ASMT-CR00

AVAGO ASMT-CR00 AlInGaP Red 0.4mm Low Profile Right Angle Surface Mount ChipLED Datasheet Features Description The ASMT-CR00 of red color chip-type LEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint 1.6 mm x 1.0 mm and a height of only 0.4 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and indication application where space is a constraint. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in conductive tape and reel, with 4000 units per reel. These part are compatible with IR soldering. • • • • • • • Small size right angle mount 0603 industry standard footprint 0.4 mm low profile type Operating temperature range of -40oC to +85 oC Compatible with IR reflow soldering process Available in 8mm tape on 178mm (7’) diameter reels Reel sealed in zip locked moisture barrier bags Applications • • • • LCD Backlighting Keypad Side / Backlighting Pushbutton backlighting Symbol Indicator Package Dimension Device Selection Guide Package Dimension (mm) Parts per Reel Package Description 1.6 (L) x 1.0 (W) x 0.4 (H) 4000 Untinted, Non-diffused CAUTION: ASMT-CR00 LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. 1 Absolute Maximum Ratings at TA = 25°C Parameter ASMT-CR00 Unit DC Forward Current [1] 25 mA Power Dissipation 60 mW Reverse Voltage (IR = 100µA) 5 V LED Junction Temperature 95 °C Operating Temperature Range -40 to +85 °C Storage Temperature Range -40 to +85 °C Soldering Temperature See reflow soldering profile (Figure 6 & 7) Note: 1. Derate linearly as shown in Figure 4. Electrical Characteristics at TA = 25°C Forward Voltage Reverse Breakdown VF (Volts) [1] VR (Volts) Thermal Resistance @ IF = 20mA @ IR = 100µ µA Rθ θJ-PIN (°C/W) Part Number Typ. Max. Min. Typ. ASMT-CR00 1.9 2.4 5 400 Notes: 1.Vf tolerance : ±0.1V Optical Characteristics at TA = 25°C Luminous Intensity Peak IV [1] (mcd) Wavelength Dominant Wavelength @ 20mA λpeak (nm) λd [2] (nm) (Degrees) Typ. Typ. Typ. 637.0 626.0 150 Part Number Min. Typ. ASMT-CR00 28.5 90.0 Viewing Angle 2 θ1/2 [3] Notes: 1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity. 2 Light Intensity (IV) Bin Limits Intensity (mcd) Bin ID Minimum Minimum N 28.50 45.00 P 45.00 71.50 Q 71.50 112.50 R 112.50 180.0 Notes: 1. 2. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on current available bins. The Iv binning specification set-up is for lowest allowable Iv binning only. There is no upper Iv bin limits. Tolerance : ±15% Color Bin Limits Dominant Wavelength (nm) Bin ID Minimum Maximum - 620.0 635.0 Tolerance : ±1nm Figure 1. Relative intensity vs. wavelength Figure 2. Forward current vs. forward voltage 3 Figure 3. Luminous intensity vs. forward current Figure 4. Maximum forward current vs. ambient temperature EMITTING DIRECTION Figure 5. Recommended soldering land pattern. Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified. Figure 6. Recommended reflow soldering profile. Figure 7. Recommended Pb-free reflow soldering profile. 4 Figure 9. Reeling orientation. Figure 10. Reel dimensions. Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified. 5 TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) DIM.A DIM.B DIM.C PART NUMBER ± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004) ASMT-CR00 1.75 (0.069) 1.10 (0.043) 0.60 (0.024) Figure 11. Tape dimensions. Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified. Reflow Soldering: For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30°C @ 60%RH max. Baking is required before mounting, if: 1. Humidity Indicator Card is > 10% when read at 23 ± 5°C. 2. Device expose to factory conditions