AFBR-742BEZ

AFBR-732BZ/BEZ/BEHZ and AFBR-742BZ/BEZ/BEHZ Ultra Short Link Pluggable Parallel Fiber Optic Modules, Transmitter and Receiver Data Sheet Description The AFBR-732BZ transmitter and AFBR-742BZ receiver are high performance fiber optic modules for parallel optical data communication applications. These 12-channel devices, operating up to 2.5Gbd per channel, provide a cost effective solution for short-reach applications requiring up to 30 Gb/s aggregate bandwidth. These modules are designed to operate on multimode fiber systems at a nominal wavelength of 850 nm. They incorporate high performance, highly reliable, short wavelength optical devices coupled with proven circuit technology to provide long life and consistent service. The AFBR-732BZ transmitter module incorporates a 12- channel VCSEL (Vertical Cavity Surface Emitting Laser) array together with a custom 12-channel laser driver integrated circuit providing IEC-60825 and CDRH Class 1M laser eye safety. The AFBR-742BZ receiver module contains a 12channel PIN photodiode array coupled with a custom preamplifier / post amplifier integrated circuit. Operating from a single +3.3 V power supply, both modules provide LVTTL or LVCMOS control interfaces and Current Mode Logic (CML) compatible data interfaces to simplify external circuitry. The transmitter and receiver devices are housed in MTP®/MPO receptacled packages. Electrical connections to the devices are achieved by means of a pluggable 10 x 10 connector array. Features • RoHS Compliant • Low cost per Gb/s • High package density per Gb/s • 3.3 volt power supply for low power consumption • 850 nm VCSEL array source • 12 independent channels per module • Separate transmitter and receiver modules • 2.5 Gbd data rate per channel • Standard MTP® (MPO) ribbon fiber connector interface • Pluggable package • 50/125 micron multimode fiber operation: Distance up to 50 m with 50um, 500 MHz.km fiber at 2.5 Gbd • Data I/O is CML compatible • Control I/O is LVTTL compatible • Manufactured in an ISO 9002 certified facility Applications • Proprietary Ultra short link interconnects Ordering Information The AFBR-732BZ and AFBR-742BZ products are available for production orders through the Avago Component Field Sales office. AFBR-732BZ No EMI Nose Shield, with Heatsink AFBR-742BZ No EMI Nose Shield, with Heatsink AFBR-732BEZ With EMI Nose Shield, with Heatsink AFBR-742BEZ With EMI Nose Shield, with Heatsink AFBR-732BEHZ With EMI Nose Shield, No Heatsink AFBR-742BEHZ With EMI Nose Shield, No Heatsink Design Summary: Design for low-cost, high-volume manufacturing Avago’s parallel optics solution combines twelve 2.5 Gb/s channels into discrete transmitter and receiver modules providing a maximum aggregate data rate of 30 Gb/s. Moreover, these modules employ a heat sink for thermal management when used on high-density cards, have excellent EMI performance, and interface with the industry standard MTP®/MPO connector systems. They provide the most cost-effective highdensity (Gb/s per inch) solutions for high-data capacity applications. See Figure 1 for the transmitter and Figure 2 for the receiver block diagrams. The AFBR-732BZ transmitter and the AFBR742BZ receiver modules provide very closely spaced, high-speed parallel data channels. Within these modules there will be some level of cross talk between channels. The cross talk within the modules will be exhibited as additional data jitter or sensitivity reduction compared to single-channel performance. Avago Technologies’ jitter and sensitivity specifications include cross talk penalties and thus represent real, achievable module performance. Functional Description, Transmitter Section The transmitter section, Figure 1, uses a 12channel 