AREM-60C0-LM000

Data Sheet AREM-x0C0-xx000 3528 PLCC-2 Surface Mount Infrared LED Description Features The Broadcom® AREM-x0C0-xx000 LEDs use single junction infrared emitter packaged in an industrial-standard PLCC-2. This high-efficiency infrared emitter is suitable to be used in various industrial automation applications, gaming, safety systems, CCTVs and home appliances.  The package is compatible with reflow soldering process. To facilitate easy pick and place assembly, these products are packed in tape and reel form.   Available in peak wavelength 820nm, 830nm, 870nm and 890nm Wide viewing angle at 120° JEDEC MSL 3 Applications       Industrial automations - Machine controls, light curtains, vision systems Gaming Clinical products Distance sensor Safety systems and CCTVs Home appliances CAUTION! This LED is ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to application note AN-1142 for additional detail. Broadcom AREM-x0C0-xx000-DS October 7, 2021 AREM-x0C0-xx000 Data Sheet 3528 PLCC-2 Surface Mount Infrared LED Figure 1: Package Drawing NOTE: 1. 2. 3. 4. All dimensions in millimeters (mm). Tolerance is ±0.20mm unless otherwise specified. Terminal finish = silver plating. Dimensions in bracket are for reference only. Device Selection Guide (TJ = 25°C, IF = 100mA, tp = 20ms) Peak Wavelength, λp (nm) Part Number Radiant Flux, Φe (mW) a, b Radiant Intensity, Ie (mW/sr) c Typ. Min. Typ. Max. Typ. AREM-20C0-LM000 820 32.9 55.0 83.8 19.7 AREM-30C0-LM000 830 32.9 48.0 83.8 17.2 AREM-40C0-LM000 870 32.9 49.0 83.8 17.6 AREM-60C0-LM000 890 32.9 52.0 83.8 18.7 a. Radiant flux, Φe is the total output measured with an integrating sphere at a single current pulse condition. b. Tolerance is ±12%. c. For reference only. Absolute Maximum Ratings Parameters DC Forward Current a Peak Forward Current b Power Dissipation Reverse Voltage LED Junction Temperature AREM-x0C0-xx000 Unit 100 mA 300 mA 200 mW Not designed for reverse bias operation 110 °C Operating Temperature Range -40 to +100 °C Storage Temperature Range -40 to +100 °C a. Derate linearly as shown in Figure 6 and Figure 7. b. Duty factor = 10.0%, frequency = 1KHz at TS = 25°C Broadcom AREM-x0C0-xx000-DS 2 AREM-x0C0-xx000 Data Sheet 3528 PLCC-2 Surface Mount Infrared LED Optical and Electrical Characteristics (TJ = 25°C) Parameters Min. Typ. Max. Unit − 120 − ° IF = 100mA, tp = 20ms 820nm − 32 − nm IF = 100mA, tp = 20ms 830nm − 31 − 870nm − 34 − 890nm − 48 − 820nm − 1.6 2.0 V IF = 100mA, tp = 20ms 830nm − 1.5 2.0 870nm − 1.5 2.0 − 1.5 2.0 820nm − 2.0 − V IF = 300mA, tp = 100µs 830nm − 1.8 − 870nm − 1.8 − Viewing Angle, 2θ½ a Test Conditions Spectral Half-Width, Δλ½ Forward Voltage, VF b 890nm Forward Voltage, VF b − 1.7 − − 15 − ns IF = 100mA − 20 − ns IF = 100mA − 80 − °C/W 820nm, 830nm, 870nm − -0.23 − %/°C IF = 100mA, 25°C ≤ T ≤ 85°C 890nm − -0.17 − 820nm − -0.97 − mV/°C IF = 100mA, 25°C ≤ T ≤ 85°C 830nm − -0.88 − 870nm − -1.11 − 890nm − -1.38 − Temperature Coefficient of Peak Wavelength, TCλp − 0.25 − nm/°C IF = 100mA, 25°C ≤ T ≤ 85°C 890nm Rise time, tr Fall time, tf c c Thermal Resistance, RθJ-S d Temperature Coefficient of Radiant Flux, TCΦe Temperature Coefficient of Forward Voltage, TCVF a. θ½ is the off-axis angle where the luminous intensity is half of the peak intensity. b. Forward voltage tolerance is ±0.1V. c. 10% and 90% of Φe max. d. Thermal resistance from LED junction to solder point. Broadcom AREM-x0C0-xx000-DS 3 AREM-x0C0-xx000 Data Sheet 3528 PLCC-2 Surface Mount Infrared LED Part Numbering System A R E M – x1 0 x2 0 – x3 x4 0 0 0 Code Description Option