ADNS-6230-001

ADNB-6011-EV and ADNB-6012-EV High Performance Laser Mouse Bundles Data Sheet Description The Avago Technologies ADNB-6011-EV and ADNB-6012EV laser mouse bundles are the world’s first laser-illuminated systems enabled for high performance navigation. Driven by Avago Technologies’ LaserStream Technology, the mouse can operate on many surfaces that prove difficult for traditional LED-based optical navigation. Its high-performance architecture is capable of sensing high-speed mouse motion – with resolution up to 2000 counts per inch, velocities up to 45 inches per second (ips) and accelerations up to 20G. This sensor is powered for the extremely high sensitive user. The ADNS-6010 sensor along with the ADNS-6120 or ADNS-6130-001 lens, ADNS-6230-001 clip and ADNV6340 laser diode form a complete and compact laser mouse tracking system. There are no moving parts, which means high reliability and less maintenance for the end user. In addition, precision optical alignment is not required, facilitating high volume assembly. Avago Technologies Lasers must be used with Avago Technologies sensors and lenses to ensure proper product operation and compliance to eye safety regulations. This document will begin with some general information and usage guidelines on the bundles, followed by individual detailed information on ADNS-6010 laser mouse sensor, ADNV-6340 VCSEL, ADNS-6120 and ADNS-6130001 lenses, and ADNS-6230-001 clip. ADNB-6011-EV and ADNB-6012-EV High Performance Laser Mouse Bundles include: Bundle Part Number ADNB-6011-EV Part Number ADNS-6010 ADNV-6340 ADNS-6120 ADNS-6230-001 Bundle Part Number ADNB-6012-EV Part Number ADNS-6010 ADNV-6340 ADNS-6130-001 ADNS-6230-001 Description Laser Mouse Sensor Single-Mode Vertical-Cavity Surface Emitting Laser (VCSEL) Laser Mouse Round Lens Laser Mouse VCSEL Assembly Clip Description Laser Mouse Sensor Single-Mode Vertical-Cavity Surface Emitting Laser (VCSEL) Laser Mouse Trim Lens Laser Mouse VCSEL Assembly Clip Overview of Laser Mouse Sensor Assembly Figure 1. Assembly drawing of ADNB-6011-EV (top, front and cross-sectional view) 2 2D Assembly Drawing of ADNB-6011-EV, PCBs and Base Plate Customer Supplied VCSEL PCB ADNS-6010 (sensor) ADNV-6340 (VCSEL) Customer Supplied PCB ADNS-6230-001 (clip) ADNS-6120 (lens)* Customer Supplied Base Plate With Recommended Features Per IGES Drawing *or ADNS-6130-001 for trim lens Figure 2. Exploded view drawing Shown with ADNS-6120 or ADNS-6130-001 Laser Mouse Lens, ADNS-6230-001 VCSEL Assembly Clip and ADNV6340 VCSEL. The components interlock as they are mounted onto defined features on the base plate. The ADNS-6010 laser mouse sensor is designed for mounting on a through hole PCB, looking down. There is an aperture stop and features on the package that align to the lens. The ADNV-6340 VCSEL provides a laser diode with a single longitudinal and a single transverse mode. It is particularly suited as lower power consumption and highly coherent replacement of LEDs. It also provides wider operation range while still remaining within singlemode, reliable operating conditions. The ADNS-6120 or ADNS-6130-001 Laser Mouse Lens is designed for use with ADNS-6010 sensor and the illumination subsystem provided by the VCSEL assembly clip and the VCSEL. Together with the VCSEL, the ADNS-6120 or ADNS-6130-001 lens provides the directed illumination and optical imaging necessary for proper operation of the Laser Mouse Sensor. ADNS-6120 or ADNS-6130001 is a precision molded optical component and should be handled with care to avoid scratching of the optical surfaces. ADNS-6120 has a large round flange to provide a long creepage path for any ESD events that occur at the opening of the base plate. The ADNS-6230-001 VCSEL Assembly Clip is designed to provide mechanical coupling of the ADNV-6340 VCSEL to the ADNS-6120 or ADNS-6130-001 lens. This coupling is essential to achieve the proper illumination alignment required for the sensor to operate on a wide variety of surfaces. Avago Technologies provides an IGES file drawing describing the base plate molding features for lens and PCB alignment. 3 Assembly Recommendation 1. Insert the sensor and all other electrical components into the application PCB (main PCB board and VCSEL PCB board). 2. Wave solder the entire assembly in a no-wash solder process utilizing a solder fixture. The solder fixture is needed to protect the sensor during the solder process. It also sets the correct sensor-to -PCB distance, as the lead shoulders do not normally rest on the PCB surface. The fixture should be designed to expose the sensor leads to solder while shielding the optical aperture from direct solder contact. 3. Place the lens onto the base plate. 4. Remove the protective kapton tape from the optical aperture of the sensor. Care must be taken to keep contaminants from entering the aperture. 5. Insert the PCB assembly over the lens onto the base plate. The sensor aperture ring should self-align to the lens. The optical position reference for the PCB is set by the base plate and lens. Note that the PCB motion due to button presses must be minimized to maintain optical alignment. 6. Remove the protective kapton tape from the VCSEL. 7. Insert the VCSEL assembly into the lens. 8. Slide the clip in place until it latches. This locks the VCSEL and lens together. 9. Tune the laser output power from the VCSEL to meet the Eye Safe Class I Standard as detailed in the LASER Power Adjustment Procedure. 10. Install the mouse top case. There must be a feature in the top case (or other area) to press down onto the sensor to ensure the sensor and lens are interlocked to the correct vertical height. Figure 3. Recommended PCB mechanical cutouts and spacing 4 Design considerations for improving ESD Performance For improved electrostatic discharge performance, typical creepage and clearance distance are shown in the table below. Assumption: base plate construction as per the Avago Technologies supplied IGES file and ADNS6130-001 trim lens (or ADNS-6120 round lens). Typical Distance Creepage Clearance Millimeters 12.0 2.1 The lens flange can be sealed (i.e. glued) to the base plate. Note that the lens material is polycarbonate and therefore, cyanoacrylate based adhesives or other adhesives that may damage the lens should NOT be used. VCSEL PCB SENSOR LENS CLIP VCSEL BASE PLATE PCB Figure 4. Cross section of PCB assembly 16 KBit EEPROM (optional) R7 100K +3.3V Buttons SW2 SW1 SW3 left Vcc middle right 1 6 5 2 3.3V Regulator U4 LP2950ACZ-3.3 Vcc __ CS SCLK SI S0 VCC ___ WP ____ HLD GND 8 3 7 4 C5 0.1 1 C7 4.7 Vout Gnd Vin 3 C4 0.1 C6 4.7 2 U1 25LC160A C1 0.1 USB microcontroller 16 18 14 VDD3 VDD3 Vcc C2 0.1 17 19 C3 0.1 C10 470pF 5 20 6 P1.0 P1.1 P1.2 3 2 4 1 R9 10 K 4 R10 10 K P1.4 P1.5 R2 20K R1 20K Vcc 13 3 Vcc 1 2 RBIN 7 6 GND SCLK MISO MOSI NCS RESET NPD REFB P0.7 * 21 P0.6 22 23 24 3 GND Q2 2N3906 19 Vcc USB Port VBUS GND D+ D1 2 3 4 R5 1.30K 16 15 8 17 ADNS-6010 P1.3 CYPRESS CY7C63743-PXC P0.5 * P0.4 * P0.2 REFC 11 R6 2.7K C9 0.1 P1.6 P1.7 C8 2.2 12 20 14 8 9 10 D1 VCSEL P0.3 LASER_NEN XY_LASER D+/SCLK 7 18 5 15 N/C N/C D-/SDAT OSC_IN GUARD OSC_OUT 13 11 12 X1 Murata 24 CSALS24MOX53-B0 MHz XTALOUT Vreg XTALIN/P2.1 GND 9 P0.0 VPP 1 P0.1 2 10 * Outputs configured as open drain QA QB SW4 ALPS EC10E Rbin Selected to match laser Optional Ground Plane R3 20K Scroll wheel encoder R4 20K Figure 5. Schematic Diagram for 3-Button Scroll Wheel USB PS/2 Mouse 5 Notes (for Figure 5) · Caps for pins 11, 12, 16 and 18 MUST have trace lengths LESS than 5 mm on each side. · Pins 16 and 18 caps MUST use pin 17 GND. · Pin 9, if used, should not be connected to PCB GND to reduce potential RF emissions. · The 0.1 uF caps must be ceramic. · Caps should have less than 5 nH of self inductance. · Caps should have less than 0.2 W ESR. · NC pins should not be connected to any traces. · Surface mount parts are recommended. · Care must be taken when interfacing a 5V microcontroller to the ADNS-6010. Serial port inputs on the sensor should be connected to open-drain outputs from the microcontroller or use an active drive level shifter. NPD and RESET should be connected to 5V microcontroller outputs through a resistor divider or other level shifting