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AFBR-1529Z

AFBR-1529Z

  • 厂商:

    AVAGO(博通)

  • 封装:

    -

  • 描述:

    光纤发射器、接收器、收发器 V-Link Horz 10MBd 50m POF, 2.3 V

  • 数据手册
  • 价格&库存
AFBR-1529Z 数据手册
AFBR-15x9Z DC to 10 Mbd Versatile Link Fiber Optic Analog Transmitter for 1 mm POF and 200 m PCS Data Sheet Description Features The AFBR-15x9Z analog transmitter from Avago Technologies uses a 650 nm LED source in a housing designed to efficiently couple into 1 mm Polymer Optical Fiber (POF) and 200 m diameter Plastic-Clad Silica (PCS). Links up to 50 m are supported with 1 mm POF, and up to 200 m with 200 m PCS. It is designed to interoperate with Broadcom´s HFBR-25xxZ, AFBR-25xxZ and AFBR-26xxZ receivers.  RoHS-compliant The transmitter is a 4-pin device, packed in Versatile Link housing. Versatile Link components can be interlocked (N-plexed together) to minimize space and to provide dual connections with the duplex connectors. Various simplex and duplex connectors, as well as POF cables are available for Versatile Link components.  Data transmission at signal rates from DC up to 10 MBd  Up to 50 meters distance with 1 mm Polymer Optical Fiber (POF) and 200 meters with 200 m PCS  Operating temperature range of –40°C to +85C  Compatible with Broadcom’s Versatile Link family of connectors, for easy termination of fiber Applications  Industrial control and factory automation  Serial field buses  Intra-system links; Board-to-Board, Rack-to-Rack  Extension of RS-232 and RS-485  High voltage isolation AFBR – 1 5 x 9 Z  Elimination of ground loops 1 = Transmitter (TX) Z = Extended Temperature Range, RoHS Compliant 5 = 650 nm products 2 = Horizontal Package 3 = Vertical Package 9 = 10 MBd Available options Horizontal Package AFBR-1529Z Vertical Package AFBR-1539Z  Reduces voltage transient susceptibility Package and Handling Information Handling Versatile Link packages are made of a flame-retardant material and use the same pad layout as a standard, eight-pin dual-in-line package. Versatile Link packages are stackable and are enclosed to provide a dust-resistant seal. Snap action simplex, simplex latching, duplex, and duplex latching connectors are offered with simplex or duplex cables. Versatile Link components are auto-insertable. When wave soldering is performed with Versatile Link components, the optical port plug should be left in to prevent contamination of the port. Do not use reflow solder processes (i.e., infrared reflow or vapor-phase reflow). Non-halogenated water-soluble fluxes (i.e., 0% chloride), not rosin-based fluxes, are recommended for use with Versatile Link components. Package Housing Color Versatile Link components and simplex connectors are color-coded to eliminate confusion when making connections. Transmitters are gray. Versatile Link components are moisture-sensitive devices and are shipped in a moisture-sealed bag. If the components are exposed to air for an extended period of time, they may require a baking step before the soldering process. Refer to the special labeling on the shipping tube for details. Mechanical Dimensions Vertical Module 2 [0.08] Horizontal Module 3.6 [0.14] 5.1 [0.20] 10.2 [0.40] 6.5 [0.26] 10.2 [0.40] 1 [0.04] 18.8 [0.74] 18.1 [0.71] 5.1 [0.20] 6.5 [0.26] 7.6 [0.30] 4.2 [0.17] 18.9 [0.75] 1.3 [0.05] 1) Dimensions: mm [in] 0.6 [0.02] 2.54 [0.100] 2.8 [0.11] MIN 0.5 [0.02] NOTES: 1.3 [0.05] 0.5 [0.02] 7.62 [0.300] 2.54 [0.100] ‡ 1.7 [0.07] DIMENSIONS IN MILLIMETERS (INCHES) NOTES: 1) Dimensions: mm [in] 2) 2) Optional mounting hole for #2 self-tapping-screw (metric equivalent M2.2 x 0.45) 3.8 [0.15] 2 0.6 3] 0 0. [‡ 3.8 [0.15] 2.8 [0.11] 1.7 [0.07] 