APDS-9002

APDS-9002 Miniature Surface-Mount Ambient Light Photo Sensor Data Sheet Description The APDS-9002 is a low-cost analog-output ambient light photo sensor in lowest cost miniature chipLED lead-free surface mount package. It consists of a spectrally suited phototransistor, which peaks in human luminosity curve. Hence, it provides an excellent responsivity that is close to the response of human eyes, as shown in Figure 2. It provides a design-alternative to the HSDL-9000 digital-output ambient light photo sensor is suitable for portable applications with its ultra small package design. The APDS-9002 is ideal for applications in which the measurement of ambient light is used to control display backlighting. Mobile appliances such as the mobile phones and PDAs that draw heavy current from display backlighting will benefit from incorporating these photo sensor products in their designs by reducing power consumption significantly. Features • Excellent responsivity which peaks in the human luminosity curve Close responsivity to the human eye • Miniature chipLED lead-free surface-mount package Height – 0.80 mm Width – 2.00 mm Depth – 1.25 mm • Good output linearity across wide illumination range • Low sensitivity variation across various light sources • Guaranteed temperature performance -40°C to 85°C • VCC supply 2.4 to 5.5 V • Lead-free package Applications • Detection of ambient light to control display backlighting Mobile devices – mobile phones, PDAs Computing devices – notebooks, webpads Consumer devices – TVs, video cameras, digital still cameras • Automatic residential and commercial lighting management • Electronic signs and signals • Daylight and artificial light exposed devices Application Support Information The Application Engineering Group is available to assist you with the application design associated with APDS-9002 ambient light photo sensor module. You can contact them through your local sales representatives for additional details. Ordering Information Part Number APDS-9002-021 Packaging Type Tape and Reel Package 4-pins Chipled package Quantity 2500 Typical Application Circuit PIN 2: VCC PIN 3: VCC PIN 1: IOUT APDS-9002 RLOAD PIN 4: NC Figure 1. Typical application circuit for APDS-9002. Figure 1 Table Component RLOAD Recommended Application Circuit Components 1 kW I/O Pins Configuration Table Pin 1 2 3 4 Symbol IOUT VCC VCC NC Description IOUT VCC VCC No Connect 2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 350 450 550 650 750 850 950 1050 1150 1250 WAVELENGTH (nm) APDS-9002 SILICON EYE RESPONSE Figure 2. Relative spectral response vs. wavelength. NORMALIZED RESPONSIVITY CAUTIONS: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD. Absolute Maximum Ratings For implementations where case to ambient thermal resistance is ≤ 50°C/W Parameter Storage Temperature Operating Temperature Supply Voltage Symbol TS TA VCC Min. -40 -40 2.4 Max. 85 85 5.5 Units °C °C V Recommended Operating Conditions Parameter Operating Temperature Supply Voltage Symbol TA VCC Min. -40 2.4 Max. 85 5.5 Units °C V Conditions 3 Electrical & Optical Specifications (TA = 25°C) Parameter Photo Current (I) Photo Current (II) Photo Current (III) Dark Current Symbol I_PH1 I_PH2 I_PH3 I_DARK T_RISE T_FALL Min. 10 136 Typ. 20 250 300 50 1.2 0.95 0.8 Max. 33 410 160 2 2 Units µA µA µA nA ms ms Conditions VCC = 3.0 V, Lux = 10[2] VCC = 3.0 V, Lux = 100[2] VCC = 3.0 V, Lux = 100[1] VCC = 3.0 V, Lux = 0 VCC = 3.0 V, Lux = 100, Rload = 1 kΩ[3] VCC = 3.0 V, Lux = 100, Rload = 1 kΩ[3] Light Current Ratio I_PH3 / I_PH2 Rise Time Fall Time Notes: 1. Illuminance by CIE standard light source (incandescent lamp). 