technique. · VDD3 and GND should have low impedance connections to the power supply. · Because the RBIN pin sets the XY_LASER current, the following PC board layout practices should be followed to reduce the chance of uncontrolled laser drive current caused from a leakage path between RBIN and ground. One hypothetical source of such a leakage path is PC board contamination due to a liquid, such as a soft drink, being deposited on the printed circuit board. o The RBIN resistor should be located close to the sensor pin 13. The traces between the resistor and the sensor should be short. o The pin 13 solder pad and all exposed conductors connected to pin 13 should be surrounded by a guard trace connected to VDD3 and devoid of a solder mask. o The pin 13 solder pad, the traces connected to pin 13, and the RBIN resistor should be covered with a conformal coating. o The RBIN resistor should be a thru-hole style to increase the distance between its terminals. This does not apply if a conformal coating is used. Eye Safety The ADNS-6010 and the associated components in the schematic of Figure 5 are intended to comply with Class 1 Eye Safety Requirements of IEC 60825-1. Avago Technologies suggests that manufacturers perform testing to verify eye safety on each mouse. It is also recommended to review possible single fault mechanisms beyond those described below in the section “Single Fault Detection”. Under normal conditions, the ADNS-6010 generates the drive current for the laser diode (ADNV-6340). In order to stay below the Class 1 power requirements, resistor Rbin must be set at least as high as the value in the bin table of Figure 5, based on the bin number of the laser diode and LP_CFG0 and LP_CFG1 must be programmed to appropriate values. Avago Technologies recommends using the exact Rbin value specified in the bin table to ensure sufficient laser power for navigation. The system comprised of the ADNS-6010 and ADNV-6340 is designed to maintain the output beam power within Class 1 requirements over component manufacturing tolerances and the recommended temperature range when adjusted per the procedure below and when implemented as shown in the recommended application circuit of Figure 5. For more information, please refer to Avago Technologies ADNB-6001, ADNB-6002, ADNB6011 and ADNB-6012 Laser Mouse Eye Safety Calculation Application Note 5088. LASER Power Adjustment Procedure 1. The ambient temperature should be 25C +/- 5C. 2. Set VDD3 to its permanent value. 3. Ensure that the laser drive is at 100% duty cycle. 4. Program the LP_CFG0 and LP_CFG1 registers to achieve an output power as close to 506uW as possible without exceeding it. Good engineering practices should be used to guarantee performance, reliability and safety for the product design. Avago Technologies has additional information and detail, such as firmware practices, PCB layout suggestions, and manufacturing procedures and specifications that could be provided. LASER Drive Mode The LASER has 2 modes of operation: DC and Shutter. In DC mode, the LASER is on at all times the chip is powered except when in the power down mode via the NPD pin. In shutter mode the LASER is on only during the portion of the frame that light is required. The LASER mode is set by the LASER_MODE bit in the Configuration_bits register. For optimum product lifetime, Avago Technologies recommends the default Shutter mode setting (except for calibration and test). Laser Bin Table Bin Number 2A 3A Rbin Resistor Value (kohm) 18.7 12.7 Match_Bit (Reg 0x2C, Bit7) 0 0 6 Parameter Laser output power Symbol LOP Minimum Maximum 716 Units uW Notes Per conditions above LASER Output Power The laser beam output power as measured at the navigation surface plane is specified below. The following conditions apply: 1. The system is adjusted according to the above procedure. 2. The system is operated within the recommended operating temperature range. 3. The VDD3 value is no greater than 50mV above its value at the time of adjustment. 4. No allowance for optical power meter accuracy is assumed. Single Fault Detection ADNS-6010 is able to detect a short circuit, or fault, condition at the RBIN and XY_LASER pins, which could lead to excessive laser power output. A low resistance path to ground on either of these pins will trigger the fault detection circuit, which will turn off the laser drive current source and set the LASER_NEN output high. When used in combination with external components as shown in the block diagram below, the system will prevent excess laser power for a single short to ground at RBIN or XY_LASER by shutting off the laser. Refer to the PC board layout notes for recommendations to reduce the chance of high resistance paths to ground existing due to PC board contamination. In addition to the continuous fault detection described above, an additional test is executed automatically whenever the LP_CFG0 register is written to. This test will check for a short to ground on the XY_LASER pin, a short to VDD3 on the XY_LASER pin, and will test the fault detection circuit on the XY_LASER pin. Disabling the LASER LASER_NEN is connected to the base of a PNP transistor which when ON connects VDD3 to the LASER. In normal operation, LASER_NEN is low. In the case of a fault condition (ground at XY_LASER or RBIN), LASER_NEN goes high to turn the transistor off and disconnect VDD3 from the LASER. VDD3 Microcontroller ADNS-6010 LASER DRIVER fault control block LASER voltage sense XY_LASER LASER_NEN VDD3 RESET NPD current set RBIN GND Figure 6. Single Fault Detection and Eye-safety Feature Block Diagram 7 ADNS-6010 Laser Mouse Sensor Theory of Operation The ADNS-6010 is based on LaserStream Technology, which measures changes in position by optically acquiring sequential images (frames) and mathematically determining the direction and magnitude of movement. ADNS-6010 contains an Image Acquisition System (IAS), a Digital Signal Processor (DSP), and a four wire serial port. The IAS acquires microscopic surface images via the lens and illumination system. These images are processed by the DSP to determine the direction and distance of motion. The DSP calculates the ∆x and ∆y relative displacement values. An external microcontroller reads the ∆x and ∆y information from the sensor serial port. The microcontroller then translates the data into PS2 or USB signals before sending them to the host PC or game console. Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 8 Name NCS MISO SCLK MOSI NC RESET NPD OSC_OUT GUARD OSC_IN REFC REFB RBIN XY_LASER NC VDD3 GND VDD3 GND LASER_NEN Description Chip select (active low input) Serial data output (Master In/Slave Out) Serial clock input Serial data input (Master Out/Slave In) No Connection Reset input Power down(active low input) Oscillator output Oscillator GND for PCB guard (optional) Oscillator input Reference capacitor Reference capacitor Set XY_LASER current LASER current output No Connection Supply voltage Ground Supply voltage Ground Laser enable (active low) PINOUT Figure 7. Package outline drawing (top view) NCS MISO SCLK MOSI NC RESET NPD OSC_OUT GUARD OSC_IN 1 19 2 3 4 16 5 15 6 14 7 13 8 12 9 11 10 REFC REFB RBIN XY_LASER NC VDD3 GND VDD3 GND Features • High speed motion detection – up to 45 ips and 20G • New LaserStream architecture for greatly improved optical navigation technology • Programmable frame rate over 7080 frames per second • SmartSpeed self-adjusting frame rate for optimum performance • Serial port burst mode for fast data transfer • 400, 800, 1600 or 2000 cpi selectable resolution • Single 3.3 volt power supply • Four-wire serial port along with Power Down, and Reset pins • Laser fault detect circuitry on-chip for Eye Safety Compliance Applications • Mice for game consoles and computer games • Mice for desktop PC’s, Workstations, and portable PC’s • Laser Trackballs • Integrated input devices Pinout TOP VIEW 20 LASER_NEN A6010 XYYWWZ 18 17 A6010 XYYWWZ A A SECTION A-A Notes. 