850 nm VCSEL array as the optical source and a diffractive optical lens array to launch the beam of light into the fiber. The package and connector system are designed to allow repeatable coupling into standard 12-fiber ribbon cable. In addition, this module has been designed to be compliant with IEC 60825 Class 1M eye safety requirements. The optical output is controlled by a custom IC, which provides proper laser drive parameters and monitors drive current to ensure eye safety. An EEPROM and state machine are programmed to provide both ac and dc current drive to the laser to ensure correct modulation, eye diagram over variations of temperature and power supply voltages. Functional Description, Receiver Section The receiver section, Figure 2, contains a 12channel AlGaAs/ GaAs photodetector array, transimpedance preamplifier, filter, gain stages to amplify and buffer the signal, and a quantizer to shape the signal. The Signal Detect function is designed to sense the proper optical output signal on each of the 12 channels. If loss of signal is detected on an individual channel, that channel output is squelched. Packaging The flexible electronic subassembly was designed to allow high-volume assembly and test of the VCSEL, PIN photo diode and supporting electronics prior to final assembly. Regulatory Compliance The overall equipment design into which the parallel optics module is mounted will determine the certification level. The module performance is offered as a figure of merit to assist the designer in considering their use in the equipment design. Organization Recognition See the Regulatory Compliance Table for a listing of the standards, standards associations and testing laboratories applicable to this product. Electrostatic Discharge (ESD) There are two design cases in which immunity to ESD damage is important. The first case is during handling of the module prior to mounting it on the circuit board. It is important to use normal ESD handling precautions for ESD sensitive devices. These precautions include using grounded wrist straps, work benches, and floor mats in ESD controlled areas. The second case to consider is static discharges to the exterior of the equipment chassis containing the module parts. To the extent that the MTP® (MPO) connector receptacle is exposed to the outside of the equipment chassis it may be subject to system level ESD test criteria that the equipment is intended to meet. See the Regulatory Compliance Table for further details. 2 COMPARATOR SHUT DOWN AMPLIFIER 12 DIN+ INPUT STAGE LEVEL SHIFTER 12 DRIVER D/A CONVERTER DIN- 12 VCSEL ARRAY SERIAL CONTROL I/O* 4 CONTROLLER D/A CONVERTER TEMPERATURE DETECTION CIRCUIT Figure 1. Transmitter block diagram(each channel). * TX_EN, TX_DIS, RESET-, FAULT- OFFSET CONTROL PIN DOUT+ TRANSIMPEDANCE PRE-AMPLIFIER LIMITING AMPLIFIER OUTPUT BUFFER DOUT- SIGNAL DETECT CIRCUIT SD Figure 2. Receiver block diagram (each channel). 3 Electromagnetic Interference (EMI) Many equipment designs using these high-datarate modules will be required to meet the requirements of the FCC in the United States, CENELEC in Europe and VCCI in Japan. These modules, with their shielded design, perform to the levels detailed in the Regulatory Compliance Table. The performance detailed in the Regulatory Compliance Table is intended to assist the equipment designer in the management of the overall equipment EMI performance. However, system margins are dependent on the customer board and chassis design. Immunity Equipment using these modules will be subject to radio frequency electromagnetic fields in some environments. These modules have good immunity due to their shielded designs. See the Regulatory Compliance Table for further