ALMD-EL3D-VX002

ALMD-EL3D, ALMD-EG3D, ALMD-CM3D, ALMD-CB3D High Brightness SMT Round LED Lamps Amber, Red, Green and Blue Tinted LEDs Data Sheet Description Features The new Avago ALMD-xx3D LED series has the same or just slightly less luminous intensity than conventional high brightness, through-hole LEDs. • Compact form factor The new LED lamps can be assembled using common SMT assembly processes and are compatible with industrial reflow soldering processes. • High brightness material • Available in Red, Amber, Green and Blue color • Red AlInGaP 626 nm • Amber AlInGaP 590 nm The LEDs are made with an advanced optical grade epoxy for superior performance in outdoor sign applications. • Green InGaN 525 nm For easy pick and place assembly, the LEDs are shipped in EIA-compliant tape and reel. Every reel is shipped from a single intensity and color bin– except the red color–for better uniformity. • JEDEC MSL 2A Package Dimensions • Blue InGaN 470 nm • Compatible with industrial reflow soldering process • Typical Viewing angle: 30° • Tinted, non-diffused Applications Package Marking • Variable Message Signs A A 4.20 ± 0.20 C C A: Anode C: Cathode 4.20 ± 0.20 4.75 ± 0.50 6.50 ± 0.50 3.40 ± 0.50 2.50 ± 0.20 C A 1.4 (4x) Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is ± 0.20 mm unless other specified. 3. Copper leadframe. CAUTION: InGaN devices are Class 1C HBM ESD sensitive, AlInGaP devices are Class 1B ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. CAUTION: Customer is advised to keep the LED in the MBB when not in use as prolonged exposure to environment might cause the silver plated leads to tarnish, which might cause difficulties in soldering. Device Selection Guide Part Number Color and Dominant Wavelength λd (nm) Typ [3] Luminous Intensity Iv (mcd) [1,2,5] Min Max Viewing Angle Typ (°) [4] ALMD-EG3D-VX002 Red 626 4200 9300 30° ALMD-EL3D-VX002 Amber 590 4200 9300 ALMD-CM3D-Y1002 Green 525 9300 21000 ALMD-CB3D-SU002 Blue 470 1900 4200 Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition. 2. The optical axis is closely aligned with the package mechanical axis. 3. Dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp. 4. θ½ is the off-axis angle where the luminous intensity is half the on-axis intensity. 5. Tolerance for each bin limit is ± 15% Part Numbering System A L M D - x1 x2 x3 x4 - x5 x6 x7 x8 x9 Code Description Option x1 Package type E C Round AlInGaP Round InGaN x2 Color B G L M Blue Red Amber Green x3 Viewing angle 3 30° x4 Product specific designation D x5 Minimum intensity bin Refer to device selection guide x6 Maximum intensity bin Refer to device selection guide x7 Color bin selection 0 Full distribution x8x9 Packaging option 02 Tested 20mA, 13inch carrier tape 2 Absolute Maximum Rating, TJ = 25 °C Parameter Red and Amber Blue and Green Unit 50 30 mA 100 [2] 100 [3] mA 114 mW DC Forward Current [1] Peak Forward Current 120 Power Dissipation Reverse Voltage 5 (IR = 100 μA) [4] 5 (IR = 10 μA) [4] V 110 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +100 °C LED Junction Temperature Notes: 1. Derate linearly as shown in Figure 4 and Figure 9. 2. Duty Factor 30%, frequency 1 kHz. 3. Duty Factor 10%, frequency 1 kHz. 4. Indicates product final testing; long-term reverse bias is not recommended. Electrical / Optical Characteristics, TJ = 25 °C Parameter Symbol Forward Voltage Red Amber Green Blue VF Reverse Voltage Red & Amber Green & Blue VR Dominant Wavelength [1] Red Amber Green Blue λd Peak Wavelength Red Amber Green Blue Thermal Resistance Luminous Efficacy [2] Red Amber Green Blue Thermal coefficient of λd Red Amber Green Blue Min. 1.8 1.8 2.8 2.8 Typ. 2.1 2.1 3.2 3.2 Max. 2.4 2.4 3.8 3.8 5 5 618.0 584.5 519.0 460.0 626.0 590.0 525.0 470.0 Units Test Conditions V IF = 20 mA V IF = 100 µA IF = 10 µA IF = 20 mA 630.0 594.5 539.0 480.0 λPEAK 634 594 516 464 nm Peak of Wavelength of Spectral Distribution at IF = 20 mA RθJ-PIN 130 °C/W LED Junction-to-Pin ηV 200 520 530 65 lm/W Emitted Luminous Power/Emitted Radiant Power nm/°C IF = 20 mA ; +25 °C ≤ TJ ≤ +100 °C 0.059 0.103 0.028 0.024 Notes: 1. The dominant wavelength is derived from the chromaticity diagram and represents the color of the lamp. 