1. Dimensions in millimeters (inches) 2. Dimenstional tolerance: ±0.1 mm 3. Coplanarity of leads: 0.1 mm 4. Lead pitch tolerance: ±0.15 mm 5. Cummulative pitch tolerance. ±0.15 mm 6. Angular tolerance: ±3.0˚ 7. Maximum flash +0.2 mm 8. Chamfer (25˚ x 2) on the taper side of the lead Figure 8. Package outline drawing CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD 9 External PROM The ADNS-6010 must operate from externally loaded programming. This architecture enables immediate adoption of new features and improved performance algorithms. The external program is supplied by Avago Technologies as a file, which may be burned into a programmable device. The example application shown in this document uses an EEPROM to store and load the external program memory. A micro-controller with sufficient memory may be used instead. On power-up and reset, the ADNS-6010 program is downloaded into volatile memory using the burst-mode procedure described in the Synchronous Serial Port section. The program size is 1986 x 8 bits. Regulatory Requirements • Passes FCC B and worldwide analogous emission limits when assembled into a mouse with shielded cable and following Avago Technologies recommendations. • Passes IEC-1000-4-3 radiated susceptibility level when assembled into a mouse with shielded cable and following Avago Technologies recommendations. • Passes EN61000-4-4/IEC801-4 EFT tests when assembled into a mouse with shielded cable and following Avago Technologies recommendations. • UL flammability level UL94 V-0. NCS OSCILLATOR Serial Port OSC_IN RESONATOR OSC_OUT REFB VOLTAGE REGULATOR AND POWER CONTROL VCSEL Clip VCSEL VCSEL PCB Sensor Sensor PCB 3.3 V POWER SCLK MOSI MISO IMAGE PROCESSOR REFC REFERENCE VOLTAGE FILTER NODE NPD V DD3 GND CTRL RESET RBIN LASER DRIVER XY_LASER LASER_NEN Lens 2.40 0.094 Figure 10. Distance from lens reference plane to surface Surface Figure 9. Block diagram of ADNS-6010 optical mouse sensor 10 Absolute Maximum Ratings Parameter Storage Temperature Operating Temperature Lead Solder Temp Supply Voltage ESD Input Voltage Output current Input Current VIN IOUT IIN -0.5 VDD3 -0.5 Symbol TS TA Minimum -40 -15 Maximum 85 55 260 3.7 2 VDD3+0.5 7 15 Units °C °C °C V kV V mA mA All pins, human body model MIL 883 Method 3015 NPD, NCS, MOSI, SCLK, RESET, OSC_IN, OSC_OUT, REFC, RBIN MISO, LASER_NEN XY_LASER current with RBIN 12.7KΩ LP-CFG0 = 0x00; LP_CFG1 = 0xFF For 10 seconds, 1.6mm below seating plane. Notes Recommended Operating Conditions Parameter Operating Temperature Power supply voltage Power supply rise time Supply noise(Sinusoidal) Oscillator Frequency Serial Port Clock Frequency Resonator Impedance Distance from lens reference plane to surface Speed Acceleration Frame Rate Resistor value for LASER Drive Current set Voltage at XY_LASER Symbol TA VDD3 VRT VNB fCLK fSCLK 23 24 Minimum 0 3.10 1 3080 25 2500 3.30 Typical Maximum 40 3.60 Units °C Volts us mV p-p MHz MHzkHz 0 to 3.0V 10kHz- 300KHZ300KHz50MHz Set by ceramic resonator Active drive, 50% duty cycleOpen drain drive with pull-ups on, 50 pF load Results in +/- 0.2 mm minimum DOF, see Figure 10 Notes XRES Z S A FR Rbin 2000 2.18 2.40 55 2.62 45 20 7080 W mm in/sec G Frames/ s kOhms V See Frame_Period register section ADNV-6340 VCSEL See Bin Table in Figure 5 VDD3 Vxy_laser 0.7 11 AC Electrical Specifications Electrical Characteristics over recommended operating conditions. Typical values at 25 °C, VDD3=3.3V, fclk=24MHz. Parameter VDD to RESET Data delay after RESET Input delay after reset Power Down Wake from NPD Symbol tOP tPU-RESET TIN-RST tPD tPUPD Min. Typ. Max. 250 180 550 600 tCOMPUTE 75 Units ms ms ms ms ms Notes From VDD = 3.0V to RESET sampled From RESET falling edge to valid motion data at 2000 fps and shutter bound 20k. From RESET falling edge to inputs active (NPD, MOSI, NCS, SCLK) From NPD falling edge to initiate the power down cycle at 2000 fps (tpd = 1 frame period + 100ms ) From NPD rising edge to valid motion data at 2000 fps and shutter bound 20k. Max assumes surface change while NPD is low From NPD rising edge to all registers contain data from new images at 2000 fps (See Figure 11). CL = 50pF CL = 50pF From SCLK falling edge to MISO data valid, no load conditions Data held until next falling SCLK edge Amount of time data is valid after SCLK rising edge From data valid to SCLK rising edge From rising SCLK for last bit of the first data byte, to rising SCLK for last bit of the second data byte. From rising SCLK for last bit of the first data byte, to rising SCLK for last bit of the second address byte. From rising SCLK for last bit of the first data byte, to falling SCLK for first bit of the second address byte. Data delay after NPD RESET pulse width MISO rise time MISO fall time MISO delay after SCLK MISO hold time MOSI hold time MOSI setup time SPI time between write commands SPI time between write and read commands SPI time between read and subsequent commands SPI read addressdata delay SPI motion read address-data delay tCOMPUTE tPW-RESET tr-MISO tf-MISO tDLY-MISO tholdMISO 3.1 10 40 40 200 200 120 250 200 120 50 50 ms ms ns ns ns ns ns ns ms ms tholdMOSI tsetupMOSI tSWW tSWR tSRWtSRR 250 ns tSRAD 50 ms From rising SCLK for last bit of the address byte, to falling SCLK for first bit of data being read. All registers except Motion & Motion_Burst From rising SCLK for last bit of the address byte, to falling SCLK for first bit of data being read. Applies to 0x02 Motion, and 0x50 Motion_Burst, registers From NCS falling edge to first SCLK rising edge From last SCLK falling edge to NCS rising edge, for valid MISO data transfer From NCS rising edge to MISO high-Z state (See Figure 24 and 25) tSRADMOT 75 ms NCS to SCLK active tNCS-SCLK SCLK to NCS inactive NCS to MISO high-Z PROM download and frame capture byte-to-byte delay NCS to burst mode exit Transient Supply Current tSCLK-NCS tNCS-MISO tLOAD 120 120 250 10 ns ns ns ms tBEXIT IDDT C IN 4 68 14-22 ms mA pF Time NCS must be held high to exit burst mode Max supply current during a VDD3 ramp from 0 to 3.6 V OSC_IN, OSC_OUT 12 Input Capacitance DC Electrical Specifications Electrical Characteristics over recommended operating conditions. Typical values at 25 °C, VDD3=3.3 V. Parameter DC Supply Current Power Down Supply Current Input Low Voltage Input High Voltage Input hysteresis Input current, pull-up disabled Input current, CMOS inputs Output current, pulledup inputs XY_LASER Current Symbol IDD_AVG IDDPD 5 Minimum Typical Maximum 53 90 Units mA mA Notes DC average at 7080 fps. No DC load on XY_LASER, MISO. NPD=GND; SCLK, MOSI, NCS=GND or VDD3; RESET=0V or GND SCLK, MOSI, NPD, NCS, RESET SCLK, MOSI, NPD, NCS, RESET SCLK, MOSI, NPD, NCS, RESET Vin=0.8*VDD3, SCLK, MOSI, NCS NPD, RESET, Vin=0.8*VDD3 Vin=0.2V, SCLK, MOSI, NCS; See bit 2 in Extended_Config register Vxy_laser >= 0.7 VLP_CFG0 = 0x00, LP_CFG1 = 0xFF Rbin < 50 Ohms, or VXY_LASER 250 ns SRAD SRAD MOT SCLK Address Read Operation Data Address Next Read or Write Operation Figure 22. Timing between read and either write or subsequent read commands 17 Motion Read Reading the Motion_Burst register activates this mode. The ADNS-6010 will respond with the contents of the Motion, Delta_X, Delta_Y, SQUAL, Shutter_Upper, Shutter_Lower, and Maximum_Pixel registers in that order. After sending the register address, the micro-controller must wait tSRAD-MOT and then begin reading data. All 64 data bits can be read with no delay between bytes by driving SCLK at the normal rate. The data are latched into the output buffer after the last address bit is received. After the burst transmission is complete, the micro-controller must raise the NCS line for at least tBEXIT to terminate burst mode. The serial port is not available for use until it is reset with NCS, even for a second burst transmission. controller must write subsequent bytes by presenting the data on the MOSI line and driving SCLK at the normal rate. A delay of at least tLOAD must exist between data bytes as shown. After the download is complete, the micro-controller must raise the NCS line for at least tBEXIT to terminate burst mode. The serial port is not available for use until it is reset with NCS, even for a second burst transmission. Avago Technologies recommends reading the SROM_ID register to verify that the download was successful. In addition, a self-test may be executed, which performs a CRC on the SROM contents and reports the results in a register. The test is initiated by writing a particular value to