3.3 [0.13] MAX .6 ‡ 0 3] 0.0 [‡ 3.6[0.14]MIN. 7.7 [0.30] 3.8[0.15]MAX. 0.6 [0.03] 7.6 [0.30] 2 [0.08] Versatile Link Printed Board Layout Dimensions Horizontal Module Vertical Module 7.62 [0.300] 7.62 [0.300] 2.54 [0.100] 2.54 [0.100] ‡1 ] 4 0.0 [‡ [‡ 2 1 5 8 4] 2.25 [0.09] clearance hole for optional vertical mount self-tapping-screw #2 3.8 [0.15] 4 3 2 1 7.62 [0.300] 3 7.7 [0.30] 4 ‡1 0.0 PCB EDGE 5 8 1.9 MIN. [0.07] PCB EDGE 3.8 [0.15] 1.7 [0.07] MIN. NOTES: 1) Dimensions: mm [in] 1) Dimensions: mm [in] Footprint - TOP VIEW NOTES: Footprint - TOP VIEW Interlocked (Stacked) Assemblies Horizontal packages may be stacked by placing units with pins facing upward. Initially engage the interlocking mechanism by sliding the L bracket body from above into the L slot body of the lower package. Use a straight edge, such as a ruler, to bring all stacked units into uniform alignment. This technique prevents potential harm that could occur to fingers and hands of assemblers from the package pins. Stacked horizontal packages can be disengaged if necessary. Repeated stacking and unstacking causes no damage to individual units. Stacking Horizontal Modules Stacking Vertical Modules 3 To stack vertical packages, hold one unit in each hand, with the pins facing away and the optical ports on the bottom. Slide the L bracket unit into the L slot unit. The straight edge used for horizontal package alignment is not needed. Pin Description Transmitter VCC R1 C1 R2 C2 AFBR-15x9Z 1 Fiber port facing front, pins downward, 1 = Rightmost pin to 4 = Leftmost pin 8 2 3 68 4 5 5 1/2 SN75451 DATA 7 4 Note: This is an inverting circuitry, thus the LED is off in case of DATA "H". Therefore, an inverting receiver, e.g. AFBR-2529Z, should be used accordingly. Value Tolerance R1 2 k 5% R2 100  1% C1 0.1 F 20% C2 10 F 20% Pin Name Function/Description Notes 1 Anode LED Anode 2 Cathode LED Cathode 3 Pin No function, physical pin available, recommended to signal GND 4 Pin No function, physical pin available, recommended to signal GND 5 Housing Pin Physical pin available, recommended to chassis GND 1 8 Housing Pin Physical pin available, recommended to chassis GND 1 Figure 1. Recommended drive circuit Top View (IF,on = 30 mA nominal at TA = 25C) Regulatory Compliance Feature Test Method Performance Electrostatic Discharge (ESD) to the Electrical Pins Human Body Model MIL-STD-883 Method 3015 Min  2000 V Eye Safety IEC 60825-1,2 ,Class 1 Class 1 Specified Link Performance, TA = –40°C to +85°C, 10 MBd Parameter Min Max Unit Condition Note Link Distance with Standard Loss POF cable 0.1 50 m –40°C to +85°C 2 Link Distance with 200 m PCS cable 0.1 200 m –40°C to +85°C 3 Notes: 1. Pins 5 and 8 are for mounting and retaining purposes. Make sure they are electrically connected to Chassis GND. 2. POF is HFBR-R/EXXYYYZ plastic (1 mm) optical fiber. Worst-case attenuation used (0.27 dB/m for standard loss POF cable from –40C to +85C at 650 nm). Link performance is valid in combination with AFBR-26x4Z and AFBR-25x9Z. 3. PCS, worst-case attenuation (12 dB/km from –40C to +85C at 650 nm). 4 Absolute Maximum Ratings Parameter Symbol Min Max Unit Notes Storage and Operating Temperature TS,O –40 85 °C Transmitter Peaking Forward Input Current IF,PK 45 mA 1 Transmitter Short Term Peaking Forward Input Current IF, PKshort 80 mA 2 Transmitter Average Forward Input Current IF,AVG 30 mA Transmitter Reverse Input Voltage VR 3 V Notes: 1. For IF,PK > 30 mA the duty factor must maintain ≤ 30 mA IF,AVG and pulse width ≤ 1 s. 2. Maximum short term peaking forward current must not longer be applied than 5 ns to improve rise time or enhance signaling rate. Applying a