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/ηV where IV is the luminous intensity in candelas and ηV is the luminous efficacy in lumens/watt. 3 AlInGaP 100 RELATIVE INTENSITY 0.8 Amber FORWARD CURRENT - mA 1 Red 0.6 0.4 0.2 0 500 550 600 WAVELENGTH - nm 40 20 0 0.5 1 1.5 2 FORWARD VOLTAGE - V 2.5 60 Amber Red 0 20 40 60 FORWARD CURRENT - mA 80 100 50 40 30 20 10 0 0 20 40 60 TA - AMBIENT TEMPERATURE (°C) 80 Note: RθJ-A = 460 °C/W RELATIVE DOMINANT WAVELENGTH SHIFT(NORMALIZED AT 20mA) - nm Figure 3. Relative Intensity vs Forward Current 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 Figure 4. Maximum Forward Current vs Ambient Temperature Amber Red 0 20 40 60 FORWARD CURRENT - mA 80 Figure 5. Relative Dominant Wavelength Shift vs Forward Current 4 3 Figure 2. Forward Current vs Forward Voltage MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20mA) 60 0 650 Figure 1. Relative Intensity vs Wavelength 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 80 100 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 100 BLUE FORWARD CURRENT-mA RELATIVE INTENSITY InGaN GREEN 380 430 480 530 WAVELENGTH - nm 580 630 Figure 6. Relative Intensity vs Wavelength 0 IFmax - MAXIMUM FORWARD CURRENT - mA RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20mA) 2.5 Green 2.0 1.5 1.0 0.5 0 20 40 60 80 DC FORWARD CURRENT-mA 100 120 0 1 2 3 FORWARD VOLTAGE-V 4 5 40 60 80 TA - AMBIENT TEMPERATURE - °C 100 5 Green Blue 0 -5 0 20 30 25 20 15 10 5 0 0 20 Figure 9. Maximum Forward Current vs Ambient Temperature 10 RELATIVE DOMINANT WAVELENGTH SHIFT -nm 20 Figure 7. Forward Current vs Forward Voltage Figure 8. Relative Intensity vs Forward Current 40 60 FORWARD CURRENT-mA Figure 10. Dominant Wavelength Shift vs Forward Current 5 40 Blue 3.0 -10 60 35 3.5 0.0 80 80 100 NORMALIZED INTENSITY 1.0 0.8 0.6 Package Marking 0.4 A X 0.2 0.0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT-DEGREE 60 Figure 11b. Component Axis for Radiation Pattern 0.3 Red Amber Blue Green FORWARD VOLTAGE SHIFT-V NORMALZIED INTENSITY (PHOTO) C 90 10 1 -40 -15 10 35 TJ - JUNCTION TEMPERATURE 60 85 0.7 4.0 Figure 12. Relative Intensity Shift vs Junction Temperature 2.1 5.2 Note: Recommended stencil thickness is 0.1524mm (6 mils) minimum and above. Figure 14. Recommended Soldering Land Pattern 6 X C Figure 11a. Radiation Pattern for X axis 0.1 A Red Amber 0.2 Green Blue 0.1 0 -0.1 -0.2 -0.3 -40 -15 10 35 TJ - JUNCTION TEMPERATURE Figure 13. Forward Voltage Shift vs Junction Temperature 60 85 0.50±0.10 4.00±0.20 2.00±0.20 1.55±0.20 1.75±0.20 1.80±0.20 7.50±0.20 5.20±0.20 2.20±0.20 4.50±0.20 8.00±0.20 16.00±0.30 1.60±0.20 5.30±0.20 7.10±0.20 Figure 15. Carrier Tape Dimension ∅100 ± 0.50 16.40 ± 0.20 ∅330 MAX. 13.00 ± 0.20 Figure 16. Reel Dimension 2 anode leads lead unreeling direction Figure 17. Unit Orientation from reel 7 Intensity Bin Limit Table (1.3:1 Iv bin ratio) VF Bin Table (V at 20 mA) for Red & Amber Intensity (mcd) at 20 mA Bin Min Max S 1900 2500 T 2500 3200 U 3200 4200 V 4200 5500 W 5500 7200 X 7200 9300 Y 9300 12000 Z 12000 16000 1 16000 21000 Bin ID Min Max VD 1.8 2.0 VA 2.0 2.2 VB 2.2 2.4 Tolerance for each bin limit is ± 0.05V Tolerance for each bin limit is ± 15% Red Color Range Green Color Range Min Dom Max Dom X min Y Min X max Y max 0.2943 Min Bin Dom Max Dom 618.0 630.0 0.6872 0.3126 0.6890 Xmin Ymin Xmax Ymax 0.6690 0.3149 0.7080 0.2920 1 519.0 523.0 0.0667 0.8323 0.1450 0.7319 0.1200 0.7375 0.0979 0.8316 2 523.0 527.0 0.0979 0.8316 0.1711 0.7218 0.1450 0.7319 0.1305 0.8189 0.1305 0.8189 0.1967 0.7077 0.1711 0.7218 0.1625 0.8012 0.1625 0.8012 0.2210 0.6920 0.1967 0.7077 0.1929 0.7816 0.1929 0.7816 0.2445 0.6747 0.2210 0.6920 0.2233 0.7600 Tolerance for each bin limit is ± 0.5nm Amber Color Range Bin Min Dom Max Dom Xmin Ymin Xmax Ymax 1 584.5 587.0 0.5420 0.4580 