the SROM_Enable register; the result is placed in the Data_Out register. See those register descriptions for more details. Avago Technologies provides the data file for download; the file size is 1986 data bytes. The chip will ignore any additional bytes written to the SROM_Load register after the SROM file. PROM Download This function is used to load the Avago Technologiessupplied firmware file contents into the ADNS-6010. The firmware file is an ASCII text file with each 2-character byte on a single line. The following steps activate this mode: 1. Perform hardware reset by toggling the RESET pin 2. Write 0x1D to register 0x14 (SROM_Enable register) 3. Wait at least 1 frame period 4. Write 0x18 to register 0x14 (SROM_Enable register) 5. Begin burst mode write of data file to register 0x60 (SROM_Load register) After the first data byte is complete, the PROM or micro≥ t SRAD-MOT 75 µs SCLK Motion_Burst Register Address Read First Byte Read Second Byte Read Third Byte First Read Operation Figure 23. Motion burst timing. exit burst mode tBEXIT ≥ 4 µs NCS SROM_Enable reg write MOSI SROM_Enable reg write address key data SROM_Load reg write address byte 0 enter burst mode byte 1 byte 1985 address ≥1 frame period SCLK tNCS-SCLK >120ns ≥ 40 µs tLOAD tLOAD ≥ 10 µs ≥ 10 µs ≥ 10 µs ≥ 100 µs soonest to read SROM_ID Figure 24. PROM Download Burst Mode 18 Frame Capture This is a fast way to download a full array of pixel values from a single frame. This mode disables navigation and overwrites any downloaded firmware. A hardware reset is required to restore navigation, and the firmware must be reloaded. To trigger the capture, write to the Frame_Capture register. The next available complete 1 2/3 frames (1536 values) will be stored to memory. The data are retrieved by reading the Pixel_Burst register once using the normal read method, after which the remaining bytes are clocked out by driving SCLK at the normal rate. The byte time must be at least tLOAD. If the Pixel_Burst register is read before the data is ready, it will return all zeros. To read a single frame, read a total of 900 bytes. The next 636 bytes will be approximately 2/3 of the next frame. The first pixel of the first frame (1st read) has bit 6 set to 1 as a start-of-frame marker. The first pixel of the second partial frame (901st read) will also have bit 6 set to 1. All other bytes have bit 6 set to zero. The MSB of all bytes is set to 1. If the Pixel_Burst register is read past the end of the data (1537 reads and on) , the data returned will be zeros. Pixel data is in the lower six bits of each byte. After the download is complete, the micro-controller must raise the NCS line for at least tBEXIT to terminate burst mode. The read may be aborted at any time by raising NCS. Alternatively, the frame data can also be read one byte at a time from the Frame_Capture register. See the register description for more information. exit burst mode tBEXIT ≥ 4 µs NCS frame capture reg write MOSI address data pixel dump reg read address enter burst mode SCLK tNCS-SCLK >120ns MISO P0 bit 6 set to 1 tCAPTURE tSRAD ≥ 50 µs tLOAD ≥ 10 µs frame capture reg address soonest to begin again ≥ 10 µs tLOAD ≥ 10 µs P0 P1 all MSB = 1 P899 see note 2 Notes: 1. MSB = 1 for all bytes. Bit 6 = 0 for all bytes except pixel 0 of both frames which has bit 6 = 1 for use as a frame marker. 2. Reading beyond pixel 899 will return the first pixel of the second partial frame. 3. tCAPTURE = 10 s + 3 frame periods. 4. This figure illustrates reading a single co mplete frame of 900 pixels. An additional 636 pixels from the next frame are available. Figure 25. Frame capture burst mode timing 19 The pixel output order as related to the surface is shown below. Cable Top Xray View of Mouse Positive Y LB RB Positive X 1 A6010 20 10 11 expanded view of the surface as viewed through the lens last output 899 898 897 896 895 894 893 892 891 890 889 888 887 886 885 884 883 882 881 880 879 878 877 876 875 874 873 872 871 870 869 868 867 866 865 864 863 862 861 860 859 858 857 856 855 854 853 852 851 850 849 848 847 846 845 844 843 842 841 840 839 838 etc. 59 29 58 28 57 27 56 26 55 25 54 24 53 23 52 22 51 21 50 20 49 19 48 18 47 17 46 16 45 15 44 14 43 13 42 12 41 11 40 10 39 9 38 8 37 7 36 6 35 5 34 4 33 3 32 2 61 31 1 60 30 0 first output Figure 26. Pixel address map (surface referenced) Error detection and recovery 1. The ADNS-6010 and the micro-controller might get out of synchronization due to ESD events, power supply droops or micro-controller firmware flaws. In such a case, the micro-controller should pulse NCS high for at least 1 ms. The ADNS-6010 will reset the serial port (but not the control registers) and will be prepared for the beginning of a new transmission after the normal transaction delay. 2. Invalid addresses: Writing to an invalid address will have no effect. Reading from an invalid address will return all zeros. 3. Termination of a transmission by the micro-controller may sometimes be required (for example, due to a USB suspend interrupt during a read operation). To accomplish this the micro-controller should raise NCS. The ADNS-6010 will not write to any register and will reset the serial port (but not the control registers) and be prepared for the beginning of future transmissions after NCS goes low. The normal delays between reads or writes (tSWW, tswr, tSRAD, tSRAD-mot) are still required after aborted transmissions. 4. The micro-controller can verify success of write operations by issuing a read command to the same address and comparing written data to read data. 5. The micro-controller can verify the synchronization of the serial port by periodically reading the product ID and inverse product ID registers. 6. The microcontroller can read the SROM_ID register to verify that the sensor is running downloaded PROM code. ESD or similar noise events may cause the sensor to revert to native ROM execution. If this should happen, pulse RESET and reload the SROM code. 20 Notes on Power-up and the serial port Reset Circuit The ADNS-6010 does not perform an internal power up self-reset; the reset pin must be raised and lowered to reset the chip. This should be done every time power is applied. During power-up there will be a period of time after the power supply is high but before any clocks are available. The table below shows the state of the various pins during power-up and reset when the RESET pin is driven high by a micro-controller. Power Down Circuit The following table lists the pin states during power down. The chip is put into the power down (PD) mode by lowering the NPD input. When in PD mode, the oscillator is stopped but all register contents are retained. To achieve the lowest current state, all inputs must be held externally within 200mV of a rail, either ground or VDD3. The chip outputs are driven low or hi-Z during PD to prevent current consumption by an external load. State of Signal Pins After VDD is Valid Pin SPI pullups NCS MISO SCLK MOSI XY_LASER RESET NPD LASER_NEN Before Reset undefined hi-Z control functional During Reset off hi-Z control functional After Reset on (default) functional low or hi-Z (per NCS) functional functional functional functional functional functional driven or hi-Z (per driven or hi-Z (per NCS) NCS) undefined undefined undefined functional undefined undefined ignored ignored hi-Z high (externally driven) ignored high (off ) State of Signal Pins During Power Down Pin SPI pullups NCS MISO SCLK MOSI XY_LASER RESET NPD REFC OSC_IN OSC_OUT LASER_NEN 21 NPD low off hi-Z control functional low or hi-Z (per NCS) ignored ignored high (off ) functional low (driven externally) VDD3 low high high (off ) After wake from PD pre-PD state functional pre-PD state or hi-Z functional functional functional functional functional REFC OSC_IN OSC_OUT functional Registers The ADNS-6010 registers are accessible via the serial port. The registers are used to read motion data and status as well as to set the device configuration. Address 0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0a 0x0b 0x0c 0x0d 0x0e 0x0f 0x10 0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x19 0x1a 0x1b 0x1c 0x1d 0x1e 0x1f 0x20-0x2b 0x2c 0x2d 0x2e-0x3c 0x3d 0x3e 0x3f 0x40 0x50 0x60 