ASMT-BR20-AS000

ASMT-Bx20 PCB Based Subminiature Lamps (PCB PolyLED) Data Sheet Description Features The ASMT-Bx20 is an environmental friendly green product of unique PCB based subminiature lamps, namely PCB PolyLED. These PolyLEDs come in un-tinted, non-diffused package to cater for various product themes and ease handling applications. • Small foot print The small size, narrow footprint, and high brightness make these LEDs excellent for backlighting, status indication, and panel illumination applications. • Supreme product quality and reliability The available colors are AllnGaP Red, AllnGaP Green, InGaN Blue, and AllnGaP Amber. • Compatible with automated placement equipment In order to facilitate pick and place operation, these PCB PolyLEDs are shipped in tape and reel, with 1500 units per reel. The package is compatible with reflow soldering and binned by both color and intensity. • Available in four colors • Low power consumption • Non-diffused dome for high brightness • Operating temperature range of -40 °C to +85°C • Package in 8mm tape on 7” diameter reels • Compatible with infrared and vapor phase reflow soldering process Applications • Panel indicator • LCD backlighting • Symbol backlighting • Push-button backlighting • Indoor mono/full color sign Package Dimensions Notes: 1. All dimensions in millimeters. 2. Tolerance is ±0.1mm unless otherwise specified. Device Selection Guide Part Number Die Technology Color Package Description ASMT-BA20 AlInGaP Amber Untinted, Non-diffused ASMT-BG20 AlInGaP Green Untinted, Non-diffused ASMT-BR20 AlInGaP Red Untinted, Non-diffused ASMT-BB20 InGaN Blue Untinted, Non-diffused Part Numbering System ASMT - B x 20 - x x x x 0 Color Bin Selection Please refer to the Color Bin Limits Table. Max Iv Bin Options Please refer to the Iv Bin Table Min Iv Bin Options Please refer to the Iv Bin Table Die Technology A: AllnGaP N: InGaN Color A: Amber G: Green R: Red B: Blue Absolute Maximum Ratings at TA = 25°C Parameter AlInGaP InGaN Units DC Forward Current[1] 30 20 mA Reverse Voltage (IR = 100mA) 5 5 V LED Junction Temperature 95 95 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +85 °C Soldering Temperature (Pb Free) 260°C for 10 seconds Electrical Characteristics at TA = 25°C Part Number Reverse Breakdown VR (Volts) @ IR = 100μA Min. Thermal Resistance RθJ-PIN (°C/W) Typ. AlInGaP Amber 2.0 2.4 5 450 AlInGaP Green 2.0 2.4 5 450 AlInGaP Red 2.0 2.4 5 450 InGaN Blue 3.2 3.8 5 450 Notes: 1. Vf tolerance : ±0.1V  Forward Voltage VF (Volts) [1] @ IF = 20mA Typ. Max. Optical Characteristics at TA = 25°C Luminous Intensity IV [1] (mcd) @ 20mA Typ. Peak Wavelength λpeak (nm) Typ. Dominant Wavelength λd [2] (nm) Typ. Viewing Angle 2θ1/2 [3] (Degrees) Typ. AlInGaP Amber 750 592 590 15 AlInGaP Green 650 565 569 15 AlInGaP Red 650 635 626 15 InGaN Blue 650 470 468 15 Part Number Notes: 1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity. Light Intensity (IV) Bin Limits [1] Bin ID Green Color Bins [1] Intensity (mcd) Minimum Maximum Bin ID Dominant Wavelength (nm) Minimum Maximum P 45.00 71.50 1 561.5 564.5 Q 71.50 112.50 2 564.5 567.5 R 112.50 180.00 3 567.5 570.5 S 180.00 285.00 4 570.5 573.5 T 285.00 450.00 5 573.5 576.5 U 450.00 715.00 V 715.00 1125.00 W 1125.00 1800.00 X 1800.00 2850.00 Y 2850.00 4500.00 Red Color Bins [1] Bin ID Tolerance : ±15% - Color Bin Limits [1] Dominant Wavelength (nm) Minimum Maximum 620.0 635.0 Tolerance : ±1 nm Amber Color Bins [1] Bin ID Tolerance : ±1 nm Blue Color Bins [1] Dominant Wavelength (nm) Minimum Maximum 1 582.0 584.5 2 584.5 587.0 3 587.0 589.5 4 589.5 592.0 5 592.0 594.5 6 594.5 597.0 Bin ID Dominant Wavelength (nm) Minimum Maximum 1 460.0 465.0 2 465.0 470.0 3 470.0 475.0 4 475.0 480.0 Tolerance : ±1 nm Tolerance : ±1 nm Notes: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on current available bins.  RELATIVE INTENSITY 1.0 0.8 InGaN Blue 0.6 AllnGaP Green AllnGaP Amber 0.4 AllnGaP Red 0.2 0.0 380 Figure 3. Recommended soldering land pattern. 480 580 WAVELENGTH - nm 680 780 Figure 4. Relative intensity vs. wavelength 35 1.6 30 1.4 25 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) FORWARD CURRENT - mA Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified. AllnGaP 20 InGaN 15 10 5 0 0 1 2 FORWARD VOLTAGE - V 3 20 15 InGaN 5 0 0 20 40 60 80 AMBIENT TEMPERATURE - °C Figure 7. Maximum forward current vs. ambient temperature For AllnGap & InGaN Derating based on TJMAX = 95°  NORMALIZED INTENSITY MAXIMUM FORWARD CURRENT - mA AllnGaP 10 InGaN 0.8 0.6 AllnGaP 0.4 0.2 0 5 10 15 20 25 DC FORWARD CURRENT - mA 30 35 Figure 6. Relative luminous intensity vs. DC forward current 35 25 1 0 4 Figure 5. Forward current vs. forward voltage 30 1.2 100 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES Figure 8. Radiation Pattern 90 10 to 30 SEC. +5 230 - 0 °C MAX. 3°C/SEC. MAX. 183°C 125-170°C 3-4°C/SEC. 2-3°C/SEC 60-150 SEC. 120 SEC. MAX. 50°C 3 °C/SEC. MAX. 100 SEC. MAX. 60-120SEC. (Acc. to J-STD-020C) Figure 10. Recommended Pb-free reflow soldering profile USER FEED DIRECTION CATHODE SIDE  6 °C/SEC. MAX. 150 °C TIME Figure 9. Recommended reflow soldering profile Figure 11. Reeling orientation 217 °C 200 °C 255 - 260 °C 3 °C/SEC. MAX. 25°C TIME PRINTED LABEL TEMPERATURE TEMPERATURE 10 SEC. MAX. Figure 12. Reel dimensions [1] Figure 13. Tape dimensions [1] Notes: 1. All dimensions are in millimeters (inches). For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. AV02-0389EN - August 29, 2008