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APDS-9306-065

APDS-9306-065

  • 厂商:

    AVAGO(博通)

  • 封装:

    SENSOR_2X2MM_SM

  • 描述:

    DIGITAL AMBIENT LIGHT SENSOR

  • 数据手册
  • 价格&库存
APDS-9306-065 数据手册
APDS-9306/APDS-9306-065 Miniature Surface-Mount Digital Ambient Light Sensor Data Sheet Description Features Avago Technologies' APDS-9306/APDS-9306-065 is a lowvoltage Digital Ambient Light Sensor that converts light intensity to digital signal output with I2C interface. It consists of photodiode, ADC, oscillator and power-on reset to ensure consistent start-up. ADCs convert the photodiode currents to a digital output and the device is capable of rejecting 50Hz and 60Hz flicker caused by artificial light sources.  Ambient Light Sensing The APDS-9306/APDS-9306-065 approximates the response of the human-eye providing direct read out, where the output count is proportional to ambient light level. Low light functionality enables operation behind darkened glass. The APDS-9306/APDS-9306-065 supports programmable hardware interrupt with hysteresis to respond to events. APDS-9306 ultra slim form factor with a height of only 0.34mm and APDS-9306-065 with a height of 0.65mm enables the sensor to be designed into space-sensitive applications. Applications  Detection of ambient light to control display backlighting o Wearable devices – Smart watch, Sport Watch o Mobile devices – Cell phones, PDAs, PMP o Computing devices – Notebooks, Tablet PC, Key board o Consumer devices – LCD Monitor, Flat-panel TVs, Video Cameras, Digital Still Camera  Automatic Residential and Commercial Lighting Management - Utilizes Coating Technology to Emulate Human Eye Spectral Response - High Sensitivity in Low Lux Condition – Ideally Suited for Operation Behind Dark Glass - Wide Dynamic Range 18,000,000 : 1 - Low Lux Performance 0.01 lux - Up to 20-Bit Resolution  Wide Power Supply Range 1.7V to 3.6V - 50Hz/60Hz light flicker immunity - Fluorescent light flicker immunity  Power Management - Low Active Current: 85 μA typical  I2C-bus Interface Compatible - Up to 400 kHz (I2C Fast-Mode) - Dedicated Interrupt Pin  Small Package: - APDS-9306: L2.0 x W2.0 x H0.34mm - APDS-9306-065: L2.0 x W2.0 x H0.65mm Ordering Information Part Number Packaging Quantity APDS-9306 Tape & Reel 2500 per reel APDS-9306-065 Tape & Reel 2500 per reel Functional Block Diagram VDD Regulator Interrupt Oscillator INT GND Upper Threshold Clear ADC/Data Lower Threshold ALS ADC/Data SCL I2C Interfacing Temperature ADC/Data I/O Pins Configuration APDS-9306 I/O Pins Configuration Pin Name Type Description 1 GND Ground Power supply ground. All voltages are referenced to GND 2 NC No Connect 3 NC No Connect 4 VDD Supply Power supply voltage 5 SCL I I2C serial clock input terminal – clock signal for I2C serial data 6 SDA I/O I2C serial data I/O terminal – serial data I/O for I2C 7 INT O Interrupt – open drain 8 NC No Connect APDS-9306-065 I/O Pins Configuration Pin Name Type Description 1 SCL I I2C serial clock input terminal - clock signal for I2C serial data 2 SDA I/O Serial Data I/O for I2C 3 VDD Supply Power Supply Voltage 4 INT O Interrupt - Open Drain 5 NC 6 GND 2 No Connect Ground Power supply ground. All voltages are referenced to GND SDA Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)+ Parameter Symbol Power Supply Voltage [1] Min VDD Max Voltage on SCL, SDA, INT pads VO -0.5 Storage Temperature Range Tstg −45 Max Units 3.8 V 3.8 V 85 °C Conditions † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Note 1. All voltages are with respect to GND. Recommended Operating Conditions Parameter Symbol Min Operating Ambient Temperature TA Supply Voltage VDD Supply Voltage Accuracy, VDD total error including transients Typ Max Units -40 85 °C 1.7 3.6 V -3 3 % Operating Characteristics VDD = 2.8 V, TA = 25°C (unless otherwise noted) Parameter Supply Current Symbol Min. IDD Typ. Max. 85 2 ISTBY Units Test Conditions μA G=18x, 50ms μA In Standby Mode. No