Register Product_ID Revision_ID Motion Delta_X Delta_Y SQUAL Pixel_Sum Maximum_Pixel Reserved Reserved Configuration_bits Extended_Config Data_Out_Lower Data_Out_Upper Shutter_Lower Shutter_Upper Frame_Period_Lower Frame_Period_Upper Motion_Clear Frame_Capture SROM_Enable Reserved Configuration II Reserved Reserved Frame_Period_Max_Bound Lower Frame_Period_Max_Bound_Upper Frame_Period_Min_Bound_Lower Frame_Period_Min_Bound_Upper Shutter_Max_Bound_Lower Shutter_Max_Bound_Upper SROM_ID Reserved LP_CFG0 LP_CFG1 Reserved Observation Reserved Inverse Product ID Pixel_Burst Motion_Burst SROM_Load R R R W 0xE3 0x00 0x00 Any R/W 0x00 R/W R/W 0x7F 0x80 R/W R/W R/W R/W R/W R/W R 0x90 0x65 0x7E 0x0E 0x20 0x4E Version dependent R/W 0x34 R/W R/W R R R R R R W R/W W 0x49 0x08 Any Any 0x85 0x00 Any Any Any 0x00 0x00 Read/Write R R R R R R R R Default Value 0x1C 0x20 0x20 0x00 0x00 0x00 0x00 0x00 22 Product_ID Access: Read Bit Field 7 PID7 6 PID6 Address: 0x00 Default Value: 0x1C 5 PID5 4 PID4 3 PID3 2 PID2 1 PID1 0 PID0 Data Type: 8-Bit unsigned integer USAGE: This register contains a unique identification assigned to the ADNS-6010. The value in this register does not change; it can be used to verify that the serial communications link is functional. Revision_ID Access: Read Bit Field 7 RID7 6 RID6 Address: 0x01 Default Value: 0x20 5 RID5 4 RID4 3 RID3 2 RID2 1 RID1 0 RID0 Data Type: 8-Bit unsigned integer. USAGE: This register contains the IC revision. It is subject to change when new IC versions are released. NOTE: The downloaded SROM firmware revision is a separate value and is available in the SROM_ID register. 23 Motion Access: Read Bit Field 7 MOT 6 Reserved Address: 0x02 Default Value: 0x00 5 LP_Valid 4 OVF 3 Reserved 2 RES1 1 Fault 0 RES0 Data Type: Bit field. USAGE: Register 0x02 allows the user to determine if motion has occurred since the last time it was read. If so, then the user should read registers 0x03 and 0x04 to get the accumulated motion. It also tells if the motion buffers have overflowed, if fault is detected, and the current resolution setting. Field Name MOT Description Motion since last report 0 = No motion 1 = Motion occurred, data ready for reading in Delta_X and Delta_Y registers This bit is an indicator of complementary value contained in registers 0x2C and 0x2D. 0 = register 0x2C and 0x2D do not have complementary values 1 = register 0x2C and 0x2D contain complementary values Motion overflow, ∆Y and/or ∆X buffer has overflowed since last report 0 = no overflow 1 = overflow has occurred Indicates that the RBIN and/or XY_LASER pin is shorted to GND. 0 = no fault detected 1 = fault detected Resolution in counts per inch (cpi). Resolution values are approximate. Cpi Bit2(RES1) 400 0 0 800 0 1600 1 2000 1 Bit0(RES0) 1 0 1 LP_Valid OVF Fault RES1, RES0 Please see register 0x0a to set cpi Notes for Motion: 1. Reading this register freezes the Delta_X and Delta_Y register values. Read this register before reading the Delta_X and Delta_Y registers. If Delta_X and Delta_Y are not read before the motion register is read a second time, the data in Delta_X and Delta_Y will be lost. 2. Avago Technologies RECOMMENDS that registers 0x02, 0x03 and 0x04 be read sequentially. See Motion burst mode also. 3. Internal buffers can accumulate more than eight bits of motion for X or Y. If either one of the internal buffers overflows, then absolute path data is lost and the OVF bit is set. This bit is cleared once some motion has been read from the Delta_X and Delta_Y registers, and if the buffers are not at full scale. Since more data is present in the buffers, the cycle of reading the Motion, Delta_X and Delta_Y registers should be repeated until the motion bit (MOT) is cleared. Until MOT is cleared, either the Delta_X or Delta_Y registers will read either positive or negative full scale. If the motion register has not been read for long time, at 400 cpi it may take up to 16 read cycles to clear the buffers, at 2000 cpi, up to 80 cycles. Alternatively, writing to the Motion_Clear register (register 0x12) will clear all stored motion at once. 24 Delta_X Access: Read Bit Field 7 X7 6 X6 Address: 0x03 Default Value: 0x00 5 X5 4 X4 3 X3 2 X2 1 X1 0 X0 Data Type: Eight bit 2’s complement number. USAGE: X movement is counts since last report. Absolute value is determined by resolution. Reading clears the register. Motion -128 -127 -2 -1 0 +1 +2 +126 +127 Delta_X 80 81 FE FF 00 01 02 7E 7F Delta_Y Access: Read Bit Field 7 Y7 6 Y6 Address: 0x04 Default Value: 0x00 5 Y5 4 Y4 3 Y3 2 Y2 1 Y1 0 Y0 Data Type: Eight bit 2’s complement number. USAGE: Y movement is counts since last report. Absolute value is determined by resolution. Reading clears the register. Motion -128 -127 -2 -1 0 +1 +2 +126 +127 Delta_Y 80 81 FE FF 00 01 02 7E 7F 25 SQUAL Access: Read Bit Field 7 SQ7 6 SQ6 Address: 0x05 Default Value: 0x00 5 SQ5 4 SQ4 3 SQ3 2 SQ2 1 SQ1 0 SQ0 Data Type: Upper 8 bits of a 10-bit unsigned integer. USAGE: SQUAL (Surface Quality) is a measure of ¼ of the number of valid features visible by the sensor in the current frame. Use the following formula to find the total number of valid features. Number of features = SQUAL register value *4 The maximum SQUAL register value is 169. Since small changes in the current frame can result in changes in SQUAL, variations in SQUAL when looking at a surface are expected. The graph below shows 700 sequentially acquired SQUAL values, while a sensor was moved slowly over white paper. SQUAL is nearly equal to zero if there is no surface below the sensor. SQUAL remains fairly high throughout the Z-height range. SQUAL Values (White Paper) At Z=0mm, Circle@7.5" diameter, Speed-6ips 90 80 70 60 SQUAL Value (counts) 50 40 30 20 10 0 1 51 101 151 201 251 301 351 Counts Figure 27. SQUAL Values at 2000cpi (White Paper) 401 451 501 551 601 651 120 SQUAL Vaalue (counts) 100 80 60 40 20 0 -0.8 -0.6 Mean SQUAL vs. Z (White Paper) 2000 cpi, Circle@7.5" diameter, Speed-6ips Avg-3sigma Avg Avg+3sigma -0.4 -0.2 0 0.2 0.4 Distance of Lens Reference Plane to Surface, Z (mm) 0.6 0.8 Figure 28. Mean SQUAL vs. Z (White Paper) 26 Pixel_Sum Access: Read Bit Field 7 AP7 6 AP6 Address: 0x06 Default Value: 0x00 5 AP5 4 AP4 3 AP3 2 AP2 1 AP1 0 AP0 Data Type: High 8 bits of an unsigned 16-bit integer. USAGE: This register is used to find the average pixel value. It reports the upper byte of a 16-bit counter which sums all 900 pixels in the current frame. It may be described as the full sum divided by 256. To find the average pixel value, use the following formula: Average Pixel = Register Value * 256 / 900 = Register Value/3.51 T he maximum register value is 221 (63 * 900/256 truncated to an integer). The minimum is 0. The pixel sum value can change on every frame. Maximum_Pixel Access: Read Bit Field 7 0 6 0 Address: 0x07 Default Value: 0x00 5 MP5 4 MP4 3 MP3 2 MP2 1 MP1 0 MP0 Data Type: Six bit number. USAGE: Maximum Pixel value in current frame. Minimum value = 0, maximum value = 63. The maximum pixel value can vary with every frame. Reserved Address: 0x08 Reserved Address: 0x09 27 Configuration_bits Access: Read/Write Bit Field 7 0 6 LASER_MODE Address: 0x0a Default Value: 0x49 5 Sys Test 4 RES1 3 1 2 RES0 1 Reserved 0 Reserved Data Type: Bit field USAGE: Register 0x0a allows the user to change the configuration of the sensor. Shown below are the bits, their default values, and optional values. Field Name BIT 7 LASER_MODE Description Must always be zero LASER Shutter Mode 0 = Shutter mode off (LASER always on) 1 = Shutter mode on (LASER only on when illumination is required) System Tests 0 = no tests 1 = perform all system tests, output 16 bit CRC via Data_Out_Upper and Data_Out_Lower registers. NOTE: The test will fail if SROM is loaded. Perform a hardware reset before executing this test. Reload SROM after the test is completed. NOTE: The test will fail if a laser fault condition exists. NOTE: Since part of the system test is a RAM test, the RAM and SROM will be overwritten with the default values when the test is done. If any configuration changes from the default are needed for operation, make the changes AFTER the system test is run. The system test takes 200ms (@24MHz) to complete. NOTE: Do not access the