ACMD-7612-TR1

ACMD-7612 Miniature UMTS Band I Duplexer Data Sheet Description Features The Avago ACMD-7612 is a miniature duplexer designed for use in UMTS Band I handsets. •  Miniature size - 2.5 x 3.0 mm max footprint - 1.2 mm max height •  High power rating - +33 dBm Abs Max Tx Power •  Lead-free construction Maximum Insertion Loss in the Tx channel is only 1.5 dB, which minimizes current drain from the power amplifier. Insertion Loss in the Rx channel is a maximum of 2.0 dB, improving receiver sensitivity. The ACMD-7612 enhances the sensitivity and dynamic range of WCDMA receivers by providing more than 53 dB attenuation of the transmitted signal at the receiver input and more than 43 dB rejection of transmit-generated noise in the receive band. The ACMD-7612 is designed with Avago Technologies’ Film Bulk Acoustic Resonator (FBAR) technology, which makes possible ultra-small, high-Q filters at a fraction of their usual size. The excellent power handling capability of the FBAR bulk-mode resonators supports the high output power levels needed in handsets while adding virtually no distortion. The ACMD-7612 also utilizes Avago Technologies’ innovative Microcap bonded-wafer, chip scale packaging technology. This process allows the filters to be assembled in a molded chip-on-board module that is less than 1.2 mm high with a maximum footprint of only 2.5 mm x 3.0 mm. Functional Block Diagram ANT PORT 3 Tx PORT 1 Rx PORT 2 Specifications •  Performance guaranteed –30 to +85°C •  Rx band performance (2110 – 2170 mHz) - Insertion loss: 2.0 dB max - Noise blocking: 43 dB min •  Tx band performance (1920 – 1980 mHz) - Insertion loss: 1.5 dB max - Interferer blocking: 53 dB min Applications •  Handsets or data terminals operating in the UMTS Band I frequency range ACMD-7612 Specifications, Z0 = 50 Ω, TC[1] as Indicated –30 to +85°C[2] Symbol Parameter Units Min Typ[3] Max Antenna Port to Receive Port S23 Insertion Loss in Receive Band (2110 – 2170 MHz) dB 1.1 2.0 ∆S23 Ripple (p-p) in Receive Band dB 0.6 1.0 ∆S23 Ripple (p-p) in Any 5 MHz Channel within Receive Band dB – 0.5 S22 Return Loss of Receive Port in Receive Band dB 10 16 S23 Attenuation 0 – 1900 mHz dB 30 50 S23 Attenuation in Transmit Band (1920 – 1980 mHz) dB 53 61 S23 Attenuation in Bluetooth Band (2400 – 2500 mHz) dB 40 54 Transmit Port to Antenna Port S31 Insertion Loss in Transmit Band (1920 – 1980 mHz) -30° to +25°C dB 1.1 1.5 S31 Insertion Loss in Transmit Band (1920 – 1980 mHz) +25° to +85°C dB 1.1 1.6 ∆S31 Ripple (p-p) in Transmit Band dB 0.4 1.0 ∆S31 Ripple (p-p) in Any 5 mHz Channel within Transmit Band dB – 0.5 S11 Return Loss of Transmit Port in Transmit Band dB 10 20 S31 Attenuation 0 – 1800 mHz dB 30 44 S31 Attenuation in Receive Band (2110 – 2170 mHz) dB 41 52 S31 Attenuation in Bluetooth Band (2400 – 2500 mHz) dB 25 31 S31 Attenuation in Transmit 2nd Harmonic Band (3840 – 3960 mHz) dB 25 36 S31 Attenuation in Transmit 3rd Harmonic Band (5760 – 5940 mHz) dB 15 17 dB 10 17 Antenna Port S33 Return Loss of Antenna Port in Transmit and Receive Bands Isolation Transmit Port to Receive Port S21 Tx-Rx Isolation in Transmit Band (1920 – 1980 mHz) dB 53 62 S21 Tx-Rx Isolation in Receive Band (2110 – 2170 mHz) dB 43 52 Notes: 1. TC is the case temperature and is defined as the temperature of the underside of the duplexer where it makes contact with the circuit board. 2. Specifications guaranteed over the given temperature range (unless otherwise noted) with the input power to the Tx port equal to or less than +29 dBm over all Tx frequencies. 3. Typical data is the arithmetic mean value of the parameter over its indicated frequency range at the specified temperature. Typical values may vary from part to part and over time.  