AFBR-2531CZ

AFBR-25x1CZ DC…5 Megabaud Versatile Link Fiber Optic Receiver for 1mm POF and 200µm PCS Data Sheet Description Features The AFBR-25x1CZ receiver consists of an IC with an integrated photodiode providing a TTL logic families compatible output. In combination with the Avago AFBR-15x9Z or AFBR-16x9Z transmitter any type of signal from DC up to 5MBd at distances up to 50 meters with 1mm 0.5NA POF and 500 meters with 200µm 0.37NA PCS is supported. • RoHS-compliant The receiver is a 4-pin device, packed in Versatile Link housing. Versatile Link components can be interlocked (N-plexed together) to minimize space and to provide dual connections with the duplex connectors. Various simplex and duplex connectors, as well as POF cables are available for Versatile Link components. Please contact Avago Technologies for details or visit our company website at www. avagotech.com • Up to 50 meter distance with 1mm Plastic Optical Fiber (POF); up to 500 meter distance with 200µm Polymer Cladding Silica (PCS) Fiber AFBR-25x1CZ devices have inverted output signals means that light_on will lead to Data_out low. • Optical Receiver for 5MBd systems and below Available options • Extension of RS-232 and RS-485 • Data transmission at signal rates from DC up to 5MBd • Receiver: integrated PIN diode and digitalizing IC with TTL output logic • Power-on reset (POR) • Operating temperature range of -40 °C to +85 °C • Compatible with Avago’s Versatile Link family of connectors, for easy termination of fiber Applications • Industrial control and factory automation Horizontal Package AFBR-2521CZ • High voltage insulation Vertical Package AFBR-2531CZ Tilted (30°) Package AFBR-2541CZ • Elimination of ground loops • Reduces voltage transient susceptibility • Drivers and Inverters Application Literature Handling Application Note 1035 (Versatile Link) - AV02-0730EN Versatile Link components are auto-insertable. When wave soldering is performed with Versatile Link components, the optical port plug should be left in to prevent contamination of the port. Do not use reflow solder processes (i.e., infrared reflow or vapor-phase reflow). Non-halogenated water soluble fluxes (i.e., 0% chloride), not rosin based fluxes, are recommended for use with Versatile Link components. Package and Handling Information The compact Versatile Link package is made of a flame retardant material and uses the same pad layout as a standard, eight-pin dual-in-line package. Horizontal, Vertical, and Tilted (30°) packages are available. These low profile Versatile Link packages are stackable and are enclosed to provide a dust-resistant seal. Snap action simplex, simplex latching, duplex, and duplex latching connectors are offered with simplex or duplex cables. Package Housing Color Versatile Link components and simplex connectors are color coded to eliminate confusion when making connections. Receiver packages are black and transmitters are in grey color respectively. Package Orientation Performance and pinouts for the horizontal, vertical, and tilted (30°) packages are identical. To provide additional attachment support for the vertical Versatile Link housing the designer has the option of using a self-tapping screw through a printed circuit board into a mounting hole at the bottom of the package. For most applications this is not necessary. 2 Versatile Link components are moisture sensitive devices and are shipped in a moisture sealed bag. If the components are exposed to air for an extended period of time, they may require a baking step before the soldering process. Refer to the special labeling on the shipping tube for details. Recommended chemicals for Cleaning/Degreasing Alcohols: methyl, isopropyl, isobutyl. Aliphatics: hexane, heptanes. Other: soap solution, naphtha. Do not use partially halogenated hydrocarbons such as 1,1.1 trichloroethane, ketones such as MEK, acetone, chloroform, ethyl acetate, methylene dichloride, phenol, methylene chloride, or N-methylpyrolldone. Also, Avago does not recommend the use of cleaners that use halogenated hydrocarbons because of their potential environmental harm. Interlocked (Stacked) Assemblies (refer to Figure 1) Horizontal packages may be stacked by placing units with pins facing upward. Initially engage the inter­ locking mechanism by sliding the L bracket body from above into the L slot body of the lower package. Use a straight edge, such as a ruler, to bring all stacked units into uniform alignment. This tech­ nique prevents potential harm that could occur to fingers and hands of assemblers from the package pins. Stacked horizontal packages can be disengaged if necessary. Repeated stacking and unstack­ing causes no damage to individual units. To stack vertical packages, hold one unit in each hand, with the pins facing away and the optical ports on the bottom. Slide the L bracket unit into the L slot unit. The straight edge used for horizontal package