Synchronous Serial Port during system test. RES Resolution in counts per inch. Resolution values are approximate. Cpi Bit4(RES1) 400 0 0 800 1 1600 0 2000 1 Bit2(RES0) 0 1 1 Sys Test Also see register 0x02i BIT 3 Must always be one 28 Extended_Config Access: Read/Write Bit Field 7 Busy 6 Reserved Address: 0x0b Default Value: 0x08 5 Reserved 4 Reserved 3 1 2 Serial_NPU 1 NAGC 0 Fixed_FR Data Type: Bit field USAGE: Register 0x0b allows the user to change the configuration of the sensor. Shown below are the bits, their default values, and optional values. Field Name Busy Description Read-only bit. Indicates if it is safe to write to one or more of the following registers: Frame_Period_Max_Bound_Upper and Frame_Period_Max_Bound_Lower Frame_Period_Min_Bound_Upper and Frame_Period_Min_Bound_Lower Shutter_Max_Bound_Upper and Shutter_Max_Bound_Lower After writing to the Frame_Period_Maximum_Bound_Upper register, at least two frames must pass before writing again to any of the above registers. This bit may be used in lieu of a timer since the actual frame rate may not be known when running in auto mode. 0 = writing to the registers is allowed 1 = do not write to the registers yet Must always be one Disable serial port pull-up current sources on SCLK, MOSI and NCS 0 = no, current sources are on 1 = yes, current sources are off Disable AGC. Shutter will be set to the value in the Shutter_Maximum_Bound registers. 0 = no, AGC is active 1 = yes, AGC is disabled Fixed frame rate (disable automatic frame rate control). When this bit is set, the frame rate will be determined by the value in the Frame_Period_Maximum_Bound registers. 0 = automatic frame rate 1 = fixed frame rate BIT 3 Serial_NPU NAGC Fixed_FR 29 Data_Out_Lower Access: Read Bit Field 7 DO7 6 DO6 5 Address: 0x0c Default Value: Undefined 4 DO4 3 DO3 2 DO2 1 DO1 0 DO0 DO5 Data_Out_Upper Access: Read Bit Field 7 DO15 6 DO14 Address: 0x0d Default Value: Undefined 5 DO13 4 DO12 3 DO11 2 DO10 1 DO9 0 DO8 Data Type: Sixteen bit word USAGE: Data in these registers come from the system self test or the SROM CRC test. The data can be read out in either order. Data_Out_Upper System test results: SROM CRC Test Result: 0xA9 0xBE Data_Out_Lower 0xD5 0xEF System Test: This test is initiated via the Configuration_Bits register. It performs several tests to verify that the hardware is functioning correctly. Perform a hardware reset just prior to running the test. SROM contents and register settings will be lost. SROM Content: Performs a CRC on the SROM contents. The test is initiated by writing a particular value to the SROM_ Enable register. 30 Shutter_Lower Access: Read Bit Field Shutter_Upper Access: Read Bit Field 7 S15 6 S14 7 S7 6 S6 Address: 0x0e Default Value: 0x85 5 S5 Address: 0x0f Default Value: 0x00 5 S13 4 S12 3 S11 2 S10 1 S9 0 S8 4 S4 3 S3 2 S2 1 S1 0 S0 Data Type: Sixteen bit unsigned integer. USAGE: Units are clock cycles. Read Shutter_Upper first, then Shutter_Lower. They should be read consecutively. The shutter is adjusted to keep the average and maximum pixel values within normal operating ranges. The shutter value is checked and automatically adjusted to a new value if needed on every frame when operating in default mode. When the shutter adjusts, it changes by ± 1/16 of the current value. The shutter value can be set manually by setting the AGC mode to Disable using the Extended_Config register and writing to the Shutter_Max_Bound registers. Because the automatic frame rate feature is related to shutter value it may also be appropriate to enable the Fixed Frame Rate mode using the Extended_Config register. Shown below is a graph of 700 sequentially acquired shutter values, while the sensor was moved slowly over white paper. 160 140 Shutter Value (counts) 120 100 80 60 40 20 0 1 51 101 151 Shutter Value (White Paper) At Z=0mm, Circle@7.5" diameter, Speed-6ips 201 251 301 351 401 Counts 451 501 551 601 651 Figure 29. Shutter Values at 2000cpi (White Paper) 31 Mean Shutter vs. Z (White Paper) 2000dpi, Circle@7.5" diameter, Speed-6ips 200 180 160 140 120 100 80 60 40 20 0 -0.8 -0.6 -0.4 -0.2 0 0.2 0.4 0.6 0.8 Distance from Lens Reference Plane to Surface, Z (mm) Figure 30. Mean Shutter vs. Z (White Paper) Shutter Value (counts) Avg-3sigma Avg Avg+3sigma The maximum value of the shutter is dependent upon the setting in the Shutter_Max_ Bound_Upper and Shutter_Max_Bound_Lower registers. 32 Frame_Period_Lower Access: Read Bit Field 7 FP7 6 FP6 5 Address: 0x10 Default Value: Undefined 4 FP4 3 FP3 2 FP2 1 FP1 0 FP0 FP5 Frame_Period_Upper Access: Read Bit Field 7 FP15 6 FP14 5 Address: 0x11 Default Value: Undefined 4 FP12 3 FP11 2 FP10 1 FP9 0 FP8 FP13 Data Type: Sixteen bit unsigned integer. USAGE: Read these registers to determine the current frame period and to calculate the frame rate. Units are clock cycles. The formula is Frame Rate = Clock Frequency/Register value To read from the registers, read Frame_Period_Upper first followed by Frame_Period Lower. To set the frame rate manually, disable automatic frame rate mode via the Extended_Config register and write the desired count value to the Frame_Period_Max_Bound registers. The following table lists some Frame_Period values for popular frame rates with a 24MHz clock. Counts Decimal 3,390 4,800 8,000 12,000 Hex 0D3E 12C0 1F40 2EE0 Frame_Period Upper 0D 12 1F 2E Lower 3E C0 40 E0 Frames/second 7080 5000 3000 2000 Motion_Clear Access: Write Data Type: Any. Address: 0x12 Default Value: Undefined USAGE: Writing any value to this register will cause the Delta_X, Delta_Y, and internal motion registers to be cleared. Use this as a fast way to reset the motion counters to zero without resetting the entire chip. 33 Frame_Capture Access: Read/Write Bit Field 7 FC7 6 FC6 Address: 0x13 Default Value: 0x00 5 FC5 4 FC4 3 FC3 2 FC2 1 FC1 0 FC0 Data Type: Bit field. USAGE: Writing 0x83 to this register will cause the next available complete 1 2/3 frames of pixel values to be stored to SROM RAM. Writing to this register is required before using the Frame Capture burst mode to read the pixel values (see the Synchronous Serial Port section for more details). Writing to this register will stop navigation and cause any firmware loaded in the SROM to be overwritten. A hardware reset is required to restore navigation, and the firmware must be reloaded using the PROM Download burst method. This register can also be used to read the frame capture data. The same data available by reading the Pixel_Burst register using burst mode is available by reading this register in the normal fashion. The data pointer is automatically incremented after each read so all 1536 pixel values (1 and 2/3 frames) may be obtained by reading this register 1536 times in a row. Both methods share the same pointer such that reading pixel values from this register will increment the pointer causing subsequent reads from the Pixel_Burst register (without initiating a new frame dump) to start at the current pointer location. This register will return all zeros if read before the frame capture data is ready. See the Frame Capture description in the Synchronous Serial Port section for more information. This register will not retain the last value written. Reads will return zero or frame capture data. SROM_Enable Access: Write Bit Field 7 SE7 6 SE6 Address: 0x14 Default Value: 0x00 5 SE5 4 SE4 3 SE3 2 SE2 1 SE1 0 SE0 Data Type: 8-bit number. USAGE: Write to this register to start either PROM download or SROM CRC test. Write 0x1D to this register, wait at least 1 frame period, and write 0x18 to this register before downloading PROM firmware to the SROM_Load register. The download will not be successful unless this sequence is followed. See the Synchronous Serial port section for details. Write 0xA1 to start the SROM CRC test. Wait 7ms plus one frame period, then read result from the Data_Out_Lower and Data_Out_Upper registers. Navigation is halted and the SPI port should not be used during this test. Reserved Address: 0x15 34 Configuration II Access: Read/Write Bit Field 7 Reserved 6 Reserved Address: 0x16 Default Value: 0x34 5 Reserved 4 Reserved 3 Reserved 2 1 1 Force_disable 0 Reserved Data Type: Bit field USAGE: Write to this register Field Name BIT 2 Force_disable