2. Fluorescent light is used as light source. White LED is substituted in mass production. 3. White LED is used as light source. Light Measurement Circuit and Waveforms I_pulse PIN 2: VCC PIN 3: VCC I_pulse PIN 1: IOUT APDS-9002 RLOAD PIN 4: NC GND VOUT 90% 10% tr tf 4 0.01 2.5 1.2 NORMALIZED PHOTOCURRENT 2.0 NORMALIZED PHOTOCURRENT Normalized Photocurrent 50 100 1.0 0.8 0.6 0.4 0.2 Normalized Photocurrent 0 -80 -60 -40 -20 0 ANGLE 20 40 60 80 PHOTOCURRENT (A) 0.001 1.5 1.0 0.0001 Fluorescent Incandescent 0.00001 10 100 LUX 1000 0.5 -50 0 0 TEMPERATURE (°C) Figure 3. Photocurrent vs. luminence (VCC = 3 V, TA = 25°C). Figure 4. Normalized photocurrent vs. temperature (VCC = 3 V, 100 LUX). Figure 5. Normalized photocurrent vs. angle (VCC = 3 V, TA = 25°C). 10 TA = 25°C VCC = 3 V LIGHT SOURCE: WHITE LED 1.4E-3 1.2E-3 1.0E-3 1.8E-3 1.6E-3 1.4E-3 OUTPUT VOLTAGE, VOUT (V) 1 FALL TIME (sec) 1.2E-3 800.0E-6 600.0E-6 400.0E-6 AVERAGE 200.0E-6 Trise (sec) 1.0E-3 800.0E-6 600.0E-6 400.0E-6 200.0E-6 AVERAGE 0.1 0.01 R = 1 kW R = 5.1 kW R = 11 kW R = 51 kW 10 100 1000 0.001 000.0E+0 0 500 1000 1500 2000 2500 000.0E+0 0 500 1000 1500 2000 2500 LUMINANCE, Ev (LUX) RLOAD (W) RLOAD (W) Figure 6. Output voltage vs. luminance at different load resistor. Figure 7. Fall time vs. RLOAD. Figure 8. Rise time vs. RLOAD. 5 APDS-9002 Package Outline 0.35 R0.20 P1 1.25 P2 MOLDING BODY (LENS) 0.45 2.00 1.40 0.45 P3 0.45 P4 P.C. BOARD 0.20 UNITS: in mm TOLERANCE: ±0.2 mm PIN 1: IOUT PIN 2: VCC PIN 3: VCC PIN 4: NC (NO CONNECT) 0.30 0.80 0.14 6 APDS-9002 Tape and Reel Dimensions 2.00 ± 0.05 4.00 ± 0.1 0.20 1.75 ± 0.1 8 ± 0.1 3.50 ± 0.05 ORIENTATION OF UNIT IN TAPE AND REEL POCKETS IN PROGRESSIVE DIRECTION ∅1.00 ± 0.1 1.04 ± 0.1 1.96 ± 0.1 P3 1.04 ± 0.1 PROGRESSIVE DIRECTION 2.00 4.00 ± 0.1 ∅1.56 ± 0.1 P1 1.25 P2 P4 0.20 MATERIAL OF CARRIER TAPE: CONDUCTIVE POLYSTYRENE MATERIAL OF COVER TAPE: PVC METHOD OF COVER: HEAT SENSITIVE ADHESIVE EMPTY (40 mm MIN.) PARTS MOUNTED LEADER (400 mm MIN.) EMPTY (40 mm MIN.) "B" 178 "C" 75 UNIT: mm 18.4 (MAX.) DETAIL A 2.0 ± 0.50 DIA. 13.0 ± 0.50 LABEL R1.0 C B 20.2 (MIN.) DETAIL A 15.4 (MAX.) 7 Moisture Proof Packaging All APDS-9002 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 4. Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package In Reels In Bulk Temp. 60°C 125°C Time 20 hours 5 hours UNITS IN A SEALED MOISTURE-PROOF PACKAGE Baking should only be done once. Recommended Storage Conditions Storage Temperature Relative Humidity 10°C to 30°C Below 60% RH PACKAGE IS OPENED (UNSEALED) ENVIRONMENT LESS THAN 30°C, AND LESS THAN 60% RH Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions. If times longer than three days are needed, the parts must be stored in a dry box. YES NO BAKING IS NECESSARY YES PACKAGE IS OPENED LESS THAN 72 HOURS NO PERFORM RECOMMENDED BAKING CONDITIONS NO 8 Recommended Reflow Profile MAX. 260°C R3 R4 255 230 220 200 180 160 120 80 25 0 P1 HEAT UP 50 100 P2 SOLDER PASTE DRY 150 R1 T – TEMPERATURE – (°C) R2 60 sec. MAX. ABOVE 220°C R5 200 P3 SOLDER REFLOW 250 P4 COOL DOWN 300 t-TIME (SECONDS) Process Zone Heat Up Solder Paste Dry Solder Reflow Cool Down Symbol P1, R1 P2, R2 P3, R3 P3, R4 P4, R5 DT 25°C to 160°C 160°C to 200°C 200°C to 255°C (260°C at 10 seconds max.) 255°C to 200°C 200°C to 25°C Maximum DT/DTime 4°C/s 0.5°C/s 4°C/s -6°C/s -6°C/s The reflow profile is a straightline representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change