AREM-80C0-LM000

Data Sheet AREM-80C0-LM000 3528 PLCC-2 Surface Mount Infrared LED Description Features The Broadcom® AREM-80C0-xx000 is a single junction 850-nm infrared emitter packaged in an industrial-standard PLCC-2. This high-efficiency infrared emitter is suitable to be used in various industrial automation applications, gaming, safety systems, CCTVs and home appliances.    The package is compatible with reflow soldering process. To facilitate easy pick and place assembly, these products are packed in tape and reel form. Applications     Available in peak wavelength 850nm Wide viewing angle at 120° JEDEC MSL 3 Industrial automations - Machine controls, light curtains, vision systems Gaming Safety systems and CCTVs Home appliances CAUTION! This LED is ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to application note AN-1142 for additional detail. Broadcom AREM-80C0-LM000-DS September 25, 2020 AREM-80C0-LM000 Data Sheet 3528 PLCC-2 Surface Mount Infrared LED Figure 1: Package Drawing NOTE: 1. 2. 3. 4. All dimensions in millimeters (mm). Tolerance is ±0.20mm unless otherwise specified. Terminal finish = silver plating. Dimensions in bracket are for reference only. Device Selection Guide (TJ = 25°C, IF = 70mA, tp = 20ms) Peak Wavelength, λp (nm) Part Number AREM-80C0-LM000 a. Radiant Flux, Φe (mW) a, b Radiant Intensity, Ie (mW/sr) c Typ. Min. Typ. Max. Typ. 850 32.9 42.7 83.8 14.4 Radiant flux, Φe is the total output measured with an integrating sphere at a single current pulse condition. b. Tolerance is ±12%. c. For reference only. Absolute Maximum Ratings Parameters DC Forward Current a Peak Forward Current b Power Dissipation Reverse Voltage LED Junction Temperature AREM-80C0-LM000 Unit 70 mA 700 mA 126 mW Not designed for reverse bias operation 100 °C Operating Temperature Range -40 to +100 °C Storage Temperature Range -40 to +100 °C a. Derate linearly as shown in Figure 6 and Figure 7. b. Duty factor = 1.0%, frequency = 100Hz at TS = 25°C Broadcom AREM-80C0-LM000-DS 2 AREM-80C0-LM000 Data Sheet 3528 PLCC-2 Surface Mount Infrared LED Optical and Electrical Characteristics (TJ = 25°C) Parameters Viewing Angle, 2θ½ a Spectral Half-Width, Δλ½ Min. Typ. Max. Unit − 120 − ° IF = 70mA, tp = 20ms Test Conditions nm IF = 70mA, tp = 20ms − 35 − b − 1.5 1.8 V IF = 70mA, tp = 20ms Forward Voltage, VF b − 2.4 − V IF = 700mA, tp = 100µs − 15 − ns IF = 70mA Forward Voltage, VF Rise and fall time, tr, tf c − 180 − °C/W − Temperature Coefficient of Radiant Flux, TCΦe − -0.19 − %/°C IF = 70mA, 25°C ≤ T ≤ 85°C Temperature Coefficient of Forward Voltage, TCVF − -0.92 − mV/°C IF = 70mA, 25°C ≤ T ≤ 85°C Temperature Coefficient of Peak Wavelength, TCλp − 0.26 − nm/°C IF = 70mA, 25°C ≤ T ≤ 85°C Thermal Resistance, RθJ-S d a. θ½ is the off-axis angle where the luminous intensity is half of the peak intensity. b. Forward voltage tolerance is ±0.1V. c. 10% and 90% of Φe max. d. Thermal resistance from LED junction to solder point. Part Numbering System A R E M – x1 0 x2 0 – x3 x4 0 0 0 Code Description Option x1 Peak Wavelength 8 850nm x2 Junction Type C Single Junction x3 Min Radiant Flux Bin x4 Max Radiant Flux Bin Refer to the Radiant Flux Bin Limits Part Number Example AREM-80C0-LM000 x1 : 8 ˗̶ Peak wavelength 850nm x2 : C ˗̶ Single junction type x3 : L ˗̶ Minimum Radiant Flux Bin L x4 : M ˗̶ Maximum Radiant Flux Bin M Broadcom AREM-80C0-LM000-DS 3 AREM-80C0-LM000 Data Sheet 3528 PLCC-2 Surface Mount Infrared LED Bin Information Radiant Flux Bin Limits (CAT) Radiant Flux, Φe (mW) Bin ID Min. Max. L 32.9 52.9 M 52.9 83.8 Tolerance = ±12% Example of bin information on reel and packaging label: CAT : L ˗̶ Radiant Flux bin L Figure 2: Spectral Power Distribution Figure 3: Forward Current vs. Forward Voltage 800 1.0 0.9 700 FORWARD CURRENT - mA RELATIVE RADIANT FLUX 0.8 0.7 0.6 0.5 0.4 0.3 0.2 600 500 400 300 200 100 0.1 0.0 0 700 750 800 850 WAVELENGTH - nm 900 Figure 4: Relative Radiant Flux vs. Mono Pulse Current 8 1.0 7 0.9 tp = 100µs 6 5 4 3 2 1 0 0 70 140 210 280 350 420 490 560 MONO PULSE CURRENT (mA) Broadcom 630 700 770 0.5 1.0 1.5 2.0 2.5 FORWARD VOLTAGE - V 3.0 3.5 Figure 5: Radiation Pattern NORMALIZED RADIANT