active I2C communication SCL, SDA Input High Voltage VIH 1.5 VDD V SCL, SDA Input Low Voltage VIL 0 0.4 V VOL , INT, Output Low Voltage VOL 0 0.4 V Leakage Current, SDA, SCL, INT Pins ILEAK -5 5 μA 3 ALS Characteristics, VDD = 2.8 V, TA = 25°C (unless otherwise noted) Parameter Symbol Min. Typ. Peak Wavelength Output Resolution P 13 18 Dark ALS ADC Count Value 0 ALS ADC Count Value 1600 ALS ADC Integration Time 25 Max. Units 20 bit Programmable 3 counts G=18x, 50ms 2400 counts G=3x, 100msec, =530nm, Ee=49.8μW/cm2 [1] Ee=43 μW/cm2 [2] 400 ms 560 Gain Scaling, Relative to 1x Gain Setting 2000 Test Conditions nm With 50/60Hz rejection 3 6 9 18 AGAIN = 3x AGAIN = 6x AGAIN = 9x AGAIN = 18x Notes 1. Applies to APDS-9306 2. Applies to APDS-9306-065 Characteristics of the SDA and SCL bus lines, VDD = 2.8 V, TA = 25°C (unless otherwise noted) † Parameter Symbol Min. Max. Unit SCL Clock Frequency fSCL 0 400 kHz Hold Time (repeated) START condition. After this Period, the First Clock Pulse is Generated tHD;STA 0.6 – μs LOW Period of the SCL Clock tLOW 1.3 – μs HIGH Period of the SCL Clock tHIGH 0.6 – μs Set-Up Time for a Repeated START Condition tSU;STA 0.6 – μs Data Hold Time tHD;DAT 0 0.9 μs Data Set-Up Time tSU;DAT 100 – ns Clock/Data Fall Time tf 0 300 ns Clock/Data Rise Time tr 0 300 ns Set-Up Time for STOP Condition tSU;STO 0.6 – μs Bus Free Time between a STOP and START Condition tBUF 1.3 - μs 4 ALS NORMALIZED RESPONSIVITY RELATIVE RESPONSE 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 300 Human Eye 400 500 600 700 800 WAVELENGTH (nm) 900 1000 1100 Figure 2. Normalized ALS PD Angular Response 20000 1000 18000 900 16000 800 14000 700 12000 600 SENSOR LUX SENSOR LUX Figure 1. Spectral Response 10000 8000 400 300 4000 200 2000 100 0 0 2000 4000 6000 8000 10000 12000 14000 16000 18000 20000 METER LUX Figure 3. ALS Sensor LUX vs Meter LUX using White Light 0 0.9 0.8 0.7 SENSOR LUX 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 0.1 0.2 0.3 0.4 0.5 0.6 METER LUX 0.7 Figure 5. ALS Sensor LUX vs Meter LUX using White Light 100 200 300 400 500 600 METER LUX 700 800 900 0.08 0.09 1000 Figure 4. ALS Sensor LUX vs Meter LUX using White Light 1.0 SENSOR LUX 500 6000 0 5 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGULAR DISPLACEMENT (DEGREE) 0.8 0.9 1 0.11 0.10 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 0 0.01 0.02 0.03 0.04 0.05 0.06 METER LUX 0.07 Figure 6. ALS Sensor LUX vs Meter LUX using White Light 0.1 0.9 800 0.8 700 0.7 600 0.6 SENSOR LUX 1.0 900 SENSOR LUX 1000 500 400 0.4 300 0.3 200 0.2 100 0.1 0.0 0 0 100 200 300 400 500 600 METER LUX 700 800 900 1000 Figure 7. ALS Sensor LUX vs Meter LUX using Incandescent Light 0 2.0 900 1.8 800 1.6 NORMALIZED IDD @ 2.8V 1000 SENSOR LUX 600 500 400 300 400 500 600 METER LUX 700 800 900 1000 Figure 9. ALS Sensor LUX vs Meter LUX using Halogen Light 1.8 NORMALIZED IDD @ 2.8V 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 -40 -20 0 20 40 TEMPERATURE (C) Figure 11. Normalized IDD vs Temperature 60 0.7 0.8 0.9 1 0.6 0.0 1.6 1.8 2.0 2.2 2.4 Figure 10. Normalized IDD vs VDD 2.0 0.0 -60 0.5 0.6 METER LUX 0.8 0.2 0 300 0.4 1.0 0.4 200 0.3 1.2 100 100 0.2 1.4 200 0 0.1 Figure 8. ALS Sensor LUX vs Meter LUX using Incandescent Light 700 6 0.5 80 100 2.6 2.8 VDD (V) 3.0 3.2 3.4 3.6 3.8 System State Machine Ambient Light Sensor Interrupt Start Up after Power-On or Software Reset The ALS interrupt is enabled by ALS_INT_EN=1 and can function as either threshold triggered (ALS_VAR_ MODE=0) or variance triggered (ALS_VAR_MODE =1). The main state machine is set to “Start State” during power-on or software reset. As soon as the reset is released, the internal oscillator is started and the programmed I2C address and the trim values are read from the internal non volatile memory (NVM) trimming data block. The device enters Standby Mode as soon as the Idle State is reached. Note: As long as the I2C address has not yet been reached, the device will respond