Description Must be set to one 0 = LASER_NEN functions as normal 1 = LASER_NEN output high. May be useful for product test. Reserved Address: 0x17-0x18 35 Frame_Period_Max_Bound_Lower Access: Read/Write Bit Field 7 FBM7 6 FBM6 Address: 0x19 Default Value: 0x90 5 FBM5 4 FBM4 3 FBM3 2 FBM2 1 FBM1 0 FBM0 Frame_Period_Max_Bound_Upper Access: Read/Write Bit Field 7 FBM15 6 FBM14 Address: 0x1A Default Value: 0x65 5 FBM13 4 FBM13 3 FBM11 2 FBM10 1 FBM9 0 FBM8 Data Type: 16-bit unsigned integer. USAGE: This value sets the maximum frame period (the MINIMUM frame rate) which may be selected by the automatic frame rate control, or sets the actual frame period when operating in manual mode. Units are clock cycles. The formula is Frame Rate = Clock Frequency / Register value To read from the registers, read Upper first followed by Lower. To write to the registers, write Lower first, followed by Upper. To set the frame rate manually, disable automatic frame rate mode via the Extended_Config register and write the desired count value to these registers. Writing to the Frame_Period_Max_Bound_Upper and Lower registers also activates any new values in the following registers: · · · Frame_Period_Max_Bound_Upper and Lower Frame_Period_Min_Bound_Upper and Lower Shutter_Max_Bound_Upper and Lower Any data written to these registers will be saved but will not take effect until the write to the Frame_Period_Max_ Bound_Upper and Lower is complete. After writing to this register, two complete frame times are required to imple ment the new settings. Writing to any of the above registers before the implementation is complete may put the chip into an undefined state requiring a reset. The “Busy” bit in the Extended_Config register may be used in lieu of a timer to determine when it is safe to write. See the Extended_Config register for more details. The following table lists some Frame_Period values for popular frame rates (clock rate = 24MHz). In addition, the three bound registers must also follow this rule when set to non-default values: Frame_Period_Max_Bound ≥ Frame_Period_Min_Bound + Shutter_Max_Bound. Frames/second 7080 5000 3000 2000 Counts Decimal 3,390 4,800 8,000 12,000 Hex 0D3E 12C0 1F40 2EE0 Frame_Period Upper 0D 12 1F 2E Lower 3E C0 40 E0 36 Frame_Period_Min_Bound_Lower Access: Read/Write Bit Field 7 FBm7 Address: 0x1B Default Value: 0x7E 6 FBm6 5 FBm5 Address: 0x1C 4 FBm4 3 FBm3 2 FBm2 1 FBm1 0 FBm0 Frame_Period_Min_Bound_Upper Access: Read/Write Bit Field 7 FBm15 Default Value: 0x0E 6 FBm14 5 FBm13 4 FBm13 3 FBm11 2 FBm10 1 FBm9 0 FBm8 Data Type: 16-bit unsigned integer. USAGE: This value sets the minimum frame period (the MAXIMUM frame rate) which may be selected by the automatic frame rate control. Units are clock cycles. The formula is Frame Rate = Clock Rate / Register value To read from the registers, read Upper first followed by Lower. To write to the registers, write Lower first, followed by Upper, then execute a write to the Frame_Period_Max_Bound_Upper and Lower registers. The minimum allowed write value is 0x0E7E; the maximum is 0xFFFF. Reading this register will return the most recent value that was written to it. However, the value will take effect only after a write to the Frame_Period_Max_Bound_Upper and Lower registers. After writing to Frame_Period_Max_ Bound_Upper, wait at least two frame times before writing to Frame_Period_Min_Bound_Upper or Lower again. The “Busy” bit in the Extended_Config register may be used in lieu of a timer to determine when it is safe to write. See the Extended_Config register for more details. In addition, the three bound registers must also follow this rule when set to non-default values: Frame_Period_Max_Bound ≥ Frame_Period_Min_Bound + Shutter_Max_Bound. 37 Shutter_Max_Bound_Lower Access: Read/Write Bit Field 7 SB7 6 SB6 Address: 0x1D Default Value: 0x20 5 SB5 Address: 0x1E Default Value: 0x4E 6 SB14 5 SB13 4 SB12 3 SB11 2 SB10 1 SB9 0 SB8 4 SB4 3 SB3 2 SB2 1 SB1 0 SB0 Shutter_Max_Bound_Upper Access: Read/Write Bit Field 7 SB15 Data Type: 16-bit unsigned integer. USAGE: This value sets the maximum allowable shutter value when operating in automatic mode. Units are clock cycles. Since the automatic frame rate function is based on shutter value, the value in these registers can limit the range of the frame rate control. To read from the registers, read Upper first followed by Lower. To write to the registers, write Lower first, followed by Upper, then execute a write to the Frame_Period_Max_Bound_Upper and Lower registers. To set the shutter manually, disable the AGC via the Extended_Config register and write the desired value to these registers. Reading this register will return the most recent value that was written to it. However, the value will take effect only after a write to the Frame_Period_Max_Bound_Upper and Lower registers. After writing to Frame_Period_Max_Bound_ Upper, wait at least two frame times before writing to Shutter_Max_Bound_Upper or Lower again. The “Busy” bit in the Extended_Config register may be used in lieu of a timer to determine when it is safe to write. See the Extended_Config register for more details. In addition, the three bound registers must also follow this rule when set to non-default values: Frame_Period_Max_Bound ≥ Frame_Period_Min_Bound + Shutter_Max_Bound. SROM_ID Access: Read Bit Field 7 SR7 6 SR6 Address: 0x1F Default Value: Version dependent 5 SR5 4 SR4 3 SR3 2 SR2 1 SR1 0 SR0 Data Type:8-Bit unsigned integer. USAGE: Contains the revision of the downloaded Shadow ROM firmware. If the firmware has been successfully downloaded and the chip is operating out of SROM, this register will contain the SROM firmware revision, otherwise it will contain 0x00. Note: The IC hardware revision is available by reading the Revision_ID register (register 0x01). 38 LP_CFG0 Access: Read/Write Bit Field 7 Match 6 LP6 Address: 0x2C Default Value: 0x7F 5 LP5 4 LP4 3 LP3 2 LP2 1 LP1 0 LP0 Data Type: 8-bit unsigned integer USAGE: This register is used to set the laser current and bin matching parameter. It is to be used together with register 0x2D where register 0x2D must contain the complement of register 0x2C in order for the laser current to be programmed. Writing to this register causes a fault test to be performed on the XY_LASER pin. The test checks for stuck low and stuck high conditions. During the test, LASER_NEN will be driven high and XY_LASER will pulse high for 12us and pulse low for 12us (times are typical). Both pins will return to normal operation if no fault is detected. Field Name Match LP6 - LP0 Description Match the sensor to the VCSEL characteristics. Set per the bin table specification for the VCSEL bin in use. Controls the 7 bit DAC for adjusting laser current.One step is equivalent to (1/192)*100% = 0.5208% drop of relative laser current.Refer to the table below for example of relative laser current settings. LP6- LP3 0000 0000 0000 0000 0000 : 1111 1111 1111 LP2 0 0 0 0 1 : 1 1 1 LP1 0 0 1 1 0 : 0 1 1 LP0 0 1 0 1 0 : 1 0 1 Relative Laser Current 100% 99.48% 98.96% 98.43% 97.92% : 34.90% 34.38% 33.85% LP_CFG1 Access: Read/Write Bit Field 7 LPC7 6 LPC6 Address: 0x2D Default Value: 0x80 5 LPC5 4 LPC4 3 LPC3 2 LPC2 1 LPC1 0 LPC0 Data Type: 8-bit unsigned integer USAGE: The value in this register must be a complement of register 0x2C for laser current to be as programmed, otherwise the laser current is set to 33.85%. Registers 0x2C and 0x2D may be written in any order after power ON reset or SROM download. 