detail. Eye Safety These 850 nm VCSEL-based modules provide eye safety by design. The AFBR-732BZ has been registered with CDRH and certified by TUV as a Class 1M device under Amendment 2 of IEC 60825-1. See the Regulatory Compliance Table for further detail. If Class 1M exposure is possible, a safety-warning label should be placed on the product stating the following: LASER RADIATION DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS CLASS 1M LASER PRODUCT Connector Cleaning The optical connector used is the MTP® (MPO). The optical ports have recessed optics that are visible through the nose of the ports. The provided port plug should be installed any time a fiber cable is not connected. The port plug ensures the optics remain clean and no cleaning should be necessary. In the event the optics become contaminated, forced nitrogen or clean dry air at less than 20 psi is the recommended cleaning agent. The optical port features, including guide pins, preclude use of any solid instrument. Liquids are not advised due to potential damage. Process Plug Each parallel optics module is supplied with an inserted process plug for protection of the optical ports within the MTP® (MPO) connector receptacle. Handling Precautions The AFBR-732BZ and AFBR-742BZ can be damaged by current surges and overvoltage conditions. Power supply transient precautions should be taken. Application of wave soldering, reflow soldering and/or aqueous wash processes with the parallel optic device on board is not recommended as damage may occur. Normal handling precautions for electrostatic sensitive devices should be taken (see ESD section). The AFBR-732BZ is a Class 1M laser product. DO NOT VIEW RADIATION DIRECTLY WITH OPTICAL INSTRUMENTS. 4 Absolute Maximum Ratings [1,2] Parameter Storage Temperature (non-operating) Case Temperature (operating) Supply Voltage Data/Control Signal Input Voltage Transmitter Differential Data Input Voltage Output Current (dc) Relative Humidity (non-condensing) Symbol TS TC VCC VI |VD| ID RH Min. –40 Max. 100 90 Unit °C °C V V V mA % Reference 1 1, 2, 4 1, 2 1 1, 3 1 1 –0.5 –0.5 4.6 VCC + 0.5 2 25 5 95 Notes: 1. Absolute Maximum Ratings are those values beyond which damage to the device may occur. See Reliability Data Sheet for specific reliability performance. 2. Between Absolute Maximum Ratings and the Recommended Operating Conditions functional performance is not intended, device reliability is not implied, and damage to the device may occur over an extended period of time. 3. This is the maximum voltage that can be applied across the Transmitter Differential Data Inputs without damaging the input circuit. 4. Case Temperature is measured as indicated in Figure 3. Recommended Operating Conditions [1] Parameter Case Temperature Supply Voltage Signaling Rate per Channel Data Input Differential Peak-to-Peak Voltage Swing Control Input Voltage High Control Input Voltage Low Power Supply Noise for Transmitter and Receiver Transmitter/Receiver Data I/O Coupling Capacitors Receiver Differential Data Output Load DVDINP-P VIH VIL NP CAC RDL 0.1 Symbol TC VCC Min. 0 3.135 1 175 Typ. 40 3.3 Max. 80 3.465 2.5 1400 Unit °C V Gbd mVP-P V V mVP-P µF Ω Reference 2, Figs. 3, 4 Figs. 5, 6, 12 3 4, Figs. 7, 8 2.0 VEE VCC 0.8 200 5, Figs. 5, 6 Fig. 7 100 Fig. 7 Notes: 1. Recommended Operating Conditions are those values outside of which functional performance is not intended, device reliability is not implied, and damage to the device may occur over an extended period of time. See Reliability Data Sheet for specific reliability performance. 2. Case Temperature is measured as indicated in Figure 3. A +55 °C, 1 m/s, parallel to the printed circuit board, air flow at the module or equivalent cooling is required. See Figure 4. 