with NACK to any I2C command and ignore any request to avoid responding to a wrong I2C address. Standby Mode The ALS threshold interrupt is enabled with ALS_INT_ EN=1 and ALS_VAR_MODE=0. It is set when the ALS data is above the upper or below the lower ALS threshold for a specified number of consecutive measurements (1+ALS_ PERSIST) The ALS variance interrupt is enabled with ALS_INT_EN=1 and ALS_VAR_MODE=1. It is set when the absolute value of the difference between previous and current ALS data is above the decoded ALS variance threshold for a specified number of consecutive measurements (1+ALS_PERSIST). Standby Mode is the default mode after power-up. In this state, the oscillator, all internal support blocks, and the ADCs are switched off but I2C communication is fully supported. Start Ambient Light Sensor Operation ALS measurements can be activated by setting the ALS_ EN bit to 1 in the MAIN_CTRL register. As soon as the ALS becomes activated through an I2C command, the internal support blocks are powered on. Once the voltages and currents are settled (typically after 5ms), the state machine checks for trigger events from a measurement scheduler to start the ALS conversions according to the selected measurement repeat rates. Once ALS_EN is changed back to 0, a conversation running on the respective channel will be completed and the relevant ADCs and support blocks will move to standby mode. Fuse Read Idle ALS_EN==1 Wait for OSC Power Up Check ALS ALS_EN==1 Priority 2 Do ALS Conversion (ADC ms) 7 ALS_EN==0 Priority 1 I2C Protocol I²C Register Write Interface and control of the APDS-9306/APDS-9306-065 is accomplished through an I2C serial compatible interface (standard or fast mode) to a set of registers that provide access to device control functions and output data. The device supports a single slave address of 0X52 hex using 7-bit addressing protocol. (Contact factory for other addressing options). The APDS-9306/APDS-9306-065 registers can be written to individually or in block write mode. When two or more bytes are written in block write mode, reserved registers and read-only registers are skipped. The transmitted data is automatically applied to the next writable register. If a register includes read (R) and read/write (RW) bits, the register is not skipped. Data written to read-only bits are ignored. I²C Register Read If the last valid address of the APDS-9306/APDS-9306065 address range is reached but the master attempts to continue the block write operation, the address counter of the APDS-9306/APDS-9306-065 will not roll over. The APDS-9306/APDS-9306-065 will return NACK for every following byte sent by the master until the I2C™ operation is ended. The registers can be read individually or in block read mode. When two or more bytes are read in block read mode, reserved register addresses are skipped and the next valid address is referenced. If the last valid address has been reached, but the master continues with the block read, the address counter in the device will not roll over and the device returns 00HEX for every subsequent byte read. If a write access is started on an address belonging to a non-writeable register, the APDS-9306/APDS-9306-065 will return NACK until the I2C™ operation is ended. The block read operation is the only way to ensure correct data read out of multi-byte registers and to avoid splitting of results with HIGH and LOW bytes originating from different conversions. During block read access on ALS result registers, the result update is blocked. Write operations must follow the Register Write timing diagram below. If a read access is started on an address belonging to a non-readable register, the APDS-9306/APDS-9306-065 will re-turn NACK until the I2C™ operation is ended. Read operations must follow the Register Read timing diagram as below. Register Read (I2CTM Read) S Slave Addr 7 Bit 0 A Address 8 Bit A S Slave Addr 7 Bit 1 A Data 8 Bit N P From Master to Slave S From