rates. The DT/Dtime rates are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and APDS-9002 castellation pins are heated to a temperature of 160° C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4° C per second to allow for even heating of both the PC board and APDS-9002 castellations. Process zone P2 should be of sufficient time duration (60 to 120 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200° C (392° F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255° C (491° F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 60 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 60 seconds, the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200° C (392° F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25° C (77° F) should not exceed 6° C per second maximum. This limitation is necessary to allow the PC board and APDS-9002 castellations to change dimensions evenly, putting minimal stresses on the APDS-9002. 9 Appendix A: SMT Assembly Application Note Avago APDS-9002: Miniature Surface-Mount Ambient Light Sensor STENCIL APERTURE METAL STENCIL FOR SOLDER PASTE PRINTING LAND PATTERN SOLDER MASK PCBA Figure 9. Stencil and PCBA. 1.1 Recommended Land Pattern 0.55 0.45 0.55 0.55 1 0.55 10 1.2 Recommended Metal Solder Stencil Aperture It is recommended that a 0.10 mm (0.004 inches) thick stencil be used for solder paste printing. Aperture opening for shield pad is 0.6 mm x 0.6 mm. This is to ensure adequate printed solder paste volume and no shorting. APERTURE OPENING 0.1 1.65 2.2 UNIT: mm Figure 10. Solder stencil aperture. 1.3 Adjacent Land Keepout and Solder Mask Areas Adjacent land keep-out is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD components within this area. The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. Note: Wet/Liquid PhotoImageable solder resist/mask is recommended. MOUNTING CENTER 2.65 3.2 UNIT: mm 0.2 MIN. Figure 11. Adjacent land keepout and solder mask areas. 11 Appendix B: Optical Window Design for APDS-9002 2.0 Optical Window Dimensions To ensure that the performance of the APDS-9002 will not be affected by improper window design, there are some constraints on the dimensions and design of the window. There is a constraint on the minimum size of the window, which is placed in front of the photo light sensor, so that it will not affect the angular response of the APDS-9002. This minimum dimension that is recommended will ensure at least a ±35° light reception cone. If a smaller window is required, a light pipe or light guide can be used. A light pipe or light guide is a cylindrical piece of transparent plastic, which makes use of total internal reflection to focus the light. The thickness of the window should be kept as minimum as possible because there is a loss of power in every optical window of about 8% due to reflection (4% on each side) and an additional loss of energy in the plastic material. Figures 12(a) and 12(b) illustrate the two types of windows that we have recommended which could either be a flat window or a flat window with light guide. FLAT PHOTO LIGHT SENSOR Figure 12(a). Window size determination for flat window. Figure 12(b). Window design of flat window with light guide. 