ADJD-MJ60

ADJD-MJ50 / ADJD-MJ60 High Performance RGB LED Light Source Data Sheet Description Features Avago RGB LED Light Source is a high performance device which can be operated at high driving current. It comes with a plug-and-play electrical connector. • High flux output The built-in heat sink and the mechanical mounting features simplify the thermal management of a lighting solution. This enables effective heat transfer and maintain LED junction below maximum allowed temperature. The footprint of the top emitting package is 100mm x 18mm x 3.6mm with aperture of 96mm x 6mm. The footprint of side emitting package is 100mm x 18mm x 8mm with aperture of 96mm x 4.6mm. The reflector cavity design maximized the light extraction as well as maximized the color mixing to produce the required color. Together with closely pitched LED dice, the color mixing is best of its class. • Choice of top emitting or side emitting • Compact footprint for ease of stacking horizontally and vertically. • Integrated heatsink to simplify thermal management • Red, Green & Blue color premix in the reflector cavity to produce required color • Silicone encapsulation for extra long product life • Plug and play mechanical mounting and electrical connection (connector interface) • Fully serviceable due to ease of mounting and demounting. Applications • Decorative lighting • Architectural lighting • Specialty lighting CAUTION: ADJD-MJ50 & ADJD-MJ60 are Class 1 ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details  Package Dimensions ADJD-MJ50 (Top Emitting) 18.00 7.29 97.00 12.00 LED die position 50 100.00 (4.41) LED die position 1 3D VIEW 17.15 14.00 19.00 TOP VIEW 34.00 Connector Connector Pin 1 Pin 8 19.00 14.00 15.00 18.00 3.60 2.00 96.00 Dr & Tap For M3 Screw (4X) BOTTOM VIEW 2.00 SIDE VIEW ADJD-MJ60 (Side Emitting) Connector Pin 1 Connector Pin 8 14.00 19.00 34.00 19.00 14.00 Dr & Tap For M3 Screw (4X) TOP VIEW LED die position 50 3D VIEW LED die position 1 4.67 6.00 8.00 100.00 98.00 46.65 2.00 0.70 2.00 15.00 1.00 FRONT VIEW 2.00 96.00 BOTTOM VIEW Notes: 1. All Dimensions are in millimeters. 2. Tolerance = ±0.20 mm unless otherwise specified.  18.00 12.00 16.15 2.00 Color Configuration Electrical Configuration Pin 1 G1 + Pin 2 R+ Pin 3 B+ Pin 4 G2 + G1 Pin 5 RPin 6 BPin 7 G2 Pin 8 Male Connector Recommended female connector: Molex 51146-0800  Connector and Pin Configuration Pin Number Configuration 1 G1 + 2 R+ 3 B+ 4 G2 + 5 G1 - 6 R- 7 B- 8 G2 - Table 1. Absolute Maximum Ratings (Tj = 25°C) Parameter Red Green & Blue Unit DC forward current [1] [2] [3] 300 150 mA Power dissipation 10.5 6.75 W Maximum junction temperature Tj max 120 °C Operating board temperature, TB range [4] - 40 to + 85 °C Storage temperature range - 40 to + 85 °C Note: 1. Per individual string. 2. Derate linearly as shown in Figure 6. 3. Operation at current below 20 mA is not recommended. 4. Board temperature, TB = temperature of the metal core PCB at the bottom of the LED. Table 2. Electrical Characteristics (Tj = 25°C) Forward Voltage, VF (V) [1] [2] Min. Typ. Max. Testing Current, IF (mA) [1] Dynamic Resistance, RD (W) [3] [4] AlInGaP Red 25 29 35 300 26 InGaN Green G1 30 35 45 150 31 InGaN Green G2 30 35 45 150 31 InGaN Blue 30 35 45 150 31 Color Note: 1. Per individual string. 2. VF tolerance is ±1.0V. 3. Measured at Tj = 25ºC, applicable from IF = 50mA onwards. 