Slave to Master Write P Stop Condition Read A Acknowledge (ACK) Register Block Read (I2CTM Read) S Slave Addr 7 Bit 0 A Address 8 Bit Start Condition A S Slave Addr 7 Bit Write 1 A Data 8-Bit Data 8-Bit A A … Data N 8-Bit P N Not Acknowledge (NACK) Read Register Write (I2CTM Write) S Slave Addr 7 Bit 0 A Address A Data 8-Bit A From Master to Slave P S Start Condition From Slave to Master P Stop Condition Write Register Block Write (I2CTM Write) S Slave Addr 7 Bit 0 Write 8 A Address A Acknowledge (ACK) A Data 8-Bit A Data 8-Bit A … Data 8-Bit A P N Not Acknowledge (NACK) I2C Interface – Bus Timing SDA t SUDAT t LOW t HDSTA t BUS SCL t HDSTA t SUSTO t HIGH t HDDAT t SUSTA Bus Timing Characteristics Parameter Symbol Standard Mode Fast Mode Units Maximum SCL Clock Frequency fSCL 100 400 KHz Minimum START Condition Hold Time Relative to SCL Edge tDSTA 4 Minimum SCL Clock Low Width tLOW 4.7 μs Minimum SCL Clock High Width tHIGH 4 μs Minimum START Condition Setup Time Relative to SCL Edge tSUSTA 4.7 μs Minimum Data Hold Time on SDA Relative to SCL Edge tHDDAT 0 Minimum Data Setup Time on SDA Relative to SCL Edge tSUDAT 0.1 Minimum STOP Condition Setup Time on SCL tSUSTO 4 μs Minimum Bus Free Time Between Stop Condition and Start Condition tBUS 4.7 μs 9 μs μs 0.1 μs Register set: The APDS-9306/APDS-9306-065 is controlled and monitored by data registers and a command register accessed through the serial interface. These registers provide for a variety of control functions and can be read to determine results of the ADC conversions. Address Type Name Description Reset Value 00HEX RW MAIN_CTRL ALS operation mode control, SW reset 00HEX 04HEX RW ALS_MEAS_RATE ALS measurement rate and resolution in Active mode 22HEX 05HEX RW ALS_GAIN ALS analog gain range 01HEX 06HEX R Part_ID Part number ID and revision ID B1HEX (APDS-9306) B3HEX (APDS-9306-065) 07HEX R MAIN_STATUS Power-on status, interrupt status, data status 20HEX 0AHEX R CLEAR_DATA_0 Clear ADC measurement data - LSB 00HEX 0BHEX R CLEAR_DATA_1 Clear ADC measurement data 00HEX 0CHEX R CLEAR_DATA_2 Clear ADC measurement data - MSB 00HEX 0DHEX R ALS_DATA_0 ALS ADC measurement data - LSB 00HEX 0EHEX R ALS_DATA_1 ALS ADC measurement data 00HEX 0FHEX R ALS_DATA_2 ALS ADC measurement data - MSB 00HEX 19HEX RW INT_CFG Interrupt configuration 10HEX 1AHEX RW INT_PERSISTENCE Interrupt persist setting 00HEX 21HEX RW ALS_THRES_UP_0 ALS interrupt upper threshold, LSB FFHEX 22HEX RW ALS_THRES_UP_1 ALS interrupt upper threshold FFHEX 23HEX RW ALS_THRES_UP_2 ALS interrupt upper threshold, MSB 0FHEX 24HEX RW ALS_THRES_LOW_0 ALS interrupt lower threshold, LSB 00HEX 25HEX RW ALS_THRES_LOW_1 ALS interrupt lower threshold 00HEX 26HEX RW ALS_THRES_LOW_2 ALS interrupt lower threshold, MSB 00HEX 27HEX RW ALS_THRES_VAR ALS interrupt variance threshold 00HEX 10 MAIN_CTRL Default Value: 00HEX 7 6 5 4 3 2 1 0 0 0 0 SW_Reset 0 0 ALS_EN 0 FIELD BIT DESCRIPTION SW_Reset 4 1 = Reset will be triggered ALS_EN 1 1 = ALS active 0 = ALS standby 0X00 Writing to this register stops the ongoing measurements and starts new measurements (depends on the respective enable bit). ALS_MEAS_RATE Default value: 22HEX 7 6 0 5 4 ALS Resolution/Bit Width 3 2 0 FIELD BIT DESCRIPTION ALS Resolution/ Bit Width 6:4 000 : 20 bit – 400ms 001 : 19 bit – 200ms 010 : 18 bit – 100ms (default) 011 : 17 bit – 50ms 100 : 16 bit – 25ms 101 : 13 bit – 3.125ms 110 : Reserved 111 : Reserved ALS Measurement Rate 2:0 000 – 25ms 001 – 50ms 010 – 100ms (default) 011 – 200ms 100 – 500ms 101 – 1000ms 110 – 2000ms 111 – 2000ms 1 0 ALS Measurement Rate 0X04 When the measurement repeat rate is programmed to be faster than possible for the specified ADC measurement time, the repeat rate will be lower than programmed (maximum speed). Writing to this register stops the ongoing measurements and starts new measurements (depends on the respective enable bit). ALS_GAIN Default Value: 01HEX 7 6 5 4 3 0 0 0 0 0 FIELD BIT DESCRIPTION ALS Gain Range 2:0 000 : Gain 1 001 : Gain 3 010 : Gain 6 011 : Gain 9 100 : Gain 18 2 1 ALS Gain Range 0 0X05 Writing to this register stops the ongoing measurement and starts new measurements (depending on the respective bits). 