Data Sheet
AREM-90C0-KL000
3528 PLCC-2 Surface Mount Infrared LED
Description
Features
The Broadcom® AREM-90C0-xx000 is a single junction
940-nm infrared emitter packaged in an industrial-standard
PLCC-2. This high-efficiency infrared emitter is suitable to
be used in various industrial automation applications,
gaming, safety systems, CCTVs and home appliances.
The package is compatible with reflow soldering process.
To facilitate easy pick and place assembly, these products
are packed in tape and reel form.
Applications
Available in peak wavelength 940nm
Wide viewing angle at 120°
JEDEC MSL 3
Industrial automations
- Machine controls, light curtains, vision systems
Gaming
Safety systems and CCTVs
Home appliances
CAUTION!
This LED is ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to
application note AN-1142 for additional detail.
Broadcom
AREM-90C0-KL000-DS
October 1, 2021
AREM-90C0-KL000 Data Sheet
3528 PLCC-2 Surface Mount Infrared LED
Figure 1: Package Drawing
NOTE:
1.
2.
3.
4.
All dimensions in millimeters (mm).
Tolerance is ±0.20mm unless otherwise specified.
Terminal finish = silver plating.
Dimensions in bracket are for reference only.
Device Selection Guide (TJ = 25°C, IF = 70mA, tp = 20ms)
Peak Wavelength, λp (nm)
Part Number
AREM-90C0-KL000
a.
Radiant Flux, Φe (mW) a, b
Radiant Intensity, Ie (mW/sr) c
Typ.
Min.
Typ.
Max.
Typ.
940
21.2
38.6
52.9
13.4
Radiant flux, Φe is the total output measured with an integrating sphere at a single current pulse condition.
b.
Tolerance is ±12%.
c.
For reference only.
Absolute Maximum Ratings
Parameters
DC Forward Current
a
Peak Forward Current
b
Power Dissipation
Reverse Voltage
LED Junction Temperature
AREM-90C0-KL000
Unit
70
mA
700
mA
140
mW
Not designed for reverse bias operation
100
°C
Operating Temperature Range
-40 to +100
°C
Storage Temperature Range
-40 to +100
°C
a.
Derate linearly as shown in Figure 6 and Figure 7.
b.
Duty factor = 1.0%, frequency = 100Hz at TS = 25°C
Broadcom
AREM-90C0-KL000-DS
2
AREM-90C0-KL000 Data Sheet
3528 PLCC-2 Surface Mount Infrared LED
Optical and Electrical Characteristics (TJ = 25°C)
Parameters
Min.
Typ.
Max.
Unit
−
120
−
°
IF = 70mA, tp = 20ms
−
39
−
nm
IF = 70mA, tp = 20ms
Viewing Angle, 2θ½ a
Spectral Half-Width, Δλ½
Test Conditions
b
−
1.4
2.0
V
IF = 70mA, tp = 20ms
Forward Voltage, VF b
−
1.9
−
V
IF = 700mA, tp = 100µs
−
15
−
ns
IF = 70mA
IF = 70mA
Forward Voltage, VF
c
Rise time, tr
c
−
20
−
ns
Thermal Resistance, RθJ-S d
−
180
−
°C/W
−
Temperature Coefficient of Radiant Flux, TCΦe
−
-0.3
−
%/°C
IF = 70mA, 25°C ≤ T ≤ 85°C
Temperature Coefficient of Forward Voltage, TCVF
−
-0.8
−
mV/°C
IF = 70mA, 25°C ≤ T ≤ 85°C
Temperature Coefficient of Peak Wavelength, TCλp
−
0.05
−
nm/°C
IF = 70mA, 25°C ≤ T ≤ 85°C
Fall time, tf
θ½ is the off-axis angle where the luminous intensity is half of the peak intensity.
a.
b.
Forward voltage tolerance is ±0.1V.
c.
10% and 90% of Φe max.
d.
Thermal resistance from LED junction to solder point.
Part Numbering System
A
R
E
M
–
x1
0
x2
0
–
x3
x4
0
0
0
Code
Description
Option
x1
Peak Wavelength
9
940nm
x2
Junction Type
C
Single Junction
x3
Min Radiant Flux Bin
x4
Max Radiant Flux Bin
Refer to the Radiant Flux Bin Limits
Part Number Example
AREM-90C0-KL000
x1 : 9
˗̶
Peak wavelength 940nm
x2 : C
˗̶
Single junction type
x3 : K
˗̶
Minimum Radiant Flux Bin K
x4 : L
˗̶
Maximum Radiant Flux Bin L
Broadcom
AREM-90C0-KL000-DS
3
AREM-90C0-KL000 Data Sheet
3528 PLCC-2 Surface Mount Infrared LED
Bin Information
Radiant Flux Bin Limits (CAT)
Radiant Flux, Φe (mW)
Bin ID
Min.
