ASMB-MTB0-0B3A2

Data Sheet ASMB-MTB0-0B3A2 PLCC4 Tricolor Black Surface LED Overview Features These families of SMT LED are in PLCC-4 package. A wide viewing angle of 115° together with the built in reflector drives up the intensity of light output making these LEDs suitable for use in interior electronics signs. The black top surface of the LED provides better contrast enhancement, especially in full color display.  These LEDs are compatible with reflow soldering process. For easy pick & place, the LEDs are shipped in tape and reel. Every reel is shipped from a single intensity and color bin except red color for better uniformity.      Standard PLCC-4 package (Plastic Leaded Chip Carrier) LED package with diffused silicone encapsulation High brightness using AlInGaP and InGaN dice technologies Typical viewing angle at 115⁰ Compatible with reflow soldering process JEDEC MSL 3 Applications  Indoor full color display CAUTION! This LED is ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to application note AN-1142 for additional detail. Broadcom ASMB-MTB0-0B3A2-DS September 2, 2020 ASMB-MTB0-0B3A2 Data Sheet PLCC4 Tricolor Black Surface LED Figure 1: Package Drawing Pin Configuration 1 Common Anode 2 Blue Cathode 3 Green Cathode 4 Red Cathode NOTE: 1. 2. 3. 4. Broadcom All dimensions in millimeters (mm). Tolerance is ±0.20mm unless otherwise specified. Encapsulation = silicone. Terminal finish = silver plating. ASMB-MTB0-0B3A2-DS 2 ASMB-MTB0-0B3A2 Data Sheet PLCC4 Tricolor Black Surface LED Absolute Maximum Ratings Parameters DC Forward Current a Peak Forward Current b Power Dissipation Red Green Blue Unit 25 25 25 mA 100 100 100 mA 65 90 90 mW Reverse Voltage Not recommended for reverse bias operation LED Junction Temperature 110 °C Operating Temperature Range -40 to +100 °C Storage Temperature Range -40 to +100 °C a. Derate linearly as shown in Figure 8 and Figure 9. b. Duty factor = 10%, frequency = 1kHz. Optical Characteristics (TJ = 25°C, IF = 20mA) Color Luminous Intensity, IV (mcd) a Dominant Wavelength, λd (nm) b Peak Wavelength, λp (nm) Viewing Angle, 2θ½ (°) c Min. Typ. Max. Min. Typ. Max. Typ. Typ. Red 450 900 619 625 629 634 115 Green 1800 - 3550 525 530 535 522 115 Blue 355 - 715 465 470 473 465 115 a. The luminous intensity, IV is measured at the mechanical axis of the package and it is tested with a single current pulse condition. The actual peak of the spatial radiation pattern may not be aligned with the axis. b. The dominant wavelength, λd is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. c. θ½ is the off-axis angle where the luminous intensity if half of the peak intensity. Electrical Characteristics (TJ = 25°C = 20mA) Color Forward Voltage VF (V) a Min. Typ. Max. Reverse Voltage, VR (V) at IR = 10µAb Thermal Resistance, RθJ-S (°C/W) c 1 Chip On 3 Chips On Max. Typ. Typ. Red 1.8 2.1 2.6 - 609 653 Green 2.8 3.1 3.6 4.0 320 430 Blue 2.8 3.1 3.6 4.0 320 430 a. Forward voltage tolerance is ±0.1V. b. Indicates product final test condition. Long term reverse bias is not recommended. c. Thermal resistance from LED junction to solder point. Broadcom ASMB-MTB0-0B3A2-DS 3 ASMB-MTB0-0B3A2 Data Sheet PLCC4 Tricolor Black Surface LED Part Numbering System A S M B – M T x1 0 – 0 x2 x3 x4 x5 Code Description Option x1 Package Type B Black Surface Red = Bin U1 Red : Bin U1, U2, V1 x2 Minimum Intensity Bin B Green = Bin X1 Green : Bin X1, X2, Y1 Blue = Bin T2 Blue : Bin T2, U1, U2 x3 Number of Intensity Bins 3 3 Intensity Bins from minimum Red = Full Distribution x4 Color Bin Option A Green = Bin A, B, D Blue = Bin A, B, C x5 Broadcom Test Option 2 Test Current = 20mA ASMB-MTB0-0B3A2-DS 4 ASMB-MTB0-0B3A2 Data Sheet PLCC4 Tricolor Black Surface LED Bin Information Intensity Bin Limits (CAT) Luminous Intensity, IV (mcd) Bin ID Min. Max. U1 450 560 U2 560 715 V1 715 900 X1 1800 2240 X2 2240 2850 Y1 2850 3550 T2 355 450 U1 450 560 U2 560 715 Red Green Blue Tolerance = ±12% Color Bin Limits (BIN) – Red Bin ID Dominant Wavelength, λd (nm) Min. ̶ 619 Max. 629 Chromaticity Coordinates x y 0.6894 0.3104 0.6752 0.3113 0.6916 0.2950 0.7066 0.2934 Tolerance = ±1.0nm Broadcom ASMB-MTB0-0B3A2-DS 5 ASMB-MTB0-0B3A2 Data Sheet PLCC4 Tricolor Black Surface LED Color Bin Limits (BIN) – Green Bin ID Dominant Wavelength, λd (nm) Min. A B D 525 528 531 Max. 531 534 535 Chromaticity Coordinates x y 0.1142 0.8262 0.1624 0.7178 0.2001 0.6983 0.1625 0.8012 0.1387 0.8148 0.1815 0.7089 0.2179 0.6870 0.1854 0.7867 0.1625 0.8012 0.2001 0.6983 0.2238 0.6830 0.1929 0.7816 Tolerance = ±1.0nm Color Bin Limits (BIN) – Blue