3. The receiver has a lower cut off frequency near 100 kHz. 4. Data inputs are CML compatible. Coupling capacitors are required to block DC. ∆VDINP-P = ∆VDINH – ∆VDINL, where ∆VDINH = High State Differential Data Input Voltage and ∆VDINL = Low State Differential Data Input Voltage. 5. Power Supply Noise is defined for the supply, VCC, over the frequency range from 500 Hz to 2500 MHz, with the recommended power supply filter in place, at the supply side of the recommended filter. See Figures 5 and 6 for recommended power supply filters. 5 Electrical Characteristics Transmitter Electrical Characteristics (TC = 0 °C to +80 °C, VCC = 3.3 V ± 5%, Typical TC = +40 °C, VCC = 3.3 V) Parameter Supply Current Power Dissipation Differential Input Impedance FAULT Assert Time RESET Assert Time RESET De-assert Time Transmit Enable (TX_EN) Assert Time Transmit Enable (TX_EN) De-assert Time Transmit Disable (TX_DIS) Assert Time Transmit Disable (TX_DIS) De-assert Time Power On Initiation Time Control I/Os |Input Current High | Symbol ICCT PDIST Zin TOFF TOFF TON TON TOFF TOFF TON TINT |IIH| |IIL| VOL VOH Min. Typ. 364 1.2 Max. 415 1.45 120 250 7.5 100 100 7.5 7.5 100 100 0.5 0.5 Unit mA W W µs µs ms ms µs µs ms ms mA mA V V Reference (Conditions) Fig. 6 80 100 200 5 55 55 5 5 55 60 1, Fig. 7, 11 Fig. 13 Fig. 14 Fig. 14 Fig. 15 2, Fig. 15 Fig. 15 Fig. 15 Fig. 12 (2.0 V < VIH < VCC) (VEE < VIL < 0.8 V) (IOL = 4.0 mA) (IOH = –0.5 mA) (TX_EN, TX_DIS | Input Current Lo w| FAULT, RESET) Compatible Output Voltage Low Output Voltage High VEE 2.5 3.3 0.4 VCC Notes: 1. Differential impedance is measured between DIN+and DIN– over the range 4 MHz to 2 GHz. 2. When the control signal Transmitter Enable, Tx_EN, is used to disable the transmitter, Tx_EN must be taken to a logic low-state level (VIL) for one millisecond or longer. Similarly, if the control signal Transmitter Disable, Tx_DIS, is used, then Tx_DIS must be taken to a logic high- state level (VIH) for one millisecond or longer. 6 Receiver Electrical Characteristics (TC = 0 °C to +80 °C, VCC = 3.3 V ± 5%, Typical TC = +40 °C, VCC = 3.3 V) Parameter Supply Current Power Dissipation Differential Output Impedance Data Output Differential Peak-to-Peak Voltage Swing Inter-channel Skew Differential Data Output Rise/Fall Time Signal Detect Assert Time (OFF-to-ON) De-assert Time (ON-to-OFF) Control I/O Output Voltage Low LVTTL & LVCMOS Output Voltage High Compatible Symbol ICCR PDISR ZOUT DVDOUTP-P Min. Typ. 400 1.3 Max. 445 1.55 120 750 Unit mA W W mVP-P ps ps µs µs Reference (Conditions) 1, Fig. 5 80 450 100 600 2, Fig. 8, 10 3, Figs. 7, 8 100 tr/tf tSDA tSDD VOL VOH VEE 2.5 110 170 190 150 150 4 5 6 7 (IOL = 4.0 mA) (IOH = -0.5 mA) 3.1 0.4 VCC V V Notes: 1. ICCR is the dc supply current, dependent upon the number of active channels, where the Data Outputs are ac coupled with capacitors between the outputs and any resistive terminations. See Figure 7 for recommended termination. 2. Measured over the range 4 MHz to 2 GHz. 3. DVDOUTP-P = DVDOUTH – DVDOUTL, where DVDOUTH = High State Differential Data Output Voltage and DVDOUTL = Low State Differential Data Output Voltage. DVDOUTH and DVDOUTL = VDOUT+ – VDOUT–, measured with a 100 W differential load connected with the recommended coupling capacitors and with a 2500 MBd, 8B10B serial encoded data pattern. 4. Inter-channel Skew is defined for the condition of equal amplitude, zero ps skew input signals. Input power at –10 dBm. 5. Rise and Fall Times are measured between the 20% and 80% levels using a 500 MHz square wave signal. 6. The Signal Detect output will change from logic “0” (Low) to “1” (High) within the specified assert time for a step transition in optical input power from the de-asserted condition to the specified asserted optical power level on all 12 channels. 