ASDL-4360-C22

ASDL-4360 High Power and High Speed Infrared Emitter (885nm) in PLCC-2 Package Data Sheet Description ASDL-4360 Infrared emitter is encapsulated in the Industry Standard PLCC-2 SMT package that is designed for application that requires high radiant intensity and fast switching at wide viewing angle. This device optimizes at emissive wavelength of 885nm. Features • 885nm Wavelength • Industry Standard Footprint: PLCC-2 SMT Package • High Speed • High Power • Low Forward Voltage • High Pulse Rate • Lead Free and ROHS Compliant • Tape & Reel for automation placement Applications • High-Speed Machine Automated System • Medical Applications • Non-Contact Position Sensing • Optical Sensing • Security Applications Ordering Information Part Number ASDL-4360-C22 Packaging Tape & Reel Shipping Option 2000pcs Package Outline All Dimensions are in Millimeters Tape and Reel Dimension All Dimensions are in Millimeters 2 Absolute Maximum Ratings at 25°C Parameter Peak Forward Current Symbol IFPK Min. Max 500 Unit mA Reference Tp=500ns Tw = 100ns Duty Cycle = 20% Continuous Forward Current Power Dissipation Reverse Voltage Operating Temperature Storage Temperature LED Junction Temperature Lead Soldering Temperature IFDC PDISS Vr TO TS TJ 11 -40 -40 100 200 85 100 110 260 for 5 sec mA mW V °C °C °C °C Ir=100uA Electrical Characteristics at 25°C Parameter Forward Voltage Reverse Voltage Thermal Resistance Diode Capacitance CO Symbol VF Vr 11 250 90 Min. Typ. 1.4 1.6 Max. 1.7 2.0 Unit V V V °C/W pF Vr=0V, f=1MHz Condition IF=20mA IF=100mA IR=10uA Optical Characteristics at 25°C Parameter Radiant On-Axis Intensity Viewing Angle Peak wavelength Spectral Width Optical Rise Time Symbol IE 2θ1/2 λPK Δλ tr Min. 1.0 5.1 Typ. 2.0 10.0 120 885 55 20 Max. Unit mW/Sr deg nm nm ns IF = 20mA IF = 20mA IFPK=500mA Duty Factor=20% Pulse Width=100ns IFPK=500mA Duty Factor=20% Pulse Width=100ns Condition IF = 20mA IF =100mA Optical Fall Time tf 17 ns 3 Typical Electrical / Optical Characteristics Curve (TA = 25°C Unless Otherwise Stated) 1.2 1 Relative Radiant Intensity If Forward Current (A) 0.8 0.6 0.4 0.2 0 0.12 0.10 0.08 0.06 0.04 0.02 0.00 0 0.5 1 Vf Forward Voltage (V) 1.5 2 700 800 900 1000 Peak Wavelength (nm) Figure 1. Peak Wavelength Vs Relative Radiant Intensity 12 10 8 6 4 2 0 Figure 2. Forward Current Vs Forward Voltage 1 0.8 0.6 0.4 0.2 0 Ie - Relative Radiant Intensity -0.8 Radiant Intensity (mW/Sr) 0 20 40 60 80 100 120 -0.6 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8 Forward Current (mA) Figure 3. Forward Current Vs Radiant Intensity 105 100 95 90 85 80 75 70 65 60 55 50 45 40 35 30 25 20 15 10 5 0 I DC MAX - MAXIMUM DC CURRENT PER SEGMENT - mA Figure 4. Angular Displacement Vs Relative Radiant Intensity 0 20 40 60 TA - AMBIENT TEMPERATURE - C o 80 100 Figure 5. Forward Current Vs Ambient Temperature derated based on Tj – 110 °C and thermal resistance at 250 °C/W 4 Recommended Reflow Profile 255 230 217 200 180 150 120 80 25 0 P1 HEAT UP 50 100 150 200 P3 SOLDER REFLOW P4 COOL DOWN 250 300 t-TIME (SECONDS) R1 MAX 260C R3 R4 T - TEMPERATURE (°C) R2 60 sec to 90 sec Above 217 C R5 P2 SOLDER PASTE DRY Process Zone Heat Up Solder Paste Dry Solder Reflow Cool Down Time maintained above liquidus point , 217°C Peak Temperature Time within 5°C of actual Peak Temperature Time 25°C to Peak Temperature Symbol P1, R1 P2, R2 P3, R3 P3, R4 P4, R5 DT 25°C to 150°C 150°C to 200°C 200°C to 260°C 260°C to 200°C 200°C to 25°C > 217°C 260°C 25°C to 260°C Maximum DT/Dtime or Duration 3°C/s 100s to 180s 3°C/s -6°C/s -6°C/s 60s to 90s 20s to 40s 8mins The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change rates or duration. The DT/Dtime rates or duration are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and component pins are heated to a temperature of 150°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 3°C per second to allow for even heating of both the PC board and component pins. Process zone P2 should be of sufficient time duration (100 to 180 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder. Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 260°C (500°F) for optimum results. The dwell time above the liquidus point of solder should be between 60 and 90 seconds. This is to assure proper coalescing of the solder paste into liquid solder and the formation of good solder connections. Beyond the recommended dwell time the intermetallic growth within the solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25°C (77°F) should not exceed 6°C per second maximum. This limitation is necessary to allow the PC board and component pins to change dimensions evenly, putting minimal stresses on the component. It is recommended to perform reflow soldering no more than twice. 5 Recommended Land Pattern All Dimensions are in Millimeters For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. AV02-0274EN - April 27, 2007