POWER RELATIVE RADIANT FLUX (NORMALIZED AT 70mA) 0.0 950 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - deg 90 AREM-80C0-LM000-DS 4 AREM-80C0-LM000 Data Sheet 3528 PLCC-2 Surface Mount Infrared LED Figure 6: Maximum Forward Current vs. Ambient Temperature. Derated based on TJMAX = 100°C Figure 7: Maximum Forward Current vs. Solder Point Temperature. Derated based on TJMAX = 100°C 80 MAX ALLOWABLE DC CURRENT - mA MAX ALLOWABLE DC CURRENT - mA 80 70 60 50 RθJ-A = 360°C/W RθJ-A = 460°C/W RθJ-A = 560°C/W 40 30 20 10 0 0 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE, TA - °C 60 50 40 30 20 10 0 100 110 Figure 8: Pulse handling capability at TS < 42 °C. Derated based on RθJ-A = 460°C/W 0 0.80 0.70 0.70 0.60 0.60 D= 0.01 0.05 0.10 0.20 0.50 1.00 0.50 0.40 0.30 0.20 1.0E-05 1.0E-04 1.0E-03 1.0E-02 tp - PULSE DURATION - sec Broadcom 20 30 40 50 60 70 80 90 SOLDER POINT TEMPERATURE, TS - °C 100 110 0.50 D= 0.01 0.05 0.10 0.25 0.50 1.00 0.40 0.30 0.20 0.10 0.10 0.00 1.0E-06 10 Figure 9: Pulse handling capability at TS ≤ 85 °C. Derated based on RθJ-A = 460°C/W IP - PULSE CURRENT - A IP - PULSE CURRENT - A 70 1.0E-01 1.0E+00 0.00 1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 tp - PULSE DURATION - sec 1.0E-01 1.0E+00 AREM-80C0-LM000-DS 5 AREM-80C0-LM000 Data Sheet 3528 PLCC-2 Surface Mount Infrared LED Figure 10: Recommended Soldering Land Pattern COPPER PAD MAXIMIZE ANODE COPPER PAD AREA FOR BETTER HEAT DISSIPATION SOLDER MASK NOTE: All dimensions are in millimeters (mm). Figure 11: Carrier Tape Dimensions F 3.5 ±0.05 P0 P1 P2 D0 E1 W 4.0 ±0.1 4.0 ±0.1 2.0 ±0.05 1.5 +0.1/-0 1.75 ±0.1 8.0 +0.3/-0.1 T B0 K0 A0 0.25 ±0.05 3.7 ±0.1 2.15 ±0.1 3.0 ±0.1 NOTE: Broadcom All dimensions are in millimeters (mm). AREM-80C0-LM000-DS 6 AREM-80C0-LM000 Data Sheet 3528 PLCC-2 Surface Mount Infrared LED Figure 12: Reel Dimensions 9.0 178.5 60.0 PRODUCT LABEL USER FEED DIRECTION NOTE: All dimensions are in millimeters (mm). Precautionary Notes      Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisturesensitive device as stated in the following section. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to following conditions: ─ Soldering iron tip temperature = 315°C max. ─ Soldering duration = 3sec max. ─ Number of cycles = 1 only ─ Power of soldering iron = 50W max. Do not touch the LED package body with the soldering iron except for the soldering terminals, as it may cause damage to the LED. Confirm beforehand whether the functionality and performance of the LED is affected by soldering with hand soldering. Broadcom Figure 13: Recommended Lead-Free Reflow Soldering Profile 10 to 30 SEC. TEMPERATURE Soldering 217°C 200°C 255 – 260°C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 3°C/SEC. MAX. 100 SEC. MAX. 60 – 120 SEC. TIME AREM-80C0-LM000-DS 7 AREM-80C0-LM000 Data Sheet Figure 14: Recommended Board Reflow Direction 3528 PLCC-2 Surface Mount Infrared LED Handling of Moisture-Sensitive Devices This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices for additional details and a review of proper handling procedures.  REFLOW DIRECTION Handling Precautions The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant, which is hard and brittle, silicone is softer and flexible. Observe special handling precautions during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Refer to Broadcom Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions, for additional information.      Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond. Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body. Do not stack assembled PCBs together. Use an appropriate rack to hold the PCBs. Surface of silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting too much pressure on the silicone. Ultrasonic cleaning is not recommended. For automated pick and place, Broadcom has tested a nozzle size with OD 3.5mm to work with this LED. However, due to the possibility of variations in other parameters such as pick and place machine maker/model, and other settings of the machine, verify that the selected nozzle will not cause damage to the LED. Broadcom   Before use: ─ An unopened moisture barrier bag (MBB) can be stored at