ASMT-CW00

ASMT-CW00 InGaN White, 0.4mm Low Profile Right Angle Surface Mount ChipLED Data Sheet Description The ASMT-CW00 of white color chip-type LEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint 1.6 mm x 1.0 mm and a height of only 0.4 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and indication application where space is a constraint. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in conductive tape and reel, with 4000 units per reel. These part are compatible with IR soldering. Features • Small size right angle mount • 0603 industry standard footprint • 0.4 mm low profile type • Operating temperature range of -30°C to +85 °C • Compatible with IR reflow soldering process • Available in 8mm tape on 178mm (7’) diameter reels • Reel sealed in zip locked moisture barrier bags Applications • LCD Backlighting • Keypad Side / Backlighting • Pushbutton backlighting • Symbol Indicator Package Dimension 1.60 0.063 0.20 0.008 0.20 0.008 1.00 0.039 1.20 0.047 R0.60 0.024 0.40`0.05 0.016`0.002 0.50 0.020 SIDE VIEW 0.20 0.009 CATHODE MARK 0.30 0.012 TOP VIEW 0.30 0.012 0.35 0.014 0.30 0.012 0.35 0.014 TERMINAL VIEW Notes: 1. All dimensions will be in millimeters (inches) 2. Tolerance is ±0.1mm (±0.004 in) unless otherwise stated CAUTION: ASMT-CW00 LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional Device Selection Guide Package Dimension (mm) 1.6 (L) x 1.0 (W) x 0.4 (H) Parts per Reel 4000 Package Description Untinted, Non-diffused Absolute Maximum Ratings at TA = 25°C Parameter DC Forward Current [1] Power Dissipation Reverse Voltage (IR = 100μA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature Note: 1. Derate linearly as shown in Figure 4. ASMT-CW00 10 3 5 95 -30 to +85 -40 to +85 See reflow soldering profile (Figure 8 & 9) Unit mA mW V °C °C °C Electrical Characteristics at TA = 25°C Forward Voltage VF ( Volts) [1] @ IF = 5mA Part Number ASMT-CW00 Min. .55 Max. 3.15 Reverse Breakdown VR ( Volts) @ IR = 100μA Minimum 5 Thermal Resistance RθJ-PIN (°C/W) Typical 450 Notes: 1. Vf tolerance : ±0.1V Optical Characteristics at TA = 25°C Luminous Intensity IV [1] (mcd) @ 5mA Part Number ASMT-CW00 Min. 18 Typ. 35 Color Chromaticity[2] Bin A1 – D (Refer to Figure 1) Viewing Angle 2 θ1/2 [3] (Degrees) Typical 170 Notes: 1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. The chromaticity coordinates are derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. θ1/2 is the off-axis angle where the luminous intensity is ½ the peak intensity.  Light Intensity (IV) Bin Limits Intensity (mcd) Bin ID M N P Q Minimum 18.00 8.50 45.00 71.50 Maximum 8.50 45.00 71.50 11.50 Forward Voltage (VF) Bin Limits Forward Voltage (V) Bin ID 1  3 Tolerance : ±0.1V Minimum .55 .75 .95 Maximum .75 .95 3.15 Tolerance : ±15% Notes: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on current available bins. 0.38 0.36 0.34 Y - COORDINATE 0.32 0.30 0.28 0.26 0.24 0.22 0.20 0.18 0.16 0.24 0.26 0.28 0.3 X - COORDINATE 0.32 0.34 A2 A1 B1 B2 C1 C2 D1 D2 Rank A1 A2 B1 B2 C1 C2 D1 D2 X Y X Y X Y X Y X Y X Y X Y X Y Chromaticity Coordinates 0.2700 0.2700 0.2500 0.2455 0.2780 0.2500 0.2700 0.2700 