Max.
K
21.2
32.9
L
32.9
52.9
Tolerance = ±12%
Example of bin information on reel and packaging label:
CAT : L
˗̶
Radiant Flux bin L
Figure 2: Spectral Power Distribution
Figure 3: Forward Current vs. Forward Voltage
1.0
700
0.9
600
FORWARD CURRENT - mA
RELATIVE INTENSITY
0.8
0.7
0.6
0.5
0.4
0.3
0.2
500
400
300
200
100
0.1
0.0
0
700
750
800
850
900
WAVELENGTH - nm
950
1,000
Figure 4: Relative Radiant Flux vs. Mono Pulse Current
0.0
NORMALIZED RADIANT POWER
0.9
RELATIVE RADIANT FLUX
(NORMALIZED AT 70mA)
1.0
9
tp = 100µs
7
6
5
4
3
2
1
1.0
1.5
2.0
2.5
FORWARD VOLTAGE - V
3.0
3.5
Figure 5: Radiation Pattern
10
8
0.5
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
0
Broadcom
70
140
210 280 350 420 490 560
MONO PULSE CURRENT (mA)
630
700
-90
-60
-30
0
30
60
ANGULAR DISPLACEMENT - deg
90
AREM-90C0-KL000-DS
4
AREM-90C0-KL000 Data Sheet
3528 PLCC-2 Surface Mount Infrared LED
Figure 6: Maximum Forward Current vs. Ambient
Temperature. Derated based on TJMAX = 100°C
Figure 7: Maximum Forward Current vs. Solder Point
Temperature. Derated based on TJMAX = 100°C
80
MAX ALLOWABLE DC CURRENT - mA
MAX ALLOWABLE DC CURRENT - mA
80
70
60
50
RθJ-A = 380°C/W
40
RθJ-A = 430°C/W
30
RθJ-A = 480°C/W
20
10
70
60
50
40
30
20
10
0
0
0
10
20
30
40
50
60
70
80
90
0
100 110
0.80
0.80
0.70
0.70
0.60
D=
0.01
0.05
0.10
0.20
0.50
1.00
0.50
0.40
0.30
0.20
0.10
0.00
1.0E-05
Broadcom
20
30
40
50
60
70
80
90
100 110
Figure 9: Pulse handling capability at TS ≤ 85 °C. Derated
based on RθJ-S = 180°C/W
IP - PULSE CURRENT - A
IP - PULSE CURRENT - A
Figure 8: Figure 8: Pulse handling capability at TS < 74.8 °C.
Derated based on RθJ-S = 180°C/W
10
SOLDER POINT TEMPERATURE, TS - °C
AMBIENT TEMPERATURE, TA - °C
0.60
0.50
0.40
0.30
D=
0.01
0.05
0.10
0.20
0.50
1.00
0.20
0.10
1.0E-04
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01
tp - PULSE DURATION - sec
0.00
1.0E-06 1.0E-05 1.0E-04 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01
tp - PULSE DURATION - sec
AREM-90C0-KL000-DS
5
AREM-90C0-KL000 Data Sheet
3528 PLCC-2 Surface Mount Infrared LED
Figure 10: Recommended Soldering Land Pattern
COPPER PAD
MAXIMIZE ANODE COPPER
PAD AREA FOR BETTER
HEAT DISSIPATION
SOLDER MASK
NOTE:
All dimensions are in millimeters (mm).
Figure 11: Carrier Tape Dimensions
F
3.5 ±0.05
P0
P1
P2
D0
E1
W
4.0 ±0.1
4.0 ±0.1
2.0 ±0.05
1.5 +0.1/-0
1.75 ±0.1
8.0 +0.3/-0.1
T
B0
K0
A0
0.25 ±0.05
3.7 ±0.1
2.15 ±0.1
3.0 ±0.1
NOTE:
Broadcom
All dimensions are in millimeters (mm).
