AFBR-59F3Z

AFBR-59F3Z Compact 650 nm Transceiver for 1 Gbps Data communication MLCC (Multilevel Coset Coded) over POF (Polymer Optical Fiber) Data Sheet Description Features The Avago Technologies' AFBR-59F3Z transceiver provides system designers with the ability to support serial communication to data rates of one Gigabit over 2.2 mm jacketed standard Polymer Optical Fiber (POF). • Easy bare fiber termination solution for 2.2 mm jacketed standard POF The innovative bare fiber locking mechanism of the transceiver allows connection of POF cable with a simple insert-and-lock system; no connectors are required. This enables very fast installation and maintenance. This very compact designed Laser Class 1 product is UL listed, lead free and compliant with RoHS. The form factor is similar to the well known RJ-45 connector. • EMI/EMC robust • Link lengths 50 m for 1 Gbps transmission with 1 mm core diameter POF (attenuation smaller than 0.19 dB/m and NA = 0.5) • Operating temperature range 0 °C to 70 °C • 3.3 V power supply operation • Integrated optics to efficiently focus light for fiber coupling Transmitter • Analog receive power monitor (MON) The transmitter contains a 650 nm LED, which is driven by a fully integrated driver IC. The LED driver operates at 3.3 V. The IC is a linear integrated LED driver with differential input signals. It converts the input voltage linear in an output current for the LED. The driver needs an active PowerEnable signal for active current output. With a Low signal on the PowerEnable pin, the driver is set to power-saving state. LED and IC are packaged in an optical subassembly. Applications • Home/Office Networking • Factory automation • Industrial vision system Package The optical subassembly couples the optical output power over a optic lens efficiently into the POF fiber. The transceiver package contains the two optical subassemblies, which are mounted in the housing for bare fiber connection. Receiver The metal shield on the bare fiber clamp transceiver provides excellent immunity to EMI/EMC. The receiver device utilizes an integrated fiber optical receiver offering an integrated PIN photodiode together with the necessary amplifiers, which provide direct conversion of light to differential analog output signal. Receiver circuitry provides an analog receive power monitor output proportional to the amount of optical light at the receiver. The integrated receiver is packaged in an optical subassembly. This optical subassembly couples the optical power efficiently from POF fiber to the receiving PIN. The integrated IC operates at 3.3V. The receiver can be set into a power-saving state by externally forcing the monitoring pin to a voltage above a threshold. Pin description and recommended PCB footprint AFBR-597F3Z has ten active signal pins (including supply voltage and ground pins), two EMI shield solder posts, two additional ground pins and two mounting posts, which exit at the bottom of the housing. The mounting posts are to provide additional mechanical strength to hold the transceiver module on the application board. Figure 1 shows the top view of the PCB footprint and Pinout diagram. The EMI shield and the additional ground pins (11,12,13 & 14) are isolated from the internal circuit of the transceiver and are to be connected to equipment chassis ground. Pin Descriptions Pin No. Name Symbol Pin No. Name Symbol 1 Data Input (Negative) TDN 8 Imon/Rx_En IMON/ Rx_EN 2 Data Input (Positive) TDP 9 Data Output (Negative) RDN 3 Ground Tx GND 10 Data Output (Positive) RDP 4 Supply