ASM3-SLD1-NST0H

Data Sheet ASM3-SxDx-xxxxH 3W 3535 Surface Mount LED Description The Broadcom® 3535 surface mount LEDs are energy-efficient LEDs that can be driven at high driving current and able to dissipate heat efficiently resulting in a better performance in reliability. Its low profile package design addresses a wide variety of applications where superior robustness and high efficiency are required. In addition to being compatible to the reflow soldering process, the silicone encapsulation ensures product superiority and longevity. To facilitate easy pick-and-place assembly, the LEDs are packed in tape and reel. Every reel is shipped in single flux and color bin, to provide close uniformity. Features      High reliability package with enhanced silicone resin encapsulation Available in Deep Red, Far Red, Royal Blue, and Cool White Wide viewing angle at 130° Compatible with the reflow soldering process JEDEC MSL3 Applications     Horticulture lighting General lighting Commercial lighting Architecture lighting CAUTION! This LED is ESD sensitive. Observe appropriate precautions during handling and processing. Refer to application note AN-1142 for additional details. Broadcom ASM3-SxDx-xxxxH-DS100 January 11, 2019 ASM3-SxDx-xxxxH Data Sheet 3W 3535 Surface Mount LED Figure 1: Package Drawing 3.45 3.30 ANODE MARK 3.45 3.30 THERMAL P PAD 1.30 (Ø 2.59) 0.50 (Ø 2 2.89) 89) 0.60 1.95 ESD PROTECTION DEVICE (FOR InGaN DICE ONLY) NOTE: 1. All dimensions in millimeters (mm). 2. Tolerance is ±0.20 mm unless otherwise specified. 3. Encapsulation = silicone. 4. Terminal finish = silver plating. 5. Dimensions in bracket are for reference only. Device Selection Guide (TJ = 25°C, IF = 350 mA) Viewing Angle, 2θ½a Radiant Flux, e PPF, P (mW)b, c (µmol/)d, e PPF/W (µmol/J) Color Typ. Min. Typ. Max. Typ. Typ. Dice Technology ASM3-S3D0-ALN0H Far Red 130 230 285 380 1.76f 2.39 AlInGaP ASM3-SDD0-ANP0H Deep Red 130 330 350 430 1.93 2.63 AlInGaP Part Number ASM3-SDD0-APQ0H Deep Red 130 380 390 480 2.13 2.90 AlInGaP ASM3-SLD1-NST0H Royal Blue 130 530 580 705 2.19 2.09 InGaN ASM3-SWD1-NPRHH Cool White 130 115 125 154 1.75 1.67 InGaN a. θ½ is the off-axis angle where the luminous intensity is half of the peak intensity. b. Radiant flux, e / Luminous flux, v is the total output measured with an integrating sphere at a single current pulse condition. c. Radiant flux, e / Luminous flux, v tolerance is ±10%. d. Photosynthetic Photon Flux (PPF), P is the measurement of Photosynthetically Active Radiation (PAR) ranging from 400 nm to 700 nm. e. Values are calculated and for reference only. f. Plant Biologically Active Radiation Flux (PBAR) for Far Red is measured from 280 nm to 800 nm. Broadcom ASM3-SxDx-xxxxH-DS100 2 ASM3-SxDx-xxxxH Data Sheet 3W 3535 Surface Mount LED Absolute Maximum Ratings Parameters InGaN AlInGaP Unit DC Forward Currenta 700 700 mA Peak Forward Currentb 1000 1000 mA Power Dissipation 