ASMG-ST00-00001

Data Sheet ASMG-ST00-00001 3W Tri-Color High Power LED Description The Broadcom® 3W Tri-Color High Power LED Light Source is a high-performance, energy-efficient device that can handle high thermal and high driving current. The low-profile package design is suitable for a wide variety of applications, especially where height is a constraint. Features       The package is compatible with the reflow soldering process. This will give more freedom and flexibility to the light source designer.   Available in tri-color Energy efficient Compatible with reflow soldering process High current operation Long operation life Wide viewing angle Silicone encapsulation MSL 1 products Applications      Sign backlight Retail display Commercial lighting Decorative lighting Architectural lighting CAUTION! This LED is Class 1B ESD sensitive per ANSI/ESDA/JEDEC JS-001. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Broadcom ASMG-ST00-DS100 March 23, 2018 ASMG-ST00-00001 Data Sheet 3W Tri-Color High Power LED Package Dimensions NOTE: 1. All dimensions are in millimeters (mm). 2. Tolerance is ± 0.2 mm unless otherwise specified. 3. Encapsulation = silicone. 4. Terminal finish = silver plating. 5. Thermal pad is connected to the anode of red. Device Selection Guide TJ = 25°C, IF = 350 mA. Luminous Flux, ØV (lm) at 350 mAa, b Part Number ASMG-ST00-00001 Color Min. Typ. Max. Dice Technology Red 45 55 65 AllnGaP Green 80 95 112 InGaN Blue 18 20 26 InGaN a. ØV is the total luminous flux output as measured with an integrating sphere at 25ms mono pulse condition. b. Luminous flux tolerance = ±10%. Broadcom ASMG-ST00-DS100 2 ASMG-ST00-00001 Data Sheet 3W Tri-Color High Power LED Absolute Maximum Ratings Parameter AllnGaP InGaN Unit DC Forward Currenta 350 350 mA Peak Forward Currentb 500 500 mA 980 1330 mW Power Dissipation Reverse Voltage Not designed for reverse bias LED Junction Temperature 120 °C Operating Temperature Range -40 to +100 °C Storage Temperature Range -40 to +120 °C a. Derate linearly as shown in Figure 7 and Figure 8. b. Duty factor = 10%, frequency = 1 kHz. Optical Characteristics IF = 350 mA, TJ = 25°C. Dominant Wavelength, d (nm)a, b Color Min. Typ. Max. Peak Wavelength, p Viewing Angle, 2θ1/2 (°)c (nm) Typ. Typ. Red 613.5 623.0 631.0 631.5 135 Green 515.0 525.0 535.0 518.5 170 Blue 455.0 465.0 475.0 456.5 135 a. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. b. Tolerance = ± 1 nm. c. 2θ½ is the off axis angle where the luminous intensity is half of the peak intensity. Electrical Characteristics TJ = 25°C. Forward Voltage, VF (V)a at IF = 350 mA Thermal Resistance, RθJ-S (°C/W)b Min. Typ. Max. Reverse Current, IR (µA) at VR = 5V Red 1.8 2.2 2.8 Not designed for reverse bias Green 2.8 3.4 3.8 10 Blue 2.8 3.4 3.8 6 Color Typ. 6 a. Tolerance = ±0.1V. b. Thermal resistance from LED junction to solder point. Broadcom ASMG-ST00-DS100 3 ASMG-ST00-00001 Data Sheet 3W Tri-Color High Power LED Part Numbering System A S M G - S T 0 Code Description Option x1 x2 Flux bin selection 00 x3 Color bin selection 0 0 - Red: 0 x1 x2 x3 1 45–65 lm Green: 80–112 lm Blue: 18–26 lm Red: Bins 2 and 4 Green: Bins A, 1, 2, and 3 Blue: Bins A,1, 2, and 3 Bin Information Luminous Flux Bin Limit Example of bin information on reel and packaging label: Luminous flux (lm) at 350 mA Color Min. Max. Red 45 65 Green 80 112 Blue 18 26 BIN: 2A3 → Red color bin 2 → Green color bin A → Blue color bin 3 Tolerance = ±10%. Color Bin Limits (BIN) Dominant Wavelength (nm) at 350 mA Color Bin ID Min. Max. Red 2 613.5 620.5 4 620.5 631.0 Green A 515.0 520.0 1 520.0 525.0 2 525.0 530.0 Blue 3 530.0 535.0 A 455.0 460.0 1 460.0 465.0 2 465.0 470.0 3 470.0 475.0 Tolerance = ±1 nm. Broadcom ASMG-ST00-DS100 4 ASMG-ST00-00001 Data Sheet 3W Tri-Color High Power LED Figure 1: Relative Luminous Flux vs. Mono Pulse Current Figure 2: Forward Current vs. Forward Voltage 350 1 Red Green Blue 0.9 0.8 250 FORWARD CURRENT - mA 0.7 RELATIVE LUMINOUS FLUX (NORMALIZED AT 350 mA) Red Green/Blue 300 0.6 0.5 0.4 0.3 0.2 200 150 100 50 0.1 0 0 0 50 100 150 200 250 300 0 350 0.5 1 1.5 2 2.5 FORWARD VOLTAGE - V MONO PULSE CURRENT - mA Figure 3: Dominant Wavelength Shift vs. Mono Pulse Current Red Green Blue 8 140 