7. The Signal Detect output will change from logic “1” (High) to “0” (Low) within the specified de-assert time for a step transition in optical input power from the specified asserted optical power level to the de-asserted condition on any 1 channel. 7 Optical Characteristics Transmitter Optical Characteristics (TC = 0 °C to +80 °C, VCC = 3.3 V ± 5%, Typical TC = +40 °C, VCC = 3.3 V) Parameter Output Optical Power Output Optical Power – Off State Optical Modulation Amplitude Center Wavelength Spectral Width – rms Rise/Fall Time Inter-channel Skew Relative Intensity Noise Jitter Contribution Deterministic Total Symbol POUT POUT DIS OMA lC s tr/tf Min. Typ. Max. –1 –30 Unit dBm avg. dBm avg. dBm Reference 1 -9.84 830 850 0.4 50 110 860 0.85 150 200 –124 nm nm rms ps ps dB/Hz 2 3 RIN DJ TJ 80 162 psp-p psp-p 4 5 Notes: 1. The specified optical output power, measured at the output of a short test cable, will be compliant with IEC 60825-1 Amendment 2, Class 1 Accessible Emission Limits, AEL, and the output power of the module without an attached cable will be compliant with the IEC 60825-1 Amendment 2, Class 1M AEL. See discussion in the Regulatory Compliance section. 2. These are unfiltered 20-80% value measured with optical-electrical converter with 12 GHz bandwidth. To increase accuracy of measurement owning to laser overshoot and ringing, a filtered rise/fall time measurement is adopted with a 2.5Gbps (1.875 GHz bandwidth) 4th Bessel Thompson filter. A max spec of 150 ps for unfiltered waveform is equivalent to a max spec 242 ps for filtered waveform. 3. Inter-channel Skew is defined for the condition of equal amplitude, zero ps skew input signals. 4. Deterministic Jitter (DJ) is defined as the combination of Duty Cycle Distortion (Pulse-Width Distortion) and Data Dependent Jitter. Deterministic Jitter is measured at the 50% signal threshold level using a 2.5 GBd K28.5, or equivalent, test pattern with zero skew between the differential data input signals. 5. Total Jitter (TJ) includes Deterministic Jitter and Random Jitter (RJ). Total Jitter is specified at a BER of 10-12 for the same 2.5 GBd test pattern as for DJ. 8 Receiver Optical Characteristics (TC = 0 °C to +80 °C, VCC = 3.3 V ± 5%, Typical TC = +40 °C, VCC = 3.3 V) Parameter Input Optical Power Sensitivity (OMA) Input Optical Power Saturation (OMA) Operating Center Wavelength Stressed Receiver Sensitivity (OMA) Stressed Receiver Eye Opening Return Loss Signal Detect Asserted (OMA) De-asserted (OMA) Hysteresis 120 12 19 Symbol PIN MIN PIN MAX lC Min. Typ. Max. -13 Unit dBm dBm Reference 1 2 –1.22 830 860 -11.8 nm dBm ps dB 3 4 5 PA PD PA-PD -15 -35 0.5 -21 2 dBm dBm dB 6 Notes: 1. Sensitivity is defined as the OMA necessary to produce a BER of 10-12 at the center of the Baud interval using a 2.5 GBd Pseudo Random Bit Sequence of length 27 – 1 (PRBS), or equivalent, test pattern. For this parameter, input power is equivalent to that provided by an ideal source, i.e., a source with RIN and switching attributes that do not degrade the sensitivity measurement. All channels not under test are operating receiving data with an average input power up to 6 dB above PIN MIN. 2. Saturation is defined as the OMA that produces at the center of the output swing a receiver output eye width less than 120 ps where BER < 10-12 using a 2.5 GBd Pseudo Random Bit Sequence of length 27 –1 (PRBS), or equivalent, test pattern. 