11 PART_ID Default Value: B1HEX (APDS-9306), B3HEX (APDS-9306-065) 7 6 5 4 3 2 Part ID 1 0 Revision ID FIELD BIT DESCRIPTION Part Number ID 7:4 Part number ID Revision ID 3:0 Revision ID of the component 0X06 MAIN_STATUS Default Value: 20HEX 7 6 5 4 3 2 1 0 0 0 Power On Status ALS Interrupt Status ALS Data Status 0 0 0 0X07 FIELD BIT DESCRIPTION Power On Status 5 1 = Part went through a power-up event, either because the part was turned on or because there was power supply disturbance. All interrupt threshold settings in the registers have been reset to power-on default states and should be examined if necessary. The flag is cleared after the register is read. ALS Interrupt Status 4 0 : Interrupt condition not fulfilled (default) 1 : Interrupt condition fulfilled (cleared after read) ALS Data Status 3 0 : old data, already read (default) 1 : new data, not yet read (cleared after read) CLEAR_DATA Default Value: 00HEX, 00HEX, 00HEX 7 0 6 0 5 0 4 3 2 1 0 CLEAR _DATA_0 [7:0] 0X0A CLEAR_DATA_1 [15:8] 0X0B 0 CLEAR_DATA_2 [19:16] 0X0C Clear channel digital output data (unsigned integer, 13 to 20 bit, LSB aligned). The clear channel data is clipped at (2Resolution – 1) The clear channel output is already temperature compensated internally: CLEAR_DATA = (CLEARint - COMP) When an I²C™ read operation is active and points to an address in the range 07HEX to 18HEX, all registers in this range are locked until the I²C™ read operation is completed or this address range is left. This guarantees that the data in the registers comes from the same measurement even if an additional measurement cycle ends during the read operation. New measurement data is stored into temporary registers and the actual CLEAR_ DATA registers are updated as soon as there is no on-going I²C™ read operation to the address range 07HEX to 18HEX. Reg 0AHEX Reg 0BHEX Reg 0CHEX 12 Bit[7:0] Clear diode data least significant data byte Bit[7:0] Clear diode data intervening data byte Bit[3:0] Clear diode data most significant data byte ALS_DATA Default value: 00HEX, 00HEX, 00HEX 7 6 5 4 3 2 1 0 ALS_DATA_0 [7:0] 0X0D ALS_DATA _1 [15:8] 0 0 0 0X0E 0 ALS_DATA_2 [19:16] 0X0F ALS channel digital output data (unsigned integer, 13 to 20 bit, LSB aligned). The channel output is already temperature compensated internally: ALS_DATA = (ALSint – COMP) When an I²C™ read operation is active and points to an address in the range 07HEX to 18HEX, all registers in this range are locked until the I²C™ read operation is completed or this address range is left. This guarantees that the data in the registers comes from the same measurement even if an additional measurement cycle ends during the read operation. New measurement data is stored into temporary registers and the actual ALS_ DATA registers are updated as soon as there is no on-going I²C™ read operation to the address range 07HEX to 18HEX. Reg 0DHEX Reg 0EHEX Reg 0FHEX Bit[7:0] ALS diode data least significant data byte Bit[7:0] ALS diode data intervening data byte Bit[3:0] ALS diode data most significant data byte INT_CFG Default Value: 10HEX 7 6 5 0 0 0 0 4 3 2 1 0 ALS Interrupt Source ALS Variation Interrupt Mode ALS Interrupt Enable 0 0 ALS_INT_SEL ALS_VAR_MODE ALS_INT_EN 0 0 FIELD BIT DESCRIPTION ALS_INT_SEL 5:4 00 : Clear channel 01 : ALS channel (default) ALS_VAR_MODE 3 0 : ALS threshold interrupt mode (default) 1 : ALS variation interrupt mode ALS_INT_EN 2 0 : ALS Interrupt disabled (default) 1 : ALS Interrupt enabled 0X19 INT_PERSISTENCE Default value: 00HEX 7 6 5 ALS_PERSIST 4 3 2 1 0 0 0 0 0 0X1A This register sets the number of similar consecutive LS interrupt events that must occur before the interrupt is asserted. FIELD BIT DESCRIPTION ALS_PERSIST 7:4 0000 : Every ALS value out of threshold