Data Sheet
ARE1-xxx0-00000
High Power Infrared Emitting Diodes
Description
The Broadcom® high-power IR LEDs are available in
850-nm and 940-nm peak wavelength ranges, appropriate
for specific devices, such as infrared illumination,
surveillance systems, CCTV, and gesture recognition.
Packaged in a 3.85 mm × 3.85 mm surface-mount platform,
together with viewing angles of 90° and 150° lens optics
options, the high-power IR LEDs are suitable for a wide
variety of applications.
The package is compatible with the reflow soldering
process. To facilitate easy pick-and-place assembly, the
LEDs are packed in tape and reel.
Broadcom
Features
Available in peak wavelengths: 850 nm and 940 nm
High radiant intensity
High radiant power
Low forward voltage
Typical viewing angles: 90° and 150°
Compatible with industrial reflow soldering process
MSL 3
Applications
Infrared illumination for cameras
Surveillance systems
ARE1-xxx0-DS103
October 7, 2019
ARE1-xxx0-00000 Data Sheet
High Power Infrared Emitting Diodes
Figure 1: Package Drawing
Viewing Angle 90° (ARE1-89x0, ARE1-99x0)
Viewing Angle 150° (ARE1-8Fx0, ARE1-9Fx0)
Cathode
Cathode
Anode
Anode
ESD
protection
device
ESD
protection
device
NOTE:
1. All dimensions in millimeters (mm).
2. Tolerance is ± 0.1 mm unless otherwise specified.
Broadcom
ARE1-xxx0-DS103
2
ARE1-xxx0-00000 Data Sheet
High Power Infrared Emitting Diodes
Device Selection Guide (TJ = 25°C, IF = 1A)
a,b
Part Number
Radiant Flux, Φe
Radiant Intensity, Ie (mW/sr)
Peak Wavelength,
peak (nm)
(mW)c
Viewing Angle,
2θ½ (°) d
Min.
Max.
Typ.
Typ.
ARE1-89C0-00000
850
160
450
685
90
ARE1-89D0-00000
850
250
600
800
90
ARE1-8930-00000
850
630
1000
1340
90
ARE1-8FC0-00000
850
100
350
630
150
ARE1-8FD0-00000
850
150
400
800
150
ARE1-8F30-00000
850
200
500
1270
150
ARE1-99D0-00000
940
160
450
590
90
ARE1-9930-00000
940
320
850
935
90
ARE1-9F30-00000
940
160
400
970
150
a. The radiant intensity, Ie is measured at the mechanical axis of the package and it is tested with a single current pulse condition (tp = 10 ms).
The actual peak of the spatial radiation pattern may not be aligned with the axis.
b. Tolerance is ±15%.
c. The radiant flux,Φe is the total flux output as measured with an integrating sphere at a single current pulse condition (tp = 10 ms).
d. θ½ is the off-axis angle where the luminous intensity is half of the peak intensity.
Absolute Maximum Ratings
Parameters
ARE1-8xC0
ARE1-8xD0
ARE1-8x30
ARE1-9xD0
ARE1-9x30
Units
DC Forward Currenta
1000
1000
1000
1000
1000
mA
Peak Forward Currentb, c
3000
3000
3000
3000
3000
mA
Power Dissipation
2500
2500
3600
2500
3400
mW
Reverse Voltage
LED Junction Temperature
Not designed for reverse bias operation
115
145
115
115
115
°C
Operating Temperature Range
–40 to +85
–40 to +100
–40 to +85
–40 to +85
–40 to +85
°C
Storage Temperature Range
–40 to +100
–40 to +100
–40 to +100
–40 to +100
–40 to +100
°C
a. Derate linearly as shown in Figure 8, Figure 9, Figure 10, and Figure 11.
b. Duty factor = 10%, frequency = 1kHz.
c. Solder point temperature, TS = 25°C.
