.28 G G Tx Rx 0.35 2.10 Figure 20. ACMD-7403 Superposed on PCB Layout Notes: 1. Dimensions in mm 2. Transmission line Gap (G) adjusted for Zo = 50 ohms 3. I/O Pads (3 ea) 0.35 X 0.35, corner chamfer 0.03 4. Ground vias positioned to maximize port-to-port isolation 5. Preferred Tx connection on buried metal layer Figure 19. PCB Layout 0.45 > 0.30 TYP 0.45 2.90 0.20 0.20 2.90 > 0.30 TYP Figure 22. ACMD-7403 Superposed on Solder Mask Figure 21. Recommended Solder Mask A PCB layout using the principles illustrated in Figure 19 is recommended to optimize performance of the ACMD7403. It is particularly important to maximize isolation between the Tx connection to the duplexer and the Rx port. High isolation is achieved by: (1) maintaining a continuous ground plane around the duplexer mounting area, (2) surrounding the I/O ports with sufficient ground vias to enclose the connections in a “Faraday cage”, and (3) preferably routing the Tx trace in a different metal layer than the Rx.  The latter is especially useful, not only to maintain Tx-Rx isolation of the duplexer, but also to prevent leakage of the Tx signal into other components that could result in the creation of intermodulation products and degradation of overall system performance. A sufficient number of vias should be used to ensure excellent RF grounding as well as good heat sinking for the device. Note: The two signal vias shown in Fig 17 are covered with solder mask and it is not necessary to void the ground plane under them. STENCIL BOUNDARY 0.20 0.10 2.80 0.10 Figure 24. Solder Stencil Overlaid on ACMD-7403 Bottom Metal Pattern 2.80 Stencil Opening ID Qty Width (mm) Length (mm) I/O pad areas 3 0.35 0.35 All other openings 9 0.50 0.50 Notes: 1. Chamfer or radius all corners 0.05 mm min 2. Stencil openings aligned to Boundary rectangle or center lines 3. Non-I/O pad stencil openings aligned to 0.52 x 0.55 grid (i.e., spacing between openings: 0.2 vertical, 0.5 horizontal) Figure 23. Recommended Solder Stencil Figure 25. SMD Tape Packing  Figure 26. Unit Orientation in Tape Figure 27. Reel Drawing, Front View 10 Figure 28. Reel Drawing, Back View Package Moisture Sensitivity Temperature, °C 300 250 200 Feature Test Method Performance Moisture Sensitivity Level (MSL) at 260°C JESD22-A113D Level 3 150 100 50 0 Tested profile shown. 0 50 100 150 200 Time, seconds 250 300 Figure 29. Verified SMT Solder Profile Ordering Information Part Number No. of Devices Container ACMD-7403-BLK 25 Anti-static Bag ACMD-7403-TR1 1000 7-inch Reel For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. AV02-0627EN - April 10, 2008