2800 1925 mW Reverse Voltage Not designed for reverse bias operation LED Junction Temperature 120 120 °C Operating Temperature Range -40 to +85 -40 to +85 °C Storage Temperature Range -40 to +100 -40 to +100 °C a. Derate linearly as shown in Figure 15, Figure 16, and Figure 17. b. Duty factor = 10%, frequency = 1 kHz. Optical and Electrical Characteristics (TJ = 25°C, IF = 350 mA) Peak Wavelength, p (nm) Forward Voltage, VF (V)a Thermal Resistance, RθJ-S (°C/W)b Color Min. Typ. Max. Min. Typ. Max. Typ. Far Red 720 735 745 1.75 2.10 2.75 15 Deep Red 650 655 670 1.75 2.10 2.75 8 Royal Blue 440 450 460 2.75 3.00 4.00 8 a. Forward voltage, VF tolerance is ±0.1V. b. Thermal resistance from LED junction to solder point. Correlated Color Temperature, CCT (Kelvin) Color Cool White Color Rendering Index, CRI Forward Voltage, VF (V)a Thermal Resistance, RθJ-S (°C/W)b Min. Max. Min. Min. Typ. Max. Typ. 5000K 10000K 70 2.75 3.00 4.00 15 a. Forward voltage, VF tolerance is ±0.1V. b. Thermal resistance from LED junction to solder point. Broadcom ASM3-SxDx-xxxxH-DS100 3 ASM3-SxDx-xxxxH Data Sheet 3W 3535 Surface Mount LED Part Numbering System A S M 3 Code Description x1 Color x2 Viewing Angle x3 ESD Protection x4 - S x1 x2 x3 - Dice Technology x5 Minimum Flux Bin x6 Maximum Flux Bin x7 Color Bin Option – Far Red, Deep Red, and Royal Blue x8 x5 x4 x6 x7 x8 Option 3 Far Red D Deep Red L Royal Blue W Cool White D 130° 0 Without Zener Protection (for AlInGaP dice only) 1 With Zener Protection (for InGaN dice only) A AlInGaP N InGaN Refer to Radiant Flux/Luminous Flux Bin Limits (CAT) table 0 Full Distribution C 3 and 4 only D 4 and 5 only E 5 and 6 only J 3, 4, and 5 only K 4, 5, and 6 only Color Bin Option - Cool White H 6500K Test Option H Test Current = 350 mA Part Number Example ASM3-S3D0-ALN0H x 1: 3 – Far Red color x 2: D – 130° viewing angle x 3: 0 – Without Zener Protection (for AlInGaP dice only) x 4: A – AlInGaP dice x 5: L – Minimum radiant flux bin L x 6: N – Maximum radiant flux bin N x 7: 0 – Full color distribution x 8: H – Test current = 350 mA Broadcom ASM3-SxDx-xxxxH-DS100 4 ASM3-SxDx-xxxxH Data Sheet 3W 3535 Surface Mount LED Bin Information Luminous Flux Bin Limits (CAT) Color Bin Limits (BIN) Luminous Flux, V (lm) Bin ID Min. Max. Cool White Peak Wavelength, p (nm) Bin ID Min. Max. Royal Blue P 115.0 127.0 3 440 445 Q 127.0 140.0 4 445 450 R 140.0 154.0 5 450 455 6 455 460 — 650 670 — 720 745 Tolerance = ±12% Deep Red Radiant Flux Bin Limits (CAT) Far Red Radiant Flux, e (mW) Bin ID Min. Max. Tolerance = ±1.0nm Far Red, Deep Red and Royal Blue L 230 280 M 280 330 N 330 380 P 380 430 Q 430 480 R 480 530 S 530 610 T 610 705 Tolerance = ±12% Broadcom ASM3-SxDx-xxxxH-DS100 5 ASM3-SxDx-xxxxH Data Sheet 3W 3535 Surface Mount LED Color Bin Limits (BIN) – Cool White Chromaticity Coordinates Bin ID x 1A 1B 1C 1D 1E 1F 1G 1H Chromaticity Coordinates y Bin ID 0.2950 0.2970 2A 0.2920 0.3060 