x1 Peak Wavelength 2 820nm 3 830nm 4 870nm 6 890nm C Single Junction x2 Junction Type x3 Min Radiant Flux Bin x4 Max Radiant Flux Bin Refer to the Radiant Flux Bin Limits Part Number Example AREM-20C0-LM000 x1 : 2 ˗̶ Peak wavelength 820nm x2 : C ˗̶ Single junction type x3 : L ˗̶ Minimum Radiant Flux Bin L x4 : M ˗̶ Maximum Radiant Flux Bin M Bin Information Radiant Flux Bin Limits (CAT) Radiant Flux, Φe (mW) Bin ID Min. Max. L 32.9 52.9 M 52.9 83.8 Tolerance = ±12% Example of bin information on reel and packaging label: CAT : L Broadcom ˗̶ Radiant Flux bin L AREM-x0C0-xx000-DS 4 AREM-x0C0-xx000 Data Sheet 3528 PLCC-2 Surface Mount Infrared LED Figure 2: Spectral Power Distribution Figure 3: Forward Current vs. Forward Voltage 300 1.0 830nm, 870nm, 890nm RELATIVE INTENSITY 0.8 870nm 820nm 0.7 890nm 0.6 830nm 0.5 0.4 0.3 0.2 FORWARD CURRENT - mA 0.9 250 820nm 200 150 100 50 0.1 0 0.0 580 630 680 730 780 830 WAVELENGTH (nm) 880 930 0.0 980 Figure 4: Relative Radiant Flux vs. Mono Pulse Current NORMALIZED RADIANT POWER RELATIVE RADIANT FLUX (NORMALIZED AT 100mA 1.5 2.0 2.5 3.0 FORWARD VOLTAGE - V 3.5 4.0 1.0 3.5 tp = 100µs 3.0 2.5 2.0 1.5 1.0 0.5 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 0 50 100 150 200 MONO PULSE CURRENT (mA) 250 -90 300 -60 -30 0 30 ANGULAR DISPLACEMENT - deg 60 90 Figure 7: Maximum Forward Current vs. Solder Point Temperature. Derated based on TJMAX = 110°C Figure 6: Maximum Forward Current vs. Ambient Temperature. Derated based on TJMAX = 110°C 120 120 MAX ALLOWABLE DC CURRENT - mA MAX ALLOWABLE DC CURRENT - mA 1.0 Figure 5: Radiation Pattern 4.0 100 80 60 RθJ-A = 320°C/W RθJ-A = 370°C/W RθJ-A = 420°C/W 40 20 100 80 60 40 20 0 0 0 Broadcom 0.5 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE, TA - °C 100 110 0 20 40 60 80 SOLDER POINT TEMPERATURE, TS - °C 100 120 AREM-x0C0-xx000-DS 5 AREM-x0C0-xx000 Data Sheet 3528 PLCC-2 Surface Mount Infrared LED Figure 8: Pulse handling capability at TS < 94 °C. (820nm, 830nm, 870nm) 0.35 0.20 0.25 0.20 0.15 0.15 D= 0.01 0.05 0.10 0.25 0.50 1.00 0.10 0.10 0.05 0.05 0.00 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 tp - PULSE DURATION - sec 0.00 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 tp - PULSE DURATION - sec Figure 10: Pulse handling capability at TS < 94 °C. (890nm) 0.30 0.25 0.20 Figure 11: Pulse handling capability at TS = 100 °C. (890nm) 0.35 0.35 IP - PULSE CURRENT - A 0.30 D= 0.01 0.05 0.10 0.20 0.50 1.00 0.30 IP - PULSE CURRENT - A IP - PULSE CURRENT - A 0.25 D= 0.01 0.05 0.10 0.20 0.50 1.00 IP - PULSE CURRENT - A 0.35 0.30 Figure 9: Pulse handling capability at TS = 100 °C. (820nm, 830nm, 870nm) 0.25 0.20 0.15 0.15 D= 0.01 0.05 0.10 0.25 0.50 1.00 0.10 0.10 0.05 0.05 0.00 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 tp - PULSE DURATION - sec 0.00 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 tp - PULSE DURATION - sec Figure 12: Recommended Soldering Land Pattern COPPER PAD SOLDER MASK NOTE: Broadcom MAXIMIZE ANODE COPPER PAD AREA FOR BETTER HEAT DISSIPATION All dimensions are in millimeters (mm). AREM-x0C0-xx000-DS 6 AREM-x0C0-xx000 Data Sheet 3528 PLCC-2 Surface Mount Infrared LED Figure 13: Carrier Tape Dimensions F P0 P1 P2 D0 E1 W 3.5 ±0.05 4.0 ±0.1 4.0 ±0.1 2.0 ±0.05 1.5 +0.1/-0 1.75 ±0.1 8.0 +0.3/-0.1 T B0 K0 A0 0.25 ±0.05 3.7 ±0.1 2.15 ±0.1 3.0 ±0.1 NOTE: All dimensions are in millimeters (mm). Figure 14: Reel Dimensions 9.0 178.5 60.0 PRODUCT LABEL USER FEED DIRECTION NOTE: 1. All dimensions in millimeters (mm). 