Bin ID Dominant Wavelength, λd (nm) Min. A B C 465 467 469 Max. 467 472 473 Chromaticity Coordinates x y 0.1355 0.0399 0.1751 0.0986 0.1680 0.1094 0.1267 0.0534 0.1314 0.0459 0.1718 0.1034 0.1638 0.1167 0.1215 0.0626 0.1267 0.0534 0.1680 0.1094 0.1593 0.1255 0.1158 0.0736 Tolerance = ±1.0nm Broadcom ASMB-MTB0-0B3A2-DS 6 ASMB-MTB0-0B3A2 Data Sheet PLCC4 Tricolor Black Surface LED Figure 2: Spectral Power Distribution Figure 3: Forward Current vs. Forward Voltage Figure 4: Relative Luminous Intensity vs. Mono Pulse Current Figure 5: Dominant Wavelength Shift vs Mono Pulse Current Figure 6: Relative Light Output vs. Junction Temperature Figure 7: Forward Voltage Shift vs. Junction Temperature Broadcom ASMB-MTB0-0B3A2-DS 7 ASMB-MTB0-0B3A2 Data Sheet PLCC4 Tricolor Black Surface LED Figure 8: Maximum Forward Current vs. Temperature for Red (1 chip on) Figure 8a: Maximum Forward Current vs. Solder Temperature for Red (3 chips on) Figure 9: Maximum Forward Current vs. Temperature for Green & Blue (1 chip on) Figure 9a: Maximum Forward Current vs. Solder Temperature for Green & Blue (3 chips on) NOTE: Maximum forward current graphs based on ambient temperature (TA) above are with reference to the thermal resistance RθJ-A in the following table. Do refer to Precautionary Note for more details. Condition Broadcom Thermal Resistance from LED Junction to Ambient, RθJ-A (°C/W) Red Green Blue 1 chip 725 454 454 3 chips on 970 747 747 ASMB-MTB0-0B3A2-DS 8 ASMB-MTB0-0B3A2 Data Sheet Figure 10: Radiation Pattern for x-axis PLCC4 Tricolor Black Surface LED Figure 11: Radiation Pattern for y-axis Figure 11a: Illustration of package axis for radiation pattern Figure 12: Recommended Soldering Pad Pattern NOTE: Broadcom All dimensions are in millimeters (mm). ASMB-MTB0-0B3A2-DS 9 ASMB-MTB0-0B3A2 Data Sheet PLCC4 Tricolor Black Surface LED Figure 13: Carrier Tape Dimensions NOTE: 1. All dimensions in millimeters (mm). 2. Tolerance is ±0.20mm unless otherwise specified. Figure 13: Reel Dimensions and Reel Orientation NOTE: All dimensions are in millimeters (mm). Broadcom ASMB-MTB0-0B3A2-DS 10 ASMB-MTB0-0B3A2 Data Sheet PLCC4 Tricolor Black Surface LED Precautionary Notes Soldering Handling Precautions  Do not perform reflow soldering more than twice. Observe necessary precautions of handling moisturesensitive device as stated in the following section.  Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot.  Use reflow soldering to solder the LED. Use hand soldering only for rework if unavoidable, but it must be strictly controlled to following conditions: ─ Soldering iron tip temperature = 315°C max. ─ Soldering duration = 3sec max. ─ Number of cycles = 1 only ─ Power of soldering iron = 50W max. Do not touch the LED package body with the soldering iron except for the soldering terminals, as it may cause damage to the LED. Confirm beforehand whether the functionality and performance of the LED is affected by soldering with hand soldering. The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant, which is hard and brittle, silicone is softer and flexible. Observe special handling precautions during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Refer to Broadcom Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions, for additional information.   Figure 14: Recommended Lead-Free Reflow Soldering Profile  Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond.  Do not touch the silicone encapsulant. Uncontrolled force acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body. Do not stack assembled PCBs together. Use an appropriate rack to hold the PCBs. Surface of silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting too much pressure on the silicone. Ultrasonic cleaning is not recommended. For automated pick and place, Broadcom has tested a nozzle size with OD 1.5mm to work with this LED. However, due to the possibility of variations in other parameters such as pick and place machine maker/model, and other settings of the machine, verify that the selected nozzle will not cause damage to the LED.   TEMPERATURE 10 to 30 SEC. 217°C 200°C 255 – 260°C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C  3°C/SEC. MAX. 100 SEC. MAX. 60 – 120 SEC. TIME Figure 15: Recommended Board Reflow Direction Handling of Moisture-Sensitive Devices This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Broadcom Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices for additional details and a review of proper handling procedures.  Broadcom Before use: ─ An unopened moisture barrier bag (MBB) can be stored at