AREM-90C0-KL000-DS
6
AREM-90C0-KL000 Data Sheet
3528 PLCC-2 Surface Mount Infrared LED
Figure 12: Reel Dimensions
9.0
178.5
60.0
PRODUCT LABEL
USER FEED DIRECTION
NOTE:
All dimensions are in millimeters (mm).
Precautionary Notes
Do not perform reflow soldering more than twice.
Observe necessary precautions of handling moisturesensitive device as stated in the following section.
Do not apply any pressure or force on the LED during
reflow and after reflow when the LED is still hot.
Use reflow soldering to solder the LED. Use hand
soldering only for rework if unavoidable, but it must be
strictly controlled to following conditions:
─ Soldering iron tip temperature = 315°C max.
─ Soldering duration = 3sec max.
─ Number of cycles = 1 only
─ Power of soldering iron = 50W max.
Do not touch the LED package body with the soldering
iron except for the soldering terminals, as it may cause
damage to the LED.
Confirm beforehand whether the functionality and
performance of the LED is affected by soldering with
hand soldering.
Broadcom
Figure 13: Recommended Lead-Free Reflow Soldering Profile
10 to 30 SEC.
TEMPERATURE
Soldering
217°C
200°C
255 – 260°C
3°C/SEC. MAX.
6°C/SEC. MAX.
150°C
3°C/SEC. MAX.
100 SEC. MAX.
60 – 120 SEC.
TIME
AREM-90C0-KL000-DS
7
AREM-90C0-KL000 Data Sheet
Figure 14: Recommended Board Reflow Direction
3528 PLCC-2 Surface Mount Infrared LED
Application Precautions
REFLOW DIRECTION
Handling Precautions
The encapsulation material of the LED is made of silicone
for better product reliability. Compared to epoxy
encapsulant, which is hard and brittle, silicone is softer and
flexible. Observe special handling precautions during
assembly of silicone encapsulated LED products. Failure
to comply might lead to damage and premature failure of
the LED. Refer to Broadcom Application Note AN5288,
Silicone Encapsulation for LED: Advantages and Handling
Precautions, for additional information.
Do not poke sharp objects into the silicone
encapsulant. Sharp objects, such as tweezers or
syringes, might apply excessive force or even pierce
through the silicone and induce failures to the LED die
or wire bond.
Do not touch the silicone encapsulant. Uncontrolled
force acting on the silicone encapsulant might result in
excessive stress on the wire bond. Hold the LED only
by the body.
Do not stack assembled PCBs together. Use an
appropriate rack to hold the PCBs.
Surface of silicone material attracts dust and dirt easier
than epoxy due to its surface tackiness. To remove
foreign particles on the surface of silicone, use a cotton
bud with isopropyl alcohol (IPA). During cleaning, rub
the surface gently without putting too much pressure on
the silicone. Ultrasonic cleaning is not recommended.
Handling of Moisture-Sensitive Devices
This product has a Moisture Sensitive Level 3 rating per
JEDEC J-STD-020. Refer to Broadcom Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices for additional details and a review of proper
handling procedures.
For automated pick and place, Broadcom has tested a
nozzle size with OD 3.5mm to work with this LED.
However, due to the possibility of variations in other
parameters such as pick and place machine
maker/model, and other settings of the machine, verify
that the selected nozzle will not cause damage to the
LED.
Broadcom
The drive current of the LED must not exceed the
maximum allowable limit across temperature as stated
in the data sheet. Constant current driving is
recommended to ensure consistent performance.
Circuit design must cater to the whole range of forward
voltage (VF) of the LEDs to ensure the intended drive
current can always be achieved.
The LED exhibits slightly different characteristics at
different drive currents, which may result in a larger
variation of performance (meaning: intensity,
wavelength, and forward voltage). Set the application
current as close as possible to the test current to
minimize these variations.
Do not use the LED in the vicinity of material with
sulfur content or in environments of high gaseous
sulfur compounds and corrosive elements. Examples
of material that might contain sulfur are rubber
gaskets, room- temperature vulcanizing (RTV) silicone
rubber, rubber gloves, and so on. Prolonged exposure
to such environments may affect the optical
characteristics and product life.
Avoid rapid change in ambient temperature, especially
in high-humidity environments, because they cause
condensation on the LED.
If the LED is intended to be used in harsh or outdoor
environment, protect the LED against damages
caused by rain, water, dust, oil, corrosive gases,
external mechanical stresses, and so on.
Before use:
─ An unopened moisture barrier bag (MBB) can be
stored at