ADNS-3000
Low Power Optical Mouse Sensor
Data Sheet
Description
Features
The Avago Technologies ADNS-3000 is a low power, small
form factor optical mouse sensor. It has a new low-power
architecture and automatic power management modes,
making it ideal for battery, power-sensitive applications –
such as cordless input devices.
Low Power Architecture
The ADNS-3000 is capable of high-speed motion detection – up to 30 ips and 20 g. In addition, it has an on-chip
oscillator and requires an external resistor to set the LED
current.
High Speed Motion Detection up to 30 ips and 20 g
The ADNS-3000 along with the ADNS-5110-001 lens,
and HSDL-4261 IR LED or HLMP-EG3E-xxxxx Red LED
form a complete and compact mouse tracking system. There are no moving parts and this translates to
high reliability and less maintenance for the end user.
In addition, precision optical alignment is not required,
facilitating high volume assembly.
Selectable Resolution of up to 2000 cpi
The sensor is programmed via registers through a fourwire serial port. It is housed in an 8-pin staggered dual
in-line package (DIP).
Small Form Factor
Programmable Periods / Response Times and Downshift
Times from one mode to another for the Power-saving
Modes
External Interrupt Output for Motion Detection
Internal Oscillator – no clock input needed
Operating Voltage: as low as 1.7 V
Four-wire Serial Port Interface
Applications
Optical mice and optical trackballs
Integrated input devices
Battery-powered input devices
Theory of Operation
The ADNS-3000 is based on Optical Navigation Technology, which measures changes in position by optically
acquiring sequential surface images (frames) and mathematically determining the direction and magnitude of
movement.
The ADNS-3000 contains an Image Acquisition System
(IAS), a Digital Signal Processor (DSP), and a four wire
serial port.
The IAS acquires microscopic surface images via the lens
and illumination system. These images are processed
by the DSP to determine the direction and distance of
motion. The DSP calculates the Dx and Dy relative displacement values
An external microcontroller reads and translates the Dx
and Dy information from the sensor serial port into PS2,
USB, or RF signals before sending them to the host PC.
Pinout of ADNS-3000 Optical Mouse Sensor
Pin
Name
Input/
Output
1
MISO
O
Serial Data Output
(Master In/Slave Out)
2
LED
I
LED Illumination
3
MOTION
O
Motion Interrupt Output
(Default active low,
edge triggered)
4
NCS
I
Chip Select
(Active low input)
5
SCLK
I
Serial Clock
6
GND
I
Ground
7
VDD
I
Supply Voltage
8
MOSI
I
Serial Data Input
(Master Out/Slave In)
Description
Date Code
4
5
3
6
2
7
1
8
Lot Code
Product Number
Item
Marking
Product Number
A3000
Remarks
Date Code
XYYWWZ
X = Subcon Code
YYWW = Date Code
Z = Sensor Die Source
Lot Code
VVV
Numeric
Figure 1. Package Outline Drawing (Top View)
2
Product
Number
Date Code
Features for
Illustration only
Pin 1
9.10
0.358
9.90
0.390
A
(At shoulder)
3.72
0.146
3.50
0.138
5.15
0.203
12.85
0.506
Lot Code
±
90
3q
0.50
0.020
2.00
0.079
∅ 4.12
0.162
12.85 ± 0.50 (At lead tip)
0.506 ± 0.020
( 2.74 )
0.108
Lead Pitch
A
1.00
Lead Offset
0.039
( 0.04 )
0.002
Lead Width
Pin 1
4.55
0.179
Protective
Kapton Tape
Section A-A
∅ 0.70
0.028
Clear Optical Path
3.92
0.154
Notes:
1. Dimensions in millimeter / inches.
2. Dimensional tolerance: ± 0.1mm.
3. Coplanarity of leads: 0.1mm.
4. Lead pitch tolerance: ± 0.15mm.
5. Non-cumulative pitch tolerance: ± 0.15mm.
6. Angular tolerance: ± 3q
7. Maximum flash: 0.2mm.
8. Brackets () indicate reference dimension.
9. Document Number: LED_SPC_8C_PKG_002
Figure 2. Package Outline Drawing
CAUTION: It is advised that normal static precautions be taken in handling and assembling
of this component to prevent damage and/or degradation which may be induced by ESD.