range (default) asserts an interrupt 0001 : 2 consecutive ALS values out of threshold range assert an interrupt … 1111 : 16 consecutive ALS values out of threshold range assert an interrupt 13 ALS_THRES_UP Default value: FFHEX, FFHEX, 0FHEX 7 6 5 4 3 2 1 0 ALS_THRES_UP_0 [7:0] 0X21 ALS_THRES_UP_1 [15:8] 0 0 0 0 0x22 ALS_THRES_UP_2 [19:16] 0x23 ALS_THRES_UP sets the upper threshold value for the ALS interrupt. The Interrupt Controller compares the value in ALS_THRES_UP against measured data in the ALS_DATA registers. It generates an interrupt event if ALS_DATA exceeds the threshold level. The data format for ALS_THRES_UP must match that of the ALS_DATA registers. Reg 21HEX Reg 22HEX Reg 23HEX Bit[7:0] ALS upper interrupt threshold value, LSB Bit[7:0] ALS upper interrupt threshold value, intervening byte Bit[3:0] ALS upper interrupt threshold value, MSB ALS_THRES_LOW Default value: 00HEX, 00HEX, 00HEX 7 0 6 0 5 4 3 2 1 0 ALS_THRES_LOW_0 [7:0] 0X24 ALS_THRES_LOW_1 [15:8] 0x25 0 0 ALS_THRES_UP_2 [19:16] 0x26 ALS_THRES_LOW sets the upper threshold value for the ALS interrupt. The Interrupt Controller compares the value in ALS_THRES_LOW against measured data in the ALS_DATA registers. It generates an interrupt event if ALS_DATA is below the threshold level. The data format for ALS_THRES_LOW must match that of the ALS_DATA registers. Reg 24HEX Reg 25HEX Reg 26HEX Bit[7:0] ALS lower interrupt threshold value, LSB Bit[7:0] ALS lower interrupt threshold value, intervening byte Bit[3:0] ALS lower interrupt threshold value, MSB ALS_THRESH_VAR Default Value: 00HEX 7 6 5 4 3 0 0 0 0 0 2 1 ALS_THRES_VAR FIELD BIT DESCRIPTION ALS_THRES_VAR 2:0 000 : ALS result varies by 8 counts compared to previous result 001 : ALS result varies by 16 counts compared to previous result 010 : ALS result varies by 32 counts compared to previous result 011 : ALS result varies by 64 counts compared to previous result … 111 : ALS result varies by 1024 counts compared to previous result 14 0 0X27 Application Information: Hardware The application hardware circuit for implementing an ALS is simple with the APDS-9306/APDS-9306-065 and is shown in the following figure. The bypass capacitor is placed as close to the VDD pin and is connected directly to the power source and to the ground, as shown in Figure below. It allows the AC component of the VDD to pass through to ground. Use bypass capacitor with low effective series resistance (ESR) and low effective series inductance (ESI), such as the common ceramic types, which provide a low impedance path to ground at high frequencies to handle transient currents caused by internal logic switching. Pull-up resistors, RSDA and RSCL, maintain the SDA and SCL lines at a high level when the bus is free and ensure the signals are pulled up from a low to a high level within the required rise time. A pull-up resistor, RINT, is also required for the interrupt (INT), which functions as a wired-AND signal in a similar fashion to the SCL and SDA lines. A typical impedance value of 10 kΩ can be used. For a complete description of I2C maximum and minimum R1 and R2 values, please review the I2C Specification at http:// www.semiconductors.philips.com. VDD R INT R SDA R SCL 1uF MCU SCL SCL SDA SDA INT APDS-9306/ APDS-9306-065 INT GND 15 Package Outline Dimensions for APDS-9306 2 ±0.10 8 7 0.265 ±0.100 (x4) 6 5 5 6 7 8 0.775 ±0.100 (x8) (0.263) (0.344) CL 2 ±0.10 CL (0.407) 1 2 3 4 4 CL IC Active Area Center 0.34 ±0.10 Pin-Out 1 - GND 2 - NC 3 - NC 4 - VDD 5 - SCL 6 - SDA 7 - INT 8 - NC Dimensions are in mm PCB Pad Layout for APDS-9306 2 CL 0.775 (x8) 2 CL 0.350 (x8) 0.530 (x6) Dimensions are in mm 16 0.265 (x4) 0.310 (x8) 3 0.53 ±0.10 (x6) 2 CL 1 0.35 ±0.10 (x8) 0.31 ±0.10 (x8) Tape Dimensions for APDS-9306 Ø 1.50 ±0.10 2 ±0.050 4 ±0.10 A 4 ±0.10 0.200 ±0.020 1.75 ±0.10 3.500 ±0.050 8 +0.300 -0.100 2.250 ±0.050 B B C 45 Deg Max A SECTION A-A SCALE 10 : 1 Ø 1 ±0.250 2.250 ±0.050 SECTION B-B SCALE 10 : 1 45 Deg Max Unit Orientation DETAIL C SCALE 20 : 1 Dimensions are in mm Reel Dimensions for APDS-9306 (620mm MIN) LEADER (PARTS MOUNTED) (420mm MIN) TRAILER (40mm MIN) EMPTY 0 0.5 2± 1.40 Ø178 ± 1 B 56 ± 0.20 R6. 