4. Dynamic resistance is the inverse slope of the forward current vs. forward voltage characteristic as in Figure 3. Table 3. Luminous Flux Luminous Flux fv (lm) [1] [2] @ Tj = 25°C Min. Typ. White fv at 9000K color temperature, TB = 70°C [3] [4] [5] Typ. AlInGaP Red 300 130 200 310 InGaN Green G1 150 75 125 InGaN Green G2 150 75 125 InGaN Blue 150 12 30 Color Testing Current, IF (mA) Note: 1. fV is the total luminous flux output as measured with an integrating sphere per individual string. 2. fV tolerance ± 15%. 3. White point at 9000K color temperature according to CIE 1931: (0.285, 0.300). 4. When the LEDs are tuned to 9000K color temperature at TB = 70°C, not all LED strings will be driven at its maximum forward current. 5. Board temperature, TB = temperature of the metal core PCB at the bottom of the LED.  Table 4. Optical Characteristics (Tj = 25°C) Chromaticity Coordinates [1] Typ. Dominant Wavelength, ld (nm) [1] Peak Wavelength, lp (nm) Spectral Width at Half Max, Dl1/2 (nm) [2] x y Min. Typ. Max. Typ. Typ. Color Testing Current, IF (mA) AlInGaP Red 300 0.684 0.315 615 617 625 626 20 InGaN Green G1 150 0.191 0.715 520 530 535 523 35 InGaN Green G2 150 0.191 0.715 520 530 535 523 35 InGaN Blue 150 0.153 0.033 450 457 460 451 24 Notes: 1. The chromaticity coordinates and dominant wavelength are derived from the CIE Chromaticity Diagram and represent the perceived color of the device. 2. The total spectral width at 1/2 of the peak intensity. Table 5. Thermal Characteristics Temperature Coefficients Color of Dominant Wavelength Dldom/DTj (nm/°C) Typ. of Forward Voltage DVF/DTj (mV/°C) Typ. AlInGaP Red 0.08 -24 InGaN Green G1 0.01 -33 InGaN GreenG2 0.01 -33 InGaN Blue 0.03 -29 Table 6. Thermal Resistance (From Junction to Board) Part Number ADJD-MJ50 ADJD-MJ60 Thermal Resistance, Junction to Board, RqJ-B [1] (°C/W) Typ. 2.0 Notes: 1. Thermal resistance is defined as the increase of junction temperature with reference to TB per 1W of total electrical power that is applied to the entire unit. 2. TB = temperature of the metal core PCB at the bottom of the LED.  Intensity Bins ADJD-MJ60 ADJD-MJ50 Bin ID Luminous Flux fv (lm) [1] Min. Max. A 400 520 B 520 670 Bin ID Luminous Flux fv (lm) [1] Min. Max. Z 310 400 A 400 520 Notes: 1. The luminous flux used for intensity binning is by lighting up all R, G1, G2 & B channels together at maximum rated current. 2. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on current available bins. Figure 1. Color bins1 Note: 1. The chromaticity coordinate used for binning the product is obtained when all R, G1, G2 & B channels are lighted up together at maximum rated current. 2. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on current available bins. Figure 2. Relative intensity vs. wavelength  Figure 3. Forward current vs. forward voltage Figure 4. Relative luminous flux vs. forward current @ Tj=25°C Figure 5. Relative light output vs junction temperature Figure 6. Maximum forward current vs board temperature TB Note: Board temperature, TB = temperature of the metal core PCB at the bottom of the LED.  Packing Information ADJD-MJ50 and ADJD-MJ60 are supplied in plastic tray made of ESD safe material. Each tray contains 25 units. Handling Cautions 1. The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly or handling, the unit should be held on the metal reflector or metal body. 2. When attaching the product to the heat sink, a thermally conductive compound is necessary as the interface between the metal core PCB of the product and the heat sink to ensure sufficient heat dissipation. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved. AV01-0447EN - September 25, 2006