Broadcom
ARE1-xxx0-DS103
3
ARE1-xxx0-00000 Data Sheet
High Power Infrared Emitting Diodes
Optical and Electrical Characteristics (TJ = 25°C)
Parameters
Min.
Typ.
Max.
Units
Test Condition
IF = 1A
V
Forward Voltage, VFa
1.4
1.4
2.7
1.4
2.5
ARE1-8xC0
ARE1-8xD0
ARE1-8x30
ARE1-9xD0
ARE1-9x30
1.8
1.8
3.2
1.8
3.0
2.5
2.5
3.6
2.5
3.4
Not designed for reverse bias
Reverse Voltage, VR
—
Thermal Resistance, RθJ-Sb
10
—
°C/W
LED junction to solder point
a. Forward voltage tolerance is ±0.1V.
b. Thermal resistance from the LED junction to the solder point.
Part Numbering System
A
R
E
Code
1
-
x1
x2
x3
0
-
Description
0
0
0
0
0
Option
x1
Peak Wavelength
8
9
940 nm
x2
Viewing Angle
9
90°
F
150°
x3
Brightness Option
C
Single junction normal brightness
D
Single junction high brightness
3
Double junction high brightness
850 nm
Part Number Example
ARE1-89D0-00000
x 1: 8
—
Peak wavelength 850 nm
x 2: 9
—
Viewing angle typical 90°
x 3: D
—
Single junction high brightness
Broadcom
ARE1-xxx0-DS103
4
ARE1-xxx0-00000 Data Sheet
High Power Infrared Emitting Diodes
Figure 2: Spectral Power Distribution
1.0
1000
0.9
900
850nm
0.7
0.6
800
FORWARD CURRENT - mA
0.8
RELATIVE INTENSITY
Figure 3: Forward Current vs. Forward Voltage
940nm
0.5
0.4
0.3
0.2
500
400
300
200
100
0.0
0
380 440 500 560 620 680 740 800 860 920 980 1,040
WAVELENGTH - nm
Figure 4: Relative Radiant Flux vs. Mono Pulse Current
0.0
140
130
120
110
100
90
80
70
60
50
40
30
20
10
0
ARE1-8xD0
ARE1-9xD0
2.5
ARE1-8xC0
ARE1-8x30
2.0
ARE1-9x30
tp = 100μs
1.5
1.0
0.5
0.0
0
500
1000
1500
2000
MONO PULSE CURRENT -mA
2500
1.0
2.0
3.0
FORWARD VOLTAGE - V
4.0
5.0
Figure 5: Relative Light Output vs. Junction Temperature
ARE1-8x30
RELATIVE LIGHT OUTPUT - %
(NORMALIZED AT 25°C)
RELATIVE RADIANT FLUX
(NOMRLAIZED @1000mA)
3.0
3000
Figure 6: Forward Voltage Shift vs. Junction Temperature
ARE1-8xD0 (TJmax 145°C)
ARE1-9xD0 (TJmax 115°C)
ARE1-8xC0
ARE1-9x30
-50
-25
0
25
50
75
100
125
JUNCTION TEMPERATURE, TJ - °C
150
175
Figure 7: Radiation Pattern
0.50
1.0
ARE1-9x30
0.40
0.9
ARE1-8x30
0.30
ARE1-9xD0
0.20
ARE1-8xD0
0.10
150°
0.8
RELATIVE INTENSITY
FORWARD VOLTAGE SHIFT - V
(NORMALIZED AT 25°C)
ARE1-8x30
ARE1-9x30
600
0.1
ARE1-8xC0
0.00
-0.10
-0.20
0.7
0.6
0.5
0.4
90°
0.3
0.2
-0.30
0.1
-0.40
0.0
-50
Broadcom
ARE1-8xC0
ARE1-8xD0
ARE1-9xD0
700
-25
0
25
50
75
100
JUNCTION TEMPERATURE, TJ - °C
125
150
-90
-60
-30
0
30
60
ANGULAR DISPLACEMENT - DEGREE
90
ARE1-xxx0-DS103
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ARE1-xxx0-00000 Data Sheet
High Power Infrared Emitting Diodes
Figure 8: Maximum Forward Current vs. Ambient