50 .10 .50 R10 .10 ±0 DETAIL B SCALE 2 : 1 ±0 9 ±0.20 12 ±1 17 Package Outline Dimensions for APDS-9306-065 2 ±0.10 3 0.65 ±0.10 (4x) 0.65 ±0.10 2 1 1 2 3 0.75 ±0.15 (6x) 0.625 ±0.100 (6x) CL CL 2 ±0.10 5 4 IC Active Area Center CL 6 6 CL (0.223) PINOUT 1- SCL 2- SDA 3- VDD 4- INT 5- NC 6- GND PCB Pad Layout (2) (2) 1.300 (x3) 0.900 (x6) 0.650 (x4) 18 5 0.400 (x6) 4 0.300 ±0.050 (6x) 0.100±0.050 (6x) Tape Dimensions for APDS-9306-065 2 ±0.050 4±0.10 Ø 1.50 ±0.10 4±0.10 A 0.200 ±0.200 1.75 ±0.10 5 Deg Max 8 +-0.300 0.100 3.500 ±0.050 2.180 ±0.050 B B C 2.180 ±0.050 Ø 1±0.25 A 0.830 ±0.050 SECTION A-A SCALE 10 : 1 5 Deg Max SECTION B-B SCALE 10 : 1 Unit Orientation DETAIL C SCALE 20 : 1 Dimensions are in mm Reel Dimensions for APDS-9306-065 T Tape Start Slot CCD/KEACO Measured at Hub W1 T Tape Start Slot MADE IN MALAYSIA Access Hole Access Hole 13 ± 0.2 Arbor Hole 20.2 Min. ∅180 ± 0.50 Diameter Access Hole W2 Measured at Hub W3 Measured at Outer Edge Front View 19 Back View Side View 60 ± 0.50 Hub Dia. Moisture Proof Packaging Chart All APDS-9306/APDS-9306-065 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 3. BAKING CONDITIONS CHART UNITS IN A SEALED MOISTURE-PROOF PACKAGE PACKAGE IS OPENED (UNSEALED) ENVIRONMENT LESS THAN 30° C AND LESS THAN 60% RH YES NO BAKING IS NECESSARY PACKAGE IS OPENED LESS THAN 168 HOURS YES NO PERFORM RECOMMENDED BAKING CONDITIONS Recommended Storage Conditions NO Baking conditions Storage Temperature 10°C to 30°C Relative Humidity Below 60% RH If the parts are not stored per the recommended storage conditions they must be baked before reflow to prevent damage to the parts. Time from Unsealing to Soldering Package Temp. Time After removal from the bag, the parts should be soldered within seven days if stored at the recommended storage conditions. When the Moisture Barrier Bag (MBB) is opened and the parts are exposed to the recommended storage conditions more than seven days, the parts must be baked before reflow to prevent damage to the parts. In Reels 60°C 48 hours In Bulk 100°C 4 hours 20 Note: Baking should only be done once. Recommended Reflow Profile MAX 260°C T - TEMPERATURE (°C) 255 R3 230 217 200 180 R2 R4 60 sec to 90 sec Above 217°C 150 R5 R1 120 80 25 0 P1 HEAT UP Process Zone 50 100 150 200 P3 SOLDER REFLOW P2 SOLDER PASTE DRY Symbol Heat Up Solder Paste Dry Solder Reflow P1, R1 P2, R2 P3, R3 P3, R4 Cool Down P4, R5 Time maintained above liquidus point, 217° C Peak Temperature Time within 5° C of actual Peak Temperature Time 25° C to Peak Temperature The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different T/time temperature change rates or duration. The T/time rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and component pins are heated to a temperature of 150°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC board and component pins. Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder. Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 260°C (500°F) for optimum results. The dwell time For product information and a complete list of distributors, please go to our web site: 250 P4 COOL DOWN T Maximum T/time or Duration 25°C to 150°C 150°C to 200°C 200°C to 260°C 260°C to 200°C 200°C to 25°C > 217°C 260°C – 25°C to 260°C 3°C/s 100 s to 180 s 3°C/s -6°C/s -6°C/s 60 s to 90 s – 20 s to 40 s 8 mins 300 t-TIME (SECONDS) above the liquidus point of solder should be between 60 and 90 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and component pins to change dimensions evenly, putting minimal stresses on the component. It is recommended to perform reflow soldering no more than twice. www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2015–2016 Avago Technologies. All rights reserved. AV02-4755EN - October 21, 2016
APDS-9306-065 价格&库存