3. Stressed receiver sensitivity is defined as the average input power necessary to produce a BER < 10-12 at the center of the Baud interval using a 2.5 GBd Pseudo Random Bit Sequence of length 27 – 1 (PRBS), or equivalent, test pattern. For this parameter, input power is conditioned with 2.5 dB Inter-Symbol Interference, ISI, (min), 120 ps Total Jitter, TJ (min). All channels not under test are operating receiving data with an average input power up to 6 dB above PIN MIN. 4. Stressed receiver eye opening is defined as the receiver output eye width where BER < 10-12 at the center of the output swing using a 2.5 GBd Pseudo Random Bit Sequence of length 27 – 1 (PRBS), or equivalent, test pattern. For this parameter, input power is an average input optical power of –10.4 dBm and conditioned with 1.2 dB ISI (min), 120 ps TJ (min), All channels not under test are operating receiving data with an average input power up to 6 dB above PIN MIN. 5. Return loss is defined as the ratio, in dB, of the received optical power to the optical power reflected back down the fiber. 6. Signal Detect assertion requires all optical inputs to exhibit a minimum -15 dBm OMA. All channels not under test are operating with PRBS 7 serial encoded patterns, asynchronous with the channel under test, and an average input power up to 6 dB higher than PIN MIN. 9 Regulatory Compliance Table Feature Electrostatic Discharge (ESD) to the Electrical Pads Test Method JEDEC Human Body Model (HBM) (JESD22-A114-B) JEDEC Machine Model (MM) Performance Transmitter Module > 1000 V Receiver Module > 2000 V Transmitter Module > 50 V Receiver Module > 200 V Typically withstands at leasr 6 kV air discharge (with module biased) without damage. Electrostatic Discharge (ESD) to the Connector Receptacle Electromagnetic Interference (EMI) Immunity Variation of IEC 61000-4-2 FCC Part 15 CENELEC EN55022 (CISPR 22A) VCCI Class 1 Variation of IEC 61000-4-3 Typically pass with 10 dB margin. Actual performance dependent on enclosure design. Typically minimal effect from a 10 v/m field swept from 80 MHz to 1 GHz applied to the module without a chassis enclosure. POUT: IEC AEL & US FDA CRDH Class 1M CDRH Accession Number: 9720151-22 TUV Certficate Number: E2171095.04 UL File Number: E173874 Laser Eye Safety and Equipment Type Testing IEC 60825-1 Amendment 2 CFR 21 Section 1040 Component Recognition Underwriters Laboratories and Canadian Standards Association Joint Component Recognition for Information Technology Equipment including Electrical Business Equipment RoHS Complaince Less than 1000ppm of Cadmium, lead, mercury, hexavalent chromium, polybrominated biphenyls, and polybrominated biphenyl ethers 10 Table 1. Transmitter Module Pad Description Symbol VEE VCCT DIN0+ through DIN11+ Functional Description Transmitter Signal Common. All voltages are referenced to this potential unless otherwise indicated. Directly connect these pads to transmitter signal ground plane. Transmitter Power Supply. Use recommended power supply filter circuit in Figure 6. Transmitter Data In+ for channels 0 through 11, respectively. Differential termination and self bias are included, see Figure 11. Transmitter Data In- for channels 0 through 11, respectively. Differential termination and self bias are included; see Figure 11. TX Enable. Active high. Internal pull-up High = VCSEL array is enabled if TX_DIS is inactive (Low). Low = VCSEL array is off. TX_EN must be taken to a logic low state level (VOL) for 1 ms or longer. TX Disable. Active high. Internal pull-down Low = VCSEL array is enabled if TX_EN is active (High). High = VCSEL array is off. TX_DIS must be taken to a logic High state level (VOH) for 1 ms or longer. Transmitter RESET- input. Active low. Internal pull-up. Low = Resets logic functions, clears FAULT- signal, VCSEL array is off. high = Normal operation. See Figure 14. Transmitter FAULT- output. Active low. Low (logic "0") results from a VCSEL over-current