Voltage Tx Vdd 11 Chassis GND 5 Tx_ Enable Tx_En 12 Chassis GND 6 Supply Voltage Rx Vdd 13 Chassis GND 7 Ground Rx GND 14 Chassis GND ∅0 0 0.76 2.03 3.3 4.57 5.84 Top View .8 ( 10× ) 7.74 5.2 4.0 1 4 3 5 7 6 9 8 12 ∅1 ∅3.2 .3 (2 ×) 13 2×) .3 ( ∅1 10 11 0 2.74 2 (2×) Mount Post Unplated (2×) 14 Outer edge housing 7.83 5.83 3.89 0 Figure 1. PCB footprint and Pin-out diagram 2 ▼ FRONT ▼ Dimension: mm Recommended PCB thickness: 1.57 ± 0.08 Recommended compliance table Feature Test Method Performance Electrostatic discharge (ESD) to the electrical Pins JESD22-A114 Withstands up to 2 kV HBM applied between the electrical pins. Eye safety EN 60825-1:52007 Laser Class 1 product (LED radiation only). Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in isolation, all other parameters having values within the recommended operation conditions. It should not be assumed that limiting values of more than one parameter can be applied to the products at the same time. Exposure to the absolute maximum ratings for extended periods can adversely affect device reliability. Parameter Symbol Min. Max. Units Supply Voltage Vdd Max -0.5 4.5 V Storage Temperature TSTG -40 85 °C Lead Soldering Temperature [1] Tsold 260 °C Lead Soldering Time [1] tsold 10 s Electrostatic Voltage Capability [2] ESD 2.0 kV Installation temperature [3] TI 50 °C 0 Notes: 1. The transceiver is Pb-free wave solderable. According to JEDEC J-STD-020D, the moisture sensitivity classification is MSL2a. 2. ESD Capability for all Pins HBM (human body model) according JESD22-A114B. 3. Temperature range over which fibers can be connected or disconnected to or from the bare fiber clamp. Recommended Operating Conditions Parameter Symbol Min. Typ. Max. Units Operating temperature TA 0 25 70 °C DC Supply Voltage VDD 3.14 3.30 3.47 V All the data in this specification refers to the operating conditions above and over lifetime, unless otherwise stated. Mechanical Characteristics Parameter Min. Fiber/Cable Retention Force [5] Typ. Max. 30 15 Clamp opening force 50 20 10 Clamp closing force 30 13 5 20 Units Temp. [°C] N 25 N 0...70 N 25 N 0....50 [4] N 25 N 0....50 [4] Notes: 4. Temperature range over which fibers can be connected or disconnected to or from the bare fiber clamp. 5. Measured with Avago’s AFBR-HUDxxxZ (2.2mm duplex-fiber, PE-jacket, without connector) with 100mm/ min traction speed. 3 Transmitter Electrical Characteristics Parameter Symbol Current Consumption Idd Current Consumption – disabled Idd, Dis Symbol Rate SR Input Impedance to GND ZIN, SE Common Mode input voltage VIN, CM Differential Input Voltage Swing [1] VIN,DIFF Transmitter Enable Input Low Voltage [2] VIL Transmitter Enable Input High Voltage [2] VIH Min. 0.4 Typ. Max. Units 47 55 mA 0.6 0.8 mA 312.5 MSps Ω 64 190 240 300 mV 960 1200 mVpk-pk -0.3 0.8 V 2.0 VDD+0.3 V Notes: 1. To avoid clipping, the differential input amplitude swing must not exceed 4 × VCM. 2. The transmitter enable PIN has an internal pull-up resistor. Transmitter Optical Characteristics Parameter Symbol Min. Typ. Max. Units Central wavelength lC 635 650 675 nm Spectral Bandwidth (RMS) Dl 17 nm Average Output Power [3] P -6.0 -2.1 0.5 dBm Extinction Ratio [3] ER 8 10 Optical Rise Time (10% - 90%) [3, 4] tR 2.3 4.0 ns Optical Fall Time (90% - 10%) [3, 4] tF 2.6 4.0 ns dB Notes: 3. Measured with binary modulation at a data rate of 125 MBd and with typical VIN,CM and VIN,DIFF. The output power coupled into the POF is measured with a large area detector at the end of 1 m POF with NA = 0.5, which is ideally coupled to the transmitter. 