ALMD-CZ4G-VW002

Data Sheet ALMD-CZ4G-VW002 High Brightness White SMT Round Lamps Overview Features The new Broadcom® ALMD- CZ4G series is essentially like conventional high brightness though-hole LEDs in the form of surface-mount devices. It can be assembled using common SMT assembly processes and is compatible with an industrial reflow soldering process.      The LEDs are made with an advanced optical grade epoxy for superior performance in outdoor sign applications. For easy pick-and-place assembly, the LEDs are shipped in tape and reel. Every reel is shipped from a single intensity and color bin for better uniformity. High brightness InGaN Typical viewing angle: 40° Diffused lens Support EN15153 color bin, color ratio MSL3 Applications   Railway head lamps, marker lamps Variable message sign CAUTION! This LED is ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to application note AN-1142 for additional detail. The LED must be kept in a moisture barrier bag with < 5% relative humidity (RH) when not in use because prolonged exposure to the environment might cause the leads to tarnish or rust, which might cause difficulties in soldering. Broadcom ALMD-CZ4G-VW002 -DS May 8, 2018 ALMD-CZ4G-VW002 Data Sheet High Brightness White SMT Round Lamps Figure 1: Package Drawing NOTE: 1. All dimensions in millimeters (mm). 2. Tolerance is ±0.20mm unless otherwise specified. 3. Mildsteel leadframe Broadcom ALMD-CZ4G-VW002 -DS 2 ALMD-CZ4G-VW002 Data Sheet High Brightness White SMT Round Lamps Device Selection Guide (TJ = 25°C, IF =20mA) Luminous Intensity, IV (mcd) a, b Chromaticity Coordinate Part Number ALMD-CZ4G-VW002 Typ Min. Max. 0.42, 0.38 4200 7200 Color Bin 1, 2, 3 a. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. The actual peak of the spatial radiation pattern may not align with mechanical axis. b. Tolerance for each bin limit is ±15% Absolute Maximum Ratings Parameters DC Forward Current a Peak Forward Current b Power Dissipation Reverse Voltage White Unit 30 mA 100 mA 105 mW Not recommended for reverse bias operation LED Junction Temperature 100 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +100 °C a. Derate linearly as shown in Figure 12 b. Duty factor = 10%, frequency = 1kHz. Optical and Electrical Characteristics (TJ = 25°C, IF =20mA) Parameters Viewing Angle, 2θ½ Min. a Forward Voltage, VF Typ. Max. 40 b 2.70 Reverse Voltage, VR at IR=10μA Chromaticity Coordinate Thermal Resistance, RθJ-P d c 2.90 5 Unit ° 3.50 V V 0.42 , 0.38 − 350 °C/W a. θ½ is the off-axis angle where the luminous intensity is ½ the peak intensity. The actual peak of the spatial radiation pattern may not align with the mechanical axis. b. Tolerance is ±0.05V. c. Indicates product final test condition only. Long term reverse bias is not recommended. d. Thermal resistance from LED junction to pin. Broadcom ALMD-CZ4G-VW002 -DS 3 ALMD-CZ4G-VW002 Data Sheet High Brightness White SMT Round Lamps Part Numbering System A L M D – C Z x1 x2 – x3 x4 x5 x6 x7 Code Description Option x1 Viewing angle 4 x2 Lens appearance G Diffused x3 Minimum intensity bin V 4200 - 5500 x4 Maximum intensity bin W 5500 -7200 x5 Color Bin Option 0 Bin 1, 2, 3 x7, x8 Packaging Option 2 Test Current = 20mA Typical 40° Part Number Example ALMD- CZ4G – VW002 x1 : 4 x2 : G x3 : 1 x4 : 2 x5 : 0 X6 x7: 02 Broadcom − − − − − − 40° Diffused Minimum intensity bin V Maximum intensity bin W Color bin 1, 2, 3 Tested at 20mA ALMD-CZ4G-VW002 -DS 4 ALMD-CZ4G-VW002 Data Sheet High Brightness White SMT Round Lamps Bin Information Intensity Bin Limits (CAT) Color Bin Limits (BIN) Luminous Intensity, IV (mcd) Bin ID Min. Max. V 4200 5500 W 5500 7200 Bin ID 1 Tolerance = ±15% Example of bin information on reel and packaging label: 2 Chromaticity Coordinates x y 0.400 0.352 0.400 0.388 0.415 0.395 0.415 0.363 0.415 0.363 0.415 0.395 0.430 0.400 CAT : W ˗̶ Intensity bin W 0.430 0.375 BIN : 2 ˗̶ Color bin 2 0.430 0.375 0.430 0.400 0.450 0.405 0.450 0.388 3 Figure 2: Chromaticity Diagram Tolerance = ±0.01 0.45 y coordinate 0.41 EN15153 Color bin 1 0.37 2 3 0.33 0.29 0.25 0.29 Broadcom 0.33 0.37 0.41 0.45 x coordinate 0.49 0.53 ALMD-CZ4G-VW002 -DS 5 ALMD-CZ4G-VW002 Data Sheet High Brightness White SMT Round Lamps Figure 3: Spectral Power Distribution Figure 4: Forward Current vs. Forward Voltage 30 