condition, out of temperature range, or EEPROM calibration data corruption condition detected for any VCSEL. An asserted (logic "0") FAULT- disables the VCSEL array and is cleared by RESET- or power cycling VCCT FAULT- is a single ended LVTTL compatible output. Do not connect to any electrical potential. DIN0– through DIN11– TX_EN TX_DIS RESET- FAULT- DNC Table 2. Receiver Module Pad Description Symbol VEE VCCR VPP DOUT0+ through DOUT11+ Functional Description Receiver Signal Common. All voltages are referenced to this potential unless otherwise indicated. Directly connect these pads to receiver signal ground plane. Receiver Power Supply. Use recommended power supply filter circuit in Figure 5. Not required for Avago product. Pads not internally connected Receiver Data Out+ for channels 0 through 11, respectively. Terminate these high-speed differential CML outputs with standard CML techniques at the inputs of the receiving device. Individual data outputs will be squelched for insufficient input signal level. Receiver Data Out- for channel 0 through 11, respectively. Terminate these high-speed differential CML outputs with standard CML techniques at the inputs of the receiving device. Individual data outputs will be squelched for insufficient input signal level. Signal Detect. Normal optical input levels to all channels results in a logic "1" output, V OH, asserted. Low input optical levels to any channel results in a fault condition indicated by a logic "0" output, VOL, de-asserted. SD is a single-ended LVTTL compatible output. Receiver output enable. Active high (logic "1"), internal pull-up. Low (logic "0") = receiver outputs disabled, all outputs are high (logic "1"). Squelch enable input. Active high (logic "1"), internal pull-up. Low (logic "0") = squelch disabled. When SQ_EN is high and SD is low, corresponding outputs are squelched. Enable Signal Detect. Active high (logic "1"), internal pull-up. Low (logic "0") = Signal detect output forced active high. Do not connect to any electrical potential. DOUT0– through DOUT11– SD RX_EN SQ_EN EN_SD DNC 11 TRANSMITTER MODULE PAD ASSIGNMENT (TOWARD MTP® CONNECTOR) J 1 DNC I DNC H DNC G V EE F V EE E V EE D V EE C V EE B V EE A DNC 2 DNC DNC DNC V EE V EE DIN5+ V EE V EE DIN8+ V EE 3 DNC V CCT V CCT V EE DIN4+ DIN5- V EE DIN7+ DIN8- V EE 4 DNC V CCT V CCT DIN3+ DIN4- V EE DIN6+ DIN7- V EE DNC 5 DNC V CCT V CCT DIN3- V EE DIN2+ DIN6- V EE DIN9- V EE 6 DNC V CCT V CCT V EE DIN1+ DIN2- V EE DIN10- DIN9+ V EE 7 DNC DNC DNC DIN0+ DIN1- V EE DIN11- DIN10+ V EE DNC 8 DNC RESET- FAULT- DIN0- V EE V EE DIN11+ V EE V EE DNC 9 DNC TX_EN TX_DIS V EE V EE V EE V EE V EE V EE DNC 10 DNC DNC DNC DNC DNC DNC DNC DNC DNC DNC TOP VIEW (PCB LAYOUT) (10 x 10 ARRAY) 12 RECEIVER MODULE PAD ASSIGNMENT (TOWARD MTP® CONNECTOR) J 1 V PP I DNC H DNC G V EE F V EE E V EE D V EE C V EE B V EE A DNC 2 V PP DNC DNC V EE V EE DOUT5- V EE V EE DOUT8- V EE 3 DNC V CCR V CCR V EE DOUT4- DOUT5+ V EE DOUT7- DOUT8+ V EE 4 DNC V CCR V CCR DOUT3- DOUT4+ V EE DOUT6- DOUT7+ V EE DNC 5 DNC V CCR V CCR DOUT3+ V EE DOUT2- DOUT6+ V EE DOUT9+ V EE 6 DNC V CCR V CCR V EE DOUT1- DOUT2+ V EE DOUT10+ DOUT9- V EE 7 DNC DNC SD DOUT0- DOUT1+ V EE DOUT11+ DOUT10- V EE DNC 8 V PP DNC DNC DOUT0+ V EE V EE DOUT11- V EE V EE DNC 9 V PP RX_EN EN_SD V EE V EE V EE V EE V EE V EE DNC 10 SQ_EN DNC DNC DNC DNC DNC DNC DNC DNC DNC TOP VIEW (PCB LAYOUT) (10 x 10 ARRAY) 13 Case Temperature Measurement Point Figure 3. Case temperature measurement. (label and heatsink removed for clarity) 25.0 No Heatsink Heatsink 20.0 Case to Ambient Thermal Resistance (C/W) 15.0 10.0 5.0 0.0 0 0.5 1.0 Air Velocity (m/s) 1.5 2 Figure 4. Case to Ambient thermal resistance (C/W) versus air velocity (sea level) 14 