ASMB-TTB0-0A3A2

ASMB-TTB0-0A3A2 High Brightness Tall Black Surface PLCC6 Tricolor LED Data Sheet Description Features This family of SMT LEDs is packaged in the form of PLCC-6 with a separate heat path for each LED die, enabling it to be driven at higher current. • Standard PLCC-6 package (Plastic Leaded Chip Carrier) Individually addressable pin-outs give higher flexibility in circuitry design. With closely matched radiation pattern along the package’s x-axis, these LEDs are suitable for full color display application. The black top surface of the LED provides better contrast enhancement. For easy pick and place, the LEDs are shipped in tape and reel. Every reel is shipped from a single intensity and color bin for better uniformity. These LEDs are compatible with reflow soldering process. • LED package with diffused encapsulation • Tall package enable potting on LED’s lead. • High brightness using AlInGaP and InGaN dice technologies • Typical viewing angle at 115° • Compatible with reflow soldering process • JEDEC MSL 4 • Water resistance (IPx6* and IPx8) per IEC 60529:2001 - The test is conducted on component level by mounting the components on PCB with potting to protect the leads. It is strongly recommended that customers perform necessary tests on the components for their final application. Applications • Full color display CAUTION: These LEDs are ESD-sensitive. Please observe appropriate precautions during handling and processing. Please refer to Avago Application Note AN-1142 for additional details. CAUTION: Customer is advised to keep the LED in the MBB when not in use, as prolonged exposure to environment might cause the silver-plated leads to tarnish, which might cause difficulties in soldering. Package Dimensions 3.50 2.80 3 5 2 6 1 0.70 4 2.80 3.50 1.20 0.40 Package Marking 4 5 6 Red Green Blue 3 2 1 Lead Configuration 1 Cathode (Blue) 2 Cathode (Green) 3 Cathode (Red) 4 Anode (Red) 5 Anode (Green) 6 Anode (Blue) Notes: 1. All dimensions are in millimeters (mm). 2. Unless otherwise specified, tolerance is ± 0.20 mm. 3. Terminal finish = silver plating 2 0.75 Table 1. Absolute Maximum Ratings (TJ = 25 °C) Parameter Red Green & Blue Unit DC forward current [1] 50 35 mA Peak forward current [2] 100 100 mA Power dissipation 130 126 mW Maximum junction temperature Tj max 110 °C Operating temperature range - 40 to + 100 °C Storage temperature range - 40 to + 100 °C Notes: 1. Derate linearly as shown in Figure 7 to Figure 10 2. Duty Factor = 10% Frequency = 1 kHz Table 2. Optical Characteristics (TJ = 25°C) Luminous Intensity, IV (mcd) @IF = 20mA [1] Dominant Wavelength, ld (nm) @IF = 20mA [2] Peak Wavelength, lP (nm) @IF = 20mA Viewing Angle, 2q½ (°) [3] Color Min. Typ. Max. Min. Typ. Max. Typ. Typ. Red 560 790 1125 618 621 628 635 115 Green 1800 2400 3550 523 530 535 521 115 Blue 355 500 715 465 470 473 464 115 Note: 1. The luminous intensity Iv is measured at the mechanical axis of LED package and it is tested in pulsing condition. The actual peak of the spatial radiation pattern may not be aligned with the axis. 2. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. q½ is the off axis angle where the luminous intensity is ½ the peak intensity Table 3. Electrical Characteristics (TJ = 25°C) Forward Voltage, VF (V) @IF = 20mA [1] Reverse Voltage, VR (V) @IR = 100µA [2] Reverse Voltage, VR (V) @IR = 10µA [2] Thermal Resistance, RqJ-S (°C/W) Min. 1 chip on 3 chips on Color Min. Typ. Max. Min. Red 1.8 2.1 2.5 4 - 320 320 Green 2.8 3.1 3.6 - 4 320 320 Blue 2.8 3.1 3.6 - 4 320 320 Note: 1. Tolerance = ±0.1V. 2. Indicates product final testing condition. Long term reverse bias is not recommended. 