Chromaticity Coordinates x y Bin ID x y 3A 0.3048 0.3207 0.3215 0.3350 0.3130 0.3290 0.3290 0.3417 0.2984 0.3133 0.3144 0.3186 0.3290 0.3300 0.3009 0.3042 0.3068 0.3113 0.3222 0.3243 0.2920 0.3060 0.3028 0.3304 0.3207 0.3462 0.2895 0.3135 0.3115 0.3391 0.3290 0.3538 0.2962 0.3220 0.3130 0.3290 0.3290 0.3417 0.2984 0.3133 0.3048 0.3207 0.3215 0.3350 2B 2C 3B 0.2984 0.3133 0.3115 0.3391 0.3290 0.3538 0.2962 0.3220 0.3205 0.3481 0.3376 0.3616 0.3028 0.3304 0.3213 0.3373 0.3371 0.3490 0.3048 0.3207 0.2984 0.3133 0.3048 0.3207 2D 0.3130 0.3290 0.3130 0.3290 0.3213 0.3373 3C 3D 0.3290 0.3417 0.3290 0.3417 0.3371 0.3490 0.3369 0.3068 0.3113 0.3221 0.3261 0.3366 0.3009 0.3042 0.3144 0.3186 0.3290 0.3300 0.2895 0.3135 0.3005 0.3415 0.3196 0.3602 2E 3E 0.2870 0.3210 0.3099 0.3509 0.3290 0.3690 0.2937 0.3312 0.3115 0.3391 0.3290 0.3538 0.2962 0.3220 0.3028 0.3304 0.3207 0.3462 0.2962 0.3220 0.3099 0.3509 0.3290 0.3690 0.2937 0.3312 0.3196 0.3602 0.3381 0.3762 0.3005 0.3415 0.3205 0.3481 0.3376 0.3616 0.3028 0.3304 0.3290 0.3538 0.2980 0.2880 0.3222 0.3243 0.2950 2F 3F 0.3115 0.3391 0.3068 0.3113 0.2970 0.3144 0.3186 0.3290 0.3300 0.3009 0.3042 0.3161 0.3059 0.3290 0.3180 0.3037 0.2937 0.3093 0.2993 0.3231 0.3120 0.3037 0.2937 0.3144 0.3186 0.3290 0.3300 0.3009 0.3042 0.3221 0.3261 0.3366 0.3369 0.3068 0.3113 0.3231 0.3120 0.3361 0.3245 0.3093 0.2993 0.3161 0.3059 0.3290 0.3180 2G 2H 3G 3H Tolerance = ±0.01 Example of bin information on reel and packaging label: CAT: P – Radiant flux bin P BIN: — – Full distribution Broadcom ASM3-SxDx-xxxxH-DS100 6 ASM3-SxDx-xxxxH Data Sheet 3W 3535 Surface Mount LED Figure 2: Chromaticity Diagram 0.42 0.40 0.38 3F 0.36 3E 6500K 3C 2F y - COORDINATE 3B 2E 0.34 1F 1E 0.32 1B 3A 2B 1C 3D 2C 2D 3H 3G 2A 2H 1D 2G 1A 1H 0.30 1G 0.28 0.26 0.24 0.22 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 x - COORDINATE Broadcom ASM3-SxDx-xxxxH-DS100 7 ASM3-SxDx-xxxxH Data Sheet 3W 3535 Surface Mount LED Figure 4: Spectral Power Distribution for Far Red, Deep Red, and Royal Blue 1.0 1.0 0.9 0.9 0.8 0.8 RELATIVE INSTENSITY RElATIVE INSTENSITY Figure 3: Spectral Power Distribution for Cool White 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.6 0.5 0.4 0.3 0.2 350 400 450 500 550 600 650 WAVELENGTH - nm 700 750 0.0 800 350 2.2 1.8 2.0 700 750 800 DEEP RED (-APQ0H) DEEP RED (-ANP0H) FAR RED ROYAL BLUE 1.6 1.4 1.4 1.2 1.2 1.0 1.0 0.8 0.8 0.6 0.6 0.4 0.4 0.2 0.2 0 100 200 300 400 500 MONO PULSE CURRENT - mA 600 0.0 700 Figure 7: Forward Current vs. Forward Voltage 0 100 200 300 400 500 MONO PULSE CURRENT - mA 600 700 Figure 8: Radiation Pattern 1000 1.0 DEEP RED (-APQ0H) DEEP RED (-ANP0H) FAR RED 900 0.9 COOL WHITE ROYAL BLUE 0.8 RELATIVE INTENSITY 800 700 600 500 400 300 0.6 0.5 0.4 0.3 0.2 100 0.1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 FORWARD VOLTAGE - V 4.0 4.5 5.0 FAR RED DEEP RED ROYAL BLUE COOL WHITE 0.7 200 Broadcom 500 550 600 650 WAVELENGTH - nm 1.8 1.6 0 450 Figure 6: Relative Radiant Flux vs. Mono Pulse Current for Far Red, Deep Red, and Royal Blue 2.0 0.0 400 RELATIVE RADIANT FLUX - mW (NORMALIZED AT 350mA) RELATIVE LUMINOUS FLUX - lm (NORMALIZED AT 350mA) DEEP RED FAR RED 0.7 0.1 Figure 5: Relative Luminous Flux vs. Mono Pulse Current for Cool White FORWARD CURRENT - mA ROYAL BLUE 0.0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREE 90 ASM3-SxDx-xxxxH-DS100 8 ASM3-SxDx-xxxxH Data Sheet 3W 3535 Surface Mount LED Figure 10: Peak Wavelength Shift vs. Mono Pulse Current for Far Red, Deep Red, and Royal Blue 0.010 3.0 0.008 2.5 0.006 PEAK WAVELENGTH SHIFT (NORMALIZED AT 350mA) CHROMATICITY COORDINATE SHIFT (NORMALIZED AT 350mA) Figure 9: Chromaticity Coordinate Shift vs. Mono Pulse Current for Cool White 0.004 0.002 Cx Cy 0.000 -0.002 -0.004 -0.006 -0.008 -0.010 2.0 ROYAL BLUE FAR RED DEEP RED 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 0 100 200 300 400 500 MONO PULSE CURRENT - mA 600 -3.0 700 Figure 11: Relative Light Output vs. Junction Temperature 0 100 200 300 400 500 MONO PULSE CURRENT - mA 600 700 Figure 12: Forward Voltage Shift vs. Junction Temperature 0.80 120 FORWARD VOLTAGE SHIFT - V (NORMALIZED AT 25°C) 0.70 110 RELATIVE LIGHT OUTPUT - % (NORMALIZED AT 25°C) 100 90 80 FAR RED ROYAL BLUE DEEP RED COOL WHITE 70 60 50 40 30 0.50 0.40 0.20 0.10 0.00 -0.10 -0.20 -0.30 10 -0.40 -50 -25 0 25 50 75 JUNCTION TEMPERATURE, TJ - °C 100 -25 0 25 50 75 JUNCTION TEMPERATURE, TJ - °C 100 125 Figure 14: Peak Wavelength Shift vs. Junction Temperature 20.0 0.040 PEAK WAVELENGTH SHIFT - nm (NORMALIZED AT 25°C) 0.030 0.020 0.010 0.000 -0.010 Cx Cy -0.020 15.0 FAR RED DEEP RED ROYAL BLUE 10.0 5.0 0.0 -5.0 -10.0 -0.030 Broadcom -50 125 Figure 13: Chromaticity Coordinate Shift vs. Junction Temperature -0.040 FAR RED DEEP RED ROYAL BLUE COOL WHITE 0.30 20 0 CHROMATICITY COORDINATE SHIFT (NORMALIZED AT 25°C) 0.60 -50 -25 0 25 50 75 JUNCTION TEMPERATURE, TJ - °C 100 125 -15.0 -50 -25 0 25 50 75 JUNCTION TEMPERATURE, TJ - °C 100 125 ASM3-SxDx-xxxxH-DS100 9 ASM3-SxDx-xxxxH Data Sheet 3W 3535 Surface Mount LED Figure 15: Maximum Forward Current vs. Ambient Temperature for InGaN Figure 16: Maximum Forward Current vs. Ambient Temperature for AllnGaP 800 MAX. ALLOWABLE DC CURRENT - mA MAX. ALLOWABLE DC CURRENT - mA 800 700 600 500 400 RTJ-A = 25°C/W R TJ-A = 20°C/W RT J-A = 15°C/W 300 200 100 0 0 10 20 700 600 500 400 300 200 100 0 30 40 50 60 70 80 90 100 110 120 130 AMBIENT TEMPERATURE, TA - °C RTJ-A = 25°C/W RTJ-A = 20°C/W RTJ-A = 15°C/W 0 10 20 30 40 50 60 70 80 90 100 110 120 130 AMBIENT TEMPERATURE, TA - °C Figure 17: Maximum Forward Current vs. Solder Point Temperature MAX. ALLOWABLE DC CURRENT - mA 800 700 600 500 400 COOL WHITE FAR RED ROYAL BLUE DEEP RED 300 200 100 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 SOLDER POINT TEMPERATURE, TS - °C Figure 18: Recommended Soldering Land Pattern 3.3 0.3 