AFBR-742BZ VCCR VCCR VCCR VCCR VCCR VCCR VCCR VCCR R = 1.0 k Ω 0603 R = 100 Ω 0603 VCC L = 6.8 nH 0805 C = 0.1 µF 0603 C = 0.1 µF 0603 L = 1 µH 2220 C = 10 µF 1210 C = 10 µF 1210 NOTE: 1. VCC IS DEFINED BY 3.135 < V CC < 3.465 VOLTS AND THE POWER SUPPLY FILTER HAS < 50 mV DROP ACROSS IT RESULTING IN 3.085 < VCCR < 3.415 VOLTS. Figure 5. Recommended receiver power supply filter. AFBR-732BZ R = 1.0 k Ω 0603 R = 100Ω 0603 V CCT V CCT V CCT V CCT V CCT V CCT V CCT V CCT L = 6.8 nH 0805 C = 0.1 µF 0603 C = 0.1 µF 0603 L = 1 µH 2220 C = 10 µF 1210 C = 10 µF 1210 V CC NOTE: V CC IS DEFINED BY 3.135 < V CC < 3.465 VOLTS AND THE POWER SUPPLY FILTER HAS < 50 mV DROP ACROSS IT RESUL TING IN 3.085 < VCCT < 3.415 VOLTS. Figure 6. Recommended transmitter power supply filter. 15 AFBR-732BZ DATA OUT (+) C = 100 nF R 100 Ω DATA OUT (–) C = 100 nF R 50 Ω R 50 Ω AFBR-742BZ ASIC DOUT (+) C = 100 nF RDL 100 Ω DOUT (–) C = 100 nF UNUSED RECEIVER CHANNEL OUTPUTS MUST BE TERMINATED. NOTE: AC COUPLING CAPACITORS SHOULD BE USED TO CONNECT DATA OUTPUTS TO DATA INPUTS BETWEEN THE AFBR-732BZ, AFBR-742BZ, AND HOST BOARD ICs (e.g., ASIC) WITH EITHER 50WSINGLE-ENDED OR 100Ω DIFFERENTIAL TERMINATIONS AS SHOWN. THE CAPACITORS' VALUES CAN BE REDUCED FROM 100 nF (0603 SIZE) IF THE DATA RATE AND RUN LENGTH ARE LIMITED. Figure 7. Recommended ac coupling and data signal termination. D IN+ + V DI/O+ ∆V DIN – TRANSMITTER ∆V DI/OH ∆V DI/OL D IN– V DI/O– D OUT+ + RECEIVER ∆V DOUT – ∆V DI/OH + D OUT– V DI/O REFERS TO EITHER V DIN OR V DOUT AS APPROPRIATE ∆V DI/OL ∆V DI/O P-P – Figure 8. Differential signals. 16 2 x ∅ 2.54 MIN. P KEEP-OUT AD ∅ 0.1 A B-C 2 x ∅ 1.7 ± 0.05 HOLES ∅ 0.1 A B-C 3 x ∅ 4.17 MIN. P KEEP-OUT AD ∅ 0.1 A B-C 3 x ∅ 2.69 ± 0.05 HOLES FOR #2 SCREW ∅ 0.1 A B-C Rx SYM. 5.46 B A 13.72 18 REF. 18.42 MIN. 100 PIN FCI MEG-Array® RECEPTACLE CONNECT ORS C Tx END OF MODULE (10 x 10 =) 100 x∅ 0.58 ± 0.05 PADS ∅ 0.05 A B-C 8.00 50 KEEP-OUT AREA FOR MPO CONNECTOR 8.95 REF. 30.23 PCB LAYOUT (TOP VIEW) 9 x 1.27 TOT = 11.43 1.89 REF. SYM. 9 x 1.27 TOT = 11.43 FRONT NOTE: The host electrical connector attached to the PCB must be a 100-position FCI Meg-Array plug (FCI PN: 84512-102) or equivalent. Figure 9. Package board footprint (dimensions in mm). PCB top view. 17 V CCR 50 Ω 50 Ω D OUT+ D OUT– V CCT D IN+ 50 Ω Z IN 50 Ω D IN– V BIAS (NOMINAL 1.7 V) V EE V EE Figure 10. Rx data output equivalent circuit. Figure 11. Tx data input equivalent circuit. V CC > 2.8 V V CC ~60 ms ~6.5 ms TX OUT 0 SHUTDOWN ~4.6 ms TX OUT 1 SHUTDOWN ~4.6 ms TX OUT 2 SHUTDOWN NORMAL NORMAL NORMAL TX OUT 11 SHUTDOWN NORMAL Figure 12. Typical transmitter power-up sequence. NO FAULT DETECTED ~Toff 100 ns (Ton) ~55 ms ~4.2 ms TX OUT 0 SHUTDOWN ~4.6 ms NORMAL TX OUT 1 ~4.6 ms TX OUT 2 TX OUT 11 ~5 µs (Toff) Figure 14. Transmitter RESET timing diagram. TX_EN ~5 µs (Toff) TX OUT NORMAL CH 0-11 (a) SHUTDOWN TX_DIS ~5 µs (Toff) TX OUT NORMAL CH 0-11 (b) SHUTDOWN TX_EN[1] ~4.2 ms (Ton) ~55 ms ~4.6 ms NOTE [1]: TX_DIS, WHICH IS NOT SHOWN, IS THE FUNCTIONAL COMPLIMENT OF TX_EN. TX OUT CH 0 TX OUT CH 1 TX OUT CH 11 (c) Figure 15. Transmitter TX_EN and TX_DIS timing diagram. 19 Module Outline Notes: 1. Module supplied with port process plug. 2. Module mass approximately 20 grams. Figure 16. Package outline for AFBR-732BZ and AFBR-742BZ (dimensions in mm). 20 Notes: 1. Module supplied with port process plug. 2. Module mass approximately 20 grams. Figure 17. Package Outline for AFBR-732BEZ and AFBR-742BEZ (dimensions in mm) 21 Figure 18. Host Frontplate Layout (dimensions in mm) For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries. Data subject to change. Copyright © 2005 Avago Technologies Pte. All rights reserved. 5989-4536EN - December 15, 2005 22