Temperature for ARE1-8xC0 and ARE1-9xD0
Figure 9: Maximum Forward Current vs. Ambient
Temperature for ARE1-8xD0
1200
MAX ALLOWABLE DC CURRENT - mA
MAX ALLOWABLE DC CURRENT - mA
1200
1000
800
600
RșJ-A = 25°C/W
RșJ-A = 35°C/W
RșJ-A = 45°C/W
400
200
1000
800
400
200
0
0
0
20
40
60
80
AMBIENT TEMPERATURE, TA - °C
100
Figure 10: Maximum Forward Current vs. Ambient
Temperature for ARE1-8x30
0
40
60
80
100
AMBIENT TEMPERATURE, TA - °C
120
1200
MAX ALLOWABLE DC CURRENT - mA
MAX ALLOWABLE DC CURRENT - mA
20
Figure 11: Maximum Forward Current vs. Ambient
Temperature for ARE1-9x30
1200
1000
800
RșJ-A = 20°C/W
RșJ-A = 25°C/W
RșJ-A = 30°C/W
600
400
200
1000
800
RșJ-A = 20°C/W
RșJ-A = 25°C/W
RșJ-A = 30°C/W
600
400
200
0
0
0
20
40
60
80
AMBIENT TEMPERATURE, TA - °C
100
Figure 12: Maximum Forward Current vs. Solder Point
Temperature
0
20
40
60
80
AMBIENT TEMPERATURE, TA - °C
100
Figure 13: Recommended Soldering Land Pattern
1.0
120 0
MAX ALLOWABLE DC CURRENT - mA
RșJ-A = 25°C/W
RșJ-A = 35°C/W
RșJ-A = 45°C/W
600
0.5
100 0
ARE1-8xC0
ARE1-9xD0
800
600
2.8
400
ARE1-8x30
ARE1-9x30
200
ARE1-8xD0
2.8
0
0
20
40
60
80
100
SOLDER POINT TEMPERATURE, TS - °C
Broadcom
120
NOTE:
All dimensions are in millimeters (mm).
ARE1-xxx0-DS103
6
ARE1-xxx0-00000 Data Sheet
High Power Infrared Emitting Diodes
Figure 14: Carrier Tape Dimensions
NOTE:
All dimensions in millimeters (mm).
Figure 15: Reel Dimensions
14.4 Typ.
Ø 178.0 ± 2.0
Ø 60.0 ± 1.0
PRODUCT LABEL
Ø13.0 Typ.
USER FEED DIRECTION
NOTE:
Broadcom
All dimensions are in millimeters (mm).
ARE1-xxx0-DS103
7
ARE1-xxx0-00000 Data Sheet
High Power Infrared Emitting Diodes
Precautionary Notes
Reflow Soldering
Do not perform reflow soldering more than twice.
Observe necessary precautions of handling
moisture-sensitive devices as stated in Handling of
Moisture-Sensitive Devices.
Do not apply any pressure or force on the LED during
reflow and after reflow when the LED is still hot.
Figure 16: Recommended Lead-Free Reflow Soldering Profile
TEMPERATURE
10 to 30 SEC.
255 – 260°C
217°C
200°C
cleaning, rub the surface gently without putting too
much pressure on the silicone. Ultrasonic cleaning is
not recommended.
Handling of Moisture-Sensitive Devices
This product has a Moisture Sensitive Level 3 rating per
JEDEC J-STD-020. Refer to Broadcom Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices, for additional details and a review of proper
handling procedures.
Before use:
3°C/SEC. MAX.
6°C/SEC. MAX.
150°C
3°C/SEC. MAX.
100 SEC. MAX.
60 – 120 SEC.
TIME
An unopened moisture barrier bag (MBB) can be stored
at
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