12 Table 1 and Figure 13 below show the recommended dimensions of the window. These dimension values are based on a window thickness of 1.0 mm with a refractive index 1.585. D1 The window should be placed directly on top of the photo light sensor to achieve better performance and if a flat window with a light pipe is used, dimension D2 should be 1.5 mm to optimize the performance of APDS-9002. TOP VIEW T D1 L Z D1 T L Z WINDOW DIAMETER THICKNESS LENGTH OF LIGHT PIPE DISTANCE BETWEEN WINDOW REAR PANEL AND APDS-9002 PHOTO LIGHT SENSOR Figure 13. Recommended window dimensions. Table 1: Recommended Dimension for Optical Window All dimensions are in mm Flat Window Flat Window with Light Pipe (L = 0.0) (D2 = 1.5; Z = 0.5) WD (T+L+Z) Z D1 D1 L 1.5 0.5 2.25 2.0 1.0 3.25 2.5 1.5 4.25 3.0 2.0 5.00 2.5 1.5 2.1 Optical Window Material The material of the window is recommended to be polycarbonate. The surface finish of the plastic should be smooth, without any texture. The recommended plastic material for use as a window is available from Bayer AG and Bayer Antwerp N. V. (Europe), Bayer Corp. (USA) and Bayer Polymers Co., Ltd. (Thailand), as shown in Table 2. 13 Table 2: Recommended Plastic Materials Material Number Makrolon LQ2647 Makrolon LQ3147 Makrolon LQ3187 Visible Light Transmission 87% 87% 85% Refractive Index 1.587 1.587 1.587 Appendix C: General Application Guide for APDS-9002 The APDS-9002 is a low cost analog-output ambient light photo sensor which spectral response closely emulates the human eyes. APDS-9002 consists of a phototransistor that enables the photo sensor to produce a high gain photo current to a sufficient level that can be converted to voltage with a standard value of external resistor. APDS-9002 is then easily integrated into systems that use ADC input which is available for sampling of the external source, as shown in Figure 14 below. The amount of converted voltage, VOUT, is mainly dependant proportionally on the photo current which is generated by the brightness of the light shone on the photo sensor and the load resistor used, RL. Increasing the brightness of the light and/or the load resistor will increase the output voltage. Brightness is measured as “LUX” unit, which describes how intense a light source that our eyes perceive. LUX meter is the equipment for “LUX” measurement. Light sources with the same LUX level appear at the same brightness to the human eyes. VCC 2 LIGHT SOURCE VCC 3 APDS-9002 1 VOUT A/D C 4 NC RL MICROCONTROLLER Figure 14. Configuration of APDS-9002 being used directly. Selection of the load resistor RL will determine the amount of current-to-voltage conversion in the circuit. Based on Figure 14 and using white LED as the light source, measurement has been carried out by using different load resistors to examine the variation of the output voltage towards the intense of LUX. The result is shown in Graph 1. APDS-9002 allows output voltage hits around 2.3 V, after this it saturates. Light source, e.g., fluorescent light, consists of ac noise about 100 Hz frequency. A capacitor of 10 µF, which acts as a low-pass filter, is recommended to add in parallel with resistor to by-pass the ripples. 10 TA = 25°C VCC = 3 V LIGHT SOURCE: WHITE LED OUTPUT VOLTAGE, VOUT (V) 1 0.1 0.01 R = 1 kW R = 5.1 kW R = 11 kW R = 51 kW 10 100 1000 0.001 LUMINANCE, Ev (LUX) Graph 1. Output voltage vs. luminance at different load resistor. 14 Avago has fabricated an evaluation board based on the configuration shown in Figure 14 for the designer to test the ambient light sensor under different lighting conditions. A reference layout of a 2-layout Avago evaluation board for APDS9002 is shown in Figure 15 below. Figure 15. Evaluation board layout. 15 For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2006 Avago Technologies Limited. All rights reserved. 5989-3051EN June 7, 2006