ACPL-M72U-000E

ACPL-M71U, ACPL-M72U Wide Operating Temperature High Speed, Low Power CMOS Digital Optocoupler with R2CouplerTM Isolation Reliability Data Sheet Description Definition of Failure The reliability data shown includes Avago Technologies reliability test data from the reliability qualification done on this product family. All of these products use the same LEDs, similar IC, and the same packaging materials, processes, stress conditions and testing. The data in Table 1 and Table 2 reflect actual test data for devices on a per channel basis. Before stress, all devices are preconditioned using a solder reflow process (260 C peak temp) and 20 temperature cycles (-55 C to +125 C, 15 mins dwell, 1 min transfer). These data are taken from testing on Avago Technologies devices using internal Avago Technologies process, material specifications, design standards, and statistical process controls. THEY ARE NOT TRANSFERABLE TO Inability to switch, i.e. “functional failure” is the definition of failure in this data sheet. Specifically, failure occurs when the device fails to switch ON with 2 times the minimum recommended drive current (but not exceeding the max rating) or fails to switch off when there is no input current Failure Rate Projections The demonstrated point mean time to failure (MTTF) is measured at the absolute maximum stress condition. The failure rate projections in Table 2 uses the Arrhenius acceleration relationship, where a 0.43 eV activation energy is used as in the hybrid section of MIL-HDBK-217. OTHER MANUFACTURERS’ SIMILAR PART TYPES. Application Information Operating Life Test For valid system reliability calculations it is necessary to adjust for the time when the system is not in operation. Note that if you are using MIL-HDBK-217 for predicting component reliability, the results may not be comparable to those given in Table 2 due to different conditions and factors that have been accounted for in MIL-HDBK-217. For example it is unlikely that your application will exercise all available channels at full rated power with the LED(s) always ON as Avago Technologies testing does. Thus, your application total power and duty cycle must be carefully considered when comparing Table 2 to predictions using MIL-HDBK-217. The data of Table 1 and 2 were obtained on devices with high temperature operating life duration. An exponential (random) failure distribution is assumed, expressed in units of FIT (failures per billion device hours) are only defined in the random failure portion of the reliability curve. Table 1. Demonstrated Operating Life Test Performance Stress Test Condition Total Device Tested Total Device Hours Number of Failed Units Demonstrated MTTF(hr) @ Ta = +125 C Demonstrated FITs @ Ta = +125 C Ta = 150 C Vcc = 5.5V Iin = 20mA Io = 10mA 350 350,000 0 > 696,831 < 1,435 Table 2. Reliability Projection for Device Listed in Title Ambient Temperature (C) Junction Temperature (C) Typical (60% Confidence) 90% Confidence MTTF (Hr/fail) FITs (Fail/109h) MTTF (Hr/fail) FITs (Fail/109h) 125 120 110 100 90 80 70 60 50 40 30 25 140 135 125 115 105 95 85 75 65 55 45 40 760,492 881,666 1,198,296 1,654,599 2,323,997 3,325,042 4,853,437 7,240,046 11,058,874 17,333,974 27,948,680 35,897,487 1,315 1,134 835 604 430 301 206 138 90 58 36 28 302,630 350,850 476,850 658,431 924,811 1,323,167 1,931,377 2,881,104 4,400,768 6,897,882 11,121,898 14,285,047 3,304 2,850 2,097 1,519 1,081 756 518 347 227 145 90 70 Table 3. Mechanical Tests (Testing done on a constructional basis) Test Name Reference Standard Test Conditions Units Tested Units Failed Temp Cycling JESD-A104 -65 to 150 C Transfer = 1 min, Dwell = 15 mins 1000 cycles 410 0 Physical Dimensions JESD-B100 Conformance to datasheet package drawings 30 0 Solderability (Non RoHS condition) JESD-B102 8hrs steam aging (93 C), followed by solder dip (245 C,5sec) 10 0 Solderability (RoHS condition) JESD-B102 8hrs steam aging (93 C), followed by solder dip (260 C,5sec) 10 0 Preconditioning J-STD-020 JA113 As per reference standard (to conform to MSL 1) 1228 0 Mechanical Vibration Mil Std 883, Method 2007 20G, 20-2000Hz, 10 min/cycle, 4times/direction 20 0 Table 4. Environmental Testing (Testing done on a constructional basis) Test Name Reference Standard Test Conditions Units Tested Units Failed Highly Accelerated Stress Test JESD-A110 Ta = 130 C, RH=85% Vin=5V Vo=Vcc=5.5V Time = 96 hours 456 0 Unbiased Autoclave JESD-A102 Ta = 121 C, RH = 100% 15psig Unbiased Time = 96 hours 231 0 High Temperature Bake JESD-A103 Ta = 175°C Unbiased Time = 500 hours 90 0 For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. AV02-3713EN - July 16, 2012