short term peaking forward current shall not result in exceeding 30 mA average forward current. Recommended Operating Conditions Parameter Symbol Min Max Unit Notes Ambient Temperature, no air flow TA –40 Transmitter Average Forward Input Current IF,AVG 3 85 °C 1, 2 30 mA Signaling Rate fs DC 10 Mbd 3 Notes: 1. Recommended operating conditions are those values outside of which functional performance is not intended, device reliability is not implied, and damage to the device may occur over an extended period of time. Refer to the Reliability Data Sheet for specific reliability performance. 2. Measured at the housing. 3. Without peaking of the electrical input signal Process Compatibility Parameter Symbol Solder Environment Max Unit Notes TSOLD 260 °C 1, 3, 4 tSOLD 10 sec 2, 3, 4 Notes: 1. Maximum temperature refers to peak temperature. 2. Maximum time refers to time spent at peak temperature. 3. Solder surface to be at least 1 mm below lead frame stops. 4. Product is Moisture Sensitive Level 3. 5 Min Typical AFBR-15x9Z analog Transmitter The AFBR-15x9Z analog transmitter utilizes a 650 nm LED source in a housing designed to efficiently couple into 1 mm Polymer Optical Fiber (POF) or 200 m Plastic-Clad Silica (PCS). Links up to 50 meters are supported with 1 mm POF. Links up to 200 meters are supported with 200 m PCS. Electrical and Optical Characteristics (TA = –40°C to +85°C unless otherwise stated) Parameter Symbol Min Typical Max Unit Conditions Notes Peak Output Power, 1 mm POF, 30 mA PT –6 –1 2 dBm IF,DC = 30 mA 1, 2 Peak Output Power, 200 m PCS, 30 mA PT –18 –12 –9 dBm IF,DC = 30 mA 1, 2 Peak Output Power, 1 mm POF, 10 mA PT –11 –6 –3 dBm IF,DC = 10 mA 1, 2 Peak Output Power, 1 mm POF, 5 mA PT –14 –9 –6 dBm IF,DC = 5 mA 1, 2 Peak Output Power, 1 mm POF, 3 mA PT –16 –11 –8 dBm IF,DC = 3 mA 1, 2 Optical Power Temperature Coefficient PT/T –0.01 dB/K –40°C…+25°C Optical Power Temperature Coefficient PT/T –0.02 dB/K +25°C…+85°C Peak emission wavelength P Peak Emission wavelength Temperature coefficient /T 0.16 nm/K Spectral Width FWHM 20 nm Forward Voltage VF Forward Voltage temperature coefficient VF/T Reverse Input Breakdown voltage 630 650 685 1.4 9 Diode Capacitance 2.3 nm V IF,DC = 3 mA to 30 mA –1.6 mV/K IF,DC = 30 mA 20 V 70 pF Optical Rise time tr 30 30 ns 20% to 80% 3 Optical Fall time tf 30 ns 80% to 20% 3 Notes: 1. Optical power measured with polished connector end face at the end of 0.5 meters of 1 mm diameter POF with a numerical aperture (NA) of 0.5, or of 200 m diameter PCS, with NA=0.37. 2. Minimum average output power specification value includes 1dB degradation margin. 3. Using recommended drive circuit in Figure 1 for IF,DC =30mA 2.3 2 –40 qC 25 qC 85 qC 2.1 0 PT - OUTPUT POWER - dBm VF - FORWARD VOLTAGE - V 2.2 2 1.9 1.8 1.7 1.6 1.5 -4 -6 -8 -10 –40 qC 25 qC 85 qC -12 -14 1.4 -16 1 10 IF - TRANSMITTER DRIVE CURRENT - mA Figure 2. Typical forward voltage vs. drive current 6 -2 100 1 10 IF - TRANSMITTER DRIVE CURRENT - mA Figure 3. Typical optical output power, 1 mm POF vs. drive current 100 For product information and a complete list of distributors, please go to our web site: www.broadcom. com. Broadcom, the pulse logo, Connecting everything, Avago Technologies, and the A logo are among the trademarks of Broadcom in the United States, certain other countries and/or the EU. Copyright © 2016 Broadcom. All Rights Reserved. The term "Broadcom" refers to Broadcom Limited and/or its subsidiaries. For more information, please visit www.broadcom.com. Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others. AV02-4367EN – August 23, 2016
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