1.0 FORWARD CURRENT - mA 0.9 RELATIVE INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 25 20 15 10 5 0.0 0 380 430 480 530 580 630 680 WAVELENGTH - nm 730 0.0 780 Figure 5: Relative Luminous Intensity vs. Mono Pulse Current 5.0 0.0020 CHROMATICITY COORDINATE SHIFT (NORMALIZED AT 20mA) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 10 20 30 0.0015 0.0010 Cy 0.0005 0.0000 Cx -0.0005 -0.0010 -0.0015 40 0 10 20 30 MONO PULSE CURRENT - mA MONO PULSE CURRENT- mA Figure 7: Relative Light Output vs. Junction Temperature 40 Figure 8: Forward Voltage Shift vs. Junction Temperature 0.20 FORWARD VOLTAGE SHIFT - V (NORMALIZED AT 25°C) 120 100 RELATIVE LIGHT OUTPUT - % (NORMALIZED AT 25°C) 2.0 3.0 4.0 FORWARD VOLTAGE - V Figure 6: Chromaticity Coordinate Shift vs Mono Pulse Current 1.6 RELATIVE LUMINOUS INTENSITY - mcd (NORMALIZED AT 20mA) 1.0 80 60 40 0.15 0.10 0.05 0.00 -0.05 20 -0.10 0 -50 Broadcom -25 0 25 50 75 100 JUNCTION TEMPERATURE, TJ - °C 125 -50 -25 0 25 50 75 100 JUNCTION TEMPERATURE, TJ - °C 125 ALMD-CZ4G-VW002 -DS 6 ALMD--CZ4G-VW002 Datta Sheet High h Brightness White SMT Round Lamps Figurre 9: Chromatticity Coordina ate Shift vs. Junction Temp perature Figure 10: Radiation n Pattern 1.0 0.015 0.8 0.010 0.005 0.000 RELATIVE INTENSITY CHROMATICITY COORDINATE SHIFT ((NORMALIZED AT 25°C)) 0.020 Cy Cx -0.005 -0.010 -0.015 0.6 0.4 0.2 -0.020 -0.025 -50 -25 0 25 50 75 100 125 0.0 -990 JUNCTION TEMPERATURE, T TJ T - °C Figurre 11: Component Axis for Radiation Patttern -60 -30 0 30 6 60 AN ACEMENT - DEGREE NGULAR DISPLA 90 m Forward Current vs. Amb bient Figure 12: Maximum erature. Derate ed based on TJMAX = 100°C Tempe NOT TE: MAX. ALLOWABLE DC CURRENT - mA 35 All dime ensions are in millimeters m (mm m). 30 25 20 R RθJ-A = 713°C/W 15 10 5 0 0 20 0 40 60 8 80 100 AMBIENT TEMP PERATURE, TA - °C C ure 13: Recom mmended Sold dering Land Pattern P Figu NOTE E: Recommended stencil thickne ess is 6 mils minimum m Note NOT TE: Broadccom All dime ensions are in millimeters m (mm m). D-CZ4G-VW002 -DS ALMD 7 ALMD-CZ4G-VW002 Data Sheet High Brightness White SMT Round Lamps Figure 14: Carrier Tape Dimensions NOTE: All dimensions in millimeters (mm). Figure 15: Carrier Tape Dimensions +2.0 16.40 - 0 ∅330 MAX. ∅100 ±0.50 +0.5 13.00- 0.2 ANODE LEADS UNREELING DIRECTION NOTE All dimensions are in millimeters. Broadcom ALMD-CZ4G-VW002 -DS 8 ALMD-CZ4G-VW002 Data Sheet High Brightness White SMT Round Lamps Precautionary Notes Soldering Handling Precautions  For automated pick and place, Broadcom has tested following nozzle size to work with this LED. However, due to the possibility of variations in other parameters such as pick and place machine maker/model, and other settings of the machine, verify that the selected nozzle performs as per requirements.     Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisturesensitive device as stated in the following section. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to following conditions: ─ Soldering iron tip temperature = 315°C max. ─ Soldering duration = 3sec max. ─ Number of cycles = 1 only ─ Power of soldering iron = 50W max. Do not touch the LED package body with the soldering iron except for the soldering terminals, as it may cause damage to the LED. Confirm beforehand whether the functionality and performance of the LED is affected by soldering with hand soldering. Figure 18: Recommended Nozzle Dimension Pick & Place nozzle Φ >3.5mm LED flange Figure 16: Recommended Lead-Free Reflow Soldering Profile TEMPERATURE 10 to 30 SEC. 217°C 200°C 255 – 260°C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 4.8mm 3°C/SEC. MAX. 100 SEC. MAX. 60 – 120 SEC. 4.4m TIME Φ3.9mm Figure 17: Recommended Board Reflow Direction NOTE 1. 2. 3. Broadcom The nozzle tip must touch the LED flange during pick and place. Outer dimensions of the nozzle tip must be able to fit into the carrier tape pocket until it touches the LED flange. All dimensions are in mm. ALMD-CZ4G-VW002 -DS 9 ALMD-CZ4G-VW002 Data Sheet High Brightness White SMT Round Lamps Handling of Moisture-Sensitive Devices Application Precautions This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices for additional details and a review of proper handling procedures.        Before use: ─ An unopened moisture barrier bag (MBB) can be stoGreen at