3 Part Numbering System A S M B - T T B 0 - x1 Code Description 0 A 3 A 2 x2 x3 x4 x5 Option x1 x2 Package type Minimum intensity bin B A x3 x4 Number of intensity bins Color bin combination 3 A x5 Test option 2 Black surface Red: bin U2 Green: bin X1 Blue: bin T2 3 intensity bins from minimum Red: full distribution Green: bin E,A,B Blue: bin A, B, C Test current = 20 mA Red: bin U2, V1, V2 Green: bin X1, X2, Y1 Blue: bin T2, U1, U2 Table 4. Bin Information Intensity Bins (CAT) Color Bins (BIN) – Red Bin ID Luminous intensity (mcd) Min Max T2 U1 U2 V1 V2 W1 W2 X1 X2 Y1 355 450 560 715 900 1125 1400 1800 2240 2850 450 560 715 900 1125 1400 1800 2240 2850 3550 Bin ID Dominant Wavelength (nm) Min. Max. Chromaticity Coordinate (for reference) Cx Cy -- 618.0 0.6873 0.6696 0.6866 0.7052 628.0 0.3126 0.3136 0.2967 0.2948 Tolerance: ±1nm Tolerance: ±12% Color Bins (BIN) – Blue Color Bins (BIN) – Green Bin ID Dominant Wavelength (nm) Min. Max. Chromaticity coordinate (for reference) Cx Cy A 465.0 469.0 B 467.0 471.0 0.1355 0.1553 0.1473 0.1267 0.1314 0.1516 0.1427 0.0399 0.0692 0.0814 0.0534 0.0459 0.0746 0.0897 C 469.0 473.0 0.1215 0.1267 0.1473 0.1376 0.1158 0.0626 0.0534 0.0814 0.0996 0.0736 Tolerance: ±1 nm 4 Bin ID Dominant Wavelength (nm) Min. Max. Chromaticity Coordinate (for reference) Cx Cy E 523.0 529.0 A 526.0 532.0 B 529.0 535.0 0.0979 0.1685 0.2027 0.1468 0.1223 0.1856 0.2192 0.1702 0.1468 0.2027 0.2350 0.1929 Tolerance: ± 1 nm 0.8316 0.6821 0.6673 0.8104 0.8228 0.6759 0.6576 0.7965 0.8104 0.6673 0.6471 0.7816 100 0.8 80 Blue Green FORWARD CURRENT (mA) WAVELENGTH - nm 1.0 Red 0.6 0.4 0.2 0.0 400 450 500 550 600 RELATIVE INTENSITY 650 700 Figure 1. Relative Intensity vs. Wavelength 3.0 1.5 1.0 0.5 0.0 0 10 20 30 40 FORWARD CURRENT - mA 50 -1 0 0.3 1.2 1.0 0.8 Red Green Blue -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE - °C Figure 5. Relative Intensity vs. Junction Temperature 10 20 30 40 FORWARD CURRENT - mA 50 60 Figure 4. Dominant wavelength shift vs. forward current 1.4 -40 5 0 1.6 0.2 4 1 0.4 0.4 1 Red Green Blue 1.8 0.6 0 2 -2 FORWARD VOLTAGE SHIFT - V NORMALZIED INTENSITY 20 2 3 FORWARD VOLTAGE - V Figure 2. Forward Current vs. Forward Voltage 60 Figure 3. Relative Intensity vs. Forward Current 5 40 0 DOMINANT WAVELENGTH SHIFT - nm RELATIVE INTENSITY 2.0 60 3 Red Green Blue 2.5 Red Green/Blue 100 120 0.2 0.1 0 Red Green Blue -0.1 -0.2 -0.3 -40 -20 0 20 40 60 80 TJ - JUNCTION TEMPERATURE - °C Figure 6. Forward Voltage vs. Junction Temperature 100 120 60 MAXIMUM FORWARD CURRENT - mA MAXIMUM FORWARD CURRENT - mA 60 50 40 TA 30 TS 20 10 0 0 20 40 60 80 TEMPERATURE (°C) 100 30 MAXIMUM FORWARD CURRENT - mA MAXIMUM FORWARD CURRENT - mA TA 20 10 0 20 40 60 80 TEMPERATURE (°C) 100 120 100 120 40 TS TA 20 10 0 20 40 60 80 TEMPERATURE (°C) 100 120 Figure 9. Maximum forward current vs. temperature for Green & Blue (1 chip on) Note: Maximum forward current graphs based on ambient temperature, TA are with reference to thermal resistance RqJ-A as follows. For more details, see Precautionary Notes (4) . Thermal resistance from LED junction to ambient, RqJ-A (°C/W) Condition Red Green & Blue 1 chip on 437 485 3 chips on 654 654 6 30 Figure 8. Maximum forward current vs. temperature for Red (3 chips on) 40 0 TS 40 0 120 Figure 7. Maximum forward current vs. temperature for Red (1 chip on) 50 TS 30 TA 20 10 0 0 20 40 60 80 TEMPERATURE (°C) Figure 10. Maximum forward current vs. temperature for Green & Blue (3 chips on) 1.0 0.8 0.8 NORMALIZED INTENSITY NORMALIZED INTENSITY 1.0 0.6 0.4 Red Green Blue 0.2 0.0 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREE Figures 11a. Radiation pattern along x-axis of the package 60 0.6 0.4 0.0 -90 90 X Y Figure 11c. Illustration of package axis for radiation pattern 2.80 0.70 4.60 1.40 1.60 0.35 Maximize the size of copper pad for PIN1, PIN4,PIN5 for better heat dissipation. Copper Pad Figure 12. Recommended soldering land pattern 7 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREE Figures 11b. Radiation pattern along y-axis of the package Y X Red Green Blue 0.2 Solder mask 60 90 4.00 2.00 +0.10 1.55 0 1.50 B PACKAGE MARKING 3.15 1.50 A 1.75 5.50 3.70 12.00 ± 0.3 5.50 B A 0.30 8.00 1.50 Unless other specified, tolerance is ±0.10 mm 0.30 3.60 7.00 Figure 13. Carrier tape dimensions Package Marking Printed Label Figure 14. Reeling orientation 12.40 RECYCLE Detail-1 2.3 R8 ∅ 13.0 ±0.2 ∅ 100.0 ±1.0 10.75 ∅ 110 ∅ 90 DATE OF YEAR DATE OF MONTH Figure 15. Reel dimensions 8 ∅ 320.0 ±2.0 ∅ 330.0 ±2.0 Detail-1 2.20 Packing Label: (i) Standard label (attached on moisture barrier bag) STANDARD LABEL LS0002 RoHS Compliant Halogen Free STANDARD LABEL LS0002 