3
Overview of Optical Mouse Sensor Assembly
Avago Technologies provides an IGES file drawing describing the base plate molding features for lens and PCB alignment. The ADNS-3000 sensor is designed for mounting on a through-hole PCB, looking down. There is an aperture
stop and features on the package that align to the lens. The ADNS-5110-001 lens provides optics for the imaging of the
surface as well as the illumination of the surface at the optimum angle. Features on the lens align it to the sensor, base
plate, and clip with the LED. The LED clip holds the LED in relation to the lens. The LED must be inserted into the clip and
the LED’s leads formed prior to loading on the PCB. The LEDs recommended for illumination include HSDL-4261 IR LED,
HLMP-EG3E-xxxxx Red LED.
26
1.024
25.00
2X 0.984
2.00
3X 0.079
0.383999
0.015118
1.00
0.039
12.9
0.508
12.60
0.496
11.22
0.442
Optional hole for
alignment post if used
3.00
ø
0.118
Notes:
Clear zone
1. Dimensions in millimeter/inches
10X ø 0.80
0.031
Figure 3. Recommended PCB Mechanical Cutouts and Spacing
4
6.290362
0.247652
7.56
0.298
0.3
0.012
Optical center
10.35
0.407
0
5.02
0.198
0
1.37
0.054
Pin 1
2.25
0.089
24.15
2X 0.951
14.94
0.588
14.5
0.571
13.06
0.514
2. View from component side of PCB
(or top view of mouse)
33.45
1.317
A
A
Sensor
Lens
Section A – A
Figure 4. 2D Assembly drawing of ADNS-3000 (Top and Side View)
Sensor
2.40
A
0.094
Lens
6.87
0.271 B
LED Clip
Alignment Post
(Optional)
Important Note: Pin 1 of sensor should be located nearest to the LED
Surface
Lens Reference Plane
Note:
A – Distance from object surface to lens reference plane
B – Distance from object surface to sensor reference plane
Figure 5. Distance from lens reference plane to tracking surface (Z)
5
LED
PCB
2.40
0.094
7.45
0.293
10.60
0.417
Gap between
0.05 sensor package
0.002 and top of PCB
13.10
0.516
Pin 1
Base Plate
LED
LED Clip
ADNS-3000 (Sensor)
Customer supplied PCB
ADNS-5110-001
Customer supplied base plate with
recommended alignment features
per IGES drawing
Important Note: IR LED is recommended for lower power consumption.
Figure 6. Exploded View of Assembly
PCB Assembly Considerations
4. This sensor package is only qualified for wave-solder
process.
5. Wave solder the entire assembly in a no-wash solder
process utilizing solder fixture. The solder fixture
is needed to protect the sensor during the solder
process. It also sets the correct sensor-to-PCB distance
as the lead shoulders do not normally rest on the PCB
surface. The fixture should be designed to expose
the sensor leads to solder while shielding the optical
aperture from direct solder contact.
6. Place the lens onto the base plate.
7. Remove the protective Kapton tape from optical
aperture of the sensor. Care must be taken to
keep contaminants from entering the aperture.
Recommend not to place the PCB facing up during the
entire mouse assembly process. Recommend to hold
the PCB first vertically for the Kapton removal process.
8. Insert PCB assembly over the lens onto the base plate
aligning post to retain PCB assembly. The sensor
aperture ring should self-align to the lens.
6
10. Install mouse top case. There MUST be a feature in
the top case to press down onto the PCB assembly to
ensure all components are interlocked to the correct
vertical height.
ADNS-3000
VDD
GND
IMAGE ARRAY
DSP
LED
SERIAL PORT AND REGISTERS
3. Insert the LED clip assembly into PCB.
POWER AND CONTROL
2. Insert the LED into the assembly clip and bend the
leads 90 degrees.
9. The optical position reference for the PCB is set by the
base plate and lens. Note that the PCB motion due to
button presses must be minimized to maintain optical
alignment.
LED DRIVE
1. Insert the sensor and all other electrical components
into PCB.
OSCILLATOR
Figure 7. Block diagram of ADNS-3000 optical mouse
NCS
SCLK
MOSI
MISO
MOTION
SW1
SLIDE SW SPDT
ZB
R0
3
352*
3
3
P20
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RESET
MSCK
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P6
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Figure 8a. Schematic diagram of the mouse (cordless application)
21
R3
300k
R4
1M1
R2
453k
R1
1M3
C7
100nF
C6
100nF
C3
100nF
C1
100nF
P16
C13
4.7nF
P7
9&&B'&
C10
4.7nF
P21
LED
R LED
D5
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P22
C11
MOSI
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ADNS-3000
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