120 RELATIVE LIGHT OUTPUT - % (NORMALIZED AT 25 °C) DOMINANT WAVELENGTH SHIFT - nm (NORMALIZED AT 350 mA) 4 160 10 6 4 2 0 100 80 60 Red 40 Green 20 Blue 0 -2 0 50 100 150 200 250 300 25 350 50 75 MONO PULSE CURRENT - mA 100 125 JUNCTION TEMPERATURE, T J -°C Figure 5: Forward Voltage Shift vs. Junction Temperature Figure 6: Dominant Wavelength Shift vs. Junction Temperature 8.0 0.2 Red 0.1 Blue 0.0 Red 6.0 Green DOMINANT WAVELENGTH SHIFT - nm (NORMALIZED AT 25°C) FORWARD VOLTAGE SHIFT - V (NORMALIZED AT 25°C) 3.5 Figure 4: Relative Light Output vs. Junction Temperature 12 -0.1 -0.2 -0.3 Green Blue 4.0 2.0 0.0 -2.0 -0.4 25 50 75 JUNCTION TEMPERATURE, TJ - °C Broadcom 3 100 125 25 50 75 100 125 JUNCTION TEMPERATURE, T J -°C ASMG-ST00-DS100 5 ASMG-ST00-00001 Data Sheet 3W Tri-Color High Power LED Figure 8: Derating Curve According to Ambient Temperature (TA) . Derated based on TJMAX = 120°C, RθJ-A = 30°C/W for Red and Blue and RθJ-A = 34°C/W for Green. 400 400 350 350 300 300 250 MAX ALLOWABLE DC CURRENT - mA MAX ALLOWABLE DC CURRENT - mA Figure 7: Derating Curve According to Solder Point Temperature (TS) 200 150 100 50 0 0 20 40 60 80 100 Red Green Blue 250 200 150 100 50 0 120 0 20 SOLDER POINT TEMPERATURE, T S - °C Figure 9: Pulse Handling Capability at TS ≤ 100°C for AllnGaP 100 120 0.60 DF = 0.05 0.10 0.25 0.50 1.00 0.50 0.45 0.50 0.40 0.35 0.30 0.25 1E-05 0.0001 0.001 0.01 0.1 1 DF = 0.05 0.10 0.25 0.50 1.00 0.55 IP - PULSE CURRENT - A 0.55 I P - PULSE CURRENT - A 60 80 AMBIENT TEMPERATURE, T A - °C Figure 10: Pulse Handling Capability at TS ≤ 100°C for InGaN 0.60 0.45 0.40 0.35 0.30 0.25 1E-05 10 0.0001 0.001 0.01 0.1 1 10 60 90 t p - PULSE DURATION - sec t p - PULSE DURATION - sec Figure 11: Radiation Pattern for Red Figure 12: Radiation Pattern for Green 1.00 1.00 0.75 0.75 NORMALIZED INTENSITY NORMALIZED INTENSITY 40 0.50 0.25 0.00 0.50 0.25 0.00 -90 Broadcom -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES 60 90 -90 -60 -30 0 30 ANGULAR DISPLACEMENT - DEGREES ASMG-ST00-DS100 6 ASMG-ST00-00001 Data Sheet 3W Tri-Color High Power LED Figure 13: Radiation Pattern for Blue Figure 14: Spectral Power Distribution 1.00 1.0 0.9 0.8 0.7 RELATIVE INTENSITY NORMALIZED INTENSITY 0.75 0.50 0.25 0.6 0.5 0.4 0.3 0.2 0.1 0.00 0.0 -90 -60 -30 0 30 60 90 ANGULAR DISPLACEMENT - DEGREES 380 430 480 530 580 630 WAVELENGTH - nm 680 730 780 Figure 15: Recommended Soldering Land Pattern (mm) Units: mm. Broadcom ASMG-ST00-DS100 7 ASMG-ST00-00001 Data Sheet 3W Tri-Color High Power LED Figure 16: Carrier Tape Dimensions CATHODE MARK NOTE: 1. Drawing not to scale. 2. All dimensions are in millimeters. 3. Tolerance is ± 0.10 mm unless otherwise specified. Broadcom ASMG-ST00-DS100 8 ASMG-ST00-00001 Data Sheet 3W Tri-Color High Power LED Figure 17: Reel Dimensions NOTE: 1. 500 pieces per reel. 2. Drawing not to scale 3. All dimensions are in millimeters. Broadcom ASMG-ST00-DS100 9 ASMG-ST00-00001 Data Sheet 3W Tri-Color High Power LED Soldering  Recommended reflow soldering conditions: Figure 18: Recommended Reflow Soldering Profile TEMPERATURE 10 - 30 SEC. 217 qC 200 qC   255 - 260 qC 3°C/SEC. MAX. 6°C/SEC. MAX. 150 qC 3 qC/SEC. MAX. 100 SEC. MAX. 60 - 120 SEC.  TIME (Acc. to J-STD-020C)      Do not perform reflow soldering more than twice. Do not apply any pressure or force on the LED during reflow and after reflow when the LED is still hot. Use reflow soldering to solder the LED. Hot plate should only be used for rework if unavoidable but must be strictly controlled to the following conditions: – LED temperature = 260°C max. – Time at maximum temperature = 20s max. Confirm beforehand whether the functionality and performance of the LED is affected by soldering with hot plate. Hand soldering is not recommended. Precautionary Notes Figure 19: Nozzle Size   Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and induce failures to the LED die or wire bond. Broadcom Storage The soldering terminals of these LEDs are silver plated. If the LEDs are exposed in an ambient environment for too long, the silver plating might be oxidized and thus affecting its solderability performance. As such, keep unused LEDs in a sealed moisture barrier bag (MBB) with desiccant or in desiccator at