4. Measured with 62.5 MHz square signal. Receiver Electrical Characteristics Parameter Symbol Min. Typ. Max. Units Current Consumption Idd 12 14 20 mA Current Consumption – disabled Idd, Dis 0.5 0.7 0.9 mA Output Common Mode Voltage VOUT, CM 1.18 1.23 1.28 V Differential Output Voltage Swing [5] VOUT,DIFF 180 240 300 mVpk-pk Single-Ended Output Resistance ZOUT,SE 75 W Differential Output Resistance ZOUT,DIFF 150 W Startup Time from Powersaving tON 300 ns Shutdown Time to Powersaving tOFF 125 ns Monitoring Output/Optical Input IMON/ Pin 0.23 A/W Max. Monitor Voltage [6] VMON,MAX Input voltage for power save mode VMON,PS-TH 1.3 1.8 V V Notes: 5. Conditions: Extinction ratio of optical input signal equal to 10 dB, differential load=150 W. 6. Monitor current is limited by VMON,MAX/Load resistance Receiver Optical Characteristics Parameter Symbol Min. Typ. Max. Units Central wavelength lC 635 650 675 nm 4 Informative section Avago cannot guarantee the following parameters and values because they also depend on the performance of the PHY chips. However, you can use them to calculate the 1 Gbps link budget. Furthermore, you can use them to gauge link performance. Transmitter Optical Characteristics Parameter Symbol Min. Typ. Max. Units Average Output Power for 1 Gbps [1] POUT 1Gbps -5.8 -1.9 0.7 dBm Parameter Symbol Min. Typ. Max. Units Receiver Input Power for 1 Gbps [1, 2] Pin 1Gbps Min -17.5 3 dBm Parameter Symbol Min. Max. Units Link distance [1, 3] l 50 Unstressed Receiver Optical Characteristics Link Performance Typ. m Notes: 1. 1 Gbps transmission based on PAM16 modulation. Tested with KDPOF KD1001 PHY-IC. 2. Only optical attenuator is used to degrade the optical input test signal to the receiver. 3. POF parameters: attenuation smaller than 0.19 dB/m, 1 mm core diameter and NA of 0.5. Direct connection between Tx and Rx without inline connector or any additional attenuation. 5 2.54 (6x) 2.54 5.2 9.4 ± 0.2 0 4.0 ± 0.15 2.74 6.65 1.52 7.78 11.65 1.27 (8x) Mechanical Data - Package Outline 15.9 ± 0.15 4.9 6 0.25 ± 0.05 (10×) 2.6 3.75 ± 0.2 3 11.4 10.85 ± 0.2 0.9 ± 0.15 0.25 ± 0.05 0.5 ± 0.05 (10×) 15.8 ± 0.2 15 Notes: 1. Dimension: mm 2. General tolerance: ±0.1 3. Recommended PCB thickness: 1.57 ± 0.08 4. Design related is a small gap between plastic part and dust plug possible. Function is nevertheless given. 24.4 ± 0.25 Clamp open Clamp with Dust Plug +0.4 [4] 12 ± 0.2 15.5 ± 0.25 29.2 -0.2 Figure 2. Package Outline Drawing 6 Application Circuit The recommended application circuit is shown in Figure 3. It shows the minimum external circuitry at DC-coupling for the connection of the AFBR-59F3Z to the KDPOF 1001-PHY. AFBR-59F3Z [1] OFE_RXP 237Ω OFE_RXN RDP [1] RDN Imon/Rx_EN OFE_PMON OFE_Rx_EN_N KDPOF1001-PHY GND [3] 10 µF 10 µF 3.3V GND Tx_EN OUT 3.3V GND TxOUT_P 100 nF Vdd Rx Tx_EN Tx 1 µH 1 µH 10 µF 10 µF 100 nF Vdd GND TDP [2] TxOUT_N GND TDN [2] Notes: Chassis GND 1. Single-ended output impedance, ZOUT,SE = 75 Ω. 2. Single-ended input impedance, ZIN,SE = 64 Ω. 3. Choose a suitable resistor value such that the output monitor voltage is not saturated. Refer to Figure 4. Figure 3. Application Circuit with KDPOF KD1001 PHY-IC configuration Figure 4 depicts the relationship between monitor voltage and POF length with 10 kΩ, 20 kΩ and 47 kΩ. Monitor voltage vs. POF length 1.6 1.4 1.2 Vmon (V) 1 0.8 Vmon(10k) 0.6 Vmon(20k) Vmon(47k) 0.4 0.2 0 60 50 Figure 4. Typical Vmon vs. POF length 7 40 30 POF length (m) 20 10 0 For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. AV02-4655EN - December 17, 2014