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APDS-9306-065
  •  国内价格 香港价格
  • 1+9.317601+1.18670
  • 10+7.1719010+0.91340
  • 100+6.08740100+0.77530
  • 500+5.66750500+0.72180
  • 2500+5.154402500+0.65650
  • 5000+4.583005000+0.58370
  • 10000+4.3031010000+0.54810

库存:19621

APDS-9306-065
    •  国内价格
    • 1+7.89480
    • 10+7.16040
    • 30+6.70680
    • 100+6.24240
    • 500+6.02640
    • 1000+5.94000

    库存:2752

    APDS-9306-065
    •  国内价格 香港价格
    • 2500+5.212022500+0.62838
    • 5000+4.828705000+0.58216
    • 7500+4.625737500+0.55769
    • 12500+4.4099312500+0.53168
    • 17500+4.3402517500+0.52327

    库存:75031

    APDS-9306-065
    •  国内价格 香港价格
    • 1+10.497861+1.26565
    • 5+9.382535+1.13118
    • 10+8.2151710+0.99045
    • 25+7.7540625+0.93485
    • 50+7.2271950+0.87133
    • 100+6.13475100+0.73962
    • 500+5.71473500+0.68899

    库存:75031

    APDS-9306-065
    •  国内价格
    • 1+5.50060

    库存:284

    APDS-9306-065
    •  国内价格
    • 2500+4.57783

    库存:11100

    APDS-9306-065
    •  国内价格
    • 10+6.87838
    • 630+6.72650
    • 1250+6.58373

    库存:11100

    APDS-9306-065
    •  国内价格
    • 630+6.72650
    • 1250+6.58373

    库存:11100