0.2500 0.2455 0.2130 0.1850 0.2700 0.2700 0.2900 0.2455 0.2780 0.3060 0.2700 0.2700 0.2900 0.2455 0.2130 0.2410 0.2900 0.3100 0.3100 0.3060 0.3355 0.3030 0.2900 0.3100 0.3100 0.2410 0.2705 0.3030 0.3100 0.3100 0.3300 0.3030 0.3355 0.3650 0.3100 0.3100 0.3300 0.3030 0.2705 0.3000 0.2500 0.2175 0.2500 0.2175 0.2900 0.2735 0.2900 0.2735 0.2900 0.2735 0.2900 0.2735 0.3300 0.3325 0.3300 0.3325 Figure 1. Color bin limits (CIE 1931 Chromaticity Diagram) [Tolerance: ±0.02] 1 0.9 FORWARD CURRENT - mA 430 480 530 580 630 680 730 780 0.8 RELATIVE INTENSITY 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 380 100 10 1 0.1 2.0 2.5 3.0 3.5 4.0 WAVELENGTH - nm Figure 2. Relative intensity vs. wavelength FORWARD VOLTAGE - V Figure 3. Forward voltage vs. forward current 3 2.0 1.8 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 5 mA) RELATIVE LUMINOUS INTENSITY 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 2 4 6 8 DC FORWARD CURRENT - mA 10 12 10 (NORMALIZED AT 5 mA) 8 6 4 2 0 0 20 40 60 80 100 DC FORWARD CURRENT - mA Figure 4. Luminous intensity vs. forward current Figure 5. Maximum forward current vs. ambient temperature 1 0.9 RELATIVE INTENSITY 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 0.8 (0.031) 1.2 (0.047) 0.15 (0.006) 0.4 (0.016) 0.4 (0.016) 0.7 (0.028) CENTERING BOARD 0.8 (0.031) Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified Figure 6. Radiation pattern Figure 7. Recommended soldering land pattern 10 SEC. MAX. TEMPERATURE TEMPERATURE 230°C MAX. 140-160°C 4°C/SEC. MAX. OVER 2 MIN. TIME 4°C/SEC. MAX. 3°C/SEC. MAX. 255 - 260°C 3°C/SEC. MAX. 10 to 30 SEC. 217 °C 200 °C 150 °C 6°C/SEC. MAX. 3°C/SEC. MAX. 60 - 120 SEC. TIME 100 SEC. MAX. Figure 8. Recommended reflow soldering profile Figure 9. Recommended Pb-free reflow soldering profile 4 USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 10. Reeling orientation 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) ∅13.1 ± 0.5 (∅0.516 ± 0.020) ∅20.20 MIN. ( ∅0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) Æ 178.40 ± 1.00 (7.024 ± 0.039) 59.60 ± 1.00 (2.346 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS 5.0 ± 0.5 (0.197 ± 0.020) Figure 11. Reel dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified. 5 4.00 ± 0.10 0.157 ± 0.004 1.50 0.059 DIM. C 1.75 0.069 8.00 ± 0.30 0.315 ± 0.012 SEE TABLE 1 0.20 ± 0.02 0.008 ± 0.001 DIM. A SEE TABLE 1 DIM. B [ SEE TABLE 1 ] 2.00 ± 0.05 0.079 ± 0.002 4.00 0.157 R 0.40 USER FEED DIRECTION COVER TAPE CARRIER TAPE Table1. PART NUMBER ASMT-CW00 DIM.A ± 0.10 (0.004) 1.75 (0.069) DIM.B ± 0.10 (0.004) 1.10 (0.043) DIM.C ± 0.10 (0.004) 0.60 (0.04) Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1mm (±0.004in.) unless otherwise specified. Dimensions In Millimeters (Inches) Figure 12. Tape dimensions END START THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 13. Tape leader and trailer dimensions Reflow Soldering For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components. Storage Condition 5 to 30°C @ 60%RH max.Baking is required before mounting, if 1. Humidity Indicator Card is > 10% when read at 23 ± 5°C. 2. Device expose to factory conditions