alignment is not needed. Stacking Horizontal Modules Stacking Vertical Modules Figure 1a. Interlocked (stacked) Horizontal packages Figure 1b. Interlocked (stacked) Vertical packages Tilted (30°) Module Figure 1c. Interlocked (stacked) Tilted (30°) packages 3 Mechanical Dimensions Horizontal Module Vertical Module 2.03 (0.080) 6.86 (0.270) 10.16 (0.400) 2.03 (0.080) 5.08 (0.200) 18.8 (0.74) 0.64 (0.025) 3.81 (0.150) MAX. 3.56 (0.140) MIN. 7.62 (0.300) 6.86 (0.27) 4.19 (0.165) 7.62 (0.30) 18.29 (0.720) 18.80 (0.740) 1.27 (0.050) 2.54 (0.100) 0.51 (0.020) 5.08 10.16 (0.200) (0.400) 0.64 (0.025) DIA. 1.85 (0.073) 2.77 (0.109) DIMENSIONS IN MILLIMETERS (INCHES). Figure 2a. Mechanical Dimensions - Horizontal packages Figure 2b. Mechanical Dimensions - Vertical packages 2 (0.08) Tilted (30°) Module 5.2 (0.21) 30° B 10.2 (0.40) A ∅0.7 (0.03) 0.4 (0.02) 2.54 (0.100) 0.5 (0.02) 1.3 (0.05) 1.1 (0.05) 10.1 (0.40) 19.3 (0.76) 8.7 (0.34) DIMENSIONS IN MILLIMETERS (INCHES). Figure 2c. Mechanical Dimensions - Tilted (30°) packages 4 2.8 (0.11) 4.6 (0.18) 6.6 (0.26) 0.6 (0.03) 15.2 (0.60) 7 18. 4) (0.7 2.2 (0.09) 7.62 (0.300) Versatile Link Printed Board Layout Dimensions Horizontal Module Vertical Module 7.62 (0.300) 2.54 (0.100) TOP VIEW 1.01 (0.040) DIA. 4 3 2 1 5 7.62 (0.300) TOP VIEW PCB EDGE 8 1.85 MIN. (0.073) DIMENSIONS IN MILLIMETERS (INCHES). Figure 3a. PCB Dimensions - Horizontal packages Figure 3b. PCB Dimensions - Vertical packages Tilted (30°) Module 7.62 (0.300) 1.01 DIA. (0.040) 2.54 (0.100) 8.7 (0.34) 0.5 (0.02) 1.01 DIA. (0.040) Bottom View DIMENSIONS IN MILLIMETERS (INCHES). Figure 3c. PCB Dimensions - Tilted (30°) packages 5 Pin Description Receiver RX 4 3 2 1 Fiber port facing front, pins downward, 1 = Rightmost pin to 4 = Leftmost pin Pin Name Function/Description Notes 1 Data Out Data Output 1, 2 2 VEE Ground 3 VCC Power Supply 3.3V ± 5% or 5V ± 5% 4 Pin No function, physical pin is available, recommended to signal GND 3 5 Housing Pin Physical pin is available, recommended to chassis GND 4 8 Housing Pin Physical pin is available, recommended to chassis GND 4 Notes: 1. TTL compatible data output 2. Light on at the receiver input will lead to a “low” output signal and light off to a “high” output signal. 3. It is recommended to connect this pin to signal GND 4. Pin 5 and 8 are for mounting and retaining purposes and should be connected to chassis GND. Regulatory Compliance Feature Test Method Performance Electrostatic Discharge (ESD) to the Electrical Pins Human Body Model MIL-STD-883 Method 3015 Min +/- 2000V Eye Safety IEC 60825-1,2 ,Class 1 Specified Link Performance, TA = -40 °C to +85 °C, 5 MBd Parameter Min. Max. Unit Condition Notes Link Distance with POF cable 0.1 50 meters -40°C to +85°C 5, 7 Link Distance with PCS 0.1 500 meters -40°C to +85°C 6, 7 Notes: 5. HFBR-R/EXXYYYZ is the part number for 1mm POF. Worst case attenuation used (0.27dB/m for standard loss POF cable from -40°C to +85°C at 660nm). 6. PCS, worst case attenuation (12dB/km from -40°C to +85°C at 650nm) 7. The optical link performance is guaranteed only with transmitters AFBR-15x9Z (>20mA forward current) or AFBR-16x9Z Recommended Application Circuit GND Gnd 5 L2 VEE Data Out 1 Figure 4. Recommended Application Circuit 6 C4 100 nF 2 GND VCC 1 µH 3 8 Gnd RX NC VCC 4 GND GND TTL Output C2 10 µF GND C6 10 µF GND Absolute Maximum Ratings Parameter Symbol Min. Storage Temperature TS Ambient Temperature TC Relative Humidity Max. Unit Notes –40 95 °C 1 -40 85 °C 1 RH 0 85 % 1 Supply Voltage VCC –0.5 6 V 1 Data Output Current IO 10 mA 1 5 MBd Data Rate Typ. DC Notes: 1. Absolute Maximum Ratings are those values beyond which damage to the device may occur if these limits are exceeded for other than a short period of time. Recommended Operating Conditions Parameter Symbol Min. Typ. Max. Unit Notes Ambient Temp TA -40 25 85 °C 2 Supply Voltage VCC 3.135 3.3 3.465 V 2 4.75 5 5.25 V 2 Notes: 2. Recommended operating conditions are those values outside of which functional performance is not intended, device reliability is not implied, and damage to the device may occur over an extended period of time. See Reliability Data Sheet for specific reliability performance. Process Compatibility Parameter Symbol Max. Unit Notes Solder Environment TSOLD 260 °C 3, 5, 6 tSOLD 10 sec 4, 5, 6 Notes: 3. Maximum temperature refers to peak temperature. 4. Maximum time refers to time spent at peak temperature. 5. Solder surface to be at least 1.6mm below lead frame stops. 6. Product is moisture sensitive level 3. 7 Min. Typ. AFBR-25x1CZ Receiver The AFBR-25x1CZ receiver consists of a digitalizing IC with integrated photodiode to produce an output level that is compatible with TTL logic. The integrated photodiode and the following amplifier use a fully differential approach with an active and a passive area for an improved EMI performance. Within the specified ranges the AFBR-25x1CZ devices support a BER