Absolute Maximum Ratings[1] Parameter Unit Value Storage Temperature °C -65 to +125 Maximum RF Input Power to Tx Port dBm +33 Parameter Unit Value Operating Temperature, TC[3] , Tx Power ≤ 29 dBm Operating Temperature, TC[3] , Tx Power ≤ 30 dBm °C -40 to +100 °C -40 to +85 Maximum Recommended Operating Conditions[2] Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device. 2. The device will function over the recommended range without degradation in reliability or permanent change in performance, but is not guaranteed to meet electrical specifications. 3. TC is defined as case temperature, the temperature of the underside of the duplexer where it makes contact with the circuit board. 0 0 -0.5 -0.5 INSERTION LOSS (dB) INSERTION LOSS (dB) ACMD-7612 Typical Performance at TC = 25°C -1.0 -1.5 -2.0 -2.5 1920 -1.0 -1.5 -2.0 1930 1940 1950 1960 1970 -2.5 2110 1980 2120 2130 FREQUENCY (MHz) 0 2170 -10 INSERTION LOSS (dB) RETURN LOSS (dB) 2160 0 -5 -10 Tx Rx -15 -20 Tx Rx -20 -30 -40 -50 1900 2000 2100 FREQUENCY (MHz) Figure 3. Tx and Rx port return loss  2150 Figure 2. Rx band insertion loss Figure 1. Tx band insertion loss -25 1800 2140 FREQUENCY (MHz) 2200 2300 -60 1800 1900 2000 2100 FREQUENCY (MHz) Figure 4. Tx rejection in Rx band and Rx rejection in Tx band 2200 2300 0 -5 -50 RETURN LOSS (dB) INSERTION LOSS (dB) -40 -60 -70 -80 1800 -10 -15 -20 1900 2000 2100 2200 -25 1800 2300 1900 2000 FREQUENCY (MHz) 0 -30 -10 INSERTION LOSS (dB) INSERTION LOSS (dB) -20 -40 -50 3.85 3.90 3.95 -30 -40 5.7 4.00 5.8 5.9 5.9 6.0 6.0 Figure 8. Tx third harmonic rejection -40 INSERTION LOSS (dB) -20 INSERTION LOSS (dB) 5.8 FREQUENCY (GHz) Figure 7. Tx second harmonic rejection -30 -40 2.42 2.44 2.46 FREQUENCY (GHz) Figure 9. Tx rejection in bluetooth band (2400 – 2500 mHz)  2300 -20 FREQUENCY (GHz) -50 2.40 2200 Figure 6. Antenna port return loss Figure 5. Tx to Rx isolation -60 3.80 2100 FREQUENCY (MHz) 2.48 2.50 -50 -60 -70 2.40 2.42 2.44 2.46 FREQUENCY (GHz) Figure 10. Rx rejection in bluetooth band (2400 – 2500 mHz) 2.48 2.50 -20 -30 -30 INSERTION LOSS (dB) INSERTION LOSS (dB) -20 -40 -50 -60 -70 -80 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 -10 Tx -20 Rx -30 Rx -40 Tx -50 0 1 2 3 FREQUENCY (MHz) Figure 13. Tx and Rx wideband response -80 0 0.2 0.4 0.6 0.8 Figure 12. Rx low frequency rejection 0 INSERTION LOSS (dB) -60 1.0 1.2 FREQUENCY (GHz) Figure 11. Tx low frequency rejection  -50 -70 FREQUENCY (GHz) -60 -40 4 5 6 1.4 1.6 1.8 2.0 1.0 0.8 1.0 0.8 1.5 0.6 1.5 0.6 2 2 0.4 0.4 3 3 4 4 5 5 10 10 20 20 0.2 0.4 0.6 0.8 1.0 1.5 2 3 4 5 10 20 50 50 -50 0.2 0.4 0.6 0.8 1.0 1.5 2 3 4 5 10 20 50 -20 -20 -10 -10 -5 -5 -4 -4 -3 -3 -0.4 -0.4 -2 -0.6 -2 -0.6 -1.5 -0.8 -1.0 Figure 15. Rx impedance (S22) in Rx band 1.0 0.8 -1.5 -0.8 -1.0 Figure 14. Tx impedance (S11) in Tx band 1.0 0.8 1.5 0.6 1.5 0.6 2 2 0.4 0.4 3 3 4 4 5 5 10 10 20 0.2 0.4 0.6 0.8 1.0 1.5 2 3 4 5 10 20 50 20 50 -50 0.2 0.4 0.6 0.8 1.0 1.5 2 3 4 5 10 20 50 -20 -10 -5 -5 -4 -4 -3 -0.4 -3 -0.4 -2 -0.6 -0.8 -1.5 -1.0 Figure 16. Ant impedance (S33) in Tx band 50 -50 -20 -10  50 -50 -2 -0.6 -0.8 -1.5 -1.0 Figure 17. Ant impedance (S33) in Rx band 0.34 ANT 0.53 0.34 0.53 0.20 2.30 2.5 MAX 0.34 PRODUCT MARKING 0.34 0.20 Tx Rx 3.0 MAX 1.2 MAX PACKAGE ORIENTATION Figure 18. Package drawing PACKAGE ORIENTATION TX P ANT Figure 19. Package marking  0.34 0.34 2.27 Notes: 1. Dimensions in millimeters 2. Dimensions nominal unless otherwise noted 3. All chamfers 45° 4. I/O pads (3 ea) Size: 0.53 x 0.53, corner chamfers: 0.03 x 0.03 Spacing to ground plane: 0.34 Inside ground plane chamfer: 0.20 x 0.20 5. Tolerance: X.X = ± 0.1 X.XX = ±0.05 6. Contact areas are gold plated RX 0.53 0.53 P = ACMD-7612 FB = Avago ID Y = Year WW = Work Week DC = Date Code NNNN = Lot Number 2.80 0.53 0.10 Ant Ø 0.20 VIA ARRAY HORIZ PITCH = 0.33 VERT PITCH = 0.38 Ø 0.20 VIA ARRAY HORIZ PITCH = 0.38 0.10 1.78 W Tx R x G Ø 0.20 VIA ARRAY HORIZ PITCH = 0.33 VERT PITCH = 0.38 Ø 0.20 VIA ARRAY HORIZ PITCH = 0.38 VERT PITCH = 0.33 2.27 Notes: 1. Dimensions in mm. 2. Transmission line Gap (G) and Width (W) adjusted for Zo = 50 ohms. 3. I/O Pads (3 ea) 0.53 x 0.53, corner chamfer 0.30. 