2. Quantity per reel: 2000pcs. Broadcom AREM-x0C0-xx000-DS 7 AREM-x0C0-xx000 Data Sheet 3528 PLCC-2 Surface Mount Infrared LED Precautionary Notes Soldering Handling Precautions  The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant, which is hard and brittle, silicone is softer and flexible. Observe special handling precautions during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Refer to Broadcom Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions, for additional information.     Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisturesensitive device as stated in the following section. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to following conditions: ─ Soldering iron tip temperature = 315°C max. ─ Soldering duration = 3sec max. ─ Number of cycles = 1 only ─ Power of soldering iron = 50W max. Do not touch the LED package body with the soldering iron except for the soldering terminals, as it may cause damage to the LED. Confirm beforehand whether the functionality and performance of the LED is affected by soldering with hand soldering. Figure 15: Recommended Lead-Free Reflow Soldering Profile    Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond. Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body. Do not stack assembled PCBs together. Use an appropriate rack to hold the PCBs.  Surface of silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting too much pressure on the silicone. Ultrasonic cleaning is not recommended. TEMPERATURE 10 to 30 SEC. 217°C 200°C 255 – 260°C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C  For automated pick and place, Broadcom has tested a 3°C/SEC. MAX. nozzle size with OD 3.5mm to work with this LED. However, due to the possibility of variations in other parameters such as pick and place machine maker/model, and other settings of the machine, verify that the selected nozzle will not cause damage to the LED. 100 SEC. MAX. 60 – 120 SEC. TIME Figure 16: Recommended Board Reflow Direction Application Precautions   REFLOW DIRECTION Broadcom  The drive current of the LED must not exceed the maximum allowable limit across temperature as stated in the data sheet. Constant current driving is recommended to ensure consistent performance. Circuit design must cater to the whole range of forward voltage (VF) of the LEDs to ensure the intended drive current can always be achieved. The LED exhibits slightly different characteristics at different drive currents, which may result in a larger variation of performance (meaning: intensity, AREM-x0C0-xx000-DS 8 AREM-x0C0-xx000 Data Sheet    wavelength, and forward voltage). Set the application current as close as possible to the test current to minimize these variations. Do not use the LED in the vicinity of material with sulfur content or in environments of high gaseous sulfur compounds and corrosive elements. Examples of material that might contain sulfur are rubber gaskets, room- temperature vulcanizing (RTV) silicone rubber, rubber gloves, and so on. Prolonged exposure to such environments may affect the optical characteristics and product life. Avoid rapid change in ambient temperature, especially in high-humidity environments, because they cause condensation on the LED. If the LED is intended to be used in harsh or outdoor environment, protect the LED against damages caused by rain, water, dust, oil, corrosive gases, external mechanical stresses, and so on. Handling of Moisture-Sensitive Devices This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices for additional details and a review of proper handling procedures.     Before use: ─ An unopened moisture barrier bag (MBB) can be stored at