39 Reserved Address: 0x2f-0x3C Observation Access: Read/Write Bit Field 7 OB7 6 Reserved Address: 0x3D Default Value: 0x00 5 OB5 4 Reserved 3 Reserved 2 Reserved 1 OB1 0 OB0 Data Type: Bit field USAGE: Each bit is set by some process or action at regular intervals, or when the event occurs. The user must clear the register by writing 0x00, wait an appropriate delay, and read the register. The active processes will have set their corresponding bit(s). This register may be used as part of a recovery scheme to detect a problem caused by EFT/B or ESD. Field Name OB7 OB5 OB1 OB0 Description 0 = Chip is not running SROM code 1 = Chip is running SROM code 0 = NPD pulse was not detected 1 = NPD pulse was detected Set once per frame Set once per frame Reserved Address: 0x3E Inverse_Product_ID Access: Read Bit Field 7 NPID7 6 NPID6 Address: 0x3F Default Value: 0xE3 5 NPID5 4 NPID4 3 NPID3 2 NPID2 1 NPID1 0 NPID0 Data Type: Inverse 8-Bit unsigned integer USAGE: This value is the inverse of the Product_ID, located at the inverse address. It can be used to test the SPI port. 40 Pixel_Burst Access: Read Bit Field 7 PB7 6 PB6 Address: 0x40 Default Value: 0x00 5 PB5 4 PB4 3 PB3 2 PB2 1 PB1 0 PB0 Data Type: Eight bit unsigned integer USAGE: The Pixel_Burst register is used for high-speed access to all the pixel values from one and 2/3 complete frame. See the Synchronous Serial Port section for use details. Motion_Burst Access: Read Bit Field 7 MB7 6 MB6 Address: 0x50 Default Value: 0x00 5 MB5 4 MB4 3 MB3 2 MB2 1 MB1 0 MB0 Data Type: Various, depending on data USAGE: The Motion_Burst register is used for high-speed access to the Motion, Delta_X, Delta_Y, SQUAL, Shutter_Upper, Shutter_Lower, and Maximum_Pixel registers. See the Synchronous Serial Port section for use details. SROM_Load Access: Write Bit Field 7 SL7 6 SL6 Address: 0x 60 Default Value: N/A 5 SL5 4 SL4 3 SL3 2 SL2 1 SL1 0 SL0 Data Type: Eight bit unsigned integer USAGE: The SROM_Load register is used for high-speed programming of the ADNS-6010 from an external PROM or microcontroller. See the Synchronous Serial Port section for use details. 41 ADNV-6340 Single-Mode Vertical-Cavity Surface Emitting Laser (VCSEL) Description This advanced class of VCSELs was engineered by Avago Technologies providing a laser diode with a single longitudinal as well as a single transverse mode. In contrast to most oxide-based single-mode VCSELs, these VCSELs remain within a single mode operation over a wide range of output power. When compared to an LED, the ADNV6340 has a significantly lower power consumption making it an ideal choice for optical navigation applications. Features • Advanced Technology VCSEL chip • Single Mode Lasing operation • Non-hermetic plastic package • 832-865 nm wavelength • Enhanced ESD up to 2-KV 4.3 KAPTON TAPE 5.36 W X Y Z = BIN NUMBER = BIN LETTER = SUBCONTRACTOR CODE = DIE SOURCE 1° MAX. 4.70 ± 0.05 (BASE) CATHODE FLAT (5.25) AT SHOULDER 3.28 0.90 +3° 2X 90°- 5 ° 5.72 7.22 0.50 0.25 5.25 ± 0.65 AT LEAD TIP Figure 31. Outline drawing for ADNV-6340 VCSEL. Note: Since the VCSEL package is not sealed, the protective kapton tape should not be removed until just prior to assembly into the ADNS-6120 or ADNS-6130-001 lens. 42 11.00 7.20 MAX. CABLE/WIRE CONNECTION 5.00 RECOMMENDED PCB THICKNESS: 1.5 Ð 1.6 mm 1.70 PLASTIC VCSEL PACKAGE: 5.00 PITCH LEADS: 0.5 x 0.25 Figure 32. Suggested ADNV-6340 PCB mounting guide. Absolute Maximum Ratings Parameter DC Forward Current Peak Pulsing Current Power Dissipation Reverse Voltage Laser Junction Temperature Operating Case Temperature Storage Case Temperature Lead Soldering Temperature ESD (Human-Body Model) Comments: 1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are the stress ratings only and functional operation of the device at these or any other condition beyond those indicated for extended period of time may affect device reliability. 2. The maximum ratings do not reflect eye-safe operation. Eye safe operating conditions are listed in the power adjustment procedure section in the ADNS7050 laser sensor datasheet. 3. The inherent design of this component causes it to be sensitive to electrostatic discharge. The ESD threshold is listed above. To prevent ESD-induced damage, take adequate ESD precautions when handling this product. Rating 12 19 24 5 150 5 to 45 -40 to +85 260 2 Units mA mA mW V ˚C ˚C ˚C ˚C KV Notes Duration = 100ms, 10% duty cycle I = 10µA See IR reflow profile (Figure 32) 43 Optical/Electrical Characteristics (at Tc = 5 °C to 45 °C): Parameter Peak Wavelength Maximum Radiant Power [1] Symbol l LOPmax dλ /dT dλ /dI θ FW@1/e^2 Ith SE VF Min. 832 Typ. 842 4.5 Max. 865 Units nm mW Notes Maximum output power under any condition. This is not a recommended operating condition and does not meet eye safety requirements. Wavelength Temperature Coefficient Wavelength Current Coefficient Beam Divergence Threshold Current Slope Efficiency Forward Voltage [2] Comments: 0.065 0.21 15 4.2 0.4 1.9 nm/ºC nm/mA deg mA W/A V At 500 µW output power VCSELs are sorted into bins as specified in the power adjustment procedure section in the ADNS-6XXX laser sensor datasheets. Appropriate binning resistor and register data values are used in the application circuit to achieve the target output power. Danger: When driven with current or temperature range greater than specified in the power adjustment procedure section, eye safety limits may be exceeded. At this level, the VCSEL should be treated as a Class IIIb laser, potentially an eye safety hazard. Typical Characteristics 2.5 2.0 4.5 4.0 OPTICAL POWER, LOP (mW) FORWARD VOLTAGE (V) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 1.5 1.0 0.5 0 0 2 4 6 8 10 0 0 5 10 15 20 25 FORWARD CURRENT (I F) FORWARD CURRENT, I F (mA) Figure 33. Forward voltage vs. forward current . Figure 34. Optical power vs. forward current. 44 50 dT 40 TEMPERATURE RISE ( ˚ C) 30 20 10 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 I (mA) Figure 35. Junction temperature rise vs. forward current. 300 250 TEMPERATURE ( ˚ C) 10-20 SEC 255˚C 250˚C 217˚C 200 150 120 SEC 60-150 SEC 125˚C 100 50 0 0 22 45 66 87 108 129 150 171 192 213 235 256 278 299 320 341 363 384 TIME 40˚C Figure 36. Recommended reflow soldering profile. 45 ADNS-6120 and ADNS-6130-001 Laser Mouse Lens Description The ADNS-6120 and ADNS-6130-001 laser mouse lens are designed for use with Avago Technologies laser mouse sensors and the illumination subsystem provided by the ADNS-6230-001 VCSEL assembly clip and the ADNV-6340 Single-Mode Vertical-Cavity Surface Emitting Lasers ( VCSEL). Together with the VCSEL, the ADNS-6120 or ADNS-6130-001 laser mouse lens provides the directed illumination and optical imaging necessary for proper operation of the laser mouse sensor. ADNS-6120 or ADNS-6130-001 laser mouse lens is a precision molded optical component and should be handled with care to avoid scratching of the optical surfaces. Part Number ADNS-6120 ADNS-6130-001 Description Laser Mouse Round Lens Laser Mouse Trim Lens Figure 37. ADNS-6120 laser mouse round lens outline drawings and details 46 Figure 38. ADNS-6130-001 laser mouse trim lens outline drawings and details MOUSE SENSOR LID ADNS-6120 B A OBJECT SURFACE Figure 39. Optical system assembly cross-section diagram 47 Mechanical Assembly Requirements All specifications reference Figure 39, Optical System Assembly Diagram Figure 40. Logo locations 48 Lens Design Optical Performance Specifications All specifications are based on the Mechanical Assembly Requirements. Parameters Design Wavelength Lens Material* Index of Refraction Symbol l N 1.5693 Min. Typical 842 1.5713 1.5735 Max. Units nm l = 842 nm Conditions *Lens material is polycarbonate. Cyanoacrylate based adhesives should not be used as they will cause lens material deformation. Mounting Instructions for the ADNS-6120 and ADNS-6130-001 Laser Mouse Lenses to the Base Plate An IGES format drawing file with design specifications for laser mouse base plate features is available. These features are useful in maintaining proper positioning and alignment of the ADNS-6120 or ADNS-6130-001 laser mouse lens when used with the Avago Technologies Laser Mouse Sensor. This file can be obtained by contacting your local Avago Technologies sales representative. Figure 41. Illustration of base plate mounting features for ADNS-6120 laser mouse round lens Figure 42. Illustration of base plate mounting features for ADNS-6130-001 laser mouse trim lens 50 ADNS-6230-001 Laser Mouse VCSEL Assembly Clip Description The ADNS-6230-001 VCSEL Assembly Clip is designed to provide mechanical coupling of the ADNV-6340 VCSEL to the ADNS-6120 or ADNS-6130-001 Laser Mouse Lens. This coupling is essential to achieve the proper illumination alignment required for the sensor to operate on a wide variety of surfaces. Figure 43. Outline Drawing for ADNS-6230-001 VCSEL Assembly Clip For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0104EN AV02-0118EN - August 17, 2007