APDS-9700-020

APDS-9700 Signal Conditioning IC for Optical Proximity Sensors Data Sheet Description Features APDS-9700 is a signal conditioning IC that enhances the performance and robustness of the optical sensors used for proximity or object detection. • Low power consumption APDS-9700 is a single chip solution that consists of a LED driver circuit, sunlight cancellation and built-in LED stuck high protection circuit integrated into a single chip. APDS9700 has artificial light immunity and is also operational under the sun. Design flexibility is optimized as APDS9700 can be paired up with an integrated proximity sensor or discrete pair solution. APDS-9700 can be disabled to maximize power savings and battery life in applications such as portable or battery-operated devices. The LED current of the optical proximity sensors can be configured to different levels using a limiting resistor at the LEDA pin. APDS-9700 also provides user flexibility to control the pulse width with suitable burst rate, duty cycle and frequency that can reduce power consumption. These low power consumption features makes it also ideal for low power mobile and handheld devices. APDS-9700 is capable of operating at voltage supply ranging from 2.4 V to 3.6 V. APDS-9700 has two separate output pins for analog and digital outputs. This provides flexibility to use either the analog or digital output (or both) depending on the requirements of the application. The device is packaged in 8-pin QFN package measuring 0.55mm(H) x 2mm(W) x 2mm(L). - LED pulse width control - Low shut down current - External LED drive-current control • Complete shutdown mode • Supply voltage : 2.4 V to 3.6 V • Operational in sunlight conditions up to 100klux(with HSDL-9100) • Artificial light immunity • Analog & Digital output available - Built in hysteresis comparator for digital output • LED stuck High protection • Wide bandwidth Trans-impedance amplifier • External capacitor and resistor for integration and gain controls • Flexibility to enhance detection distance up to 200mm with HSDL-9100 or further with external discretes pair • Small 2mm x 2mm QFN 8-pin package • Design flexibility to pair with Avago Proximity Sensors or discretes pair solution • Lead-free & ROHS Compliant Applications • PDA and mobile phones Ordering Information • Portable and Handheld devices Part Number Package Shipping Option • Personal Computers/Notebooks APDS-9700-020 Tape & Reel 2500 • Amusement/Games/Vending Machines • Industrial Automation Application Support Information • Contactless Switches The Application Engineering Group is available to assist you with the application design associated with APDS9700 module. You can contact them through your local sales representatives for additional details. • Sanitary Automation Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Min. Max. Units Supply Voltage VCC 0 4.5 V Input Logic Voltage Vi 0 4.5 V 260 °C Reflow Soldering Temperature Conditions Recommended Operating Conditions Parameter Symbol Min. Max. Units Conditions Operating Temperature TA -40 105 °C Storage Temperature Ts -40 125 °C Supply Voltage VCC 2.4 3.6 V Symbol Minimum Typical Logic High Voltage, LEDON VIH 1.6 Vcc V Logic High Voltage, ENB VIH 1.4 Vcc V For Vcc = 2.4V 1.5 Vcc V For 2.4V < Vcc ≤ 3V 1.7 Vcc V For 3V < Vcc ≤ 3.6V Electrical & Optical Specifications (Ta=25°C) Parameters Maximum Units Conditions Input Logic Low Voltage, LEDON VIL 0 0.3 V Logic Low Voltage, ENB VIL 0 0.3 V Logic High Input Current, LEDON IIH 0.1 1 uA VI ≥ VIH Logic High Input Current, ENB IIH 0.1 1 μA VI ≥ VIH Logic Low Input Current, LEDON IIL 0.1 1 μA VI ≤ VIL Logic Low Input Current, ENB IIL 0.1 1 μA VI ≤ VIL Shutdown Current ISD 0.3 1 μA Vcc=3V, ENB=3V Idle Current Icc 500 650 μA Vcc=3V, ENB=0V 0.3 V IDOUT(Low) = 2mA, Vcc = 3V Output Digital Output VOL 0 Rise Time(DOUT) TR 1 us Vcc = 3V, R2 = 10kΩ, Frequency = 10kHz Fall Time(DOUT) TF 1 us Vcc = 3V, R2 = 10kΩ, Frequency = 10kHz Rise Time (LEDA) TR 40 ns Vcc = 3V , ILED = 120mA, Freq = 10kHz Fall Time (LEDA) TF 40 ns Vcc = 3V , ILED = 120mA, Freq = 10kHz Max ILED Pulse Width Max-PW 120 μs Vcc=3V, ENB=0V ILED Pulse Current ILED 120 mA Vcc=3V, R1 = 10Ω Transmitter  300 Electrical & Optical