OPTIONAL SOLDERING PAD TO ATT TACH THERMOCOUPLE FOR TS MEASUREMENT 1.3 1.0 3.3 3.0 0.5 0.3 0.4 0.5 COPPER P PAD 0.8 MAXIMIZE COPPER PAD AREA A FOR BETTER HEA AT DISSIPA ATION 0.65 SOLDER STENCIL SOLDER MASK Broadcom ASM3-SxDx-xxxxH-DS100 10 ASM3-SxDx-xxxxH Data Sheet 3W 3535 Surface Mount LED Figure 19: Carrier Tape Dimensions P0 P1 Ø D0 K0 P2 E1 F W B0 A0 PACKAGE MARKING T USER FEED DIRECTION F P0 P1 P2 D0 E1 W 5.50 ± 0.05 4.00 ± 0.10 8.00 ± 0.10 2.00 ± 0.05 1.50 + 0.1 1.75 ± 0.10 12.00 ± 0.20 T B0 K0 A0 0.25 ± 0.05 3.70 ± 0.10 2.15 ± 0.10 3.70 ± 0.10 NOTE: Broadcom All dimensions are in millimeters (mm). ASM3-SxDx-xxxxH-DS100 11 ASM3-SxDx-xxxxH Data Sheet 3W 3535 Surface Mount LED Figure 20: Reel Dimensions 12.4 178.5 60.0 PRODUCT LABEL USER FEED DIRECTION NOTE: Broadcom All dimensions are in millimeters (mm). ASM3-SxDx-xxxxH-DS100 12 ASM3-SxDx-xxxxH Data Sheet 3W 3535 Surface Mount LED Precautionary Notes Soldering       Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisture-sensitive devices as stated in the following section. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to following conditions: – Soldering iron tip temperature = 315°C maximum – Soldering duration = 3sec maximum – Number of cycles = 1 only – Power of soldering iron = 50W maximum Do not touch the LED package body with the soldering iron except for the soldering terminals, because it may cause damage to the LED. Confirm beforehand whether the functionality and performance of the LED is affected by soldering with hand soldering.     Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond. Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body. Do not stack assembled PCBs together. Use an appropriate rack to hold the PCBs. Surface of silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting too much pressure on the silicone. Ultrasonic cleaning is not recommended. For automated pick and place, Broadcom has tested a nozzle size with OD 3.5 mm to work with this LED. However, due to the possibility of variations in other parameters such as pick-and-place machine maker/ model, and other settings of the machine, verify that the selected nozzle will not cause damage to the LED. Figure 21: Recommended Lead-Free Reflow Soldering Profile Handling of Moisture-Sensitive Devices TEMPERATURE 10 to 30 SEC. 217°C 200°C 255 – 260°C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices for additional details and a review of proper handling procedures.  3°C/SEC. MAX. 100 SEC. MAX. 60 – 120 SEC. TIME Handling Precautions The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant, which is hard and brittle, silicone is softer and flexible. Observe special handling precautions during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Refer to Broadcom Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions, for additional information. Broadcom  Before use: – An unopened moisture barrier bag (MBB) can be stored at