e4 Max Temp 260C MSL4 RoHS Compliant Halogen Free (Q) QTY: Quantity e4 Max Temp 260C MSL4 (Q) QTY: Quantity CAT: Intensity Bin (1P) Item: Part Number (1P) Item: Part Number (1T) Lot: Lot Number (1T) Lot: Lot Number LPN: LPN: CAT: Intensity Bin (9D) MFG Date: Manufacturing Date BIN: Color Bin (9D) MFG Date: Manufacturing Date BIN: Color Bin (P) Customer Item: (P) Customer Item: (V) Vendor ID: (9D) Date Code: Date Code (V) Vendor ID: (9D) Date Code: Date Code DeptID: Made In: Country of Origin DeptID: Made In: Country of Origin Packing Label: (ii) Baby label (attached on plastic reel) (1P) PART #: Part Number (1P) PART #: Part Number (1T) LOT #: Lot Number BABY LABEL COSB 001B V0.0 BABY LABEL COSB 001B V0.0 (1T) LOT #: Lot Number (9D)MFG DATE: Manufacturing Date QUANTITY: Packing Quantity (9D)MFG DATE: Manufacturing Date C/O: Country of Origin QUANTITY: Packing Quantity (9D): DATE CODE: C/O: Country (1T) TAPE DATE:of Origin CAT: U2 X1 VF: T2 D/C: DATE Date Code (9D): CODE: CAT: D/C: BIN: CAT: BIN: (1T) TAPE DATE: Example of luminous intensity (Iv) bin information on label: CAT: U2 X1 T2 INTENSITY Date Code BIN VF: COLOR BIN INTENSITY BIN COLOR BIN Intensity bin for Blue: T2 Intensity bin for Green: X1 Intensity bin for Red: U2 Example of color bin information on label: BIN: A B Intensity bin for Blue: T2 Intensity bin for Green: X1 Intensity bin for Red: U2 Note: There is no color bin ID for Red color as there is only 1 range as stated in Table 4. 9BIN: A B Color bin for Blue: B Color bin for Blue: B Color bin for Green: A Soldering Recommended reflow soldering condition: (i) Leaded reflow soldering: (ii) Lead-free reflow soldering: 20 SEC. MAX. 183°C 100-150°C -6°C/SEC. MAX. 3°C/SEC. MAX. 120 SEC. MAX. 60-150 SEC. TIME a. Reflow soldering must not be done more than 2 times. Do observe necessary precautions of handling moisture sensitive device as stated in below section. b. Recommended board reflow direction: TEMPERATURE TEMPERATURE 10 to 30 SEC. 240°C MAX. 3°C/SEC. MAX. 217°C 200°C 255 - 260 °C 3°C/SEC. MAX. 6°C/SEC. MAX. 150°C 3 °C/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC. TIME c. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. d. It is preferred to use reflow soldering to solder the LED. Hand soldering shall only be used for rework if unavoidable but must be strictly controlled to conditions below: - Soldering iron tip temperature = 320°C max - Soldering duration = 3 sec max - Number of cycle = 1 only - Power of soldering iron = 50W max e. Do not touch the LED body with hot soldering iron except the soldering terminals as it may cause damage to the LED. f. For de-soldering, it is recommended to use double flat tip. g. User is advised to confirm beforehand whether the functionality and performance of the LED is affected by hand soldering. 10 PRECAUTIONARY NOTES 1. Handling precautions a. Do not poke sharp objects into the encapsulant. Sharp object like tweezers or syringes might apply excessive force or even pierce through the encapsulant and induce failures to the LED die or wire bond. b. Do not touch the encapsulant. Uncontrolled force acting on the encapsulant might result in excessive stress on the wire bond. The LED should only be held by the body. c. Do no stack assembled PCBs together. Use an appropriate rack to hold the PCBs. d. To remove foreign particles on the surface of the encapsulant, a cotton bud can be used with isopropyl alcohol (IPA). During cleaning, rub the surface gently without applying too much pressure. Ultrasonic cleaning is not recommended. e. For automated pick and place, Avago has tested the following nozzle size to be working fine with this LED. However, due to the possibility of variations in other parameters such as pick and place machine maker/model and other settings of the machine, customer is recommended to verify the nozzle selected will not cause damage to the LED. ID OD ID = 1.7mm OD = 3.5mm 11 2. Handling of moisture sensitive device This product has a Moisture Sensitive Level 4 rating per JEDEC J-STD-020. Refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. a. Before use - An unopened moisture barrier bag (MBB) can be stored at