Specification (continued) Parameters Symbol Minimum Typical Maximum Units Conditions Photodiode input current (PD) IPD 0 Current Gain IPFiLT/IPD 20 times Vcc = 3V Hysterisis VHYS 40 mV Vcc= 3.0V Threshold voltage V TH 655 mV Vcc= 3.0V IDC 100 μA Vcc= 3.0V Receiver 3 μA Hysterisis Comparator Sunlight Cancellation DC Current, PD APDS-9700 pin-out and I/O Configurations PIN #1 CORNER Pin 1 Pin 8 Pin 2 Pin 7 Pin 3 Pin 6 Pin 4 Pin 5 I/O Pins Configuration Table Pin Symbol Type Description 1 LEDON Digital I/P LED Driver Input LEDA will turn off when LEDON is stuck in high state for > Max-PW 2 ENB Digital I/P Power Down Enable ENB = 0 Normal mode operation ENB = 1 Shut down mode 3 DOUT Digital O/P Digital Output An open drain output that requires a pull-up resistor of recommended value 10k Ω DOUT = 0 when VPFILT > V TH DOUT = Vcc when VPFILT < V TH   4 GND Ground Ground 5 PD Analog I/P Photo-Detector Input Connect to Cathode of photo-detector (proximity sensor) 6 PFILT Analog O/P Analog Output Connect to integration circuit (R3 & CX3) 7 LEDA Analog O/P LED Driver Output Connect to Anode of LED (proximity sensor) LEDA will turn off when LEDON is stuck in high state for > Max-PW 8 VCC Supply  Voltage Supply VIO R2 PWM/ GPIO LEDON GPIO 1 8 Vcc ENB R1 2 MCU 7 LEDA APDS-9700 GPIO CX2 CX1 DOUT 3 R3 6 PFILT CX3 GND ADC 4 5 PD Avago Proximity Sensor Reflective Object Figure 1. Typical Application Circuit for APDS-9700 Recommended Avago Proximity Sensor Description HSDL-9100 Integrated Reflective Proximity Sensor Component Recommended Values ( with HSDL-9100) R1 10 Ω R2 10k Ω R3 100k Ω to 500k Ω CX1 100 nF ± 20% X 7R, Ceramic, CX2 6.8 μF ± 20%, Tantalum CX3 3.3 nF ± 20% X 7R, Ceramic  APDS-9700 Block Diagram (1) LEDON (7) LEDA Stuck High Protection Sunlight Cancellation R1 (5) PD TIA V IO Avago Proximity Sensor PIN (6) PFILT R2 CX3 V-I CONVERTER (2) ENB (3) DOUT Hysteresis Comparator (4) DOUT Figure 2. APDS-9700 Block Diagram  LED R3 APDS-9700 Package Dimensions 2 7 6 5 1 2 3 4 2 8 PIN #1 ID ON TOP 0.05 0.15 0.05 0.50 0.55 TOP VIEW 0.7 2 1.3 R0.1 0.7 0.65 1.35 1 0.22 0.35 SIDE VIEW R0.125 0.35 0.25 0.25 0.5 0.75 BOTTOM VIEW Dimensions in mm. Tolerance ±0.1mm Figure 3. Package Outline Dimensions and land patterm  APDS-9700 Tape and Reel Dimensions 0.254±0.02 Ko = 1.00 ±0.05 ±0.05 4.00±0.10 4.00±0.10 2.00 ±0.05 ø1.50 ±0.10 1.75 ±0.10 +0.30 / -0.10 8.00 \ S 3.50 ±0.05 Bo = 2.30 ±0.05 ±0.05 Ao = 2.30 ±0.05 ø1.00 +0.25/-0.00 10º MAX Unit Orientation Package YWW Figure 4. APDS-9700 Tape and Reel Dimensions Marking Information The unit is marked ‘YWW’ on the chip. Y = Year WW= work week  Note: 1. All unit are in millimeters 2. General Tolerance: Specified 3. Resistivity: 50ns Burst Pulses LEDON >20µs PFLIT V TH DOUT Note: Pulses at LEDON can only be activated at least 20us after ENB turn from high to low. 10 APDS-9700 Performance Charts (Typical Conditions) 1.6 1.1 1.4 1 NORMALIZED ILED NORMALIZED ILED 1.2 1 0.8 0.9 0.8 0.7 0.6 0.6 0.4 0.2 0.5 2.4 2.6 2.8 3 VCC (V) 3.2 3.4 -40 3.6 Figure 8. Normalized ILED Vs Vcc (T=25 °C, R1=10Ω ) -20 0 20 40 TEMP(ºC) 60 80 100 Figure 9. Normalized ILED VS Temp (VCC=3V,R1=10Ω) 1.1 0.7 Vcc=2.4V 0.6 Vcc=3V 1.05 0.5 TYPICAL ILED (A) NORMALIZED ICC IDLE Vcc=2.7V 1 Vcc=3.3V Vcc=3.6V 0.4 0.3 0.2 0.95 0.1 0.9 2.4 2.6 2.8 3 VCC(V) 3.2 3.4 1.2 1.02 1.15 1.01 1.1 1.00 1.05 1 0.95 0.9 3 4 5 6 RLED (-) 7 8 9 10 0.99 0.98 0.97 0.96 0.95 0.85 0.8 2.4 2 Figure 11. ILED VS RLED (T=25°C) NORMALIZED ICC IDLE NORMALIZED ICC SD Figure 10. Normalized ICC Idle Vs Vcc (T=25°C) 0.94 2.6 2.8 3 VCC(V) Figure 12. Normalized ICC SD VS VCC (T=25°C) 11 0 3.6 3.2 3.4 3.6 0.93 -40 -20 0 20 40 TEMP(ºC) Figure 13. Normalized ICC IDLE VS TEMP (VCC=3V) 60 80 100 Appendix A: SMT Assembly Application Note Recommended Minimum Land pattern and Keep-out Area 1. Area of Solder Land pattern = 2.3mm x 2.1mm 0.32 0.5 0.1 Keep-out Area Recommendations: 2. Module placement tolerance & keep out on each side with no lead = 0.55mm & keep out on each side solder lead = 0.8mm 0.25 0.22 R0 .17 5 2 0.22 3. Keep-out area = 3.9mm x 3.2mm 0.25 0.5 2 SOLDER LAND PATTERN Dimension in mm. Tolerances +0.1mm For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. AV02-0893EN - August 13, 2008