0.5530 0.4400 0.5370 0.4550 0.5570 0.4420 0.5570 0.4420 0.5670 0.4250 0.5530 0.4400 0.5720 0.4270 0.5720 0.4270 0.5820 0.4110 0.5670 0.4250 0.5870 0.4130 0.5870 0.4130 0.5950 0.3980 0.5820 0.4110 0.6000 0.3990 2 4 6 587.0 589.5 592.0 589.5 592.0 594.5 Tolerance for each bin limit is ± 0.5nm 3 527.0 531.0 4 531.0 535.0 5 535.0 539.0 Tolerance for each bin limit is ± 0.5nm Blue Color Range Min Bin Dom Max Dom Xmin Ymin Xmax Ymax 1 464.0 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 2 460.0 464.0 468.0 3 468.0 472.0 4 472.0 476.0 5 476.0 480.0 Tolerance for each bin limit is ± 0.5nm 8 Packing Label (i) Mother Label (Available on MBB bag) (1T) Lot: Lot Number STANDARD LABEL LS0002 RoHS Compliant (Q) QTY: Quantity e4 Max Temp 260C MSL 2a LPN: CAT: Intensity Bin (9D)MFG Date: Manufacturing Date BIN: Refer to below information (1P) Item: Part Number (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code DeptID: OEAT01 Made In: Country of Origin (ii) Baby Label (Available on Plastic Reel) (1P) PART #: Part Number (1T) Lot #: Lot Number (9D)MFG Date: Manufacturing Date C/0: Country of Origin (1T) TAPE DATE: Taping Date BABY LABEL COSBOO1B V0.0 (Q) QTY: Quantity (9D) Date Code: Date Code CAT Intensity Bin BIN Refer to Below information Note: Acronyms and Definition: Example: BIN: a. Color bin only or VF bin only (i) Color bin only or VF bin only BIN: 4 (represent color bin 4 only) (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) (ii) Color bin incorporated with VF bin Applicable for part number that have both color bin and VF bin BIN: VA (represent VF bin “VA” only) b. Color bin incorporate with VF bin BIN: 4 VA VA: VF bin “VA” 4: Color bin 4 only 9 Soldering Recommended reflow soldering condition: (i) Leaded reflow soldering: (ii) Lead-free reflow soldering: 20 SEC. MAX. 183°C 100-150°C -6°C/SEC. MAX. 3°C/SEC. MAX. 120 SEC. MAX. 60-150 SEC. TIME a. Reflow soldering must not be done more than two times. Make sure you take the necessary precautions for handling a moisture-sensitive device, as stated in the following section. b. Recommended board reflow direction: TEMPERATURE TEMPERATURE 10 to 30 SEC. 240°C MAX. 3°C/SEC. MAX. 217°C 200°C 255 - 260 °C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME c. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. d. It is preferred that you use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable but must be strictly controlled to the following conditions: - Soldering iron tip temperature = 320 °C max. - Soldering duration = 3 sec max. - Number of cycles = 1 only - Power of soldering iron = 50 W max. e. Do not touch the LED body with a hot soldering iron except the soldering terminals as this may damage the LED. f. For de-soldering, it is recommended that you use a double flat tip. REFLOW SOLDERING 10 g. Please confirm beforehand whether the functionality and performance of the LED is affected by hand soldering. PRECAUTIONARY NOTES d. Control of assembled boards 1. Handling precautions For automated pick and place, Avago has tested nozzle size below made with urethane material to be working fine with this LED. However, due to the possibility of variations in other parameters such as pick and place machine maker/model and other settings of the machine, customer is recommended to verify the nozzle selected. - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at 3.5mm - The LEDs are exposed to condition of >30°C / 60% RH at any time. - The LED floor life exceeded 672hrs. LED flange 4.4 mm ∅3.9 mm The recommended baking condition is: 60±5ºC for 20hrs. Baking should only be done once. f. Storage Note: a. Nozzle tip should touch the LED flange during pick and place. b. Outer dimensions of the nozzle should be able to fit into the carrier tape pocket. 2. Handling of moisture-sensitive device This product has a Moisture Sensitive Level 2a rating per JEDEC J-STD-020. Refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. a. Before use - An unopened moisture barrier bag (MBB) can be stored at