4. I/O Pad to Ground plane gap = 0.34, corner chamfer 0.30. 5. Ground vias positioned to maximize port-to-port isolation. Figure 20. PCB layout A PCB layout implementing design principles similar to those illustrated in Figure 16 is recommended to optimize performance of the ACMD-7612. It is particularly important to maximize isolation between the Tx connection to the duplexer and the Rx port. High isolation is achieved by (1) maintaining a continuous ground plane around the duplexer mounting area, (2)  surrounding the I/O ports with sufficient ground vias to enclose the connections in a “Faraday cage”, and (3)  preferably routing the Tx trace in a different metal layer than the Rx. The latter is especially useful, not only to maintain TxRx isolation of the duplexer, but also to prevent leakage of the Tx signal into other components that could result in the creation of intermodulation products and degradation of overall system performance.  Figure 21. ACMD-7612 superposed on PCB layout 0.63 > 0.30 TYP. 0.63 2.40 0.24 0.24 > 0.30 TYP. 2.90 Note: Dimensions in mm. Figure 23. ACMD-7612 superposed on solder mask Figure 22. Recommended solder mask STENCIL BOUNDARY 0.15 0.15 A B B 2.30 C A A 2.80 STENCIL OPENING ID QTY WIDTH (mm) LENGTH (mm) A (I/O pad areas) 3 0.43 0.43 B 2 0.50 1.24 C 1 0.77 1.24 Notes: 1. Chamfer or radius all corners 0.05 mm min. 2. Stencil openings aligned to Boundary rectangle or center lines. Figure 24. Recommended solder stencil  Figure 25. Solder stencil overlaid on ACMD-7612 bottom metal pattern 4.00 ± 0.10 (SEE NOTE #2) 2.00 ± 0.05 ∅ 1.55 ± 0.05 1.75 ± 0.10 R0.60 TYP. 5.50 ± 0.05 12.00 ± 0.10 Bo Ko 8.00 ± 0.10 SECTION B – B 5° (MAX.) Ao 0.30 ± 0.05 SECTION A – A NOTES: 1. Ao and Bo measured at 0.3 mm above base of pocket. 2. 10 pitches cumulative tolerance ± 0.2 mm. 3. ( ) Reference dimensions only. Ao Bo Ko Pitch Width Figure 26. SMD tape packing PACKAGE PIN 1 ORIENTATION SPROCKET HOLES P P P TAPE WIDTH POCKET CAVITY Figure 27. Unit orientation in tape 10 = = = = = 2.80 3.30 1.50 8.00 12.00 ∅ 1.50 (MIN.) Figure 28. Reel drawing, back view Reel Component Resistivity Reel (coated with proprietary antistatic agent) 10^9 to 10^11 Ohm/Sq Carrier Tape (carbon polystyrene) 10^9 Ohm/Sq Cover Tape Top Layer – transparent PET film Bonding Layer – adhesive Polyolefin Sealing Layer – peelable, special film 10^9 to 10^11 Ohm/Sq Notes: 1. Reel shall be labeled with the following information (as a minimum): a. Manufactures name or symbol b. Avago Technologies part number c. Purchase order number d. Date code e. Quantity of units 2. A certificate of compliance © of C) shall be issued and accompany each shipment of product. 3. Reel must not be made with or contain ozone depleting materials. 4. All dimensions in millimeters (mm). Figure 29. Reel drawing, front view Package Moisture Sensitivity Feature Test Method Performance Moisture Sensitivity Level (MSL) at 260°C J-STD-020C Level 3 300 TEMPERTURE (°C) 250 200 150 100 Tested profile shown. 50 0 0 50 100 150 200 250 300 TIME (SECONDS) Figure 30. Verified SMT solder profile ACMD-7612 Ordering Information Part Number No. of Devices Container ACMD-7612-BLK 25 Anti-static Bag ACMD-7612-TR1 1000 178 mm (7-inch) Reel For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0473EN - September 25, 2007